TWI737249B - Fingerprint identification chip packaging structure and manufacture method thereof - Google Patents

Abstract

The present disclosure provides a fingerprint identification chip packaging structure, including: a packaging layer, a redistribution layer and a plurality of pins. The packaging layer includes a fingerprint identification chip, a plurality of conductive pillars and a packaging material layer covering the fingerprint identification chip and the conductive pillars. The redistribution layer located on a side of the packaging layer and is close to the front surface of the fingerprint identification chip. The redistribution layer includes a plurality of lines, the fingerprint identification chip is electrically connected to the plurality of conductive pillars by the plurality of lines. The plurality of pins are provided at a side of the packaging layer away from the redistribution layer. The plurality of pins correspond to the plurality of conductive pillars one by one. Each of the plurality of pins is electrically connected to one conductive pillar. The present disclosure also provides a manufacture method of the above-mentioned fingerprint identification chip packaging structure. The above-mentioned fingerprint recognition chip packaging structure does not need a substrate, therefore it is beneficial to reduce the thickness and manufacturing cost.

Description

Fingerprint identification chip packaging structure and manufacturing method thereof

The invention relates to the technical field of chip packaging, in particular to a fingerprint identification chip packaging structure and a manufacturing method thereof.

Fingerprint recognition technology is widely used in electronic devices such as display devices, attendance equipment, and door locks. When the fingerprint recognition chip is packaged in the prior art, since the fingerprint recognition chip with a small thickness is prevented from breaking and other damages during the packaging process, the fingerprint recognition chip is often packaged on a substrate, which can be a printed circuit board, fingerprint recognition The chip and the substrate are electrically connected. That is, the fingerprint recognition chip is packaged with the printed circuit board (substrate). In use, the fingerprint recognition chip packaged with the substrate is connected to the motherboard (such as the TFT substrate of a liquid crystal display device). However, the arrangement of the substrate makes the overall package thickness of the fingerprint identification chip thicker, which is not conducive to the lightness and thinness of the electronic device using the fingerprint identification chip.

The first aspect of the present invention provides a fingerprint recognition chip packaging structure, including: a packaging layer including a fingerprint recognition chip, a plurality of conductive pillars, and packaging materials covering the fingerprint recognition chip and the conductive pillars; One side of the packaging layer close to the front surface of the fingerprint identification chip includes a plurality of leads, and the fingerprint identification chip is electrically connected to the corresponding conductive posts through the leads; and pins are arranged on the packaging layer On the side far away from the redistribution layer, the pins correspond to the conductive pillars one-to-one, and each pin is electrically connected to a conductive pillar.

The second aspect of the present invention provides a method for manufacturing a fingerprint identification chip packaging structure, including: A carrier board is provided, and a plurality of fingerprint recognition chips are arranged on the carrier board at intervals, wherein the front of the fingerprint recognition chip faces the carrier board; a plurality of conductive pillars are formed on the carrier board, and each fingerprint recognition chip corresponds to At least one conductive pillar; forming a packaging material on the carrier board so that the packaging material covers the fingerprint identification chip and the conductive pillar to form a packaging layer; Grind the side surface so that the surface of the packaging material away from the carrier board is flush with the end surface of the conductive column at the end away from the fingerprint recognition chip; transfer the carrier board to the fingerprint recognition chip On the other side, a redistribution layer is formed on the surface of the packaging layer away from the carrier board, and a plurality of leads and an insulating material filling the gaps between the leads are formed in the redistribution layer. Sexually connect the fingerprint recognition chip and the conductive post; attach a bonding film on the side of the redistribution layer away from the packaging layer; peel off the packaging layer from the carrier board and remove the carrier board; A protective layer is attached to the surface of the bonding film away from the redistribution layer; and a plurality of pins are formed on the surface of the encapsulation layer away from the redistribution layer, and each pin is electrically connected to a conductive line Column to obtain a fingerprint recognition package array; cutting the fingerprint recognition package array to obtain a plurality of fingerprint recognition chip package structures containing at least one fingerprint recognition chip.

The fingerprint identification chip packaging structure does not need to increase the structure of the substrate, so it is beneficial to reduce the overall packaging thickness of the fingerprint identification chip packaging structure, is beneficial to the light and thin development of the fingerprint identification chip packaging structure, and is also beneficial to reduce the manufacturing cost. The manufacturing method of the fingerprint recognition chip packaging structure does not need to use an additional packaging substrate, so the package thickness can be reduced, and the manufacturing cost can be reduced. On this basis, the fingerprint recognition chip can be effectively prevented from breaking and other damages during the packaging process.

