TWI834728B - Inspection instruction information generation device, substrate inspection system, inspection instruction information generation method and inspection instruction information generation program - Google Patents

Abstract

The inspection instruction information generating device 3 includes a storage unit 34 that stores conductive structure information D1. The conductive structure information D1 represents a pair of front and back substrate surfaces F1 and F2 provided with a plurality of conductive portions P. The substrate surfaces F1 and F2 are laminated on the substrate surfaces F1 and F2. How the wiring layer L, which is the layer between the substrate surfaces F2, and the through hole V connecting the wiring of the wiring layer L to the plurality of conductive parts P, the conductive portion P of the substrate B, the wiring W, and the through hole V are electrically connected; and inspection The instruction information generation unit 33 executes an inspection instruction information generation process that combines a plurality of conductive portions P formed on the same substrate surface in pairs based on the conductive structure information D1, and Information representing the combined pair of conductive parts P is generated as inspection instruction information D2.

Description

Inspection instruction information generation device, substrate inspection system, inspection instruction information generation method and inspection instruction information generation program

The present invention relates to an inspection instruction information generation device that generates inspection instruction information for instructing an inspection location when inspecting a substrate, a substrate inspection system that uses the inspection instruction information to perform inspection, an inspection instruction information generation method, and an inspection instruction information generation program. .

Conventionally, there has been known an inspection device that measures the resistance of a through hole provided in a substrate by making probes reach one end and the other end of the through hole across the front and back of the substrate. Measurement (for example, refer to Patent Document 1).

[Prior art documents]

[Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 09-043295

However, like the above inspection device, in order to measure the voltage between the front and back of the substrate, it is necessary to pull the wire connecting the probe to the voltmeter across the front and back of the substrate. Therefore, the measurement wiring loop becomes larger and noise is easily picked up, which may result in lower resistance. Measurement accuracy. In addition, if the probe is placed across the front and back of the substrate and contacts the surface and back of the substrate respectively, the influence of external noise on the two sides of the substrate is different, and noise is superimposed on the detection voltage of the probe, which may reduce the resistance. Measurement accuracy.

An object of the present invention is to provide an inspection instruction information generation device that generates inspection instruction information, a substrate inspection system including the inspection instruction information generation device, an inspection instruction information generation method, and an inspection instruction information generation program. The inspection instruction information representation is easily improved. Check the resistance measurement accuracy of through holes.

An inspection instruction information generating device according to an example of the present invention is an inspection instruction information generating device for inspecting a substrate having a pair of front and back substrate surfaces provided with a plurality of conductive portions, and is laminated on the one surface. The inspection instruction information generating device is provided with a storage unit for storing the conductive information indicating the substrate for the wiring layer that is a layer between the substrate surfaces and the through hole connecting the wiring of the wiring layer and the conductive part. part, the wiring, and the conductive structure information of how the through hole is connected; and the inspection instruction information generation unit performs inspection instruction information generation processing. The inspection instruction information generation processing is based on the conductive structure information to form the same The conductive portions on the substrate surface are combined into pairs, and information representing the combined pair of conductive portions is generated as inspection instruction information.

In addition, an inspection instruction information generating method according to an example of the present invention is a method for generating inspection instruction information for inspecting a substrate having a pair of front and back substrate surfaces provided with a plurality of conductive portions, which are laminated on the substrate. The wiring layer is a layer between the pair of substrate surfaces, and the wiring of the wiring layer is connected to the conductive portion. of the through hole, the inspection instruction information generation method executes inspection instruction information generation processing based on a conductive structure indicating how the conductive portion, the wiring, and the through hole of the substrate are electrically connected. Information is generated by combining the conductive portions formed on the same substrate surface into pairs, and generating information representing the combined pair of conductive portions as inspection instruction information.

In addition, an inspection instruction information generation program according to an example of the present invention is an inspection instruction information generation program for inspecting a substrate having a pair of front and back substrate surfaces provided with a plurality of conductive portions, and is laminated on the substrate. The wiring layer is a layer between the pair of substrate surfaces, and a through hole connects the wiring of the wiring layer to the conductive part. The inspection instruction information generating program causes the computer to execute inspection instruction information generation processing. The inspection instruction The information generation process is based on the conductive structure information indicating how the conductive portion, the wiring, and the through hole of the substrate are electrically connected, so that the conductive portions formed on the same substrate surface are paired with each other. The conductive parts are combined in pairs, and information representing the combined pair of conductive parts is generated as inspection instruction information.

In addition, the substrate inspection system of the present invention includes: the inspection instruction information generating device; and a substrate inspection device that performs inspection of the through hole based on the inspection instruction information generated by the inspection instruction information generating device.

1:Substrate inspection system

2:Substrate inspection device

3: Check the instruction information generating device

4U, 4L: Measuring fixture

12:Measurement block

13:Scanner Department

20:Control Department

21:Inspection Processing Department

31: Simplified processing department

32:Tree structure data conversion department

33: Inspection instruction information generation department

22, 34: Storage Department

110:Substrate fixing device

112:Frame

121, 122: Measurement Department

125:Mobile mechanism

a1~a4, b1~b4, c1, c2, d1: conductive path

B, B1~B5: substrate

CS, CM: Power Department

D1: Conductive structure information

D1': Simplified conductive structure information

D1": Tree structure conductive structure information

D2: Check instruction information

F1, F2: substrate surface

+F, -F: current terminal

I: current value

IP, IPa, IPd: planar conductor

L, L1, L2, Lc, L4: wiring layer

M, Mr1~Mr6, M11~M14, M22, M41~M47: branches

N, N11, N12, N21, N41, N42: nodes

NR: root node

P, P1~P7, P11~P17: conductive part

Pr: probe

+S, -S: voltage detection terminal

S1, S2, S3, S4, S11, S5, S5a, S5b, S6a, S6, S11, S12, S12a, S12b, S13, S13a, S14, S15, S15a, S21, S22, S23, S24, S25, S26, S27, S28: steps

VM: Voltage detection department

V, V11~V17, V21~V27, V31~V36, V41~V45, V51~V57: through holes

W, W11, W12, W21, W22, W41~W45: Wiring

FIG. 1 is a schematic diagram conceptually showing the structure of a substrate inspection system according to an embodiment of the present invention.

FIG. 2 is a block diagram showing an example of the electrical configuration of the measurement unit shown in FIG. 1 .

FIG. 3 is a cross-sectional view showing an example of a substrate to be inspected.

FIG. 4 is a plan view showing an example of a substrate to be inspected.

FIG. 5 is a diagram illustrating an example of simplified conductive structure information.

FIG. 6 is a diagram illustrating an example of tree-structured conductive structure information.

FIG. 7 is a flowchart showing an example of the operation of the inspection instruction information generating method and the inspection instruction information generating device.

FIG. 8 is a flowchart showing an example of the operation of the inspection instruction information generating method and the inspection instruction information generating device.

FIG. 9 is an explanatory diagram of search processing.

FIG. 10 is a modification of FIG. 7 .

FIG. 11 is a modification of FIG. 8 .

FIG. 12 is a modification of step S5a in FIG. 10 .

FIG. 13 is a modification of step S12a in FIG. 11 .

FIG. 14 is an explanatory diagram of inspection instruction information.

FIG. 15 is a flowchart showing an example of the operation of the substrate inspection device shown in FIG. 1 .

Hereinafter, embodiments of the present invention will be described based on the drawings. In addition, components assigned the same reference numerals in the respective drawings represent the same components, and descriptions thereof will be omitted. The substrate inspection system 1 shown in FIG. 1 includes an inspection instruction information generating device 3 and a substrate inspection device 2 .

The inspection instruction information generating device 3 shown in Figure 1 includes a simplified processing unit 31. Tree structure data conversion unit 32, inspection instruction information generation unit 33, and storage unit 34. The inspection instruction information generating device 3 is constructed using a computer such as a personal computer, for example, and includes a central processing unit (CPU) that performs predetermined calculations and a random access memory (RAM) that temporarily stores data. ), non-volatile storage devices such as Hard Disk Drive (HDD) and/or flash memory, communication circuits, and their peripheral circuits, etc.

Furthermore, the examination instruction information generating device 3 functions as a simplified processing unit 31, a tree structure data converting unit 32, and and the inspection instruction information generating unit 33 functions. The storage unit 34 is configured using the non-volatile storage device, for example.

