TWI753408B - A light-emitting body and light-emitting module - Google Patents

Abstract

The present invention relates to the technical field of light-emitting diode (LED) packaging, and provides a light-emitting body and a light-emitting module, wherein the light-emitting body comprises: an integrated circuit chip with a plurality of electrical contacts on the lower surface; pin electrodes, the pin electrode layers are arranged on the lower surface of the integrated circuit chip, the arrangement positions of the plurality of pin electrodes respectively correspond to the arrangement positions of the plurality of electrical contacts, and at least part of the plurality of pin electrodes respectively have protruding parts, The protruding portion protrudes around the lower surface of the integrated circuit chip; a plurality of light-emitting chips are disposed on the upper surface of the integrated circuit chip and are respectively electrically connected to the integrated circuit chip through the protruding portion; and a packaging structure wraps the plurality of light-emitting chips and the integrated circuit chip The light-emitting module includes the above-mentioned light-emitting body; the light-emitting body and light-emitting module provided by the present invention have the following advantages: the light-emitting body can be made smaller and the volume of the light-emitting body is reduced.

Description

A light-emitting body and light-emitting module

The present invention relates to the technical field of LED packaging, and more particularly, to a light-emitting body and a light-emitting module.

LED (Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into visible light. It can directly convert electrical energy into light and is a green energy source. With the continuous improvement of science and technology and people's living standards, the application fields of LEDs are becoming more and more extensive. In order to save the design space of LEDs, the design of IC (Integrated Circuit, integrated circuit) chips on the application side is slowly changing from the outside of the LED. In order to encapsulate the inside of the LED, and this method has gradually become the mainstream of the market, but to make some smaller-sized LEDs, because the space is too small, the IC chip still cannot be encapsulated inside the LED. The LED is used in some special fields and occasions. usage is greatly restricted.

The purpose of the present invention is to provide a light-emitting body and a light-emitting module to solve the technical problem of the large size of the LED package in the prior art.

In order to achieve the above purpose, the technical solution adopted in the present invention is a luminous body, comprising: an integrated circuit chip, which has an upper surface and a lower surface, and the lower surface has a plurality of electrical contacts; a pin electrode layer has a plurality of pin electrodes , the lead electrode layer is arranged on the lower surface of the integrated circuit chip and the setting positions of the plurality of lead electrodes correspond to the setting positions of the plurality of electrical contacts respectively, and at least part of the plurality of lead electrodes respectively have a protruding portion, the protruding portion protruding from the integrated circuit chip the periphery of the lower surface; a plurality of light-emitting chips disposed on the upper surface of the integrated circuit chip and each electrically connected to the integrated circuit chip through the protruding portion; and a package structure encapsulating the plurality of light-emitting chips and the integrated circuit chip , and the package structure is connected to the lead electrode layer.

In one embodiment, the light-emitting body further includes a bracket on which an accommodating cavity is formed, the bracket has a plurality of metal wirings and the plurality of metal wirings form the lead electrode layer, and the lead electrode layer is exposed to the accommodating cavity , the package structure fills the accommodating cavity.

In one embodiment, the plurality of lead electrodes penetrate through the lead electrode layer, the upper surfaces of the plurality of lead electrodes are exposed on the upper surface of the lead electrode layer, and are respectively electrically connected to the plurality of electrical contacts. The lower surface of the pin electrode is exposed on the lower surface of the pin electrode layer.

In one embodiment, the light-emitting body further includes a bracket having a plurality of metal wirings, and the packaging structure includes an inner packaging layer for wrapping the plurality of light-emitting chips and the integrated circuit chip, and an inner packaging layer for wrapping the inner packaging layer. Outer encapsulation layer, the lower surface of the pin electrode is connected to the plurality of metal wirings of the part, and part of the plurality of pin electrodes protrudes from the periphery of the lower surface of the inner encapsulation layer and is wrapped by the outer encapsulation layer for connecting part of the the plurality of metal wirings.

