TWI744043B - Heat dissipation device - Google Patents

Abstract

A heat dissipating device includes: a base with a first side and a second side separately arranged on the upper and lower sides of the base, the first side is in contact with at least one heat source, and the second Extend a heat dissipation area laterally, and choose to extend an auxiliary heat dissipation area laterally on either side of the periphery of the heat dissipation area, the auxiliary heat dissipation area has an air guide, and the side of the heat dissipation area is below the auxiliary heat dissipation area The junction has a shielding area, and the heat sink of the present invention can correspond to multiple heat sources at the same time, providing direct or indirect airflow for deheating.

Description

Heat sink

A heat dissipating device, especially a heat dissipating device applied to electronic equipment, which can directly absorb or guide airflow to deheat multiple heat sources at the same time.

The current server or personal computer has many electronic components inside, and as the computing performance becomes faster and faster, the heat generated by the internal electronic components also becomes higher and higher, and by setting radiators or heat sink fins accordingly The heat dissipating element and the heat source are assembled together to further guide the heat from the heat source, so as to prevent heat accumulation and achieve heat dissipation and cooling.

In a limited space, the size of the heat dissipation components and the number of installations are also greatly restricted. In order to improve the heat dissipation performance, it is necessary to install heat dissipation components for these electronic components to achieve the purpose of heat dissipation, and the configuration of the electronic components is equivalent. It is compact. If at least one heat dissipation element must be provided for each electronic element, the space may be insufficient, and the heat dissipation elements will not be installed due to mutual interference.

In addition, when multiple heat dissipation elements (heat sinks, heat dissipation fins) are arranged adjacent to each other, they will affect each other and block the internal air flow, thereby affecting the heat dissipation performance. Therefore, installing too many heat dissipation elements will not only not improve the heat dissipation performance, but even cause Block the heat dissipation air flow each other, and interfere with each other during assembly to reduce the heat dissipation efficiency.

Figures 1 and 2 are three-dimensional diagrams and schematic diagrams of the conventional heat dissipation module. The conventional heat dissipation module 6 conducts heat by directly contacting a main radiator 61 with a heat source 7. The main radiator 61 is through the heat pipe 8. It is connected to other sub-radiators 62, and the heat pipes 8 transfer the absorbed heat to the connected sub-radiators 62 for heat dissipation. The main purpose is to dissipate the heat to the outside through the heat pipe 8 for remote heat dissipation. Set scattered The thermal module 6 occupies a considerable amount of installation space, and it is also impossible to install the heat dissipation module 6 for each heat source 7 one by one in a limited space to de-heat.

Conventionally, a plurality of fans 9 are installed at the air inlet or outlet of the system to forcefully attract external airflow into the system or forcefully exhaust the internal airflow of the system, thereby causing the formation of heat dissipation air convection in the system, and in order to increase the heat dissipation of the heat source inside the system In order to further improve the heat dissipation efficiency of the heat dissipation module 6, the heat dissipation module 6 is divided into a main body. The radiator 61 and the plurality of sub-radiators 62 transfer the heat generated by the main radiator 61 to the remote sub-radiator 62 through the heat pipe to avoid heat accumulation.

When the heat-dissipating airflow first passes through the sub-radiators 62, the heat-dissipating airflow at the sub-radiators 62 has been shielded by the sub-radiators 62, causing the wind pressure to be weakened and even more heated, so it flows backwards through the sub-radiators 62 In addition to the temperature, the air pressure is reduced due to the obstruction of the secondary radiators 62, and the main radiator 61 and other electronic components arranged behind the secondary radiators 62 cannot provide cooling effect. Similarly, if the heat dissipation airflow passes through the main radiator 61 and is heated by the main radiator 61, and then the temperature of the heat dissipation airflow is increased, other heat sources located behind or beside the main radiator 61 and the sub-radiator 62 will not be able to cool down. At the same time, the heat dissipation airflow is blocked by the main radiator 61 and the wind pressure of the heat dissipation airflow is also reduced. As the wind pressure of the heat dissipation airflow is weakened, other electronic components cannot be cooled by the guiding heat dissipation airflow, and problems such as internal heat accumulation need to be improved.

Therefore, how to solve the lack of acquaintance is the most important goal of those skilled in the art.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a heat dissipation device that can guide the airflow and simultaneously deheat a plurality of the same or different heat sources.

