TWI805953B - Ball loading method and ball loading device - Google Patents

Abstract

The present invention is a ball mounting method for mounting conductive balls on predetermined electrodes of a wafer (substrate). There is a flux printing process (step S1 to step S4 ) of printing flux (flux) on the electrodes by a gravure offset printing method. There is a ball mounting process (steps S5 to S8 ) of mounting balls on flux. The present invention can provide a ball loading method capable of achieving high-definition ball loading.

Description

Ball loading method and ball loading device

field of invention

The present invention relates to a ball mounting method and a ball mounting device for mounting conductive balls on a substrate.

Background technique

Bumps of electrodes provided on substrates such as silicon wafers and printed wiring boards are formed by mounting conductive balls such as solder balls on electrodes and fusing the balls. When mounting conductive balls, as described in Patent Document 1 and Patent Document 2, flux is applied to electrodes by a screen printing method, and balls are placed on the flux. Patent Document 1 and Patent Document 2 disclose a ball mounting device including a screen printing section for printing flux onto electrodes of a substrate using a mask, and a ball mounting section for mounting balls on the flux.

On the other hand, as described in Patent Document 3 and Patent Document 4, as a technique for forming a wiring pattern on a substrate, a technique of printing a wiring material on a substrate by a gravure offset printing method is known. Patent Document 3 discloses a gravure offset printing method in which ink constituting a wiring material is transferred from a gravure offset printing plate to a substrate through a rubber cylinder. Patent Document 4 discloses a method of printing a fine wiring pattern using the gravure offset printing method of the technology of Patent Document 3. Among the printing methods of wiring, letterpress printing, inkjet printing, gravure printing, screen printing, etc. are used according to the pattern of wiring, production speed, and the like. In cases where fine wiring can be printed and printing accuracy is important, the gravure offset printing method is used.

prior art literature

patent documents

[Patent Document 1] Japanese Patent Laid-Open No. 2019-67991

[Patent Document 2] Japanese Unexamined Patent Publication No. 2008-288515

[Patent Document 3] Japanese Unexamined Patent Publication No. 2014-73653

[Patent Document 4] International Publication No. WO2014/112557

Summary of the invention

In recent years, as electronic components have been miniaturized and densified, electrodes have been formed to be smaller and the intervals (pitches) between electrodes have been shortened. However, in the screen printing method, it is not possible to mount fine ball printing flux in such a narrow pitch range. The reason for this is that there is a limit to improving the accuracy of printing in the screen printing method. Therefore, there is a problem of hindering the production of electronic components intended to be miniaturized and denser in ball mounting devices for printing flux by the screen printing method.

The object of the present invention is to provide a ball loading method and a ball loading device capable of achieving high-definition ball loading.

In order to achieve this object, the ball mounting method of the present invention is a ball mounting method of mounting conductive balls on predetermined electrodes of a substrate, which includes: a flux printing process of printing flux on the electrodes using gravure offset printing. and a ball mounting step of mounting the aforementioned balls on the aforementioned flux.

The ball mounting device of the present invention is a ball mounting device for mounting conductive balls on predetermined electrodes of a substrate, and includes: a gravure offset printing section using a rotary transfer body that transfers flux from a gravure plate for gravure offset printing; Flux is printed on the aforementioned electrodes; and a ball mounting portion for mounting the aforementioned balls on on top of the aforementioned flux.

In the present invention, flux is printed with high precision on the electrodes of the substrate by the gravure offset printing method. Therefore, according to the present invention, it is possible to provide a ball mounting method and a ball mounting device capable of achieving high-definition ball mounting.

1: Ball carrying device

2:Loading & Unloading Department

3: Gravure offset printing department

4: Ball carrying part

6 (6A, 6B): workpiece storage container

8(9): wafer (substrate)

8a: Electrode formation area

8b: electrode

11: Flux

12: ball

13: Transfer robot

14: Pre-aligner

14a: Rotary table

14b: Sensor

15: The first transfer arm

16: The first wafer set-up

16a: adsorption pin

17: The first wafer transfer device

17a: The second conveying arm

17b: X slider

17c: Y slider

18: Sliding member of workpiece table

18a: Support surface

18b: adsorption pin

19: Rubber cylinder (rotary transfer body)

19a: Blanket

20: scraper

20a: blade

21: Edition Slider

22: Dispenser

23: Align the camera

24: Gravure (gravure) for gravure offset printing

24a: Printing area

25: Concave

31: The 2nd wafer setting table

31a: suction pin

32: Second wafer transfer device

32a: The third conveying arm

32b: X slider

32c: Y slider

33: Wafer carrier

33a: upper surface

34: Mask for Ball Arrangement

35: Ball insertion part

36: Brush scraper

41: air hole

42: Attraction chamber

43: Through hole

C1, C2, C3: axes

D: point diameter

L: point spacing

S1 to S4: Steps (Flux Printing Process)

S5 to S8: steps (ball loading process)

S9: step

Fig. 1 is a block diagram showing the structure of a ball loading device implementing the ball loading method of the present invention.