10: Fingerprint recognition chip package structure

111: Fingerprint recognition chip

112: Conductive column

113: Packaging materials

120: Redistribution layer

121: Lead

123: Insulation material

130: pin

140: protective layer

150: Bonding film

160: carrier board

170: Fingerprint Identification Package Array

FIG. 1 is a schematic structural diagram of a fingerprint identification chip package structure provided by an embodiment of the present invention.

2 is a schematic cross-sectional view of the fingerprint identification chip package structure provided by an embodiment of the present invention at step S1 in the manufacturing process.

3 is a schematic cross-sectional view of the fingerprint identification chip package structure provided by an embodiment of the present invention at step S2 in the manufacturing process.

4 is a schematic cross-sectional view of the fingerprint identification chip package structure provided by an embodiment of the present invention at step S3 in the manufacturing process.

5 is a schematic cross-sectional view of the fingerprint identification chip package structure provided by an embodiment of the present invention at step S4 in the manufacturing process.

6 is a schematic cross-sectional view of the fingerprint identification chip package structure provided by an embodiment of the present invention at step S5 in the manufacturing process.

FIG. 7 is a schematic cross-sectional view of the fingerprint identification chip package structure provided by an embodiment of the present invention at step S6 in the manufacturing process.

FIG. 8 is a schematic cross-sectional view of the fingerprint identification chip package structure provided by an embodiment of the present invention at step S7 in the manufacturing process.

9 is a schematic cross-sectional view of the fingerprint identification chip package structure provided by an embodiment of the present invention at step S8 in the manufacturing process.

10 is a schematic cross-sectional view of the fingerprint identification chip package structure provided by an embodiment of the present invention at step S9 in the manufacturing process.

In order to be able to understand the above objectives, features and advantages of the present invention more clearly, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the application and the features in the embodiments can be combined with each other if there is no conflict.

In the following description, many specific details are set forth in order to fully understand the present invention. The described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.

Please refer to FIG. 1, the fingerprint recognition chip packaging structure 10 of the embodiment of the present invention includes a packaging layer including a fingerprint recognition chip 111, a plurality of conductive pillars 112, and a encapsulating fingerprint recognition chip 111 and conductive pillar 112 packaging material 113. One surface of the fingerprint identification chip 111 is exposed to the packaging material 113, and two ends of the conductive pillar 112 are exposed to the packaging material 113. The type of the fingerprint recognition chip 111 may be, for example, an optical fingerprint recognition chip, a capacitive fingerprint recognition chip or an ultrasonic fingerprint recognition chip. The material of the conductive pillar 112 may be a metal or alloy with good conductivity, such as copper or its alloy. The material of the packaging material 113 is at least one of polyimide, silicone and epoxy, but it is not limited thereto.

The fingerprint identification chip packaging structure 10 also includes a redistribution layer 120, which is disposed on one side of the packaging layer and is exposed on the surface of the packaging material 113 close to the fingerprint identification chip 111. The redistribution layer 120 includes a plurality of leads 121 (in In the cross-sectional view shown in FIG. 2, only two can be seen), the fingerprint identification chip 111 is electrically connected to the corresponding conductive pillar 112 through the leads 121 respectively. The material of the lead 121 is a metal or alloy with good electrical conductivity, for example, it may be at least one of copper, aluminum, nickel, gold, silver, and titanium. In an embodiment, the material of the conductive pillar 112 may be the same as the material of the lead 121. The redistribution layer 120 also includes an insulating material 123 that fills the gaps between the leads 121 to insulate the leads 121 from each other. The insulating material 123 may be, for example, epoxy resin, silicone, polyimide (PI), polyparaphenylene benzo Bisoxazole (PBO), benzocyclobutene (BCB), silica or phosphosilicate glass. The insulating material 123 completely covers the lead 121, which can protect the lead 121 from damage and does not affect the individual signal transmission of each lead 121. In this embodiment, the fingerprint identification chip package structure 10 includes a fingerprint identification chip 111. In other embodiments, the fingerprint identification chip packaging structure 10 may include a plurality of fingerprint identification chips 111, and the specific number may be designed according to actual requirements.

The fingerprint recognition chip packaging structure 10 further includes pins 130. The pins 130 are arranged on the side of the packaging layer away from the redistribution layer 120 and correspond to the conductive pillars 112 one by one. Each of the pins 130 is electrically connected to a conductive pillar 112. , The leads 121, the conductive posts 112 and the pins 130 cooperate with each other to electrically connect the fingerprint identification chip 111 with the external circuit. The external circuit is used to drive the fingerprint recognition chip 111 to work (such as powering the fingerprint recognition chip 111, etc.), and the external circuit can also receive the fingerprint recognition signal sent by the fingerprint recognition chip 111. The material of the pin 130 is metal or alloy, such as at least one of lead, tin, and silver, or an alloy including lead, tin, or silver, but it is not limited thereto. In this embodiment, the pin 130 has a convex spherical shape.

