TWI807784B - Load board providing apparatus and load board providing method thereof - Google Patents

Abstract

A load board providing apparatus includes a device main body and a board- moving device. The device main body includes an entry, an exit and a containing space, in which the entry used to contain a conveying device, the exit is nearly connected to a chip picking-placing device, and the containing space is disposed between the entry and the exit. The board-moving device includes a bearing platform, an object-taking arm, a first sensor and a second sensor. The object-taking arm is disposed on the bearing platform. The first sensor is fixed on one end of the object-taking arm, and the second sensor is fixed on the bearing platform. When the conveying device is disposed at the entry, the first sensor detects the position of the load board, and the object-taking arm hooks the load board for detecting the barcode by the second sensor. After the second sensor detects the barcode on the load board, the object-taking arm hooks the load board to the chip picking-placing device.

Description

Carrier supplying device and carrier supplying method thereof

The present invention relates to a carrier supply device and its supply method, in particular to a carrier supply device and its supply method capable of automatically hooking a carrier on a transport device to a wafer pick-and-place device.

The burn-in test is used in the second half of the test process of the integrated circuit to test whether the chip is flawed, and the defective chip will show its short life cycle characteristics early in the process of the burn-in test. The existing avalanche test method is mainly to place the wafer to be tested on a specific carrier, and then send the carrier to the avalanche test furnace, heat the wafer at a specific time and temperature, and conduct an electrical test.

Before the crash test, due to the large number of wafers to be tested and the different test conditions required for wafers used in different products, the wafer pick-and-place device is currently used to assist in placing the wafers to be tested on the carrier. However, the work of moving the carrier board to the wafer pick-and-place device and removing the wafer-placed carrier board still requires manpower. In addition to easily causing fatigue, human errors may also cause carrier board or wafer pick-and-place errors when replacing different batches and types of wafers for pick-and-place. Therefore, there is still a need for a carrier mobile device to solve the problems encountered in the prior art.

According to the problems faced by the prior art, the object of the present invention is to provide a carrier board supply device, which can automatically transfer the carrier board on the transport device to the wafer pick-and-place device, reducing the consumption of manpower.

Another object of the present invention is to provide a carrier plate supply method through the carrier plate supply equipment, which can avoid errors caused by human operation.

In order to achieve the above purpose, the present invention provides a carrier board supply device for transferring the carrier board from the transport device to the wafer pick-and-place device. The carrier board supply device includes a device body and a carrier board removal device. The equipment body includes an entrance, an exit and an accommodating space. The entrance is used to accommodate the conveying device, the exit is adjacent to the wafer pick-and-place device, and the accommodating space is located between the entrance and the exit. The carrier board removal device is arranged in the accommodating space, and is used for picking up the carrier board from the conveying device through the inlet, and hooking the carrier board through the outlet to the wafer pick-and-place device. The carrier removing device includes a carrying platform, an object picking arm, a first sensor and a second sensor. The bearing platform is fixed in the accommodation space. The pick-up arm is arranged on the carrying platform and can move back and forth between the entrance and the exit. The first sensor is fixed at one end of the pick-up arm facing the entrance, and is used for sensing the position of the carrier on the conveying device. The second sensor is fixed on the carrying platform and is used for sensing the barcode on the carrying plate. Wherein the picking arm, the first sensor and the second sensor are electrically connected to the processor. When the transporting device is accommodated at the entrance, the first sensor senses the position of the carrier on the transporting device and sends a first signal to the processor. The processor then controls the picking arm to hook the carrier to the loading platform according to the first signal so that the second sensor senses the barcode on the carrier. The second sensor senses the barcode and sends a second signal to the processor. Wafer pick and place device.

In a preferred embodiment, after the wafer pick-and-place device completes the wafer pick-and-place operation on the carrier, the processor controls the pick-up arm to hook the carrier through the outlet to the loading platform, and the processor controls the pick-up arm to hook the carrier through the inlet to the original position of the carrier on the transport device according to the first signal.

In a preferred embodiment, the pick-up arm can drive the first sensor to move in a direction perpendicular to the loading surface of the loading platform to sense the position of the loading plate.

In a preferred embodiment, the first signal includes the location data of the carrier on the transport device, and the second signal includes the storage path of the chip sorting data on the carrier.

