TWI703690B - Cooling device and operation method thereof - Google Patents

Abstract

A cooling device includes a sink, a dielectric liquid disposed in the sink, a heat exchanger, a first tube, a second tube, a gas storage unit, a first valve, a second valve and a third valve. A first interface of the first tube is connected to a first tank interface of the tank. A second interface of the first tube is connected to a first heat exchanger interface of the heat exchanger. The second tube is connected between a second sink interface of the sink and a second heat exchanger interface of the heat exchanger. The first valve is disposed on a third interface of the first tube. The second valve is disposed between the first valve and a first gas storage unit interface of the gas storage unit. The third valve is disposed between a second gas storage unit interface of the gas storage unit and an external space.

Description

Cooling device and its operation method

The present invention relates to a cooling device and an operating method thereof, especially a cooling device having a plurality of valves and an operating method thereof.

Two-phase immersion cooling devices can be used to cool electronic components that are easy to generate heat. For example, electronic components that are easy to heat (such as servers) can be immersed in the dielectric fluid in the tank. After the electronic components heat up, the dielectric The liquid can evaporate into a dielectric liquid vapor, and the dielectric liquid vapor can be condensed to change back to the dielectric liquid, thereby flowing back and dripping back into the tank. The heat generated by the heating electronic components can be removed through the process of condensation to achieve the effect of heat dissipation and cooling.

Although the above solutions can be used in the industrial field, based on experience, there are problems to be solved. For example, in order to repair or inspect the electronic components immersed in the dielectric fluid, the user must open the cover of the tank regularly or from time to time to repair the electronic components. This will cause outside air to enter the inside of the cooling device, which will increase the internal pressure of the cooling device. Since the number of opening repairs is not easy to control, and the amount of air entering the cooling device from the outside is not easy to predict, increasing the volume of the cooling device to control the internal pressure of the cooling device is not an appropriate solution. In addition, the entry of outside air into the cooling device will also cause difficulties in eliminating the air other than the dielectric liquid vapor.

The embodiment provides a cooling device, including a tank, a dielectric fluid, a heat exchanger, a first tube, a second tube, a gas storage unit, a first valve, a second valve, and a The third valve. The tank includes a first tank interface and a second tank interface. The dielectric fluid is located in the tank, and one of the heating elements is placed in the tank and immersed in the dielectric fluid. The heat exchanger includes a first heat exchanger interface and a second heat exchanger interface for condensing the dielectric liquid vapor of the dielectric liquid. The first tube body includes a first interface connected to the first tank interface, a second interface connected to the first heat exchanger interface, and a third interface. The second tube body includes a first interface connected to the second tank interface, and a second interface connected to the second heat exchanger interface. The gas storage unit includes a first gas storage unit interface and a second gas storage unit interface. The first valve is arranged at the third interface of the second pipe body. The second valve is arranged between the first gas storage unit interface and the first valve. The third valve is arranged between the second gas storage unit interface and an external space.

The embodiment provides a method of operating a cooling device. The cooling device includes a tank, a dielectric fluid in the tank, a heat exchanger, a first tube, a second tube, a gas storage unit, a first valve, a second valve, and a The third valve. A first port of the first tube is connected to a first port of the tank. A second interface of the first tube is connected to a first heat exchanger interface of the heat exchanger. The second tube is connected between a second tank interface of the tank and a second heat exchanger interface of the heat exchanger. The first valve is arranged at a third port of the first pipe body. The second valve is arranged between the first valve and a first gas storage unit interface of the gas storage unit. The third valve is arranged between a second gas storage unit interface of the gas storage unit and an external space. The method includes opening the first valve and the second valve, and closing the third valve; and reducing the cooling capacity of the heat exchanger to increase the internal pressure of the cooling device.

100: cooling device

110: tank

120: Dielectric fluid

130: heat exchanger

140: first tube body

150: second tube body

160: gas storage unit

171: The first valve

172: Second valve

173: The third valve

113: upper cover

125: Dielectric liquid vapor

188: heating element

1101: The first slot interface

1102: second slot interface

1401, 1501: first interface

1402, 1502: second interface

1403: third interface

1301: First heat exchanger interface

1302: second heat exchanger interface

1601: The first gas storage unit interface

1602: second gas storage unit interface

165: heat exchange device

200: method

205 to 264: steps

Figure 1 is a schematic diagram of the cooling device in the embodiment.

Figure 2 is a flowchart of a method for controlling the cooling device of Figure 1 in an embodiment.

Figure 3 is a flowchart of the functional operation performed when the functional operation in Figure 2 is an open cover maintenance operation in the embodiment.

Fig. 4 is a flowchart of the function operation performed when the function operation in Fig. 2 is a shutdown operation in another embodiment.