In one embodiment, the light-emitting chip is electrically connected to the protruding portion of the lead electrode through a bonding wire, and the bonding wire is wrapped by the packaging structure.

In one embodiment, the light-emitting chip is electrically connected to the protruding portion of the lead electrode through a metal post, wherein the packaging structure has an inner packaging layer and an outer packaging layer, and the inner packaging layer wraps the metal post and the integrated circuit chip , the outer encapsulation layer is a light-transmitting layer, wraps the plurality of light-emitting chips and is located on the inner encapsulation layer.

In one embodiment, the surrounding area of the lead electrode layer protrudes from the periphery of the lower surface of the integrated circuit chip, and the package structure adheres to the surrounding area of the lead electrode layer.

In one embodiment, the lead electrode layer has a slice area surrounding the plurality of lead electrodes, the upper surface of the plurality of lead electrodes protrudes from the upper surface of the slice area, and the lower surface of the plurality of lead electrodes is flush on the lower surface of the lamella region.

Another object of the present invention is to provide a light-emitting module, which includes a circuit board and the above-mentioned light-emitting body disposed on the circuit board.

Another object of the present invention is to provide a light-emitting module comprising a plurality of integrated circuit chips, the integrated circuit chip has an upper surface and a lower surface, the lower surface of the integrated circuit chip has a plurality of electrical contacts; a circuit board , has a plurality of setting areas, the setting area has a plurality of lead electrodes, the lower surface of the integrated circuit chip is set in the setting area, and the setting positions of the plurality of lead electrodes in the setting area correspond to the area respectively. The arrangement position of the plurality of electrical contacts of the integrated circuit chip, at least part of the plurality of lead electrodes in the arrangement area each has a protruding portion, and the protruding portion protrudes from the periphery of the lower surface of the integrated circuit chip; a plurality of A light-emitting chip set, the light-emitting chip set has a plurality of light-emitting chips, the plurality of light-emitting chips of the light-emitting chip set are arranged on the upper surface of the integrated circuit chip and respectively pass through the protruding portion of the lead electrode in the setting area The integrated circuit chip is electrically connected; and a package structure wraps the plurality of light-emitting chip groups and the plurality of integrated circuit chips, and the package structure is connected to the circuit board.

The beneficial effects of the luminous body and the light-emitting module provided by the present invention are: compared with the prior art, the luminous body of the present invention does not have a support substrate in structure, so its thickness can be made thinner, while the integrated circuit chip, lead The stacking arrangement between the foot electrode layer and the light-emitting wafer reduces the lateral dimension of the light-emitting body and also reduces the volume of the light-emitting body. Therefore, the light-emitting body can be made smaller through the design of the present invention.

1: Integrated circuit chip

11: Electrical contacts

2: Pin electrode layer

21: Pin electrode

22: slice area

3: Light-emitting chip

4: Package structure

41: Inner encapsulation layer

42: Outer encapsulation layer

5: Bonding wire

6: Metal Column

7: circuit board

8: Illuminator

81: FDI pin

82: VDD pin

83: GND pin

84: DIN pin

85: DO pin

9: Bracket

91: Metal wiring

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the drawings that need to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary knowledge in the field, other schemas can also be obtained based on these schemas without any creative effort.

Fig. 1 is a sectional view of a luminous body provided by an embodiment of the present invention; Fig. 2 is a top view of a luminous body provided by an embodiment of the present invention; Fig. 3 is a sectional view of a luminous body provided by another embodiment of the present invention; Figure 5 is a cross-sectional view of a light-emitting body provided by another embodiment of the present invention; Figure 5 is a cross-sectional view of a light-emitting body provided by another embodiment of the present invention; Figure 6 is a top view of the first light-emitting module provided by another embodiment of the present invention; Figure 7 It is a top view of the second light-emitting module provided by another embodiment of the present invention; FIG. 8 is an enlarged view at "A" in FIG. 4 ; FIG. 9 is an enlarged view at "B" in FIG. 5 ; A cross-sectional view of a light-emitting module provided by an embodiment.