To achieve the above object, the present invention provides a method for supplying a carrier using the above-mentioned carrier moving device, comprising the following steps: providing a conveying device having at least one carrier and accommodating it at the entrance, and setting an outlet adjacent to the wafer pick-and-place device; sensing the carrier in the conveying device through the first sensor; picking the carrier through the entrance to the loading platform; sensing the barcode on the carrier through the second sensor; and picking the carrier through the outlet to the wafer pick-and-place device.

In a preferred embodiment, the carrier board supply method further includes the following steps. When the chip pick-and-place device completes the chip placement operation on the carrier board, it hooks the carrier board through the exit to the carrying platform; and hooks the carrier board through the entrance to the delivery device.

In a preferred embodiment, the processor controls the pick-up arm to hook the carrier board to the original position of the carrier board on the conveying device according to the first signal.

In a preferred embodiment, in the step of sensing the carrier in the conveying device through the first sensor, if no carrier is sensed, then controlling the pick-up arm to drive the first sensor to move, and implementing the step of sensing the carrier in the conveying device through the first sensor until the first sensor senses the carrier.

According to the above, the carrier board supply device has a first sensor to sense the position of the carrier board in the transport device and send a first signal to the processor. When the carrier board is hooked onto the carrier platform, the second sensor senses the barcode on the carrier board and sends the second signal to the processor. When the carrier board is hooked to the wafer pick-and-place device, the processor simultaneously sends the second signal to the wafer pick-and-place device. In this way, the operator only needs to dock the conveying device loaded with multiple empty boards to the entrance of the board supply equipment, and the movement of the boards can be automatically completed by the board supply equipment, thus reducing manpower consumption. In addition, since the movement of the carrier is automatically performed by the carrier supply equipment, it is also possible to avoid carrier movement errors caused by operators, and greatly improve the accuracy of wafer pick-and-place of the wafer pick-and-place device to improve work efficiency.

10: Carrier board supply equipment

11: Equipment body

111: Entrance

112: export

113:Accommodating space

12: Carrier removal device

121: Retrieval arm

1211: hook claw

122: Bearing platform

123: The first sensor

124: Second sensor

13: Processor

20: Transport device

21: carrier board

211: barcode

212: chip slot

213: Groove

30: Wafer pick-and-place device

40: Database

D1: Direction

S101~S107, S201~S202: steps

1 is a schematic perspective view of a carrier supply device according to an embodiment of the present invention; FIG. 2 is a schematic cross-sectional view of a carrier supply device according to the embodiment of FIG. 1; FIG. 3 is a partial top view of a carrier according to the embodiment of FIG. 2; FIG. The embodiment of FIG. 5 shows the carrier board picking process of the carrier board supply device; and FIG. 7 is the embodiment according to FIG. 6 , showing the flow chart of carrier board movement using the carrier board supply device of the present invention.

The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only directions referring to the attached drawings. Accordingly, the directional terms used are for the purpose of illustration and not for the purpose of limiting the invention. In addition, the XYZ coordinate axes in the drawings are only used to illustrate the embodiments of the present invention, and are not used to limit the patent scope of the present invention.

FIG. 1 is a schematic perspective view showing a carrier board supplying device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional schematic view showing a carrier board supplying device according to the embodiment of FIG. 1 . Please refer to FIG. 1 and FIG. 2 , the carrier supply device 10 includes a device body 11 and a carrier removal device 12 . The carrier board supply device 10 is used to move the carrier board 21 on the transport device 20 to the wafer pick-and-place device 30 , wherein the device body 11 includes an inlet 111 , an outlet 112 and an accommodating space 113 . In this embodiment, the conveying device 20 can be a trolley or other suitable conveying device, and the carrier board 21 can be a crash-response board, a high-temperature and low-temperature test board, or other suitable test boards. The wafer pick-and-place device 30 can place the wafer to be tested on the carrier 21 , wherein the wafer pick-and-place device 30 places the wafer to be tested on the carrier 21 by using a vacuum chuck or other suitable mechanism, for example.

