TWI703690B - Cooling device and operation method thereof - Google Patents
Cooling device and operation method thereof Download PDFInfo
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Description
本發明係關於一種冷卻裝置及其操作方法,尤指一種具有複數個閥之冷卻裝置及其操作方法。 The present invention relates to a cooling device and an operating method thereof, especially a cooling device having a plurality of valves and an operating method thereof.
兩相浸入式的冷卻裝置可用於冷卻易發熱之電子元件,舉例來說,可將易發熱之電子元件(例如伺服器)浸泡於槽體內的介電液中,待電子元件發熱後,介電液可蒸發成為介電液蒸氣,介電液蒸氣可被冷凝而變回介電液,從而流回及滴回槽體。發熱電子元件產生的熱能可透過冷凝的過程被移除,以達散熱及冷卻的效果。 Two-phase immersion cooling devices can be used to cool electronic components that are easy to generate heat. For example, electronic components that are easy to heat (such as servers) can be immersed in the dielectric fluid in the tank. After the electronic components heat up, the dielectric The liquid can evaporate into a dielectric liquid vapor, and the dielectric liquid vapor can be condensed to change back to the dielectric liquid, thereby flowing back and dripping back into the tank. The heat generated by the heating electronic components can be removed through the process of condensation to achieve the effect of heat dissipation and cooling.
上述解決方案雖可用於工業領域,但根據經驗,已有待解的難題。舉例來說,為了維修或檢查浸泡於介電液內的電子元件,使用者須定時或不定時地打開槽體之蓋子,方可檢修電子元件。此會導致外界的空氣進入冷卻裝置之內部,從而會導致冷卻裝置之內壓提高。由於開蓋維修的次數不易控制,由外界進入冷卻裝置之空氣量也不易預估,若增加冷卻裝置之體積以控制冷卻裝置之內壓,並非適當的解決方案。此外,外界的空氣進入冷卻裝置之內部,也會導致難以排除介電液蒸氣以外的空氣之難題。 Although the above solutions can be used in the industrial field, based on experience, there are problems to be solved. For example, in order to repair or inspect the electronic components immersed in the dielectric fluid, the user must open the cover of the tank regularly or from time to time to repair the electronic components. This will cause outside air to enter the inside of the cooling device, which will increase the internal pressure of the cooling device. Since the number of opening repairs is not easy to control, and the amount of air entering the cooling device from the outside is not easy to predict, increasing the volume of the cooling device to control the internal pressure of the cooling device is not an appropriate solution. In addition, the entry of outside air into the cooling device will also cause difficulties in eliminating the air other than the dielectric liquid vapor.
實施例提供一種冷卻裝置,包含一槽體、一介電液、一熱交換器、一第一管體、一第二管體、一儲氣單元、一第一閥、一第二閥及一第三閥。該槽體包含一第一槽體接口及一第二槽體接口。該介電液位於該槽體,其中一發熱元件係置於該槽體及浸泡於該介電液。該熱交換器包含一第一熱交換器接口及一第二熱交換器接口,用以冷凝該介電液之介電液蒸氣。該第一管體包含一第一接口連接於該第一槽體接口,一第二接口連接於該第一熱交換器接口,及一第三接口。該第二管體包含一第一接口連接於該第二槽體接口,及一第二接口連接於該第二熱交換器接口。該儲氣單元包含一第一儲氣單元接口,及一第二儲氣單元接口。該第一閥設置於該第二管體之該第三接口。該第二閥設置於該第一儲氣單元接口及該第一閥之間。該第三閥設置於該第二儲氣單元接口及一外部空間之間。 The embodiment provides a cooling device, including a tank, a dielectric fluid, a heat exchanger, a first tube, a second tube, a gas storage unit, a first valve, a second valve, and a The third valve. The tank includes a first tank interface and a second tank interface. The dielectric fluid is located in the tank, and one of the heating elements is placed in the tank and immersed in the dielectric fluid. The heat exchanger includes a first heat exchanger interface and a second heat exchanger interface for condensing the dielectric liquid vapor of the dielectric liquid. The first tube body includes a first interface connected to the first tank interface, a second interface connected to the first heat exchanger interface, and a third interface. The second tube body includes a first interface connected to the second tank interface, and a second interface connected to the second heat exchanger interface. The gas storage unit includes a first gas storage unit interface and a second gas storage unit interface. The first valve is arranged at the third interface of the second pipe body. The second valve is arranged between the first gas storage unit interface and the first valve. The third valve is arranged between the second gas storage unit interface and an external space.