The fingerprint recognition chip packaging structure 10 further includes a protective layer 140, which is disposed on the side of the redistribution layer 120 away from the encapsulation layer, and is used to protect the redistribution layer 120 and has a scratch-proof effect. The material of the protective layer 140 can be a high dielectric constant material, such as at least one of sapphire, glass, ceramic, quartz, acrylic, and plastic, but it is not limited thereto.

A bonding film 150 is provided between the protection layer 140 and the redistribution layer 120, and the bonding film 150 is used for bonding the protection layer 140 and the redistribution layer 120. The material of the bonding film 150 can be an adhesive with high light transmittance and not easily oxidized, for example, a B-stage (B-stage) high molecular polymer adhesive or a FOW (Film-over-wire) film.

The fingerprint identification chip packaging structure 10 provided by the embodiment of the present invention does not require an increase in the structure of the substrate, so it is beneficial to reduce the overall packaging thickness of the fingerprint identification chip packaging structure 10, and is beneficial to the light and thin development of the fingerprint identification chip packaging structure 10, and is also beneficial to Reduce the cost due to the substrate. Specifically, the overall packaging thickness of the fingerprint identification chip packaging structure 10 can be reduced to less than 1 mm.

The embodiment of the present invention also provides a manufacturing method of the above-mentioned fingerprint identification chip packaging structure 10. The manufacturing method of the fingerprint identification chip packaging structure 10 of the embodiment of the present invention includes the following steps:

S1: A carrier board 160 is provided, and a plurality of fingerprint identification chips 111 are arranged on the carrier board 160 at intervals, wherein the front side of the fingerprint identification chip 111 faces the carrier board 160, as shown in FIG. 2. The carrying plate 160 may be a plastic or glass plate.

S2: A plurality of conductive pillars 112 are formed on the carrier board 160, and each fingerprint identification chip 111 corresponds to at least one conductive pillar 112, as shown in FIG. 3.

In this embodiment, along the direction perpendicular to the carrier board 160, the height of the conductive pillar 112 is greater than the height of the fingerprint identification chip 111, that is, the end of the conductive pillar 112 away from the carrier board 160 exceeds the end surface of the fingerprint identification chip 111 away from the carrier board 160. Specifically, the conductive pillars 112 may be directly disposed on the carrier board 160 using a pillar-shaped conductive material (for example, copper pillars), or a metal layer may be formed on the carrier board 160 first, and then the metal layer may be patterned and etched. As a result, the present invention does not limit this.

S3: The packaging material 113 is formed on the carrier board 160, so that the packaging material 113 encapsulates the fingerprint identification chip 111 and the conductive pillar 112 to form a packaging layer. That is, in this embodiment, the packaging layer includes a fingerprint identification chip 111, a conductive pillar 112, and a packaging material 113, as shown in FIG. 4.

S4: Grind the surface of the packaging material 113 away from the carrier plate 160, so that the surface of the packaging material 113 away from the carrier plate 160 is flush with the end surface of the conductive column 112 at the end away from the fingerprint recognition chip 111, as shown in FIG. 5 .

S5: Transfer the carrier board 160 to the other side of the fingerprint recognition chip 111, that is, contact with the ground side of the packaging material 113 to contact the fingerprint recognition chip 111, and form on the surface of the packaging layer away from the carrier board 160 The redistribution layer 120 is formed in the redistribution layer 120 between the plurality of leads 121 and the filling leads 121 The insulating material 123 in the gap and the lead 121 are electrically connected to the fingerprint identification chip 111 and the conductive pillar 112, as shown in FIG. 6.

S6: Attach the bonding film 150 to the side of the redistribution layer 120 away from the encapsulation layer, as shown in FIG. 7. The bonding film 150 has two adhesive surfaces arranged opposite to each other, and one of the adhesive surfaces is adhered to the side of the redistribution layer 120 away from the encapsulation layer.

S7: Peel the carrier board 160 off the packaging layer and remove the carrier board 160, as shown in FIG. 8.

S8: Attach a protective layer 140 to the surface of the bonding film 150 away from the redistribution layer 120, as shown in FIG. 9. The protective layer 140 is stuck on the other sticking surface of the bonding film 150.

S9: A plurality of pins 130 are formed on the surface of the packaging layer away from the redistribution layer 120, and each pin 130 is electrically connected to a conductive pillar 112 to obtain a fingerprint recognition package array 170, as shown in FIG. 10.

S10: Cutting the fingerprint recognition package array 170 to obtain a plurality of fingerprint recognition chip package structures 10 including at least one f fingerprint recognition chip 111 as shown in FIG. 1.

It can be understood that whether the fingerprint recognition package array 170 is cut in step S10 and how many fingerprint recognition chips 111 each fingerprint recognition chip package structure 10 contains after cutting can be adjusted according to actual needs.