The conductive structure information D1 is stored in the storage unit 34 . The conductive structure information D1 may be transmitted from the outside to the inspection instruction information generating device 3 via, for example, a communication circuit (not shown), and the transmitted conductive structure information D1 may be stored in the storage unit 34 , or the inspection instruction information may be generated. The device 3 reads the conductive structure information D1 that has been stored in a storage medium such as a Universal Serial Bus (USB) memory, and stores the conductive structure information D1 in the storage unit 34. Various methods can be used to convert the conductive structure information D1 into a storage medium. The structural information D1 is stored in the storage unit 34 .

The conductive structure information D1 is information indicating how the conductive portion P of the substrate B described below, the wiring W or the planar conductor IP of each wiring layer L, and the through hole V are electrically connected. As the conductive structure information D1, for example, any information used in the production of the substrate can be used. So-called Gerber data (gerber data), and/or network connection list (netlist), etc.

The simplification processing unit 31 simplifies the wiring and via holes connected in parallel based on the conductive structure information D1, and generates the simplified conductive structure information D1'. The simplified conductive structure information D1' is equivalent to an example of conductive structure information.

The tree structure data conversion unit 32 converts the simplified conductive structure information D1' into a tree structure data structure by making the wiring W correspond to the node, the via V to the branch, and the planar conductor IP to the root node. The tree-structure conductive structure information D1" is generated. The tree-structure conductive structure information D1" is equivalent to an example of the conductive structure information.

The inspection instruction information generation unit 33 generates inspection instruction information D2 for the substrate inspection device 2 based on the conductive structure information D1 (D1', D1"). The inspection instruction information D2 is used to instruct the conductive portion P to which current should flow for inspection. Yes. The inspection instruction information generation unit 33 may send the inspection instruction information D2 to the substrate inspection device 2 via, for example, a communication circuit (not shown). Alternatively, the inspection instruction information generation unit 33 may write the inspection instruction information D2 into a storage medium. Furthermore, the user can also cause the substrate inspection device 2 to read the inspection instruction information D2 from the storage medium. Details of the operation of the inspection instruction information generating unit 33 will be described later.

The substrate inspection apparatus 2 shown in FIG. 1 is an apparatus for inspecting the substrate B which is an inspection target substrate.

The substrate B is, for example, an intermediate substrate or a multilayer substrate. It may also be a printed wiring substrate, a film carrier, a flexible substrate, a ceramic multilayer wiring substrate, a semiconductor substrate such as a semiconductor chip or a semiconductor wafer, or a package for semiconductor packaging. Substrates, electrode plates for liquid crystal displays or plasma displays, and processes for manufacturing these substrates The intermediate substrate of the process, or the so-called carrier substrate.

The substrate inspection device 2 shown in FIG. 1 has a housing 112 . In the internal space of the frame 112, the substrate fixing device 110, the measuring part 121, the measuring part 122, the moving mechanism 125, and the control part 20 are mainly provided. The substrate fixing device 110 is configured to fix the substrate B at a predetermined position.

The measurement unit 121 is located above the substrate B fixed to the substrate fixing device 110 . The measurement unit 122 is located below the substrate B fixed to the substrate fixing device 110 . The measurement parts 121 and 122 include measurement jigs 4U and 4L for bringing probes into contact with a plurality of conductive parts provided on the substrate B.

A plurality of probes Pr are attached to the measuring jig 4U and the measuring jig 4L. The measurement jigs 4U and 4L are arranged and hold a plurality of probes Pr so as to correspond to the arrangement of the conductive portions of the measurement target provided on the surface of the substrate B. The moving mechanism 125 moves the measuring parts 121 and 122 appropriately in the frame 112 according to the control signal from the control part 20, so that the probes Pr of the measuring jig 4U and the measuring jig 4L contact each conductive part of the substrate B. .

Furthermore, the substrate inspection device 2 may include only any one of the measurement part 121 and the measurement part 122, and the substrate B may be provided with a conductive part only on one surface. In addition, the substrate inspection device 2 can also invert the front and back of the substrate to be inspected, and measure both sides of the substrate using any one of the measuring units.

The control unit 20 is configured by, for example, the following components: a CPU (Central Processing Unit) that performs predetermined calculation processing, a RAM (Random Access Memory) that temporarily stores data, and a read-only memory that stores predetermined control programs. Non-volatile storage unit 22 such as (Read Only Memory, ROM), HDD (Hard Disk Drive), and peripheral circuits thereof. Furthermore, the control unit 20 functions as the inspection processing unit 21 by executing, for example, a control program stored in the storage unit 22 .

The measurement unit 121 shown in FIG. 2 includes a scanner unit 13, a plurality of measurement blocks 12, and a plurality of probes Pr. In addition, since the measurement part 122 has the same structure as the measurement part 121, its description is abbreviate|omitted.

The measurement block 12 includes a power supply unit CS, a power supply unit CM, and a voltage detection unit VM. The power supply unit CS and the power supply unit CM are constant current circuits that output a current I corresponding to a control signal from the control unit 20 . The power supply unit CS causes the current I to flow in the direction supplied to the scanner unit 13 , and the power supply unit CM causes the current I to flow in the direction drawn from the scanner unit 13 . The voltage detection unit VM is a voltage detection circuit that measures a voltage and sends the voltage value to the control unit 20 .

Furthermore, the measurement block 12 does not necessarily need to include both the power supply unit CS and the power supply unit CM. The measurement block 12 may include only any one of the power supply unit CS and the power supply unit CM.

The scanner unit 13 is, for example, a switching circuit configured using switching elements such as transistors and relay switches. The scanner unit 13 corresponds to the plurality of measurement blocks 12 and includes a plurality of current terminals +F and -F for supplying the current I for resistance measurement to the substrate B, and for detecting the current I on the substrate B. The voltage generated between the conductive parts is the voltage detection terminal +S and the voltage detection terminal -S. In addition, a plurality of probes Pr are electrically connected to the scanner unit 13 . The scanner unit 13 responds to the control information from the control unit 20 No. to switch the connection relationship between the current terminal +F, the current terminal -F, the voltage detection terminal +S, the voltage detection terminal -S and the plurality of probes Pr.

One end of the output terminal of the power supply unit CS is connected to circuit ground, and the other end is connected to the current terminal +F. One end of the output terminal of the power supply unit CM is connected to the circuit ground, and the other end is connected to the current terminal -F. One end of the voltage detection unit VM is connected to the voltage detection terminal +S, and the other end is connected to the voltage detection terminal -S.

Furthermore, the scanner unit 13 can conductively connect the current terminal +F, the current terminal -F and the voltage detection terminal +S and the voltage detection terminal -S to any probe Pr in response to the control signal from the control unit 20 . Thereby, the scanner unit 13 can cause the current I to flow between any conductive parts in contact with the probe Pr in response to the control signal from the control unit 20, and use the voltage detection unit VM to measure the voltage generated between the conductive parts. Voltage V.

Since a plurality of measurement blocks 12 are provided, current supply and voltage measurement can be simultaneously performed between a plurality of conductive parts.

In addition, as long as the power supply unit CS and the power supply unit CM can cause the current I to flow into the substrate B via the scanner unit 13, the power supply unit CS and the power supply unit CM are not limited to the example in which one end of the power supply unit CS and the power supply unit CM is connected to the circuit ground. For example, one end of the power supply unit CS and one end of the power supply unit CM may be connected to form a current loop.

Thereby, the control unit 20 can use the plurality of power supply units CS and the power supply unit CM to cause the current I to flow between any plurality of pairs of probes Pr by outputting the control signal to the scanner unit 13, and use the plurality of voltage detection units. VM to detect arbitrary pairs of probes Pr voltage between.

Furthermore, the measurement blocks 12 are not necessarily limited to the example in which a plurality of measurement blocks 12 are provided. It may also be configured so that one measurement block 12 sequentially performs current supply and voltage measurement between a plurality of conductive parts.

FIG. 3 serves as a cross-sectional view of the substrate B and an explanatory diagram illustrating the conductive structure information D1 of the substrate B. As shown in FIG. The conductive structure information D1 is not necessarily data represented by an image. However, in the following description, in order to facilitate understanding, the structure represented by the conductive structure information D1 is represented and explained using diagrams.

The substrate B shown in FIG. 3 is a multilayer substrate in which five substrates B1 to B5 are laminated. Let one surface of the substrate B be a substrate surface F1 and the other surface be a substrate surface F2. A wiring layer L1 is provided between the substrates B1 and B2, a wiring layer L2 is provided between the substrates B2 and B3, a wiring layer Lc is provided between the substrates B3 and B4, and a wiring layer is provided between the substrates B4 and B5. L4.