實施例提供一種操作冷卻裝置的方法。該冷卻裝置包含一槽體,一介電液位於該槽體,一熱交換器,一第一管體,一第二管體,一儲氣單元,一第一閥,一第二閥及一第三閥。該第一管體之一第一接口連接於該槽體之一第一槽體接口。該第一管體之一第二接口連接於該熱交換器之一第一熱交換器接口。該第二管體連接於該槽體之一第二槽體接口及該熱交換器之一第二熱交換器接口之間。該第一閥設置於該第一管體之一第三接口。該第二閥設置於該第一閥及該儲氣單元之一第一儲氣單元接口之間。該第三閥設置於該儲氣單元之一第二儲氣單元接口及一外部空間之間。該方法包含開啟該第一閥及該第二閥,及關閉該第三閥;及調降該熱交換器之冷卻能力,以提高該冷卻裝置之內壓。 The embodiment provides a method of operating a cooling device. The cooling device includes a tank, a dielectric fluid in the tank, a heat exchanger, a first tube, a second tube, a gas storage unit, a first valve, a second valve, and a The third valve. A first port of the first tube is connected to a first port of the tank. A second interface of the first tube is connected to a first heat exchanger interface of the heat exchanger. The second tube is connected between a second tank interface of the tank and a second heat exchanger interface of the heat exchanger. The first valve is arranged at a third port of the first pipe body. The second valve is arranged between the first valve and a first gas storage unit interface of the gas storage unit. The third valve is arranged between a second gas storage unit interface of the gas storage unit and an external space. The method includes opening the first valve and the second valve, and closing the third valve; and reducing the cooling capacity of the heat exchanger to increase the internal pressure of the cooling device.
100:冷卻裝置 100: cooling device
110:槽體 110: tank
120:介電液 120: Dielectric fluid
130:熱交換器 130: heat exchanger
140:第一管體 140: first tube body
150:第二管體 150: second tube body
160:儲氣單元 160: gas storage unit
171:第一閥 171: The first valve
172:第二閥 172: Second valve
173:第三閥 173: The third valve
113:上蓋 113: upper cover
125:介電液蒸氣 125: Dielectric liquid vapor
188:發熱元件 188: heating element
1101:第一槽體接口 1101: The first slot interface
1102:第二槽體接口 1102: second slot interface
1401、1501:第一接口 1401, 1501: first interface
1402、1502:第二接口 1402, 1502: second interface
1403:第三接口 1403: third interface
1301:第一熱交換器接口 1301: First heat exchanger interface
1302:第二熱交換器接口 1302: second heat exchanger interface
1601:第一儲氣單元接口 1601: The first gas storage unit interface
1602:第二儲氣單元接口 1602: second gas storage unit interface
165:熱交換裝置 165: heat exchange device
200:方法 200: method
205至264:步驟 205 to 264: steps
第1圖為實施例中,冷卻裝置之示意圖。 Figure 1 is a schematic diagram of the cooling device in the embodiment.
第2圖為實施例中,用以控制第1圖之冷卻裝置之方法的流程圖。 Figure 2 is a flowchart of a method for controlling the cooling device of Figure 1 in an embodiment.
第3圖為實施例中,第2圖之功能操作為開蓋維修操作時,執行功能操作的流程圖。 Figure 3 is a flowchart of the functional operation performed when the functional operation in Figure 2 is an open cover maintenance operation in the embodiment.
第4圖為另一實施例中,第2圖之功能操作為關機操作時,執行功能操作的流程圖。 Fig. 4 is a flowchart of the function operation performed when the function operation in Fig. 2 is a shutdown operation in another embodiment.