Fig. 2 is a plan view showing the structure of the ball mounting device.

Fig. 3 is a cross-sectional view showing the structure of a ball mounting portion.

FIG. 4 is an enlarged cross-sectional view showing a part of a ball mounting portion.

Fig. 5A is a cross-sectional view for explaining the operation of the gravure offset printing unit.

Fig. 5B is a cross-sectional view for explaining the operation of the gravure offset printing unit.

Fig. 5C is a cross-sectional view for explaining the operation of the gravure offset printing unit.

Fig. 6 is a flow chart for illustrating the ball loading method of the present invention.

Fig. 7 is an enlarged plan view showing the printed flux.

form for carrying out the invention

Hereinafter, an embodiment of a ball loading method and a ball loading apparatus according to the present invention will be described in detail with reference to FIGS. 1 to 7 .

(explanation of the ball carrying device)

The ball loading device 1 shown in FIG. 1 is a device for implementing the ball loading method of the present invention, and mainly has three functional parts. These functional parts are: the loading & unloading part 2 located in the central part of FIG. 1 , the gravure offset printing part 3 located on the left side in FIG. 1 , and the ball mounting part 4 located on the right side in FIG. 1 . Also, the ball carrying device 1 Set up in a clean room or an environment equivalent to a clean room.

The loading & unloading part 2 has the function of taking out the substrate without balls as the workpiece from the workpiece storage container 6, or storing the substrate with the ball loaded into the workpiece storage container 6; Section 4 performs the function of receiving and delivering substrates. The substrate is, for example, a silicon wafer or a printed wiring substrate. The ball mounting device 1 of this embodiment uses a silicon wafer (hereinafter simply referred to as a wafer) as a substrate. As the workpiece storage container 6 for storing wafers, a so-called closed type cassette called FOUP (Front Opening Unify Pod) can be used. The workpiece storage container 6 has a wafer inlet and outlet (not shown) in the vicinity of the loading & unloading unit 2 . The wafer entrance and exit are arranged so as to point to the loading & unloading unit 2 . In this embodiment, as shown in FIG. 2 , a first workpiece storage container 6A for storing a plurality of wafers 8 without balls mounted thereon, and a second workpiece storage container 6B for storing a plurality of wafers 9 with balls mounted thereon are used. .

Although the details of the ball mounting device 1 of this embodiment will be described later, the flux 11 is printed on the electrode formation region 8a of the wafer 8 on which no balls are mounted by using the gravure offset printing method (see FIGS. 5A to 5C ). Ball 12 is mounted on 11 (see FIG. 4 ).

The loading & unloading unit 2 includes, as shown in FIG. 2 , a transfer robot 13 composed of an articulated robot, and a pre-aligner 14 .

The transfer robot 13 includes a first transfer arm 15 that absorbs the lower surface of the wafer 8 to hold the wafer 8 , and transfers the first transfer arm 15 horizontally and vertically to transfer the wafer 8 .

The pre-aligner 14 is for aligning the position of a flat cut (not shown) formed on the outer peripheral portion of the wafer 8 with a predetermined position, and includes: a turntable 14a on which the wafer 8 is placed and rotated; and Sensor 14b for detecting flat cuts.

(Explanation of gravure offset printing department)

As shown in FIG. 2, the gravure offset printing unit 3 is provided with: a first wafer setting table 16 installed near the boundary with the loading & unloading unit 2; Carrying device 17; a workpiece table sliding member arranged near the first wafer transfer device 17 and holding the wafer 8 at the printing position 18; rubber cylinder 19; scraper 20; plate slider 21; and distributor 22, etc. The first wafer stage 16 has three suction pins 16a. The suction pins 16 a have a function of sucking the lower surface of the wafer 8 to hold the wafer 8 and a function of raising and lowering the wafer 8 .