Conductive portions P1 to P7 are provided on the substrate surface F1, and conductive portions P11 to P17 are provided on the substrate surface F2. The conductive portions P1 to P7 and the conductive portions P11 to P17 serve as inspection points where the pads, bumps, wirings, electrodes, etc. are contacted by the probe Pr.

As an example of wiring, a planar conductor IP, which is a conductor expanded in a planar or mesh shape, is provided on the wiring layer Lc. The wiring layer L1 is provided with the wiring W11 and the wiring W12, the wiring layer L2 is provided with the wiring W21 and the wiring W22, and the wiring layer L4 is provided with the wiring W41, the wiring W42, the wiring W43, the wiring W44, and the wiring W45. The planar conductor IP can be expanded into a sheet shape, that is, a planar shape, or it can have the following properties: Shaped conductors: Conductor patterns such as wiring are combined into a regular or irregular mesh (mesh-like), and are expanded into a planar shape as a whole within the same layer.

3 shows an example in which the planar conductor IP extends to substantially the entire area of the substrate B, but the planar conductor IP is not necessarily limited to the example in which it extends to substantially the entire area of the substrate B. The planar conductor IP may be provided in only a part of the substrate B. For example, the wiring W may be provided in a region of the wiring layer Lc where the planar conductor IP of the substrate B is not provided.

The substrate B shown in FIG. 4 includes a planar conductor IPa and a planar conductor IPd that are electrically separated from each other. The planar conductor IPa can be used as an analog ground, for example, and the planar conductor IPd can be used as a digital ground, for example. As shown in FIG. 4 , the substrate B may also include a plurality of planar conductors IP that are insulated from each other.

The wiring W41, W42, and W43 are one wiring in which the wiring W41, the wiring W42, and the wiring W43 of the wiring layer L4 are connected. However, for convenience of explanation, each part of one wiring W41, W42, and W43 is called wiring W41, W42, and W43. Wiring W42 and wiring W43. Similarly, wiring W44 and W45 are one wiring in which wiring W44 and wiring W45 are connected, and wiring W44 and wiring W45 are parts of wiring W44 and W45 respectively.

In addition, the substrate B is provided with through holes V11 to V17 penetrating the substrate B1, through holes V21 to V27 penetrating the substrate B2, and through holes V31 to V36 penetrating the substrate B3. Through-holes V41 to V45 penetrating the substrate B4 are provided, and through-holes V51 to V57 penetrating the substrate B5 are provided.

The conductive structure information D1 that has been stored in the storage unit 34 includes the representation The conductive parts P1 to P7, the conductive parts P11 to P17, the wiring W11, the wiring W12, the wiring W21, the wiring W22, the wiring W41 to the wiring W45, the through holes V11 to the through holes V17, the through holes V21 to the through holes V27, through hole V31~through hole V36, through hole V41~through hole V45, through hole V51~through hole V57, and information on how the planar conductor IP is connected, such as information indicating the connection relationship as shown in Figure 3 .

Hereinafter, the conductive portions P1 to P7, P11 to P17, and other conductive portions are collectively referred to as the conductive portion P, and the wirings W11, W12, W21, W22, W41 to W45, and other wirings are collectively referred to as wirings. W, the through hole V11~through hole V17, the through hole V21~the through hole V27, the through hole V31~the through hole V36, the through hole V41~the through hole V45, the through hole V51~the through hole V57, etc. are collectively called the through hole V, and The wiring layer L1, the wiring layer L2, the wiring layer Lc, and the wiring layer L4 are collectively referred to as the wiring layer L.

The conductive structure information D1 further includes information indicating the thickness, width, length, and resistivity of each wiring W, each through hole V, and each planar conductor IP, and/or information indicating the resistance value of each through hole V, each wiring W, and Information on the sheet resistance value of each planar conductor IP. Thereby, the inspection instruction information generation unit 33 can calculate the resistance value of any conductive path based on the conductive structure information D1.

Furthermore, the data form of the conductive structure information D1 can adopt various forms. The conductive structure information D1 may be, for example, a single data file, may be composed of multiple data files, and may be a data structure without a file form.

Each conductive part P is electrically connected to the planar conductor IP via the through hole V and the wiring W. In this way, the wiring structure in which each conductive part P and the planar conductor IP are electrically connected is generally used for circuit grounding or power supply mode connection purposes. Furthermore, substrate B can of course also include Contains wiring or pads that are not connected to circuit ground or power mode.

When the substrate B is mounted on the substrate fixing device 110, the moving mechanism 125 causes the probes Pr of the measurement part 121 to contact the conductive parts P1 to P7, and the probes Pr of the measurement part 122 to contact the conductive part P1 to the conductive part P7. In the conductive part P11~conductive part P17. Thereby, the measuring part 121 and the measuring part 122 can cause the current I to flow between any pair of conductive parts P, and detect the voltage between the pair of conductive parts P.

In order to measure resistance using a so-called four-terminal resistance measurement method, the measurement sections 121 and 122 can bring the probe Pr for current supply and the probe Pr for voltage measurement into contact with a conductive part P. In order to use a so-called two-terminal resistance measurement method, In the resistance measurement of the measurement method, a probe Pr that serves as both a current supply and a voltage measurement can also be brought into contact with a conductive part P.

The inspection processing part 21 controls the measurement part 121 and the measurement part 122, supplies the electric current I from the power supply part CS (refer FIG. 2) to one of the pair of conductive parts P selected as mentioned later, and passes it through the power supply part. CM (refer to FIG. 2) extracts the current I from the other, thereby supplying the current I between the conductive parts P, detecting the voltage between the conductive parts P, and checking based on the current and the voltage. Substrate B. The inspection processing unit 21 may, for example, perform resistance measurement using a four-terminal resistance measurement method or a two-terminal resistance measurement method based on the current and the voltage, and inspect the substrate B based on the resistance value.

Hereinafter, the case where the inspection processing unit 21 performs current supply and voltage detection by controlling the measurement unit 121 and the measurement unit 122 will only be described as if the inspection processing unit 21 supplies the current and detects the voltage. The details of the operation of the inspection processing unit 21 will be described later.

Next, the operation of the inspection instruction information generating device 3 will be described. The description will be given as an example of generating inspection instruction information corresponding to the substrate B shown in FIG. 3 . Hereinafter, the operation of the inspection instruction information generation device 3 that executes the inspection instruction information generation method based on the inspection instruction information generation program according to an embodiment of the present invention will be described with reference to FIGS. 5 to 8 .

In addition, in the following flowcharts, the same step numbers are assigned to the same processing, and the description thereof is omitted.

First, the simplification processing unit 31 executes a process of simplifying the connection structure represented by the conductive structure information D1 as preprocessing. Specifically, when the wiring W of a plurality of wiring layers L is connected in parallel, the simplification processing unit 31 copies and changes the conductive structure information D1 in such a way that the parallel-connected wiring W is replaced with one wiring W, thereby The simplified conductive structure information D1' is generated (step S1: simplification processing).

Specifically, in the conductive structure information D1 shown in FIG. 3 , the wiring W11 and the wiring W21 of the wiring layers L1 and L2 are connected in parallel by the through holes V21 and V22. In this case, with respect to the conductive structure information D1, as shown in FIG. 5 , the two wires W11 and W21 are replaced with, for example, one wire W11 closest to the substrate surface F1 among the wires W11 and W21, resulting in simplification. Conductive structure information D1'. At this time, one end of the through hole V22 becomes open, so in the data, it can also be regarded as processing that the through hole V22 does not exist. This simplifies the wiring structure of the substrate B, making subsequent processing easier.

Next, when the through-holes V or the rows of the through-holes V are connected in parallel by the wiring W and the planar conductor IP, the parallel-connected The through-hole V or the row of through-holes V is replaced with one through-hole or a row of through-holes, and the simplified conductive structure information D1' is changed (step S2: simplification processing).

Specifically, in the conductive structure information D1 shown in FIG. 3 , the vias V24 and V33 are connected in series to form a row, and the vias V25 and V34 are connected in series to form a row. Furthermore, the rows of via holes V24 and via holes V33 are connected in parallel to the rows of via holes V25 and via holes V34 by the wiring W12 and the planar conductor IP. In addition, the through hole V32 and the through hole V33 are connected in parallel by the wiring W22 and the planar conductor IP.