In order to achieve the above objective, the present invention provides a heat sink, which includes: a base; The base has a first side and a second side separately arranged on the upper and lower sides of the base, the first side is in contact with at least one heat source, and the second side extends upward with a heat dissipation area, And choose to extend at least one auxiliary heat dissipation area laterally in front, back, left, and right of the peripheral side of the heat dissipation area, or any direction, the auxiliary heat dissipation area has an air guide portion, and the side of the heat dissipation area is connected At the lower junction of the heat dissipating area, there is a shielding area (which is set across (elevated) above the electronic components (such as resistors, capacitors, memory, etc.)).

Through the heat dissipation device of the present invention, the main corresponding heat source can be provided to dissipate heat, and the auxiliary heat dissipation area can further increase the heat dissipation area, and the air guide portion provided through the auxiliary heat dissipation area The airflow is guided to the shielded area below, and the shielded area performs forced heat dissipation and heat exchange of the shielded electronic components in the shielded shielded area. Therefore, the present invention provides a single heat sink that can simultaneously deheat multiple heat sources The heat dissipation structure.

1: heat sink

1a: cooling zone

1b: auxiliary cooling area

1c: Air guide

1d: Covered area

11: Pedestal

111: first side

112: second side

1121: Groove

12: cooling fins

121: first side

122: second side

2: heating source

3: Heat pipe group

31: The first heat pipe

32: second heat pipe

4: Heat source

5: Fan

6: Cooling module

61: main radiator

62: Sub radiator

7: Heat source

8: Heat pipe

9: Fan

Fig. 1 is a perspective view of a conventional heat dissipation module; Fig. 2 is a schematic diagram of a conventional heat dissipation module; Fig. 3a is a perspective exploded view of the first embodiment of the heat dissipation device of the present invention; Fig. 3b is a perspective view of the present invention Another implementation aspect of the air guide portion of the auxiliary heat dissipation area; Figure 3c is another implementation aspect of the air guide portion of the auxiliary heat dissipation area of the present invention; Figure 4 is a three-dimensional decomposition of the second embodiment of the heat dissipation device of the present invention Figure; Figure 5 is a perspective exploded view of the third embodiment of the heat dissipation device of the present invention; Figure 6 is a perspective view of the fourth embodiment of the heat dissipation device of the present invention; Figure 7 is a perspective view of the heat dissipation device of the present invention Three-dimensional schematic diagram.

The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings.

Please refer to Figure 3a, which is a perspective exploded view of the first embodiment of the heat dissipation device of the present invention. As shown in the figure, the heat dissipation device 1 includes: a base 11; Above a heat source 2, a first side 111 and a second side 112 are respectively provided on the upper and lower sides of the base 11. The first side 111 is in contact with at least one heat source 2, and the second The side 112 extends upwards with a heat dissipation area 1a, and the heat dissipation area 1a extends laterally to one of the front, rear, left, and right sides of the peripheral side, or at least one auxiliary heat dissipation area 1b with an air guiding portion 1c. There is a shielding area 1d at the junction between the side of the heat dissipation area 1a and the lower part of the auxiliary heat dissipation area 1b, and the shielding area 1d is correspondingly spanned (elevated) above another heat source 4 (memory) group.

The heat dissipation area 1a and the auxiliary heat dissipation area 1b can be composed of a single heat sink or a plurality of heat dissipation fins 12 or a combination of the two. In this embodiment, a heat sink is selected as the heat dissipation area, and then the combination is buckled or overlapped. The method of combining the heat dissipation fin sets is an auxiliary heat dissipation area, where the heat sink and the heat dissipation fins are directly connected or indirectly contacted, and the heat dissipation area and the auxiliary heat dissipation area can be made of the same or different materials.

Hereinafter, the figure is taken as an example to illustrate the state of the diversion area. As shown in Figure 3a, the heat dissipation fins 12 of the auxiliary heat dissipation area 1b have a first side 121 and a second side 122, respectively. The first and second sides 121, 122 are arranged parallel to each other, and the first and second sides 121, 122 are arranged on the short sides of the heat dissipation fins 12, and the area of the heat dissipation fins 12 is divided by the first The sides 121 and 122 gradually expand toward the second side 122, and the heat dissipation fins 12 are arranged in parallel to define the aforementioned air guiding portion 1c. Viewed from the side of the auxiliary heat dissipation area 1b, the air guiding portion 1c is It is an inclined surface, which is arranged at the lower edge of the auxiliary heat dissipation area 1b, and because the first side 121 is the wind-in or wind-receiving side, the inclined surface guides the heat dissipation airflow to the lower side of the auxiliary heat dissipation area 1b The shielded area 1d flows, so that a tunnel structure that can guide the airflow to blow downward is formed under the auxiliary heat dissipation area 1b.