Figure 1 is a schematic diagram of the cooling device 100 in the embodiment. The cooling device 100 includes a tank body 110, a dielectric fluid 120, a heat exchanger 130, a first tube body 140, a second tube body 150, a gas storage unit 160, a first valve 171, a second valve 172 and a third valve 173. The tank body 110 includes a first tank body interface 1101 and a second tank body interface 1102. The dielectric fluid 120 is located in the tank body 110, and the heating element 188 can be placed in the tank body 110 and immersed in the dielectric fluid 120. The heat exchanger 130 includes a first heat exchanger interface 1301 and a second heat exchanger interface 1302 for condensing the dielectric liquid vapor 125 of the dielectric liquid 120. The first tube 140 includes a first interface 1401, a second interface 1402, and a third interface 1403. The first interface 1401 is connected to the first tank interface 1101, and the second interface 1402 is connected to the first heat exchanger interface 1301. The second tube 150 includes a first interface 1501 and a second interface 1502, wherein the first interface 1501 is connected to the second tank interface 1102, and the second interface 1502 is connected to the second heat exchanger interface 1302. The gas storage unit 160 includes a first gas storage unit interface 1601 and a second gas storage unit interface 1602. The first valve 171 is disposed at the third port 1403 of the first pipe body 140. The second valve 172 is disposed between the first gas storage unit interface 1601 and the first valve 171. The third valve 173 is disposed between the second gas storage unit interface 1602 and the external space. The external space may be the space outside the cooling device 100.

According to the embodiment, as shown in Figure 1, the height of the first slot interface 1101 may be lower than the height of the second slot interface 1102. Therefore, the first tank interface 1101 can be located below the liquid surface of the dielectric fluid 120 and in the dielectric fluid 120, and the second tank interface 1102 can be located above the fluid surface of the dielectric fluid 120. According to the embodiment, the tank body 110 may further include an upper cover 113, and the user can open the upper cover 113 to inspect the heating element 188. The heating element 188 may, for example, include at least one server, a circuit board, a chip, and/or other elements that generate heat due to operation.

According to an embodiment, as shown in FIG. 1, the cooling device 100 may optionally further include a heat exchange device 165 disposed beside the air storage unit 160 for cooling the air storage unit 160. According to an embodiment, the heat exchange device 165 may be, for example, a fan or a condenser tube or the like. According to the embodiment, the volume of the air storage unit 160 is adjustable, for example, it may be a balloon formed of an elastic material, or a telescopic element having a wind drum structure. According to the embodiment, the cooling capacity of the heat exchanger 130 is adjustable. For example, the rotation speed of the fan provided in the heat exchanger 130 can be adjusted, or the flow rate of the condensate in the condenser tube of the heat exchanger 130 can be adjusted. According to an embodiment, the heat exchanger 130 may be a first heat exchanger, and the heat exchange device 165 may be a second heat exchanger.

According to an embodiment, in the cooling device 100 of FIG. 1, when the heating element 188 generates heat, the dielectric fluid 120 can be heated to evaporate and transform into a dielectric fluid vapor 125. The dielectric liquid vapor 125 can enter the heat exchanger 130 through the second tube body 150 and change back to the dielectric liquid 120 through heat exchange. The dielectric fluid 120 of the heat exchanger 130 can flow back to the tank body 110 through the first tube body 140. For the tank body 110, the first tube body 140 may be an inlet tube body, and the second tube body 150 may be an outlet tube body. When the volume of the dielectric liquid vapor 125 is larger, and/or there is more air than the dielectric liquid vapor 125 in the cooling device 100, the dielectric liquid vapor 125 and air can enter the air storage unit 160 to control the internal pressure. However, if only the air storage unit 160 is used to control the internal pressure, it is difficult to properly handle the air entering the cooling device 100 by opening the upper cover 113, and it is also impossible to perform more accurate control. Therefore, according to the embodiment, the method of FIG. 2 can be used.

Fig. 2 is a flowchart of a method 200 for controlling the cooling device 100 of Fig. 1 in an embodiment. The method 200 may include the following steps.

Step 205: Start; Step 210: Open the first valve 171 and the second valve 172, and close the third valve 173; Step 212: Is the temperature of the dielectric fluid 120 about the boiling point? If yes, go to step 216, if not, go to step 214; step 214: wait for the first time period; go to step 212; step 216: reduce the cooling capacity of the heat exchanger 130 to increase the internal pressure of the cooling device 100; step 218: Wait for the second time period; Step 220: Close the first valve 171 and the third valve 173, and open the second valve 172; Step 222: Increase the cooling capacity of the heat exchanger 130 to reduce the cooling device 100 except for the air storage unit 160 Partial internal pressure; Step 226: Wait for the third period; Step 230: Open the first valve 171, and close the second valve 172 and the third valve 173; Step 232: Wait for the fourth period; Step 240: Close the first valve 171 and the third valve 173, and open the second valve 172; step 242: wait for the fifth period; step 244: add 1 to the variable i, and determine whether the variable i is equal to the predetermined number of times N? If yes, go to step 246, if not, go to step 230; Step 246: perform functional operations.