In this case, for example, as shown in FIG. 5 , for the simplified conductive structure information D1 ′, the rows of vias V24 and V33 and the rows of vias V25 and V34 are replaced with any row, for example, with vias In the rows of V24 and through hole V33, the through hole V32 and the through hole V33 are replaced with one through hole V, for example, replaced with the through hole V32.

In addition, in the conductive structure information D1 shown in FIG. 3 , the through hole V41 and the through hole V42 are connected in parallel by the series wiring of the wiring W41 , the wiring W42 , and the wiring W43 and the planar conductor IP. In this case, for example, as shown in FIG. 5 , in the simplified conductive structure information D1 ′, the through hole V41 and the through hole V42 are replaced by one through hole V, for example, replaced by the through hole V41 . In addition, in the conductive structure information D1 shown in FIG. 3 , the through hole V43 , the through hole V44 , and the through hole V45 are connected in parallel by the wiring W44 , the wiring W45 and the planar conductor IP. In this case, for example, as shown in FIG. 5 , in the simplified conductive structure information D1 ′, the through hole V43 , the through hole V44 , and the through hole V45 are replaced with one through hole V, for example, with the through hole V43 . This simplifies the wiring structure of the substrate B, making subsequent processing easier.

Furthermore, the simplified processing unit 31 is not necessarily required. Steps S1 and S2 may not be executed, but in subsequent processing, the conductive structure information D1 in the data format representing the actual wiring structure of the substrate B shown in FIG. 3 may be used. Replace the simplified conductive structure information D1'.

Then, the tree structure data conversion unit 32 converts the data structure of the simplified conductive structure information D1' into a tree structure (step S3). The simplified conductive structure information D1' that has been converted into a tree structure is called the tree structure conductive structure information D1". As shown in Figure 6, in the tree structure conductive structure information D1", a wiring W consists of a node N Expression, the planar conductor IP is expressed by the root node NR, and the through hole V is expressed as a branch M connecting the conductive part P and the nodes, or a branch M connecting the nodes to each other.

Furthermore, the tree structure data converting unit 32 is not necessarily required. Step S3 may not be executed, but the conductive structure information D1 in the data format representing the wiring structure of the substrate B or the simplified conductive structure information D1' may be used to perform subsequent processing. In the following description, the processing for the node N is the same as the processing for the wiring W corresponding to the node N, the processing for the root node NR is the same as the processing for the planar conductor IP, and the processing for the branch M is the same as for the corresponding The processing of the through hole V of the branch M is the same.

In the example of the tree-structured conductive structure information D1" of the tree structure shown in FIG. 6 , the node N11 corresponds to the wiring W11 (W21), the node N12 corresponds to the wiring W12, the node N21 corresponds to the wiring W22, and the node N41 corresponds to The wiring W41, the wiring W42, the wiring W43, and the node N42 correspond to the wiring W44 and the wiring W45. In addition, the branch M11 corresponds to the through hole V11 (V21), and the branch M12 corresponds to the through hole V12 (V22), branch M13 corresponds to the through hole V14, branch M14 corresponds to the through hole V15, branch M22 corresponds to the through hole V24 (V25), branch Mr1 corresponds to the through hole V31, branch Mr2 corresponds to the through hole V32 (V33), Branch Mr3 corresponds to through-hole V16, through-hole V26, and through-hole V35, branch Mr4 corresponds to through-hole V17, through-hole V27, and through-hole V36, branch M41 corresponds to through-hole V51, branch M42 corresponds to through-hole V52, and branch M43 Corresponding to the through hole V53, the branch M44 corresponds to the through hole V54, the branch M45 corresponds to the through hole V55, the branch M46 corresponds to the through hole V56, the branch M47 corresponds to the through hole V57, the branch Mr5 corresponds to the through hole V41 (V42), the branch Mr6 corresponds to via V43 (V44, V45).

Next, the inspection instruction information generating unit 33 calculates the pair of conductive parts P based on the conductive structure information D1 for all combinations in which the conductive parts P on the substrate surface F1 are paired, that is, the conductive parts P formed on the same substrate surface are paired. The resistance value between P (step S4). Furthermore, in step S4, for all combinations of all conductive portions P of the substrate B, the resistance value between the pair of conductive portions P can be calculated, and the calculated value can be used in step S11 described later.

In addition, for all combinations in which the conductive parts P are paired with each other, the resistance value between the pair of conductive parts P does not need to be calculated. For example, the resistance value may be calculated for a combination in which the distance between a pair of conductive parts P is equal to or less than a predetermined distance. By reducing the number of combinations of calculated resistance values, the processing time is shortened.

Next, the inspection instruction information generating unit 33 sequentially selects pairs of conductive parts starting from the combination with the smallest calculated resistance value obtained in step S4 so that the conductive parts P do not overlap, and records them in the inspection instruction information (step S5: Inspection Instruct information generation and processing). Hereinafter, the resistance value between the conductive parts P1 and P2 is denoted as R(P1, P2), and the resistance value between the conductive parts P3 and P4 is denoted as R(P3, P4)...

For example, in the conductive structure information D1 shown in Figure 3, when the resistance value becomes larger in the order of R(P1, P2), R(P4, P5), R(P6, P7), select the conductive parts P1 and P2 , each pair of conductive parts P4, P5, and conductive parts P6, P7, and record them in the inspection instruction information.

Next, when the number of conductive parts P on the substrate surface F1 is an odd number, the inspection instruction information generating unit 33 selects the pair of conductive parts with the smallest resistance value from the combination including the last remaining conductive part P, and additionally records it in the inspection instruction information. (Step S6).

In the conductive structure information D1 shown in FIG. 3 , the conductive part P3 remains at the end. Therefore, among the combinations including the conductive part P3, as the conductive part pair with the smallest resistance value, for example, the conductive part P3 and the conductive part P4 are selected, and Additional records are added to the inspection instruction information.

Next, the inspection instruction information generating unit 33 calculates the pair of conductive portions P based on the conductive structure information D1 for all combinations in which the conductive portions P on the substrate surface F2 are paired, that is, the conductive portions P formed on the same substrate surface are paired. resistance value between (step S11).

Then, starting from the combination with the smaller calculated resistance value obtained in step S11, the inspection instruction information generating unit 33 sequentially selects the pair of conductive parts so that the conductive parts P do not overlap, and records them in the inspection instruction information (step S12: Check instruction information generation processing).

For example, in the conductive structure information D1 shown in Figure 3, when according to R When the sequential resistance values of (P11, P12), R (P13, P14), and R (P15, P16) become larger, select each pair of conductive parts P11, P12, conductive parts P13, P14, and conductive parts P15, P16, And record it in the inspection instruction information.

Next, when the number of conductive portions P on the substrate surface F2 is an odd number, the inspection instruction information generating unit 33 selects the pair of conductive portions with the smallest resistance value among the combinations including the last remaining conductive portion P, and additionally records it in the inspection instruction information. (Step S13).

In the conductive structure information D1 shown in FIG. 3 , the conductive part P17 remains at the end. Therefore, among the combinations including the conductive part P17 , as the conductive part pair with the smallest resistance value, for example, the conductive part P16 and the conductive part P17 are selected, and Additional records are added to the inspection instruction information.

Then, the inspection instruction information generation unit 33 searches for a conductive portion that is not located in each conductive portion pair selected in steps S5, S6, S12, and S13 based on the tree-structured conductive structure information D1" of the tree structure. Detect leakage via hole on the conductive path from P to another conductive part P (step S14: search processing).

Referring to FIG. 9 , the conductive portions P1 and P2, P4 and P5, P6 and P7, and P3 and P4 are aligned from one conductive portion P to the other. The conductive paths a1 to a4 of one conductive part P, and the conductive parts of the conductive part P11 and the conductive part P12, the conductive part P13 and the conductive part P14, the conductive part P15 and the conductive part P16, and the conductive part P16 and the conductive part P17 The pair of conductive paths b1 to b4 from one conductive part P to the other conductive part P do not include branch Mr1, branch Mr2, branch Mr5, and branch Mr6.

Therefore, the inspection instruction information generation unit 33 detects the branch Mr1, branch Branch Mr2, branch Mr5, and branch Mr6, that is, through hole V31, through hole V32, through hole V41 (V42), and through hole V43 (V44, V45) are used as leak detection through holes.