As shown in Figure 3b, it is another embodiment of the air guiding portion 1c of the auxiliary heat dissipation area 1b of this embodiment. The air guiding portion 1c is formed by a flow channel formed in the auxiliary heat dissipation area. In the area 1b, a heat dissipation airflow can be guided to flow to the shielded area 1d below the auxiliary heat dissipation area 1b.

As shown in Figure 3c, it is another embodiment of the air guiding portion 1c of the auxiliary heat dissipation area 1b of this embodiment. The auxiliary heat dissipation area 1b is formed by a plurality of heat dissipation fins 12 arranged at intervals to form a plurality of spaces 12a. The heat dissipation fins 12 have at least one rib 12b on at least one side surface, and the ribs 12b and the spaces 12a jointly define a plurality of guide channels 12c, and can guide a heat dissipation airflow to the shielding area under the auxiliary heat dissipation area 1b 1d flows.

It is revealed from the implementation of the above-mentioned air guiding portion 1c that the air guiding portion 1c is located above the shielded area 1d, and other electronic components can be avoided through the shielded area 1d, in order to form the aforementioned air guiding portion 1c and the shielded area 1d , Then there must be a height difference between the configuration of the auxiliary heat dissipation area 1b and the base 11, and then from any one or more of the front, back, left, and right positions of the heat dissipation area 1a, It is configured to extend in the horizontal direction, so that the shielding area 1d is formed under the auxiliary heat dissipation area 1b, and the auxiliary heat dissipation area 1b straddles the electronic components, and is formed in the air guide portion of the auxiliary heat dissipation area 1b. 1c can direct the external air flow (guided by the fan) to the shielded area 1d, so the electronic components corresponding to the shielded area 1d can obtain more heat exchange by the external air flow.

In this embodiment, one auxiliary heat dissipation area 1b is used as an illustration. Of course, a plurality of auxiliary heat dissipation areas 1b can be optionally provided, which is not limited.

Please refer to Figure 4, which is a perspective exploded view of the second embodiment of the heat sink of the present invention. As shown in the figure, this embodiment is partially the same as the first embodiment, so it will not be repeated here. However, this embodiment example The difference from the foregoing first embodiment is that it further has at least one heat pipe group 3 and the auxiliary heat dissipation area 1b of this embodiment is provided in a plurality, formed by extending the left and right sides of the heat dissipation area 1a, respectively.

The heat pipe 3 has a first heat pipe 31 and a second heat pipe 32. The first and second heat pipes 31, 32 extend through the heat dissipation area and the auxiliary heat dissipation areas 1a, 1b, and can provide heat dissipation through the heat pipe group 3 The heat of the area 1a is quickly guided to the auxiliary heat dissipation area 1b on the peripheral side for heat dissipation.

Please refer to FIG. 5, which is a three-dimensional exploded view of the third embodiment of the heat sink of the present invention. As shown in the figure, the structure of this embodiment is the same as that of the foregoing third embodiment, so it will not be repeated here, but this embodiment The difference between this example and the aforementioned second embodiment is that the base 11 has a plurality of grooves 1121. One and two heat dissipation areas 1a, 1b. One end of the second heat pipe 32 is accommodated in the groove 1121 to be combined with the base 11, and the other end is extended and connected with the heat dissipation area and auxiliary heat dissipation areas 1a, 1b.