Please continue to refer to FIG. 1 and FIG. 2 , in the carrier board supply equipment 10 , the carrier board removal device 12 is disposed in the accommodating space 113 for picking up the carrier board 21 from the transport device 20 through the inlet 111 , and hooking up the carrier board 21 through the outlet 112 to the wafer pick-and-place device 30 . The carrier removing device 12 includes a picking arm 121 , a carrying platform 122 , a first sensor 123 and a second sensor 124 . In detail, the pick-up arm 121 can be a combination of a mechanical arm and a hook, a combination of a mechanical arm and a vacuum chuck, or other mechanical devices suitable for moving the carrier. The carrying platform 122 is fixed in the accommodating space 113. The carrying platform 122 can be a metal platform and has a carrying capacity. surface, such as made of stainless steel, wherein the carrying surface of the carrying platform 122 is set parallel to the XY plane. The pick-up arm 121 is disposed on the carrying platform 122 and can move back and forth between the entrance 111 and the exit 112 .

Please continue to refer to FIG. 1 and FIG. 2 , the first sensor 123 is used to sense the position of the carrier 21 on the conveying device 20 , and the first sensor 123 is fixed at one end of the pick-up arm 121 facing the entrance 111 . The second sensor 124 is fixed on the carrying platform 122 for sensing the barcode on the carrying plate 21 . In this embodiment, the first sensor 123 can be an infrared sensor or other sensing device capable of sensing the position of an object, and the second sensor 124 can be a visible light barcode sensor, an infrared light barcode sensor or other suitable barcode sensors. 3 is a partial top view of the carrier board according to the embodiment of FIG. 2. Please refer to FIG. 3. The carrier board 21 includes a barcode 211 and a plurality of chip slots 212. The barcode 211 can be used by the second sensor 124 to sense the information contained therein. The barcode 211 is a one-dimensional barcode, a two-dimensional barcode or other barcodes that can contain information. In this embodiment, the barcode 211 includes the storage path of the chip sorting information of the carrier board 21 itself, such as the storage path stored in the database 40 (shown in FIG. 4 ), and the chip slot 212 is used as a position for the chip pick-and-place device 30 to place the chip.

FIG. 4 is a system block diagram showing the electrical connections of components in the carrier board supply device according to the embodiment of FIG. 2 . Please refer to FIG. 2 and FIG. 4 , the first sensor 123 and the second sensor 124 of the picking arm 121 in the board picking device 121 are electrically connected to the processor 13, wherein the processor 13 can be electrically connected to the above-mentioned components in a known wired or wireless manner, and the processor 13 can be a PC, a tablet computer or other equipment, and can also be a single-core or multi-core central processing unit (CPU), digital signal processor (DSP), programmable controller or other suitable data processing devices. Therefore, the present invention does not limit the available types of the processor 13 , nor does it limit whether the processor 13 needs to be disposed in the accommodating space 113 of the device body 11 .

Please continue to refer to FIG. 1 to FIG. 4, when the operator pushes the delivery device 20 to the carrier plate supply device 10 of the present invention and is accommodated in the entrance 111, the processor 13 controls the pick-up arm 121 to move toward the entrance 111. At this moment, the first sensor 123 can sense the position of the carrier board 21 in the transport device 20 and send a first signal to the processor 13 . Here, the first signal includes position data of the carrier board 21 on the conveying device 20 . The processor 13 then controls the picking arm 121 to pick one of the carrier boards 21 to the carrier platform 122 according to the first signal, and the second sensor 124 can sense the barcode 211 on the carrier board 21 and return a second signal corresponding to the carrier board 21 to the processor 13 . Here, the second signal is the storage path of the chip sorting data on the carrier board 21 , for example, the storage path in the database 40 . After receiving the second signal, the processor 13 controls the pick-up arm 121 to hook the carrier 21 to the wafer pick-and-place device 30 and simultaneously transmits the second signal to the wafer pick-and-place device 30 for the wafer pick-and-place device 30 to perform subsequent wafer pick-and-place operations. In this embodiment, the chip pick-and-place device 30 is also electrically connected to the database 40, so the chip pick-and-place device 30 can download the chip sorting data corresponding to the carrier board 21 from the database according to the content of the second signal, and place the chip on the chip slot 212 corresponding to the carrier board 21 according to the chip sorting data. In this way, since the moving operation of the carrier board 21 can be automatically performed by the carrier board supply device 10 of the present invention, manpower consumption can be greatly reduced. In addition, since the wafer pick-and-place operation of the wafer pick-and-place device 30 downloads the wafer sorting data corresponding to the carrier 21 from the database according to the database path obtained by the above-mentioned second signal, the wafer pick-and-place accuracy of the wafer pick-and-place device 30 can be greatly improved, and the overall operation efficiency can be greatly improved.