For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description, and therefore it is intended to fall within the claims. The meaning of the equivalent elements and all changes within the scope are included in the present invention. Any reference signs in the request shall not be regarded as the request item involved in the restriction. In addition, it is obvious that the word "including" does not exclude other units or steps, and the singular does not exclude the plural. The plural devices stated in the device request item can also be implemented by the same device or system by software or hardware. Words such as first and second are used to denote names, but do not denote any specific order.

Those of ordinary skill in the art should realize that the above embodiments are only used to illustrate the present invention, and not to limit the present invention. As long as they fall within the essential spirit of the present invention, the above embodiments are appropriately made. Changes and changes fall within the scope of protection of the present invention.

10: Fingerprint recognition chip package structure

111: Fingerprint recognition chip

112: Conductive column

113: Packaging materials

120: Redistribution layer

121: Lead

123: Insulation material

130: pin

140: protective layer

150: Bonding film

Claims (9)

A fingerprint identification chip packaging structure, which is improved in that it includes: a packaging layer including a fingerprint identification chip, a plurality of conductive pillars, and packaging materials covering the fingerprint identification chip and the conductive pillars. One surface of the fingerprint identification chip is opposite to The encapsulation layer is exposed; the redistribution layer is arranged on one side of the encapsulation layer and is close to the exposed surface of the fingerprint recognition chip with respect to the encapsulation layer. The redistribution layer includes a plurality of leads and insulating materials, and the insulation The material fills the gaps between the plurality of leads and completely covers and directly contacts the exposed surface of the fingerprint identification chip with respect to the packaging layer, and the exposed surface of the fingerprint identification chip with respect to the packaging layer is respectively connected with Corresponding conductive posts are electrically connected; and pins are arranged on the side of the packaging layer away from the redistribution layer, the pins correspond to the conductive posts one-to-one, and each pin is electrically connected to a conductive line column. The fingerprint identification chip packaging structure according to claim 1, wherein the leads, the conductive posts, and the pins cooperate with each other to electrically connect the fingerprint identification chip to an external circuit, and the external circuit is used for Drive the fingerprint recognition chip to work. The fingerprint recognition chip package structure according to claim 1, wherein the fingerprint recognition chip is one or more, and each fingerprint recognition chip is electrically connected to the corresponding conductive pillar through the corresponding lead. The fingerprint identification chip packaging structure according to claim 1, wherein the fingerprint identification chip packaging structure further includes a protective layer disposed on a side of the redistribution layer away from the packaging layer. The fingerprint recognition chip packaging structure according to claim 4, wherein the material of the protective layer is at least one of sapphire, glass, ceramic, quartz, acrylic, and plastic. The fingerprint recognition chip packaging structure according to claim 4, wherein a bonding film is provided between the protection layer and the redistribution layer, and the bonding film is used to bond the protection layer and the redistribution layer . The fingerprint recognition chip packaging structure according to claim 1, wherein the fingerprint recognition chip is one of an optical fingerprint recognition chip, a capacitive fingerprint recognition chip or an ultrasonic fingerprint recognition chip. The fingerprint recognition chip packaging structure according to claim 1, wherein the material of the packaging material is at least one of polyimide, silicone and epoxy. A method for manufacturing a fingerprint recognition chip packaging structure, the improvement is that it includes: providing a carrier board, and arranging a plurality of fingerprint recognition chips on the carrier board at intervals, wherein the front side of the fingerprint recognition chip faces the carrier board; A plurality of conductive pillars are formed on the carrier board, and each fingerprint identification chip corresponds to at least one conductive pillar; a packaging material is formed on the carrier board so that the packaging material covers the fingerprint identification chip and the conductive pillars to Form an encapsulation layer; grind the side surface of the encapsulation material away from the carrier board so that the side surface of the encapsulation material away from the carrier board and the end surface of the conductive column at one end away from the fingerprint recognition chip Flush; transfer the carrier board to the other side of the fingerprint recognition chip, a redistribution layer is formed on the surface of the packaging layer away from the carrier board, and a plurality of leads and wires are formed in the redistribution layer An insulating material for filling the gaps between the leads, the leads electrically connecting the fingerprint recognition chip and the conductive pillars; attaching a bonding film on the side of the redistribution layer away from the packaging layer; The carrier board peels off the encapsulation layer and removes the carrier board; attach a protective layer on the surface of the bonding film away from the redistribution layer; on the side of the encapsulation layer away from the redistribution layer A plurality of pins are formed on the surface, and each pin is electrically connected to a conductive post to obtain a fingerprint recognition package array; and the fingerprint recognition package array is cut to obtain a plurality of fingerprint recognition chip package structures containing at least one fingerprint recognition chip.

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