The first wafer transfer device 17 includes: a second transfer arm 17a that sucks the lower surface of the wafer 8 to hold the wafer 8; an X slider 17b that moves the second transfer arm 17a in two horizontal directions; Y slider 17c. Here, the so-called two directions in the horizontal direction refer to the X direction in the direction parallel to the gravure offset printing part 3 and the ball mounting part 4 (the left and right direction in FIG. 1 ), and the Y direction perpendicular to the X direction in the horizontal direction. direction. The X slider 17b moves the Y slider 17c and the second conveyance arm 17a in the X direction. The Y slider 17c moves the second conveyance arm 17a in the Y direction.

The work table slide member 18 has a flat support surface 18a that absorbs and holds the wafer 8, and three lift-type suction pins 18b, and is configured to be movable in the X direction and the Y direction. Above the stage slide member 18, a plurality of alignment cameras 23 capable of photographing the wafer 8 on the stage slide member 18 from above are provided. The stage slider 18 moves in the X direction and the Y direction based on the image of the wafer 8 captured by the alignment camera 23 so that the wafer 8 is arranged at a predetermined printing position.

The blanket cylinder 19 is a cylinder around which a rubber blanket 19a is wound, and has a function of rotating about an axis C1 extending in the X direction, a function of moving in the Y direction, and a predetermined lowering position. And the function of lifting between rising positions. In this embodiment, the blanket cylinder 19 corresponds to the so-called "rotary transfer body" in the present invention. The lowered position of the blanket cylinder 19 is a position where the blanket cylinder 19 comes into contact with the wafer 8 on the stage slide member 18 and the intaglio plate 24 for gravure offset printing on the plate slider 21 which will be described later. The raised position is a position where the blanket cylinder 19 is separated upward from the wafer 8 and the intaglio plate 24 for gravure offset printing. The blanket cylinder 19 of this embodiment is disposed between the work table slide member 18 and the plate slider 21 described later.

The scraper 20 is equipped with the blade 20a comprised from the strip-shaped plate material extended in X direction. The blade 20a can freely swing around an axis 2C extending in the X direction. This scraper 20 has the function that makes this blade 20a shake function, and is configured to move in the Y direction integrally with the blanket cylinder 19. The scraper 20 of this embodiment moves toward one side (upper side in FIG. 2 ) in the Y direction in a state where the lower end of the blade 20a is in contact with the upper surface of the intaglio plate 24 for gravure offset printing described later, and the lower end of the blade 20a touches the upper surface of the gravure offset printing. The intaglio plate 24 for printing moves to the other side (lower side in FIG. 2 ) in the Y direction in a state where the intaglio plate 24 is separated.

The plate slider 21 positions and holds an intaglio plate 24 for gravure offset printing (hereinafter simply referred to as the intaglio plate 24 ) at a predetermined position. As shown in FIG. 5A , the intaglio plate 24 is formed as a flat plate, and recesses 25 are respectively provided on its upper surface at positions corresponding to the plurality of electrodes 8 b of the wafer 8 . The recessed part 25 is formed in the printing area 24a of the intaglio plate 24 (refer FIG. 2). The material forming the intaglio plate 24 is glass, synthetic resin, metal, or the like.

Dispenser 22 for supplying flux 11 to intaglio plate 24 is disposed above plate slider 21 .

Also, as shown in FIG. 2 , the table slide member 18 and the plate slider 21 are arranged in a direction (Y direction) perpendicular to the direction (X direction) in which the gravure offset printing unit 3 and the ball mounting unit 4 are arranged.

(the explanation of the ball carrying part)

As shown in FIG. 2 and FIG. 3 , the ball mounting unit 4 is provided with: a second wafer setting table 31 provided near the boundary with the loading & unloading unit 2; The wafer transfer device 32, the wafer stage 33 provided near the second wafer transfer device 32 and holding the wafer 8 at the ball mounting position, the ball arrangement mask 34, the ball insertion part 35, and the brush wiper Plate 36 et al. The second wafer stage 31 has the same configuration as that of the first wafer stage 16, and has three lift-type suction pins 31a.

The second wafer transfer device 32 has the same configuration as the first wafer transfer device 17 and includes a third transfer arm 32a, an X slider 32b, and a Y slider 32c. The third transfer arm 32 a suctions the lower surface of the wafer 8 to hold the wafer 8 . The X slider 32b moves the Y slide action 32c and the third transport arm 32a in the X direction. The Y slider 32c moves the third conveyance arm 32a in the Y direction.