Please continue to refer to Figures 1 to 4. The carrier 20 is usually loaded with a plurality of carrier boards 21 (as shown in FIG. 2 ). Since each carrier board 21 can accommodate different types of wafers, and the placement position of the carrier board 21 on the carrier device 20 may be related to the process station after the wafer test, the position of each carrier board 21 may not be able to be changed arbitrarily. In the carrier plate supply device 10 of this embodiment, the pick-up arm 121 can also drive the first sensor 123 to move back and forth in a direction perpendicular to the carrying surface of the carrying platform 122, so the first sensor 123 can sense the position of each carrier plate 21 on the conveying device 20. When one of the carrier boards 21 is sensed by the first sensor 123, the first sensor 123 will send a first signal to the processor 13 for processing The processor 13 judges that there is a carrier board 21 at the position of the first sensor 123 according to the first signal, and controls the picking arm 121 to pick up the carrier board 21 . In this way, since the operator no longer needs to manually move the carrier 21 to the wafer pick-and-place device 30, manpower consumption can be reduced. Compared with moving the carrier 21 manually or using a conventional bending robot arm to move the carrier 21, the moving time of the carrier 21 can be further shortened. In addition, it is also possible to prevent the operator from accidentally putting the wrong carrier 21 into the wafer pick-and-place device 30 , causing the wafer pick-and-place device 30 to subsequently place wrong wafers.

5 is a flow chart showing a carrier board supply method using the carrier board supply device of the present invention according to another embodiment of the present invention, and FIGS. 6A to 6C are according to the embodiment of FIG. 5 , showing the carrier board pick-and-place process of the carrier board supply device, wherein the embodiment of FIGS. 6A to 6C uses the same carrier board supply device 10 as that of FIGS. In order to clearly express the carrier board supply method of the present invention, some components are omitted in FIGS. 6A to 6C , and the same components are denoted by the same reference numerals, which will not be repeated here. Please refer to FIG. 1 , FIG. 2 and FIG. 5 , step S101 : provide a conveying device having at least one carrier plate and accommodate it at the inlet, and set the outlet adjacent to the wafer pick-and-place device. In this step, the conveying device 20 has at least one carrier 21 , and the conveying device 20 is accommodated in the entrance 111 of the device body 11 for the pick-up arm 121 to hook the carrier 21 to the carrying platform 122 . In addition, the outlet 112 of the carrier supply device 10 is adjacent to the wafer pick-and-place device 30 for the pick-up arm 121 to hook the carrier 21 to the wafer pick-and-place device 30 .

Please refer to FIG. 5 and FIG. 6A , step S102 : sensing the carrier in the carrier conveying device through the first sensor. In this step, the first sensor 123 is fixed at one end of the pick-up arm 121 facing the entrance 111 , so the first sensor 123 can move along with the pick-up arm 121 to sense the carrier plate 21 on the delivery device 20 . As shown in FIG. 6A , in this embodiment, the pick-up arm 121 can move between the entrance 111 and the exit 112 , for example, along a direction D1 parallel to the XY plane, wherein the pick-up arm 121 is provided with a claw 1211 , The bottom surface of the carrier board 21 has a groove 213 . When the pick-up arm 121 moves along the direction D1 and approaches the conveying device 20 , the first sensor 123 can sense the carrier board 21 on the conveying device 20 .

Please refer to FIG. 5 , FIG. 6A and FIG. 6B , step S103 : sending the first signal to the processor. In this step, when the first sensor 123 senses the presence of the carrier board 21 in the transport device 20, the first sensor 123 sends a first signal to the processor 13, wherein the first signal includes the original position data of the carrier board 21 in the transport device 20, and the processor 13 can temporarily store the position data of the carrier board 21 in a memory module (not shown) electrically connected to the processor 13.

Please refer to FIG. 5 , FIG. 6A and FIG. 6B , step S104 : through the pick-up arm and through the entrance, pick up the carrier plate to the carrier platform. In this step, after receiving the first signal, the processor 13 will control the claw on the pick-up arm 121 to move the carrier 21 from the transport device 20 through the entrance 111 , and move the carrier 21 to the sensing range of the second sensor 124 on the carrier platform 122 . In this embodiment, the processor 13, for example, controls the claw 1211 on the picking arm 121 to hook into the groove 213 on the bottom surface of the carrier 21, and controls the moving of the picking arm 121 so that the barcode 211 on the carrier 21 can enter the sensing range of the second sensor 124.