Then, the inspection instruction information generation unit 33 preferentially selects the pair of conductive parts in the conductive path that includes the detection leakage via hole searched in step S14 in the same substrate plane and in the order of combination with the smallest resistance value, and records it in the inspection instruction. Information is in progress (step S15: conductive part addition processing).

Specifically, the inspection instruction information generating unit 33 first searches for a pair of conductive parts including a detection leakage via hole in the conductive path within the same substrate plane. If no pair is found within the same substrate plane, the search is performed across both sides of the substrate. This gives priority within the same substrate plane.

For example, when selecting a pair of conductive parts including branch Mr1, that is, a through hole V31, in the conductive path, the inspection instruction information generation unit 33 first selects the substrate by preferentially based on the tree structure conductive structure information D1" shown in Fig. 9 Select the conductive part pair from the conductive part P1 to the conductive part P7 on the surface F1.

Specifically, a pair of conductive parts in which one of them is any one of the conductive parts P1 and P2 and the other one is any one of the conductive parts P3 to P7 is selected as the conductive path. Candidates for conductive portion pairs including branch Mr1. Next, the inspection instruction information generating unit 33 selects the conductive part pair with the smallest resistance value, such as the conductive part P1 and the conductive part P6, from the conductive part pairs selected as candidates, and records it in the inspection instruction information. Similarly, as a pair of conductive parts including branch Mr2 in the conductive path, for example, conductive part P3 and conductive part P6 are selected.

Then, as the conductive path including branch Mr5 and branch Mr6 For the electrical part pair, the electrically conductive parts P11 to P17 on the substrate surface F2 are given priority, for example, the electrically conductive part P14 and the electrically conductive part P15 are selected and recorded in the inspection instruction information.

Thereby, the conductive path c1 between the conductive parts P1 and P6 includes the branch Mr1, the conductive path c2 between the conductive parts P3 and P6 includes the branch Mr2, and the conductive part P14 and the conductive part P15 include the branch Mr2. The conductive path d1 between the two substrates includes branches Mr5 and Mr6. Therefore, the substrate inspection device 2 described below performs inspection based on the inspection instruction information obtained in this way, thereby inspecting all the through holes V.

In step S15 , when there is no conductive part pair including the leakage detection via hole in the same substrate surface, the inspection instruction information generating unit 33 generates a conductive part including the conductive part P of the substrate surface F1 and the conductive part P of the substrate surface F2 . For each pair, that is, among the pairs of conductive parts including the leak detection via hole, the pair of conductive parts with the smallest resistance value is selected. Through the above steps S1 to S15, the inspection instruction information D2 shown in FIG. 14 is completed, and the process ends.

According to step S5, step S6, step S12, and step S13, a pair of conductive parts is selected by combining the conductive parts P on the same substrate surface with each other. In addition, according to step S15, pairs of conductive portions within the same substrate surface are preferentially selected. As a result, when the through hole is inspected by measuring the resistance between the pairs of conductive parts indicated by the inspection instruction information obtained in this way, the resistance measurement accuracy is improved as explained below.

That is, when performing resistance measurement between conductive portions on the same surface of the substrate B, as shown in FIG. Therefore, the measurement current can be supplied and the voltage can be detected only by any one of the measurement portion 121 and the measurement portion 122 .

On the other hand, when performing resistance measurement between a pair of conductive parts across both surfaces of the substrate B, it is necessary to use the probe Pr of the measuring jig 4U and the probe Pr of the measuring jig 4L across the measuring parts 121 and The measurement unit 122 supplies measurement current and detects voltage. In this case, compared with the case where resistance measurement is performed between conductive portions on the same plane of the substrate B, the loop formed by the current supply wiring and the voltage detection wiring of the measuring portions 121 and 122 becomes larger. . When the wiring loop is large, electromagnetic noise passing through the wiring loop increases, and the impedance of the wiring loop increases.

In addition, when the voltage between the pair of conductive parts P is detected by flowing a current between the pair of conductive parts P of the substrate B, and the resistance value is measured from the current and the measured voltage according to Ohm's law, the external electromagnetic field acts as noise And overlap with the detection voltage. The external electromagnetic field is applied in a substantially uniform manner on one surface of the substrate B. Therefore, the noise voltage caused by the external electromagnetic field becomes substantially constant on one surface side of the substrate B. Therefore, when the voltage between a pair of conductive portions P in one surface of the substrate B is measured, the noise that overlaps with the measured voltage becomes a common mode. As a result, the noise affects the measured voltage. impact is reduced.

On the other hand, a difference in the intensity of the electromagnetic field applied to the front and back of the substrate B occurs between the two surfaces of the substrate B, and a difference in noise voltage caused by the external electromagnetic field occurs between one surface and the other surface of the substrate B. Therefore, when the voltage between a pair of conductive portions P is measured across both sides of the substrate B, the noise that overlaps with the measured voltage becomes a normal mode. As a result, the noise voltage directly overlaps with the measured voltage. . As a result, compared with the case where the voltage between a pair of conductive parts P is measured on one surface of the substrate B, when the voltage between a pair of conductive parts P is measured across both surfaces of the substrate B, The impact of noise becomes greater.

Therefore, when the conductive part pairs are selected by combining the conductive parts P on the same substrate surface in steps S5, S6, S12, and S13, and the conductive part pairs within the same substrate surface are preferentially selected in step S15, and the resistance between the conductive part pairs indicated by the inspection instruction information obtained in this way is measured to inspect the through hole, the resistance measurement accuracy is improved.

In addition, in step S5, step S6, step S12, step S13, and step S15, combinations of conductive part pairs are selected in order from the combination with the smallest theoretical resistance value between the conductive part pairs. As a result, when the through hole V is inspected by measuring the resistance between the pairs of conductive parts indicated by the inspection instruction information obtained in this way, the inspection accuracy is improved.

That is, when inspecting the through hole V, it is desirable to measure the resistance value of the through hole V itself. However, as shown in FIG. 3 , since both ends of the through hole V are not exposed to the surface of the substrate B, the resistance value of the through hole V itself cannot be directly measured. Therefore, the through hole V is inspected by selecting a pair of conductive parts connected to each other on the conductive path including the through hole V and measuring the resistance value of the entire conductive path.

When such an inspection is performed, the smaller the resistance value of the entire conductive path, the higher the probability that the ratio of the resistance value of the via hole V to the resistance value of the entire conductive path will increase, and the smaller the influence of wiring resistance other than the via hole V will be. Therefore, in steps S5, S6, S12, S13, and S15, the combination of the conductive portion pairs is selected so that the smaller the resistance value between the conductive portion pairs is, the higher the priority is, and the inspection instruction obtained in this way is performed. Check the through hole V by measuring the resistance between the pairs of conductive parts indicated by the information. time, its inspection accuracy is improved.

Furthermore, in step S5, step S6, step S12, and step S13, it is not necessarily limited to the example in which the pair of conductive parts is selected by combining the conductive parts P on the same substrate surface. However, from the point of view of being able to generate inspection instruction information that can easily improve the inspection accuracy of the through hole V, it is more preferable to communicate with each other through the conductive portions P on the same substrate surface in steps S5, S6, S12, and S13. combination to select pairs of conductive parts.

In addition, in step S15, it is not limited to the example of preferentially selecting pairs of conductive portions within the same substrate surface. However, from the viewpoint of being able to generate inspection instruction information that can easily improve the inspection accuracy of the through hole V, it is more preferable to preferentially select pairs of conductive portions within the same substrate surface in step S15 .

However, in the case of inspecting, for example, a through hole of a substrate having four through holes and conductive portions X1 to X4 connected to these through holes, there is a method as follows: fixing one of the pair of conductive portions of the inspection object, such as The conductive part X1 - the conductive part X2, the conductive part X1 - the conductive part X3, the conductive part X1 - the conductive part X4 are the same, and the four through holes are inspected through three resistance measurements.

However, according to steps S5 and S12, a plurality of conductive parts P are combined in a non-overlapping manner, thereby generating inspection instruction information indicating a pair of conductive parts as an inspection part. As a result, when the through hole is inspected based on the inspection instruction information obtained in this way, the number of inspections is reduced compared to the above method. Therefore, it is easy to shorten the inspection time of the through hole.

That is, it can be seen that if a plurality of conductive Ps are combined in a non-overlapping manner, then The conductive part X1 ~ conductive part X4 are divided into two groups: conductive part X1 - conductive part X2 and conductive part X3 - conductive part Reduced, through-hole inspection time is shortened.