As shown in FIG. 3, the wafer stage 33 has a flat upper surface 33a, and has a plurality of air holes 41 opened on the upper surface 33a. The air hole 41 communicates with the suction chamber 42 provided under the wafer stage 33 and the space above the wafer stage 33 . An air suction device (not shown) is connected to the suction chamber 42 place. In addition, the wafer stage 33 is provided with a plurality of lift-type suction pins (not shown) in order to receive the wafer 8 without balls from the third transfer arm 32a or transfer the ball-mounted wafer 9 to the third transfer arm 32a. Show).

As shown in FIG. 3 , the ball arrangement mask 34 is formed to cover the wafer stage 33 from above, is arranged above the wafer stage 33 , and is configured to be movable in the vertical direction. The ball arrangement mask 34 has a plurality of through holes 43 into which the balls 12 are inserted, as shown in FIG. 4 . The through-holes 43 are respectively provided at positions corresponding to the plurality of electrodes 8 b of the wafer 8 .

The diameter of the through hole 43 is such that only one ball 12 can be inserted. The thickness of the ball-arranging mask 34 is such that the upper ends of the balls 12 inserted into the through-holes 43 are positioned near the upper surface of the ball-arranging mask 34 . Also, although not shown, a ball suction device that sucks and clears the remaining balls 12 on the ball array mask 34 may be provided near the ball array mask 34 .

The ball insertion part 35 is formed in a cylindrical shape, and is connected to a ball supply device (not shown). The ball 12 is supplied into the ball insertion part 35 from above by the ball supply means. The ball 12 is a conductive ball having conductivity such as a solder ball. Moreover, the ball insertion part 35 has the function of rotating about the axis|shaft C3 extended in the up-down direction, and the function of moving in the X direction, the Y direction, and an up-down direction. A brush scraper 36 is provided at the lower end of the ball insertion portion 35 . The brush scraper 36 is a cylindrical brush whose outer diameter gradually becomes larger as it goes downward.

(the explanation of the ball deployment method)

Next, the ball loading method according to the present invention will be described using the flow chart shown in FIG.

In order to implement the ball mounting method according to the present invention, first, the wafer 8 is transported to the gravure offset printing unit 3 (step S1). In this step, first, the wafer 8 is taken out from the first workpiece storage container 6A by the transfer robot 13 and transferred to the pre-aligner 14 . After the circumferential position of the wafer 8 is corrected by the pre-aligner 14 , the wafer 8 is transferred from the pre-aligner 14 to the first wafer stage 16 by the transfer robot 13 . This transfer is performed by moving back the first transfer arm 15 of the transfer robot 13 with respect to the wafer 8 while holding the wafer 8 by the three suction pins 16a.

Next, the wafer 8 is transferred from the first wafer setting table 16 to the second transfer arm 17a of the first wafer transfer device 17, and then the second transfer arm 17a is moved to the top of the workpiece table slide member 18 Wafer 8 is transferred to work table slide member 18 . When the wafer 8 is transferred from the first wafer stage 16 to the second transfer arm 17a, the second transfer arm 17a is inserted under the wafer 8, and the suction of the three suction pins 16a is released in this state. its down. When transferring the wafer 8 from the second transfer arm 17a to the work table slide member 18, the three suction pins 18b of the work table slide member 18 are raised to push the wafer 8 upward from the second transfer arm 17a. In this state, the second transfer arm 17a is retracted from the wafer 8 . Next, the suction pins 18 b are lowered so that the wafer 8 is placed on the upper surface of the workpiece table slide member 18 while the wafer 8 is suctioned to the suction pins 18 b.

In this way, after the wafer 8 is loaded into the gravure offset printing unit 3, the flux 11 is supplied to the gravure plate 24 (step S2). In this process, first, a predetermined amount of flux 11 is dropped onto the intaglio plate 24 by the dispenser 22 . Then, as shown in FIG. 5A, the blade 20a of the scraper 20 is tilted so that the lower end contacts the gravure plate 24, and the scraper 20 and the rubber cylinder 19 positioned at the raised position face one direction of the Y direction (in the Y direction, the workpiece The direction in which the table slide members 18 separate) moves. At this time, the blade 20a is inclined so that the downstream side of the moving direction is positioned downward. The flux 11 is filled into the concave portion 25 by the blade 20 a traversing the concave plate 24 in the Y direction.