In Figures 2 to 4, when referring to opening a valve, it means that if the valve is originally closed, the valve can be opened, and if the valve is originally open, it can be kept open. In the same way, in Figure 2, when it comes to closing one Valve means that if the valve is originally open, the valve can be closed, and if the valve is originally closed, it can be kept closed.

In step 216, for example, the fan speed of the heat exchanger 130 may be reduced, or the cooling capacity of the condenser tube of the heat exchanger 130 may be reduced, so that the cooling device 100 is slightly overheated. In the cooling device 100, the dielectric liquid vapor 125 can be increased, and the volume of the dielectric liquid vapor 125 and the air that is not the dielectric liquid vapor 125 can be increased, so the internal pressure can be increased. In step 218, the mixed gas (including the dielectric liquid vapor 125 and the air that is not the dielectric liquid vapor 125) in the cooling device 100 can more easily enter the gas storage unit 160.

In step 222, for example, the rotation speed of the fan of the heat exchanger 130 or the cooling capacity of the condenser tube of the heat exchanger 130 may be adjusted back to the original setting. Step 222 can be triggered according to the sensing result of the temperature sensor provided in the cooling device 100. In other words, when the temperature sensor senses that the temperature has reached the threshold, the heat exchanger 130 can be controlled to perform step 222. In step 226, wait for the dielectric liquid vapor 125 to condense. In steps 220 to 226, the gas storage unit 160 can be isolated from the cooling device 100 except for the gas storage unit 160. At this time, the cooling device 100 is not a dielectric liquid vapor 125 except for the gas storage unit 160. The ratio of the air can be very low, and the internal pressure is also low, so the performance of the heat exchanger 130 can be improved, and the leakage of the dielectric liquid vapor 125 can be reduced.

i

N。舉例而言，若i的初始值為0，N為5，則可將步驟230至244循環地執行5次。舉例而言，若i的初始值為0，N為7，則可將步驟230至244循環地執行7次，依此類推。 As shown in Figure 2, steps 230 to 244 can be executed cyclically. I and N in step 244 can be integers, where 0

i

N. For example, if the initial value of i is 0 and N is 5, then steps 230 to 244 can be cyclically executed 5 times. For example, if the initial value of i is 0 and N is 7, then steps 230 to 244 can be executed cyclically 7 times, and so on.

In step 232, wait for the condensed dielectric between the first valve 171 and the second valve 172 The liquid 120 drips into or flows into the first tube body 140. In step 242, it is possible to wait for the dielectric liquid vapor 125 of the gas storage unit 160 to condense into the dielectric liquid 120 and enter the space between the first valve 171 and the second valve 172. By repeatedly performing steps 230 to 242, the dielectric fluid 120 entering the gas storage unit 160 can be better recovered. In steps 230 to 242, the heat exchange device 165 can be selectively used to cool the dielectric liquid vapor 125 in the gas storage unit 160, so that the dielectric liquid vapor 125 is condensed into the dielectric liquid 120, and the volume of the gas storage unit 160 shrink.

According to the embodiment, when the internal pressure of the air storage unit 160 is greater than the internal pressure of the part of the cooling device 100 except for the air storage unit 160, it is helpful to suck the dielectric fluid 120 from the air storage unit 160 back into the first tube 140, It then returns to the circulation path of the tank body 110, the second tube body 150 and the heat exchanger 130.

According to an embodiment, the functional operation of step 246 may be a shutdown operation or an opening maintenance operation. Fig. 3 is a flowchart of step 246 when the functional operation of step 246 in Fig. 2 is an opening maintenance operation in the embodiment. Fig. 4 is a flowchart of step 246 when the functional operation of step 246 in Fig. 2 is a shutdown operation in the embodiment.

When the functional operation of step 246 in FIG. 2 is an opening maintenance operation, as shown in FIG. 3, step 246 may include the following steps.

Step 250: Open the first valve 171 and the third valve 173, and close the second valve 172 to reduce the volume of the gas storage unit 160; Step 252: Wait for the sixth period; Step 254: Close the first valve 171 and the second valve Valve 172 and third valve 173; Step 256: Open the upper cover 113 of the tank 110 to repair the heating element 188 immersed in the dielectric fluid 120 of the tank 110; Step 258: Is the upper cover 113 closed? If yes, go to step 212; if not, go to step Step 259; and Step 259: Wait for the seventh period; go to Step 258.