In addition, step S3 may not be performed, and the search process of step S14 and the conductive part of step S15 may be performed based not on the tree-like structure conductive structure information D1" of the tree structure, but on the conductive structure information D1 or the simplified conductive structure information D1'. Additional processing. However, if step S3 is executed and steps S14 and S15 are executed based on the tree-structured conductive structure information D1", it is more preferable in that the processing of steps S14 and S15 can be simplified.

In addition, step S1 may not be executed, and step S2 may not be executed. Furthermore, in step S3, the conductive structure information D1 can be converted into tree-structured conductive structure information D1" of a tree structure. However, by performing the simplification processes of steps S1 and S2, the conductive structure information D1 of step S3 can be converted into tree-structured conductive structure information D1". The conversion process of the tree-structure conductive structure information D1" is simplified, and the tree-structure conductive structure information D1" is also simplified. As a result, the processing of steps S14 and S15 based on the tree-structure conductive structure information D1" is simplified. Better at this point.

Furthermore, as shown in FIGS. 10 and 11 , steps S4 and S11 may not be executed. Steps S5a and S12a are performed not in the order of combinations with small resistance values, but in order of the distance between pairs of conductor portions on the substrate surface being short. Select the pair of conductive parts in the order of combination. In addition, steps S5b and S12b shown in FIGS. 12 and 13 can be performed instead of steps S5a and S12a, and regardless of the order of combination, the conductive parts on the same substrate surface are centered so that the conductive parts P do not overlap. The method selects the conductive part pair. In addition, it can In step S6a and step S13a, the pair of conductive parts with the shortest distance between the pairs of conductive parts on the substrate surface is selected instead of the pair of conductive parts with the smallest resistance value.

In this case, the calculation processing of the resistance value in steps S4 and S11 is not required, so the data processing amount of the inspection instruction information generation processing can be reduced. In addition, the shorter the distance between the pairs of conductive parts on the substrate surface, the higher the possibility that the length of the conductive path between the pairs of conductive parts will be short, and therefore the higher the possibility that the resistance value will be low.

Therefore, in steps S6a and S13a, instead of the combination order in which the resistance value is small in steps S6 and step S13, a combination order in which the distance between the pairs of conductive portions on the substrate surface is short is used, thereby enabling steps S4 and S13 to be performed without executing steps S4 and S13. In the case of step S11, the pairs of conductive portions are selected in priority order approximately in the order of combinations with small resistance values.

In addition, the smaller the total number of via holes and the number of wirings included in the conductive path between the conductive portion pairs, the higher the possibility that the conductive path length between the conductive portion pair will be short, and therefore the resistance value will be low. high. The number of wirings corresponds to the number of nodes N (between via V and via V) in the tree structure conductive structure information D1".

Therefore, in step S15a, instead of the combination with a small resistance value in step S15, a combination with a small total number of through holes and the number of wirings included in the conductive path between the conductive parts in the conductive part pair is given priority, thereby eliminating the need for Steps S4 and S11 are executed to select pairs of conductive portions in a priority order that approximates the order of combinations with small resistance values.

Furthermore, after executing steps S1 to S14 shown in FIGS. 7 and 8 , step S15a may be executed instead of step S15. In addition, after executing steps S1 to S14 shown in FIGS. 10 and 11 , step S15 may be executed instead of step S15a.

In addition, in step S15a, the conductive part in the pair of conductive parts may be replaced with The combinations in which the total number of through holes and the number of wirings included in the conductive paths between them are small, and similarly to steps S5a and S12a, the pairs of conductive parts on the substrate surface are selected in the order of the combinations in which the distance between the pairs of conductive parts is short. .

However, the leakage detection through hole is likely to be a through hole between wiring layers far away from the surface layer in a multilayer substrate. The length of the conductive path including the via hole between the wiring layers far from the surface layer has a weaker correlation with the distance between the pairs of conductive portions on the substrate surface than the through hole between layers close to the surface layer.

Therefore, when selecting a pair of conductive portions that include a leakage detection via hole in the conductive path, the order of combinations in which the distance between the pairs of conductive portions on the substrate surface is short is compared to the order in which the conductive portions in the pair are included in the conductive paths. It is preferable to select a pair of conductive parts in a combination order in which the total number of through holes and the number of wirings is small because the possibility of selecting a pair of conductive parts with a small resistance value between the pairs increases.

In addition, in steps S5a and S12a, it is not necessary to follow the order in which the distance between the pairs of conductive parts on the substrate surface is short. Instead, as in step S15a, the path included in the conductive path between the conductive parts in the pair of conductive parts may be used. A combination sequence in which the total number of holes and wiring is small. However, since there is no need to perform a process of searching for a conductive path between the conductive portion pairs, it is more preferable to select the conductive portion pairs in steps S5a and S12a in the order in which the distance between the conductive portion pairs on the substrate surface is short. .

In addition, in steps S6a and S13a, instead of selecting the pair of conductive parts with the shortest distance between the pairs of conductive parts on the substrate surface, the number of through holes and wiring included in the conductive paths between the conductive parts in the pair of conductive parts may be selected. The sum of the smallest number of pairs of conductive parts. However, there is never a need for a process of searching for a conductive path between pairs of conductive parts. From this point of view, it is more preferable to select the pair of conductive parts with the shortest distance between the pairs of conductive parts on the substrate surface in steps S6a and S13a.

FIG. 14 is an explanatory diagram in a table format showing an example of the inspection instruction information D2 recorded as described above. The inspection instruction information D2 obtained in this way is sent to the substrate inspection device 2 using, for example, a communication circuit (not shown), or the inspection instruction information D2 is stored in a storage medium such as a USB memory, and the substrate inspection device 2 reads the storage medium. , thereby being able to be stored in the storage unit 22 .

Next, the operation of the above-described substrate inspection device 2 will be described with reference to FIG. 15 . Hereinafter, description will be given as an example in which the storage unit 22 stores the inspection instruction information D2 shown in FIG. 14 .

First, the inspection processing unit 21 reads out information indicating pairs of conductive parts corresponding to one pair from the inspection instruction information D2 (step S21). Next, the inspection processing unit 21 measures the voltage V between the read pair of conductive parts while supplying a measurement current of the current value I between the pair of read conductive parts (step S22). Next, the inspection processing unit 21 calculates the resistance R between the pair of conductive parts to be inspected based on the current value I and the voltage V such that R=V/I (step S23).

For example, the inspection processing unit 21 reads out the first pair of conductive parts P1 and P2 from the inspection instruction information D2 shown in FIG. 14 , flows a measurement current into the conductive path a1 between the pair of conductive parts P1 and P2, and calculates the pair of conductive parts P1 , the resistance R between P2 (step S21~step S23).

Next, the inspection processing unit 21 inspects whether the resistance R is within the range of a preset judgment standard (step S24). The judgment standard may be, for example, the inspection target The calculated resistance value between pairs of conductive parts ranges from -10% to +10%.

If the resistance R is within the range of the determination criterion (YES in step S24), the inspection processing unit 21 determines that the through hole V between the pair of conductive parts to be inspected is normal (step S25), and proceeds to step S27. For example, if the pair of conductive parts P1 and P2 is the inspection target, the inspection processing unit 21 determines that the through holes V11, V21, V12, and V22 corresponding to the branches M11 and M12 on the conductive path a1 are normal. Furthermore, it is not necessary to determine the through hole V, as long as it is judged as normal between the pairs of conductive parts to be inspected.

On the other hand, if the resistance R is outside the range of the determination criterion (NO in step S24), the inspection processing unit 21 determines that the conductive path between the pair of conductive parts to be inspected is defective (step S26), and proceeds to Go to step S27. For example, if the pair of conductive parts P1 and P2 is the inspection target, the inspection processing unit 21 determines that the conductive path a1 is defective.

In step S27, the inspection processing unit 21 checks whether all pairs of conductive parts of the inspection instruction information D2 have been inspected (step S27). If there are still uninspected pairs of conductive parts (NO in step S27 ), the inspection processing unit 21 reads out the new pair of conductive parts from the inspection instruction information D2 (step S28 ), and repeats steps S22 to S27 again.

Repeating the above steps, if all conductive part pairs of the inspection instruction information D2 have completed inspection (YES in step S27), the inspection processing unit 21 ends the inspection process.