After the scraper 20 moves to one end of the Y direction, shake the blade 20a to separate its lower end from the gravure 24, and position the blanket cylinder 19 at the lowered position, and press it toward the other side of the Y direction while pressing the gravure 24. (towards the direction of the workpiece table slide member 18). At this time, the blanket cylinder 19 rotates by moving in the Y direction while contacting the intaglio plate 24 . Next, as shown in FIG. 5B , the flux 11 in the concave portion 25 is transferred to the squeegee 19 as the squeegee 19 rotates (step S3 ).

By turning the blanket cylinder 19 on the intaglio 24 to the other end in the Y direction, the flux 11 is transferred from the entire recess 25 to the blanket 19 a of the blanket cylinder 19 . Next, the rubber cylinder 19 continues to move in the Y direction, as shown in FIG. 5C , and becomes to rotate on the wafer 8 . By moving the rubber roller 19 toward the other side in the Y direction while rotating on the wafer 8 while pressing the rubber roller 19 toward the wafer 8, the upper surface of the rubber roller 19 is moved. The flux 11 is transferred from the blanket 19a to the electrode 8b of the wafer 8 (step S4). In this embodiment, the steps shown in step S1 to step S4 correspond to the "flux printing step" of the ball mounting method of the present invention.

In this way, after the flux 11 is printed on the wafer 8 by the gravure offset printing unit 3 , the wafer 8 is transported to the ball mounting unit 4 (step S5 ). In this process, first, the wafer 8 on the workpiece table slide member 18 is transferred to the first wafer table 16 by the first wafer transfer device 17, and the wafer 8 is transferred from the first wafer table 16 by the transfer robot 13. The round table 16 is transferred to the pre-aligner 14 . In the pre-aligner 14 , the wafer 8 on which the flux has been printed is rotated to correct the circumferential position of the wafer 8 . Thereafter, the wafer 8 is transferred from the pre-aligner 14 to the ball mounting unit 4 by the transfer robot 13 (step S5 ).

This transfer is to use the transfer robot 13 to transfer the wafer 8 from the pre-aligner 14 to the second wafer stage 31, and then use the second wafer transfer device 32 to enter the wafer 8 into the ball alignment mask. 34 and then transferred to the wafer stage 33 for execution. At this time, the wafer 8 is sucked onto the upper surface 33a of the wafer stage 33 by making the inside of the suction chamber 42 of the wafer stage 33 negative in advance so as to suck air from the air hole 41 . In this way, after the wafer 8 is placed on the wafer stage 33, the ball alignment mask 34 is lowered and attached to the upper surface of the wafer 8 (step S6).

Next, the ball receiving portion 35 is moved onto the ball arrangement mask 34 , and the ball 12 is supplied into the ball receiving portion 35 . Next, the ball receiving part 35 is rotated, and the ball receiving part 35 is moved in the X direction and the Y direction along the ball arrangement mask 34 while the brush scraper 36 wipes the balls 12 . Thus, by operating the ball insertion part 35, as shown in FIG. 4, the ball 12 is inserted into the through-hole 43 of the ball arrangement|mask 34 (step S7). The ball 12 is pressed from above by other balls 12 after being put into the through hole 43 , and adheres to the flux 11 while being slightly pressed against the flux 11 printed on the electrode 8 b. After all the through holes 43 are put into the ball 12, the ball putting part 35 is moved out of the ball arrangement mask 34, and utilizes, for example, a suction device to remove remaining balls remaining on the ball arrangement mask 34. Ball 12. Next, the ball-arranging mask 34 is lifted upward from the wafer 8 (step S8).

Afterwards, the wafer 9 on the wafer stage 33, which has been loaded with balls, is replaced and placed on the second wafer. The third transfer arm 32 a of the wafer transfer device 32 is transferred to the second wafer stage 31 by the second wafer transfer device 32 . Next, the wafer 8 is carried out from the ball mounting unit 4 by the transfer robot 13 (step S9 ) and stored in the second workpiece storage container 6B, whereby the ball 12 is mounted on one wafer 8 . Wafer 9 in second workpiece storage container 6B is provided with wiring in the region where balls 12 are mounted.

In this embodiment, steps S5 to S8 correspond to the "ball mounting step" of the ball mounting method of the present invention.

With the ball mounting method and ball mounting apparatus 1 of this embodiment, when printing flux 11 on electrode 8b of wafer 8, as shown in FIG. The distance L between them is 100 μm or less.