Please refer to Figures 6 and 7, which are three-dimensional schematic diagrams of the heat sink of the present invention, and refer to the aforementioned Figures 2 to 4 together. As shown in the figure, the heat sink 1 passes through the base 11 and a heat source 2 ( CPU or South and North bridge chips) are attached, and the base 11 conducts the heat generated by the heat source 2 to the heat dissipation area and auxiliary heat dissipation areas 1a, 1b for deheating, and the heat source 2 has other Heat source (memory, transistor). The shielded area 1d is provided below the auxiliary heat dissipation area 1b on both sides of the heat sink 1, so the shielded area 1d allows other heat sources 4 (memory) to be placed in the auxiliary heat dissipation area In the shielding area 1d of 1b, the auxiliary heat dissipation area 1b straddles the heat source 4 (memory), and since the air guide portion 1c is viewed from the side of the heat dissipating device 1, it has a slanted slope. , The airflow can be guided below the auxiliary heat dissipation area 1b by the air guiding portion 1c, thereby providing the effect of multiple guiding airflow.

Since the external airflow of the conventional heat sink flows through the heat dissipation fins, the length of the flow generated by the heat dissipation fins is longer. When the external airflow hits the heat dissipation fins, in addition to causing resistance, the external airflow is more severe. Only the gap between the radiating fins can flow through the radiating device 1, and it cannot be guided to other areas to assist other heat sources to dissipate heat, and the memories are closely arranged with each other and cannot directly interact with the memories. Directly set the heat dissipating element to de-heat.

With the heat dissipation device 1 of the present invention, in addition to providing an enlarged heat dissipation area to the heat source 2 directly corresponding to the heat dissipation area 1a and the auxiliary heat dissipation area 1b, the fan 5 can also be reduced by the air guide portion 1c of the auxiliary heat dissipation area 1b. The guided airflow is guided downwards from the air guiding portion 1c to the shielding area 1d below the air guiding portion 1c, so that the other heat sources 4 (memory) in the shielding area 1d are additionally guided by the airflow to forcibly directly deheat. The auxiliary heat dissipation area 1b not only provides a larger heat dissipation area, but also guides the airflow to deheat other adjacent heat sources 4. Therefore, the present invention can achieve a single heat dissipation device 1 and simultaneously treat multiple heat sources 2, 4 In addition to the anti-heat effect, it can also solve the problem that the heat sink 1 cannot be installed in a limited space.

1: heat sink

1a: cooling zone

1b: auxiliary cooling area

1c: Air guide

1d: Covered area

11: Pedestal

111: first side

112: second side

12: cooling fins

121: first side

122: second side

2: heating source

Claims (8)

A heat dissipating device includes: a base with a first side and a second side separately arranged on the upper and lower sides of the base, the first side is in contact with at least one heat source, and the second Extend a heat dissipation area laterally, and choose to extend an auxiliary heat dissipation area laterally on the periphery or above the heat dissipation area. The auxiliary heat dissipation area has an air guiding part, and the side of the heat dissipation area borders the lower part of the auxiliary heat dissipation area. There is a covered area. The heat dissipation device according to claim 1, which further has at least one heat pipe group, the heat pipe has a first heat pipe and a second heat pipe, the base has a plurality of grooves, and the first and second heat pipes One end of the heat pipe is accommodated in the groove and combined with the base, and the other end is extended to connect the heat dissipation area and the auxiliary heat dissipation area. The heat dissipation device according to claim 1, which further has at least one heat pipe group, the heat pipe has a first heat pipe and a second heat pipe, and the first and second heat pipes extend to connect the heat dissipation area and the auxiliary heat dissipation device Area. The heat dissipating device according to claim 1, wherein the air guiding part is an inclined surface disposed at the lower edge of the auxiliary heat dissipation area, and the inclined surface guides a heat dissipation airflow to the shield below the auxiliary heat dissipation area Regional mobility. The heat dissipation device according to claim 1, wherein the air guiding portion is formed by a flow channel formed in the auxiliary heat dissipation area, and can guide a heat dissipation airflow to the auxiliary heat dissipation area below the auxiliary heat dissipation area. The shaded area flows. The heat dissipation device according to claim 1, wherein the auxiliary heat dissipation area is formed by a plurality of heat dissipation fins arranged at intervals to form a plurality of spaces, the heat dissipation fins have at least one rib, and the The ribs and the spaces jointly define a plurality of guiding channels, and can guide a heat dissipation airflow to flow to the shielded area below the auxiliary heat dissipation area. The heat dissipation device according to claim 1, wherein the heat dissipation area and the auxiliary heat dissipation area may be made of the same or different materials. The heat dissipation device according to claim 1, wherein the auxiliary heat dissipation area corresponds to at least one heat source.

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