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

It should be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected or indirectly connected to the other element.

It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "level", "top" , "bottom", "inside", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention, rather than indicating that the device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation of the present invention.

Furthermore, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating relative importance or indicating the number of technical features. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined. The specific implementation of the present invention will be described in more detail below with reference to specific embodiments: As shown in FIG. 1 and FIG. 2 , a light-emitting body 8 provided by an embodiment of the present invention includes: an integrated circuit chip 1 having an upper surface and a lower surface , the lower surface has a plurality of electrical contacts 11; the pin electrode layer 2 has a plurality of pin electrodes 21, the pin electrode layer 2 is arranged on the lower surface of the integrated circuit chip 1 and the arrangement positions of the plurality of pin electrodes 21 are respectively Corresponding to the setting positions of the plurality of electrical contacts 11 of the integrated circuit chip 1, at least part of the plurality of pin electrodes 21 each has a protruding portion, and the protruding portion protrudes from the periphery of the lower surface of the integrated circuit chip 1; the plurality of light-emitting chips 3 , disposed on the upper surface of the integrated circuit chip 1 and electrically connected to the integrated circuit chip 1 through corresponding protruding parts, so as to be controlled by the integrated circuit chip 1; and a package structure 4, which wraps the plurality of light-emitting chips 3 and the integrated circuit chip The circuit chip 1, and the encapsulation structure 4 is connected to the lead electrode layer 2, wherein the encapsulation structure 4 is a cured transparent encapsulant for protecting the plurality of light-emitting chips 3 and the integrated circuit chip 1 and allowing the light energy of the plurality of light-emitting chips 3 to be emitted Illuminator 8.

The beneficial effects of the luminous body 8 provided in this embodiment are:

Compared with the prior art, the light-emitting body 8 of the present invention does not have a support substrate in structure, so its thickness can be made thinner, and at the same time, the space between the integrated circuit chip 1 , the lead electrode layer 2 and the light-emitting chip 3 The stacked arrangement reduces the lateral dimension of the luminous body 8, and also reduces the volume of the luminous body 8. Therefore, the luminous body 8 can be made smaller through the design of the present invention.

In addition, the protruding portion facilitates the electrical connection between the light-emitting chip 3 and the pin electrodes 21 of the pin electrode layer 2, so that the light-emitting chip 3 is controlled by the integrated circuit chip 1, and the manufacturing process thereof is simple and convenient.

Wherein, the lead electrode layer 2 is in the shape of a membrane, and the plurality of lead electrodes 21 are made of metal material, which can be pure metal or alloy material, preferably copper; the packaging structure 4 includes but is not limited to silicone glue and epoxy glue. one or a mixture of both, etc.

Specifically, an adhesive is provided between the plurality of electrical contacts 11 of the integrated circuit chip 1 and the lead electrodes 21 . It can be understood that, by providing the adhesive, the plurality of electrical contacts 11 of the integrated circuit chip 1 can be firmly attached to the lead electrodes 21 and are electrically connected to each other.

Finely, the adhesive includes silver paste, flux and solder paste.

As shown in FIG. 3 , in one embodiment, the light-emitting body 8 further includes a bracket 9 on which a accommodating cavity is formed, the bracket 9 has a plurality of metal wirings 91 and the plurality of metal wirings 91 form a pin electrode layer 2 , and the pin electrodes The layers are exposed in the accommodating cavity, and the encapsulation structure 4 fills the accommodating cavity.