According to the ball mounting method and ball mounting apparatus 1 of this embodiment, the flux 11 can be printed on the electrode 8b of the wafer 8 with high precision by the gravure offset printing method. Therefore, it is possible to provide a ball mounting method and a ball mounting device capable of achieving high-definition ball mounting.

The intaglio plate 24 for gravure offset printing of this embodiment is a lithographic plate. Therefore, the flux 11 can be transferred from the gravure plate 24 to the blanket cylinder 19 with high precision without skewing. Therefore, according to the present embodiment, the flux 11 can be printed on the wafer 8 so that the printing accuracy can be further improved. According to this embodiment, for a workpiece with an electrode outer diameter ψ of wafer 8 of 30 μm, a pitch of 50 μm, and a total pitch of 295 mm (in the effective area of a ψ12-inch wafer), it is possible to print a dot diameter of ψ20 μm and a printing position accuracy of ±5 μm of flux11. In other words, according to this embodiment, printing with a dot diameter of 60 μm or less and a pitch of 100 μm or less, which is the maximum accuracy of conventional screen printing, can be realized.

The gravure offset printing unit 3 of the above-mentioned embodiment performs gravure offset printing using the intaglio plate 24 for gravure offset printing made of a lithographic plate. However, the present invention is not limited thereto. In other words, the gravure offset printing part 3 may use other gravure offset printing methods other than lithographic gravure. Even in such a case, the ball mounting method of the present invention can be implemented by the following steps: while the transfer body (squeegee 19) is brought into contact with the printing pattern portion of the non-lithographic intaglio plate and rotated, the ink material (Flux 11) The process of transferring to the surface of the transfer body; the process of pressing the transfer body to the object to be printed (such as the wafer 8 ) to transfer the printed pattern to the object to be printed; and the process of mounting the ball 12 on the object to be printed.

S1 to S4: Steps (Flux Printing Process)

S5 to S8: steps (ball loading process)

S9: step

Claims (8)

A ball mounting method, which is a ball mounting method of mounting a conductive ball on a predetermined electrode of a substrate, characterized in that it includes a flux printing process, and a gravure offset printing part prints on the electrode by a gravure offset printing method flux; and a ball mounting step in which the ball mounting portion mounts the balls on the flux, the flux printing step includes: a process of holding the substrate at a printing position by a workpiece table sliding member; gravure offset printing by a plate slider A process of positioning and holding at a predetermined position with a gravure; and transferring the flux from the gravure offset printing gravure to a rotary transfer body, and transferring the flux from the rotary transfer body to the electrodes process. The ball loading method according to claim 1, wherein the work table sliding member and the plate slider are arranged in a direction perpendicular to the direction in which the gravure offset printing portion and the ball mounting portion are arranged. The ball mounting method according to claim 1 or 2, wherein the aforementioned solder flux printing process has a process of batch printing the aforementioned solder flux with a dot diameter of ψ20 μm for a total pitch of 295 mm, and the aforementioned ball mounting process has the aforementioned solder flux with a dot diameter of ψ20 μm. On top of the flux, the process of mounting the aforementioned balls in batches. A ball mounting device for mounting conductive balls on predetermined electrodes on a substrate, characterized by comprising: a gravure offset printing section that uses rotary transfer printing to transfer flux from a gravure offset printing gravure a body for printing flux onto the electrodes; and a ball mounting portion for mounting the balls on the flux, the gravure offset printing portion having: The work table slide member holds the substrate at the printing position; and the plate slider holds the intaglio plate for gravure offset printing by positioning it at a predetermined position. The ball loading device according to claim 4, wherein the work table sliding member and the plate slider are arranged in a direction perpendicular to the direction in which the gravure offset printing section and the ball loading section are arranged. The ball carrying device according to claim 4 or 5, wherein the gravure plate for gravure offset printing is a lithographic plate. The ball mounting device according to claim 4 or 5, wherein the solder flux printed on the electrodes has a dot diameter of 60 μm or less and a pitch of 100 μm or less. The ball mounting device as claimed in item 4 or 5, wherein the above-mentioned gravure offset printing part can print out the aforementioned flux with a dot diameter of ψ20 μm in batches for a total pitch of 295 mm, and the aforementioned ball-mounting part is on the aforementioned flux with a dot diameter of ψ20 μm, The aforementioned balls are loaded in batches.

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