In steps 250 to 252 in Figure 3, because the third valve 173 is opened, the mixed gas (including the dielectric liquid vapor 125 and the air that is not the dielectric liquid vapor 125) in the gas storage unit 160 can be discharged, so that the storage The volume of the air unit 160 is reduced, so it can accommodate the air that enters the cooling device 100 when the cover is opened for maintenance. Since the first valve 171 is open and the second valve 172 is closed, the dielectric fluid 120 located between the first valve 171 and the second valve 172 can be recovered and enter the first pipe body 140. In step 254, by closing the first valve 171, the second valve 172, and the third valve 173, the leakage of the dielectric liquid vapor 125 can be better avoided. In step 256, according to the embodiment, a prompt such as "The upper cover can now be opened" may be displayed on the screen to remind the user when the upper cover 113 can be opened. With the processes shown in Figs. 2 and 3, the problem of air entering the cooling device 100 from the maintenance of the cover can be dealt with.

When the functional operation of step 246 in FIG. 2 is a shutdown operation, as shown in FIG. 4, step 246 may include the following steps.

Step 260: Open the first valve 171 and the second valve 172, and close the third valve 173; Step 262: Disable the heating element 188 immersed in the dielectric fluid 120 of the tank 110; and Step 264: End.

In step 260, the mixed gas in the gas storage unit 160 can be returned to the first pipe body 140 to reduce the loss of the dielectric fluid 120. In step 262, the disabling heating element 188 can be, for example, shutting down the server or other operations.

In summary, by using the cooling device with a plurality of valves and the operating method provided in the embodiments, the problems caused by the opening of the cover of the two-phase immersion cooling device can be effectively addressed, and the escape of dielectric liquid vapor can be avoided. It is really helpful for dealing with problems in this field.

The foregoing descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the present invention.

100: cooling device

110: tank

120: Dielectric fluid

130: heat exchanger

140: first tube body

150: second tube body

160: gas storage unit

171: The first valve

172: Second valve

173: The third valve

113: upper cover

125: Dielectric liquid vapor

188: heating element

1101: The first slot interface

1102: second slot interface

1401, 1501: first interface

1402, 1502: second interface

1403: third interface

1301: First heat exchanger interface

1302: second heat exchanger interface

1601: The first gas storage unit interface

1602: second gas storage unit interface

165: heat exchange device

Claims (6)

A cooling device includes: a tank including a first tank interface and a second tank interface; a dielectric fluid located in the tank, and a heating element is placed in the tank and immersed in the tank. Dielectric liquid; a first heat exchanger, including a first heat exchanger interface, and a second heat exchanger interface, used to condense the dielectric liquid vapor of the dielectric liquid; a first tube body, including a A first port is connected to the first tank body port, a second port is connected to the first heat exchanger port, and a third port; a second pipe body includes a first port connected to the second tank body Interface, and a second interface connected to the second heat exchanger interface; a gas storage unit, including a first gas storage unit interface, and a second gas storage unit interface; a first valve arranged on the second The third interface of the pipe body; a second valve, which is arranged between the first gas storage unit interface and the first valve; a third valve, which is arranged between the second gas storage unit interface and an external space ; And a second heat exchanger for cooling the air storage unit. An operating method of a cooling device, the cooling device comprising a tank, a dielectric fluid in the tank, a heat exchanger, a first tube, a second tube, a gas storage unit, and a first valve , A second valve and a third valve, wherein a first port of the first tube is connected to a first port of the tank, and a second port of the first tube is connected to the heat exchange A first heat exchanger interface of the heat exchanger, the second tube body is connected between a second tank interface of the tank and a second heat exchanger interface of the heat exchanger, and the first valve is disposed on the A third port of the first pipe body, the second valve is disposed between the first valve and a first gas storage unit port of the gas storage unit, and the third valve is disposed on the gas storage unit Between a second gas storage unit interface of one of the units and an external space, the method includes: when the cooling device is activated, opening the first valve and the second valve, and closing the third valve; and reducing the heat The cooling capacity of the exchanger can increase the internal pressure of the cooling device. The operation method of the cooling device according to claim 2, further comprising: after the mixed gas enters the gas storage unit, closing the first valve and the third valve, and opening the second valve; and increasing the heat exchange The cooling capacity of the device to reduce the internal pressure of the cooling device except for the air storage unit. The operation method of the cooling device according to claim 3, further comprising: opening the first valve, closing the second valve and the third valve, and closing the first valve after the vapor of the dielectric liquid is condensed And the third valve, and open the second valve. The operation method of the cooling device according to claim 4, further comprising: when performing an open cover maintenance operation, opening the first valve and the third valve, and closing the second valve, so that the volume of the gas storage unit Shrink; close the first valve, the second valve, and the third valve; and open an upper cover of the tank to repair a heating element immersed in the dielectric fluid of the tank. The operating method of the cooling device according to claim 4, further comprising: when a shutdown operation is performed, opening the first valve and the second valve, and closing the third valve; and disabling the immersion in the tank A heating element in the dielectric fluid.

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