As shown in FIG. 4 , the light-emitting body 8 further includes a bracket 9, the bracket 9 has a plurality of metal wirings 91, and the packaging structure 4 includes an inner packaging layer 41 for wrapping the plurality of light-emitting chips 3 and the integrated circuit chip 1, and an inner packaging layer 41 for wrapping the inner packaging The outer package layer 42 of the layer 41, the lower surface of the lead electrode 21 is connected to the plural metal wirings 91 of the part, and the part of the plural pin electrodes 21 protrudes around the lower surface of the inner package layer 41, and is used for connecting the plural metal wirings of the part 91 , for example, the metal wiring 91 of the connection part is connected through the bonding wire 5 , and the lead electrode 21 protruding from the periphery of the lower surface of the inner encapsulation layer 41 is wrapped by the outer encapsulation layer 42 .

In one embodiment, the light-emitting chip 3 is electrically connected to the protruding portions of the lead electrodes 21 through bonding wires 5 , and the bonding wires 5 are wrapped by the packaging structure 4 , for example, by the inner packaging layer 41 as shown in FIG. 4 . In this implementation In the example, the light-emitting chip 3 is electrically connected to the protruding portion of the lead electrode 21 through the bonding wire 5 , which has a simple, stable and reliable structure.

Specifically, the bonding wire 5 includes one of pure gold wire, aluminum wire, copper wire or iron wire, or a mixture of the two.

In one embodiment, the plurality of lead electrodes 21 penetrate through the lead electrode layer 2 , the upper surfaces of the plurality of lead electrodes 21 are exposed on the upper surface of the lead electrode layer 2 and are electrically connected to the corresponding electrical contacts 11 respectively. The lower surface of the pin electrode 21 is exposed to the lower surface of the pin electrode layer 2 for being electrically connected to an external circuit board. It can be understood that the upper surface of the pin electrode 21 is used to electrically connect the electrical contacts 11 of the integrated circuit chip 1, and the lower surface of the pin electrode 21 is used to electrically connect to the external circuit board. The circuit chip 1 , the lead electrode layer 2 and the external circuit board are stacked and arranged, so that the lateral dimension of the entire luminous body 8 can be reduced, and the volume of the luminous body 8 can be reduced.

As shown in FIG. 5 , in one embodiment, the light-emitting chip 3 is electrically connected to the protruding portion of the lead electrode 21 through the metal post 6 .

The encapsulation structure 4 has an inner encapsulation layer 41 and an outer encapsulation layer 42 . The upper surface of the inner encapsulation layer 41 can be arranged with metal lines connected to the metal posts 6 , and a plurality of light-emitting chips 3 are arranged on the upper surface of the inner encapsulation layer 41 and are electrically connected to each other. Metal wiring for easy installation and setup. The inner packaging layer 41 wraps the metal post 6 and the integrated circuit chip 1. In this embodiment, the metal post 6 penetrates the inner packaging layer 41, and its two ends are respectively electrically connected to the light-emitting chip 3 and the protruding part of the lead electrode 21; the outer packaging The layer 42 is a light-transmitting layer, wraps the plurality of light-emitting chips 3 and is located on the inner packaging layer 41 . In this embodiment, the metal post 6 and the integrated circuit chip 1 are supported through the inner packaging layer 41 to have a predetermined mechanical strength, and the light-emitting chip 3 is fixed through the outer packaging layer 42 .

In one embodiment, the surrounding area of the pin electrode layer 2 protrudes from the periphery of the lower surface of the integrated circuit chip 1 , and the package structure 4 is bonded to the surrounding area of the pin electrode layer 2 . It can be understood that, bonding the package structure 4 to the surrounding area can further increase the stability of the lead electrode layer 2 .

In one embodiment, the lead electrode layer 2 has a slice area 22 surrounding the plurality of lead electrodes 21 , the upper surface of the plurality of lead electrodes 21 protrudes from the upper surface of the slice area 22 , and the lower surface of the plurality of lead electrodes 21 is aligned Flat to the lower surface of the lamella region 22 . It can be understood that, by staggering the upper surface of the lead electrode 21 and the slice region 22, the electrical connection between the lead electrode 21 and the plurality of electrical contacts 11 of the integrated circuit chip 1 is facilitated, and even in the process of conduct.