In addition, please refer to FIG. 2 , FIG. 5 and FIG. 6A , step S107 : drive the first sensor to move through the pick-up arm. As shown in FIG. 2 , multiple carrier boards 21 may be loaded on the conveying device 20 , and there may be a height difference between each carrier board 21 , and each carrier of the conveying device 20 may not necessarily have a carrier board 21 loaded thereon. Therefore, in this step, if the first sensor 123 does not sense the carrier 21, for example, the processor 13 does not receive the first signal within a preset time, the processor 13 can control the pick-up arm 121 to move or rotate in a direction other than D1 until the processor 13 receives the first signal returned by the first sensor 123.

Please refer to FIG. 4 , FIG. 5 and FIG. 6B , step S105 : sensing the barcode on the carrier through the second sensor. In this step, the carrier board 21 has a barcode 211, when the pick-up arm 121 hooks the carrier board 21 to the carrier When the second sensor 124 on the platform 122 is within the sensing range, the second sensor 124 can sense the barcode 211 and send a second signal to the processor, wherein the second signal includes a storage path in the database 40 of chip placement information on the carrier 21 .

Please refer to FIG. 4 , FIG. 5 and FIG. 6C . Step S106 : Pick up the carrier board through the pick-up arm and through the outlet to the wafer pick-and-place device. In this step, when the processor 13 receives the second signal, the processor 13 controls the pick-up arm 121 to hook the carrier 21 to the wafer pick-and-place device 30 through the outlet 112 . In this embodiment, the processor 13 also transmits a second signal to the chip pick-and-place device 30 at the same time. The chip pick-and-place device 30 is electrically connected to the database 40 , and the second signal includes the storage path of the database 40 of the chip placement information on the carrier 21 . In this way, the chip pick-and-place device 30 can download the chip placement information corresponding to the carrier 21 from the database 40 according to the second signal sent by the processor 13 , and perform subsequent chip pick-and-place operations on the carrier 21 according to the chip placement information.

FIG. 7 is a flow chart showing carrier movement using the carrier supply apparatus of the present invention according to the embodiment of FIG. 5 . Please refer to FIG. 6C and FIG. 7 , step S201 is continued from step S106 in FIG. 6 . Step S201: When the wafer pick-and-place device completes the wafer placement operation on the carrier board, hook the carrier board to the carrier platform through the exit. In this step, after the wafer pick-and-place device 30 completes the wafer placement according to the wafer placement information corresponding to the carrier 21 , the processor 13 controls the picking arm 121 to pick the carrier 21 to the carrier platform 122 through the outlet 112 . At this time, the carrier board 21 has finished placing the wafers, so the second sensor 124 is not used to scan the barcode 211 on the carrier board 21 in this process.

Please refer to FIG. 6A , FIG. 6B and FIG. 7 , step S202 : picking up the carrier board through the entrance to the delivery device. In this step, the processor 13 obtains the original position of the carrier 21 on the conveying device 20 according to the content of the aforementioned first signal, so the processor 13 can control the pick-up arm 121 to hook the carrier 21 to the original position on the conveying device 20 through the entrance 111 . In this way, the carrier board supply device 10 can move the next The wafer placement operation is carried out from the board 21 to the wafer pick-and-place device 30, and since the carrier board supply equipment 10 can return the carrier board 21 to the original placement position on the transport device 20, the operator does not need to manually return the carrier board 21 to the transport device 20 after the wafer pick-and-place device 30 completes the wafer placement operation on the carrier board 21, and after completing the wafer placement operation of all the carrier boards 21 in the transport device 20, the operator can directly move the transport device 20 to the next process station, which can greatly save operating time And increase the work efficiency of carrier board supply and chip pick-and-place.