According to the processing of steps S21 to step S28, the conductive paths a1 to a4, the conductive paths b1 to b4, the conductive paths c1, the conductive path c2 and the conductive path d1 corresponding to all pairs of conductive parts shown in FIG. 14 are measured. Resistance value R, And the via holes V included in the conductive paths a1 to a4, b1 to b4, c1, c2 and d1 can be checked based on the resistance value R.

That is, an inspection instruction information generating device according to an example of the present invention is an inspection instruction information generating device for inspecting a substrate having a pair of front and back substrate surfaces provided with a plurality of conductive portions, and is laminated on the pair of substrate surfaces. A wiring layer is a layer between the substrate surfaces, and a through hole connects the wiring of the wiring layer to the conductive part. The inspection instruction information generating device includes a storage unit that stores the conductive part indicating the substrate. , the conductive structure information of how the wiring and the through-hole are connected; and the inspection instruction information generation unit performs inspection instruction information generation processing. The inspection instruction information generation processing is based on the conductive structure information, so that the inspection instruction information is formed in the same place. The conductive portions on the substrate surface are combined into pairs, and information representing the combined pair of conductive portions is generated as inspection instruction information.

In addition, an inspection instruction information generating method according to an example of the present invention is a method for generating inspection instruction information for inspecting a substrate having a pair of front and back substrate surfaces provided with a plurality of conductive portions, which are laminated on the substrate. The wiring layer, which is a layer between the pair of substrate surfaces, and the through hole connecting the wiring of the wiring layer and the conductive part, the inspection instruction information generating method executes inspection instruction information generation processing, and the inspection instruction information generates The process is based on the conductive structure information indicating how the conductive portion, the wiring, and the through hole of the substrate are electrically connected, so that the conductive portions formed on the same substrate surface connect the conductive portions to each other in pairs. The parts are combined in pairs, and information representing the combined pair of conductive parts is generated as inspection instruction information.

In addition, an inspection instruction information generating program according to an example of the present invention is an inspection instruction information generating program for inspecting a substrate having a pair of front and back substrate surfaces provided with a plurality of conductive portions, and is laminated on the substrate. The wiring layer is a layer between the pair of substrate surfaces, and a through hole connects the wiring of the wiring layer to the conductive part. The inspection instruction information generation program causes the computer to execute inspection instruction information generation processing. The inspection instruction The information generation process is based on the conductive structure information indicating how the conductive portion, the wiring, and the through hole of the substrate are conductively connected, so that the conductive portions formed on the same substrate surface are paired with each other. The conductive parts are combined in pairs, and information representing the combined pair of conductive parts is generated as inspection instruction information.

According to the above-mentioned device, method and program, through inspection within the same substrate surface, it is possible to generate inspection instruction information indicating an inspection location that is easier to improve the resistance measurement accuracy of the through hole than the method described in the background art.

In addition, it is preferable that the inspection instruction information generating process is a process in which, when combining the plurality of conductive parts in pairs, starting from a pair with a smaller calculated resistance value between a pair of the combined conductive parts. Combined in sequence to generate the inspection instruction information.

The smaller the resistance value between a pair of conductive parts serving as the inspection site, the higher the probability that the ratio of the resistance value of the through hole to the resistance value between the conductive parts increases, and the smaller the influence of wiring resistance other than the through hole. Therefore, the combination of the conductive portion pairs is selected in such a way that the smaller the resistance value between the conductive portion pairs is, the higher the priority, whereby when the resistance measurement between the conductive portion pairs indicated by the inspection instruction information obtained in this way is performed to inspect the through hole, the combination of the conductive portion pairs is selected with priority. Check fine degree increased.

In addition, it is preferable that the inspection instruction information generating process is a process in which, when the plurality of conductive parts are combined in pairs, the distance between the combined pair of conductive parts on the substrate surface is short. The pairs are combined sequentially to generate the inspection instruction information.

The shorter the distance between the pairs of conductive parts on the substrate surface, the higher the possibility that the length of the conductive path between the pairs of conductive parts will be short, and therefore the higher the possibility that the resistance value will be low. In addition, in the process of sequentially combining the conductive parts starting from the pair with a short distance on the substrate surface, there is no need to calculate the resistance value of the conductive path between the pairs of conductive parts, so the processing amount can be reduced. Therefore, according to the above configuration, it is possible to select pairs of conductive portions in a priority order that approximates the order of combinations with small resistance values while reducing the amount of processing.

In addition, it is preferable that the inspection instruction information generating process is a process in which, when the plurality of conductive parts are combined in pairs, the number of through holes included in the conductive path between the pair of the combined conductive parts is determined. Pairs with a smaller total number of wirings are combined sequentially to generate the inspection instruction information.

The smaller the total number of via holes and the number of wirings included in the conductive path between the conductive portion pairs, the higher the possibility that the conductive path length between the conductive portion pair will be short, and therefore the resistance value will be low. . In addition, the process of counting the total number of via holes and the number of wirings included in the conductive path between the conductive parts does not require calculation of the resistance value of the conductive path between the conductive part pairs, so the processing amount can be reduced. Therefore, according to the above configuration, it is possible to select pairs of conductive portions in a priority order that approximates the order of combinations with small resistance values while reducing the amount of processing.

In addition, it is preferable that the inspection instruction information generating unit further executes a search process for searching from one conductive portion to another conductive portion that is not located in each pair combined in the inspection instruction information generation process based on the conductive structure information. a through hole on the conductive path of the part; and a conductive part additional process, when a through hole that is not located on the conductive path is found in the search process, select the through hole that contains the discovered through hole based on the conductive structure information. A pair of conductive parts at both ends of the conductive path, and information indicating the pair of conductive parts is added to the inspection instruction information.

According to the above configuration, the possibility of generating uninspected via holes during inspection based on the inspection instruction information is reduced.

In addition, it is preferable that the conductive portion adding process is a process of selecting a pair of conductive portions from a pair of conductive portions located at the two ends that satisfies a condition that a calculated resistance value between the conductive portion pairs is the smallest.

According to the above configuration, even for the conductive portion pairs added by the conductive portion addition processing, the conductive portion pairs with the smaller calculated resistance values between the conductive portion pairs are selected. Therefore, the conductive portions indicated by the inspection instruction information are selected. When through-hole inspection is performed by measuring the resistance between pairs, the inspection accuracy is improved.

In addition, it is preferable that the conductive portion adding process is a process of selecting a pair of conductive portions that satisfies a condition that the distance on the substrate surface is the shortest from a pair of conductive portions located at the both ends.

According to the above configuration, even for the conductive part pairs added by the conductive part addition processing, the conductive part pairs with the smaller calculated resistance values between the conductive part pairs are approximately selected. Therefore, the inspection instruction information indicates Resistance measurement between pairs of conductive parts When inspecting through holes, the inspection accuracy is improved.

In addition, preferably, the conductive portion adding process is a process of selecting, from a pair of conductive portions located at both ends, a total number of through holes and a number of wirings included in the conductive path between the conductive portions. Minimal conditions for conductive parts.

According to the above configuration, even for the conductive part pairs added by the conductive part addition processing, the conductive part pairs with the smaller calculated resistance values between the conductive part pairs are approximately selected. Therefore, the inspection instruction information is performed before the conductive part pairs are added. When through-hole inspection is performed by measuring the resistance between pairs of conductive parts, the inspection accuracy is improved.

In addition, it is preferable that the conductive portion adding process is a process of preferentially selecting a conductive portion that satisfies the condition among a pair of conductive portions formed on the same substrate surface among a pair of conductive portions located at both ends. Right.

Compared with measuring resistance across both sides of the substrate, measuring resistance within one face of the substrate is less susceptible to noise, so the accuracy of the resistance measurement is improved. According to the above configuration, a pair of conductive portions formed on the same substrate surface is preferentially selected, so it is easy to improve the accuracy of inspection based on the inspection instruction information obtained in this way.

In addition, preferably, the substrate further includes a plurality of wiring layers and a plurality of through holes connecting the plurality of wiring layers, and the inspection instruction information generating device further includes a simplified processing unit that executes Simplification processing, which changes the conductive structure information and the inspection instruction information by replacing the plurality of parallel-connected wirings with one wiring when the wirings of the plurality of wiring layers are connected in parallel. The generation unit performs the above-mentioned conductive structure information based on the simplified processing Describe the search process.

According to the above configuration, since the conductive structure information is simplified and the search process is performed based on the simplified conductive structure information, the search process becomes easy.