In one embodiment, the plurality of light-emitting chips 3 include red light-emitting chips 3 , green light-emitting chips 3 and blue light-emitting chips 3 . In this embodiment, the integrated circuit chip 1 controls the working states of the red light emitting chip 3, the green light emitting chip 3 and the blue light emitting chip 3 respectively, so that the luminous body 8 emits light of different colors to meet the needs of users.

As shown in FIG. 6 to FIG. 9 , this embodiment further provides a light-emitting module, which includes a circuit board 7 and a plurality of light-emitting bodies 8 disposed on the circuit board 7 .

It can be understood that the luminous body 8 can be separately formed into a whole luminous body 8 and then disposed on the circuit board 7, or the integrated circuit chip 1 and the light-emitting chip 3 can be stacked on the circuit board 7 in sequence, and then used The bonding wires 5 are electrically connected, and finally the integrated circuit chip 1 , the light-emitting chip 3 and the bonding wires 5 are packaged by the packaging structure 4 . The material of the circuit board 7 can be glass or a printed circuit board.

Specifically, FIG. 6 shows that luminous bodies 8 with a size of 1 by 4 are arranged in an array on the circuit board 7 , and FIG. 5 is an array of luminous bodies 8 with a size of 3 by 3 arranged on the circuit board 7 . The plurality of pin electrodes 21 of the pin electrode layer 2 include FDI pin 81, VDD pin 82, GND pin 83, DIN pin 84 and DO pin 85, FDI pin 81 is used for backup signal input, VDD pin 82 For power input, GND pin 83 is used For connecting the ground wire, the DIN pin 84 is used for signal input, and the DO pin 85 is used for signal output, whereby the light-emitting body 8 is electrically connected to the circuit board 7 through the plurality of pin electrodes 21 to obtain the required telecommunication from the circuit board 7 No.

As shown in FIG. 2 and FIG. 10 , this embodiment also provides another light-emitting module, which integrates the aforementioned plurality of light-emitting bodies 8 and the circuit board 7 to form a light-emitting module with a display function, including: a plurality of integrated bodies Circuit chip 1, the integrated circuit chip 1 has an upper surface and a lower surface, the lower surface of the integrated circuit chip 1 has a plurality of electrical contacts 11; the circuit board 7 has a plurality of setting areas 71, and the setting area 71 has a plurality of pins The electrode 21, the lower surface of the integrated circuit chip 1 is disposed in the setting area 71, and the setting positions of the plurality of lead electrodes 21 in the setting area 71 correspond to the setting positions of the plurality of electrical contacts 11 of the integrated circuit chip 1, respectively. At least a part of the plurality of pin electrodes 21 in the setting area 71 each has a protruding part, and the protruding part protrudes from the periphery of the lower surface of the integrated circuit chip 1; The plurality of light-emitting chips 3 are disposed on the upper surface of the integrated circuit chip 1 and are respectively electrically connected to the integrated circuit chip 1 through the protruding parts of the lead electrodes 21 in the setting area 71; and a plurality of integrated circuit chips 1 , and the package structure is connected to the circuit board 7 .

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

What is disclosed in this case is a preferred embodiment, and any partial changes or modifications that originate from the technical ideas of this case and are easily inferred by those who are familiar with the art are within the scope of the patent right of this case.

To sum up, in terms of purpose, means and efficacy, this case is showing its technical characteristics that are completely different from those of the prior art, and its first invention is suitable for practical use, and it also meets the requirements of a patent for invention. Granting a patent as soon as possible will benefit the society, and it will be a real sense of virtue.