To sum up, in the embodiment of the present invention, the carrier board supply device has a first sensor to sense the position of the carrier board in the transport device and send a first signal to the processor. When the carrier board is hooked onto the carrier platform, the second sensor senses the barcode on the carrier board and sends the second signal to the processor. When the carrier board is hooked to the wafer pick-and-place device, the processor simultaneously sends the second signal to the wafer pick-and-place device. In this way, the operator only needs to dock the conveying device loaded with multiple empty boards to the entrance of the board supply equipment, and the movement of the boards can be automatically completed by the board supply equipment, thus reducing manpower consumption. In addition, since the movement of the carrier is automatically performed by the carrier supply equipment, it is also possible to avoid carrier movement errors caused by operators, and greatly improve the accuracy of wafer pick-and-place of the wafer pick-and-place device to improve work efficiency.

But the above is only a preferred embodiment of the present invention, and should not limit the scope of the present invention, that is, all simple equivalent changes and modifications made according to the scope of the patent application for the present invention and the content of the invention are still within the scope of the patent of the present invention. In addition, terms such as "first" and "second" mentioned in this specification or patent application are only used to name components or to distinguish different embodiments or ranges, and are not used to limit the upper limit or lower limit of the number of components.

10: Carrier board supply equipment

11: Equipment body

111: Entrance

112: export

113:Accommodating space

12: Carrier removal device

121: Retrieval arm

122: Bearing platform

123: The first sensor

124: Second sensor

20: Transport device

21: carrier board

30: Wafer pick-and-place device

Claims (8)

A carrier plate supply device is used to move a carrier plate from a conveying device to a wafer pick-and-place device. The carrier plate supply device includes: a device body, including an entrance, an exit, and a storage space, the entrance is used to accommodate the transport device, the exit is adjacent to the wafer pick-and-place device, and the storage space is located between the entrance and the exit; A wafer pick-and-place device, wherein the carrier plate removal device includes: a loading platform, fixed in the accommodating space; a pick-up arm, arranged on the loading platform and capable of moving back and forth between the entrance and the exit; a first sensor, fixed at an end of the pick-up arm facing the entrance, for sensing the position of the carrier board on the conveying device, wherein the pick-up arm drives the first sensor to move in a direction perpendicular to the loading surface of the loading platform to sense the position of the carrier board; and a second sensor. , fixed on the loading platform to sense a code on the loading plate; wherein the pick-up arm, the first sensor and the second sensor are electrically connected to a processor, when the delivery device is accommodated in the entrance, the first sensor senses the position of the loading plate on the delivery device and sends a first signal to the processor, and the processor controls the pick-up arm to hook the loading plate to the loading platform according to the first signal for the second sensor to sense the barcode on the loading board, the second sensing After sensing the barcode, the processor sends a second signal to the processor, and the processor controls the pick-up arm to hook the carrier to the chip pick-and-place device through the outlet, and simultaneously sends the second signal to the chip pick-and-place device. The carrier plate supply device according to claim 1, wherein after the wafer pick-and-place device completes the wafer pick-and-place operation on the carrier plate, the processor controls the pick-up arm to hook the carrier plate to the loading platform through the outlet, and the processor controls the pick-up arm to pick the carrier plate through the inlet to the original position of the carrier plate on the transport device according to the first signal. The carrier board supplying device according to claim 1, wherein the first signal includes the position data of the carrier board on the transport device, and the second signal includes the storage path of the chip sorting data on the carrier board. A carrier board supply method using the carrier board supply device as claimed in claim 1, comprising the following steps: providing a transport device having at least one carrier board and being accommodated in the inlet, and setting the outlet adjacent to a wafer pick-and-place device; sensing the carrier board in the transport device through the first sensor; sending the first signal to the processor; hooking the carrier board to the loading platform through the inlet; sensing the barcode on the carrier board through the second sensor; The method for supplying the carrier board according to claim 4, further comprising the following steps: when the wafer pick-and-place device completes the wafer placement operation on the carrier board, hook the carrier board to the loading platform through the outlet; and hook the carrier board to the transport device through the inlet. The carrier board supply method according to claim 5, wherein the first signal includes position data of the carrier board on the transport device, and the second signal includes storage paths of chip sorting data on the carrier board. The carrier plate supply method according to claim 6, wherein the processor controls the pick-up arm to pick up the carrier plate to the original position of the carrier plate on the transport device according to the first signal. The carrier board supply method as in claim 4, wherein in the step of sensing the carrier board in the transport device through the first sensor, if the carrier board is not sensed, then controlling the pick-up arm to drive the first sensor to move, and implementing the step of sensing the carrier board in the transport device through the first sensor until the first sensor senses the carrier board.

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