In addition, it is preferable that the simplified process further includes a process of: when the via holes or rows of via holes are connected in parallel by wiring of the plurality of wiring layers, the via holes connected in parallel are Or the conductive structure information is changed by replacing the row of via holes with one via hole or a row of via holes.

According to the above configuration, since the conductive structure information is simplified and the search process is performed based on the simplified conductive structure information, the search process becomes easy.

In addition, it is preferable that the inspection instruction information generating device further includes a tree structure information conversion unit that associates the wiring with the node and the through hole with the branch. The planar conductor corresponds to the root node, and the conductive structure information that has been subjected to the simplified process is converted into a data structure of a tree structure. The inspection instruction information generation unit is based on the conductive structure converted into the data structure of the tree structure. information to perform the search processing described.

According to the above configuration, the conductive structure information is converted into tree structure data and simplified, and the search process is performed based on the simplified conductive structure information, so the search process becomes easy.

In addition, the substrate inspection system of the present invention includes: the above-mentioned inspection instruction information generating device; and a substrate inspection device that performs inspection of the through hole based on the inspection instruction information generated by the inspection instruction information generating device.

According to the above configuration, the representation-based method is easier to use than the method described in the background art. It is easy to improve the resistance measurement accuracy of the through hole by using the inspection instruction information of the inspection part to easily improve the resistance measurement accuracy of the through hole.

The inspection instruction information generating device, the inspection instruction information generating method, and the inspection instruction information generating program configured in this way can generate inspection instruction information indicating an inspection portion that can easily improve the resistance measurement accuracy of a through hole. In addition, the substrate inspection system having such a structure can easily improve the resistance measurement accuracy of through holes.

This application is based on Japanese Patent Application No. 2018-211079 filed on November 9, 2018, and its contents are included in this application. Furthermore, the specific embodiments or examples performed in one of the modes for carrying out the invention are always those that clarify the technical content of the invention, and the invention should not be narrowly limited to such specific examples. to explain.

1:Substrate inspection system

2:Substrate inspection device

3: Check the instruction information generating device

4U, 4L: Measuring fixture

20:Control Department

21:Inspection Processing Department

22:Storage Department

31: Simplified processing department

32:Tree structure data conversion department

33: Inspection instruction information generation department

34:Storage Department

110:Substrate fixing device

112:Frame

121:Measurement Department

122:Measurement Department

125:Mobile mechanism

B:Substrate

D1: Conductive structure information

D2: Check instruction information

Pr: probe

Claims (14)

An inspection instruction information generating device includes a storage unit that stores conductive structure information indicating how conductive parts, wiring and through holes of a substrate are connected. The substrate includes: a pair of front and back substrate surfaces provided with a plurality of conductive parts. ; The wiring layer is a layer laminated between the pair of substrate surfaces; and the through hole connects the wiring of the wiring layer to the plurality of conductive parts; and the inspection instruction information generating unit is based on the Conductive structure information, perform inspection instruction information generation processing, the inspection instruction information generation processing includes: pairing the conductive portions formed on the substrate surface, combining the plurality of conductive portions in pairs, and generating an indication The information of the combined pair of conductive parts is used as inspection instruction information. The inspection instruction information generation process is as follows: when the plurality of conductive parts are combined in pairs, from the combined pair of conductive parts Pairs with smaller calculated resistance values between them are combined sequentially, thereby generating the inspection instruction information. As for the inspection instruction information generation device described in item 1 of the patent application, the inspection instruction information generation unit further performs: search processing: based on the conductive structure information, search is not located in the inspection instruction information generation process. Through-holes on the conductive path from one conductive part to the other conductive part of each pair of combinations; and conductive part addition processing, when the through-hole on the conductive path is found in the search process, based on the The conductive structure information selects a pair of conductive parts located at both ends of the conductive path including the discovered via hole, and adds information indicating the pair of conductive parts to the inspection instruction information. The inspection instruction information generating device as described in claim 2 of the patent application, wherein the conductive portion addition processing is the following process: selecting from a pair of conductive portions located at the two ends that satisfies the computational requirements between the conductive portion pairs. The pair of conductive parts under the condition of minimum resistance value. The inspection instruction information generating device as described in claim 2, wherein the conductive portion addition process is the following process: selecting the shortest distance on the substrate surface from a pair of conductive portions located at the two ends. The conductive part of the condition is right. The inspection instruction information generating device as described in claim 4 of the patent application, wherein the conductive part addition processing is the following processing: from a pair of conductive parts located at the two ends, select a conductive path that satisfies the conductive path between the conductive parts. A pair of conductive parts that contains the smallest total number of via holes and wiring. The inspection instruction information generating device as claimed in claim 3, wherein the conductive portion adding process is the following process: conductive portions formed on the same substrate surface among a pair of conductive portions located at the two ends are conductive to each other. Among the pairs of conductive parts, the pair of conductive parts that meet the above conditions is preferably selected. The inspection instruction information generating device according to claim 4, wherein the conductive portion adding process is the following process: conductive portions formed on the same substrate surface among a pair of conductive portions located at the two ends are conductive to each other. Among the pairs of conductive parts, the pair of conductive parts that meet the above conditions is preferably selected. The inspection instruction information generating device as claimed in claim 5, wherein the conductive portion adding process is the following process: conductive portions formed on the same substrate surface among a pair of conductive portions located at the two ends are conductive to each other. Partially aligned, preferred Select a pair of conductive parts that satisfies the above conditions. The device for generating inspection instruction information as described in Item 3 of the patent application, wherein the substrate includes: a plurality of wiring layers and a plurality of through holes connecting the plurality of wiring layers, wherein the inspection instruction information is generated The device further includes the following processing: when the through-holes or rows of through-holes are connected in parallel, changing the through-holes or rows of through-holes in parallel by replacing them with one through-hole or a row of through-holes. The conductive structure information. The inspection instruction information generating device as described in Item 4 of the patent application, wherein the substrate includes: a plurality of wiring layers and a plurality of through holes connecting the plurality of wiring layers, wherein the inspection instruction information is generated The device further includes the following processing: when the through-holes or rows of through-holes are connected in parallel, changing the through-holes or rows of through-holes in parallel by replacing them with one through-hole or a row of through-holes. The conductive structure information. The device for generating inspection instruction information as described in Item 5 of the patent application, wherein the substrate includes: a plurality of wiring layers and a plurality of through holes connecting the plurality of wiring layers, wherein the inspection instruction information is generated The device further includes the following processing: when the through-holes or rows of through-holes are connected in parallel, changing the through-holes or rows of through-holes in parallel by replacing them with one through-hole or a row of through-holes. The conductive structure information. A substrate inspection system, including: an inspection instruction information generating device as described in any one of items 1 to 11 of the patent application scope; and a substrate inspection device based on the inspection instruction information generated by the inspection instruction information generating device , perform inspection of the vias. A method for generating inspection instruction information, including: performing inspection instruction information generation processing based on conductive structure information indicating how conductive parts, wiring, and through holes of a substrate are electrically connected, wherein the substrate includes: a pair of front and back substrate surfaces, provided There are a plurality of conductive parts; a wiring layer, which is a layer laminated between the pair of substrate surfaces; and the through hole, which connects the wiring of the wiring layer to the plurality of conductive parts, wherein the inspection instruction The information generation process includes: pairing the conductive portions formed on the substrate surface, combining the plurality of conductive portions two by two, and generating information representing the combined pair of conductive portions as inspection instruction information. , the inspection instruction information generation process is the following process: when the plurality of conductive parts are combined in pairs, the combination is sequentially started from the pair with the smaller calculated resistance value between the combined pair of conductive parts, The inspection instruction information is thereby generated. A program for generating inspection instruction information enables a computer to perform inspection instruction information generation processing based on the conductive structure information indicating how the conductive parts, wiring and through holes of the substrate are connected, wherein the substrate comprises: a pair of substrate surfaces, front and back, on which a plurality of conductive parts are arranged; a wiring layer, which is a layer stacked between the pair of substrate surfaces; and the through holes, which connect the wiring of the wiring layer to the plurality of conductive parts, wherein the inspection instruction information generation program is used to generate the inspection instruction information. The production process includes: making the conductive parts formed on the substrate surface form pairs, combining the plurality of conductive parts in pairs, and generating information indicating the combined pair of conductive parts as inspection indication information. The inspection indication information generation process is as follows: when combining the plurality of conductive parts in pairs, the plurality of conductive parts are combined in sequence starting from the pair with the smallest calculated resistance value between the combined pair of conductive parts, thereby generating the inspection indication information.

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