1: Integrated circuit chip

2: Pin electrode layer

21: Pin electrode

22: slice area

3: Light-emitting chip

4: Package structure

5: Bonding wire

Claims (10)

A luminous body, comprising: an integrated circuit chip with an upper surface and a lower surface, the lower surface has a plurality of electrical contacts; a lead electrode layer with a plurality of lead electrodes, the lead electrode layer is arranged on the On the lower surface of the integrated circuit chip, the arrangement positions of the plurality of lead electrodes respectively correspond to the arrangement positions of the plurality of electrical contacts, and at least part of the plurality of lead electrodes each has a protruding portion, and the protruding portion protrudes around the lower surface of the integrated circuit chip; a plurality of light-emitting chips, disposed on the upper surface of the integrated circuit chip, and each electrically connected to the integrated circuit chip through the protruding portion; and a package structure encapsulating the The plurality of light-emitting chips and the integrated circuit chip, and the package structure is connected to the lead electrode layer. The light-emitting body according to claim 1, wherein the light-emitting body further comprises a support, a accommodating cavity is formed on the support, the support has a plurality of metal wirings, and the plurality of metal wirings form the lead electrode layer, the lead The electrode layer is exposed in the accommodating cavity, and the packaging structure fills the accommodating cavity. The light-emitting body of claim 1, wherein the plurality of pin electrodes penetrate through the pin electrode layer, and the upper surfaces of the plurality of pin electrodes are exposed on the upper surface of the pin electrode layer and are respectively electrically connected to the plurality of electrical properties Contact, the lower surface of the plurality of pin electrodes is exposed on the lower surface of the pin electrode layer. The light-emitting body according to claim 3, wherein the light-emitting body further comprises a bracket having a plurality of metal wirings, and the packaging structure includes an inner packaging layer for wrapping the plurality of light-emitting chips and the integrated circuit chip and an outer encapsulation for wrapping the inner encapsulation layer layer, the lower surface of the pin electrode is connected to the plurality of metal wirings of the part, and the part of the plurality of pin electrodes protrudes from the periphery of the lower surface of the inner packaging layer and is wrapped by the outer packaging layer for connecting the plurality of parts of the Metal wiring. The light-emitting body of claim 3, wherein the light-emitting chip is electrically connected to the protruding portion of the lead electrode through a bonding wire, and the bonding wire is wrapped by the packaging structure. The light-emitting body of claim 3, wherein the light-emitting chip is electrically connected to the protruding portion of the lead electrode through a metal post, wherein the packaging structure has an inner packaging layer and an outer packaging layer, and the inner packaging layer wraps The metal post and the integrated circuit chip, the outer packaging layer is a light-transmitting layer, wraps the plurality of light-emitting chips and is located on the inner packaging layer. The light-emitting body of claim 1, wherein the surrounding area of the lead electrode layer protrudes from the periphery of the lower surface of the integrated circuit chip, and the package structure adheres to the surrounding area of the lead electrode layer. The light-emitting body according to claim 1, wherein the lead electrode layer has a layer area surrounding the plurality of lead electrodes, the upper surface of the plurality of lead electrodes protrudes from the upper surface of the layer area, and the plurality of lead electrodes The lower surface of the electrode is flush with the lower surface of the lamella region. A light-emitting module includes a circuit board and a plurality of the luminous bodies according to any one of claims 1 to 8, which are arranged on the circuit board. A light-emitting module, comprising: a plurality of integrated circuit chips, the integrated circuit chip has an upper surface and a lower surface, the lower surface of the integrated circuit chip has a plurality of electrical contacts; a circuit board has a plurality of settings area, the setting area has a plurality of lead electrodes, the lower surface of the integrated circuit chip is set in the setting area, and the setting positions of the plurality of lead electrodes in the setting area correspond to the The setting position of the plurality of electrical contacts, at least part of the plurality of pin electrodes in the setting area Self has a protruding portion, the protruding portion protrudes around the lower surface of the integrated circuit chip; a plurality of light-emitting chip sets, the light-emitting chip set has a plurality of light-emitting chips, and the plurality of light-emitting chips of the light-emitting chip set are arranged in the area The upper surface of the bulk circuit chip is electrically connected to the integrated circuit chip through the protruding portion of the lead electrode in the setting area; and a package structure wraps the plurality of light-emitting chip sets and the plurality of integrated circuit chips , and the package structure is connected to the circuit board.

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