第1圖為實施例中,冷卻裝置100之示意圖。冷卻裝置100包含槽體110、介電液120、熱交換器130、第一管體140、第二管體150、儲氣單元160、第一閥171、第二閥172及第三閥173。槽體110包含第一槽體接口1101及第二槽體接口1102。介電液120位於槽體110,其中發熱元件188可置於槽體110及浸泡於介電液120之中。熱交換器130包含第一熱交換器接口1301及第二熱交換器接口1302,用以冷凝介電液120之介電液蒸氣125。第一管體140包含第一接口1401、第二接口1402及第三接口1403,其中第一接口1401連接於第一槽體接口1101,第二接口1402連接於第一熱交換器接口1301。第二管體150包含第一接口1501及第二接口1502,其中第一接口1501連接於第二槽體接口1102,及第二接口1502連接於第二熱交換器接口1302。儲氣單元160包含第一儲氣單元接口1601及第二儲氣單元接口1602。第一閥171設置於第一管體140之第三接口1403。第二閥172設置於第一儲氣單元接口1601及第一閥171之間。第三閥173設置於第二儲氣單元接口1602及外部空間之間。所述的外部空間可為冷卻裝置100外部之空間。
Figure 1 is a schematic diagram of the
根據實施例,如第1圖所示,第一槽體接口1101之高度可低於第二槽體接口1102之高度。因此,第一槽體接口1101可位於介電液120之液面下方且位於介電液120中,而第二槽體接口1102可位於介電液120之液面上方。根據實施例,槽體110可另包含上蓋113,使用者可打開上蓋113以檢修發熱元件188。發熱元件188可例如包含至少一伺服器、電路板、晶片,及/或其他因運作而發熱的元件。
According to the embodiment, as shown in Figure 1, the height of the
根據實施例,如第1圖所示,冷卻裝置100可選擇性地另包含熱交換裝置165,設置於儲氣單元160旁,用以冷卻儲氣單元160。根據實施例,熱交換裝置165可例如為風扇或冷凝管等。根據實施例,儲氣單元160的體積為可調整,例如可為用彈性材料形成的氣球體,或具有風鼓結構而可伸縮之元件。根據實施例,熱交換器130的冷卻能力為可調整,舉例來說,設置於熱交換器130之風扇的轉速可調整,或設置於熱交換器130之冷凝管的冷凝劑之流速可調整。根據實施例,熱交換器130可為第一熱交換器,熱交換裝置165可為第二熱交換器。
According to an embodiment, as shown in FIG. 1, the
根據實施例,第1圖之冷卻裝置100中,當發熱元件188發熱,介電液120可受熱蒸發,轉變為介電液蒸氣125。介電液蒸氣125可透過第二管體150進入熱交換器130,經熱交換而變回介電液120。熱交換器130之介電液120可經由第一管體140流回槽體110。對於槽體110而言,第一管體140可為入口(inlet)管體,第二管體150可為出口(outlet)管體。當介電液蒸氣125之體積較大,及/或冷卻裝置100內非為介電液蒸氣125之空氣較多,介電液蒸氣125及空氣可進入儲氣單元160以控制內壓。然而,若僅使用儲氣單元160控制內壓,難以妥善處理打開上蓋113而進入冷卻裝置100之空氣,也無法執行更準確的控制。因此,根據實施例,可使用第2圖之方法。
According to an embodiment, in the
第2圖為實施例中,用以控制第1圖之冷卻裝置100之方法200的流程圖。方法200可包含以下步驟。
Fig. 2 is a flowchart of a
步驟205:開始;步驟210:開啟第一閥171及第二閥172,及關閉第三閥173;步驟212:介電液120之溫度是否約為沸點?若是,進入步驟216,若否,進入步驟214;步驟214:等待第一時段;進入步驟212;步驟216:調降熱交換器130之冷卻能力,以提高冷卻裝置100之內壓;步驟218:等待第二時段;步驟220:關閉第一閥171及第三閥173,及開啟第二閥172;步驟222:調高熱交換器130之冷卻能力,以降低冷卻裝置100除了儲氣單元160以外的部份之內壓;步驟226:等待第三時段;步驟230:開啟第一閥171,及關閉第二閥172及第三閥173;步驟232:等待第四時段;步驟240:關閉第一閥171及第三閥173,及開啟第二閥172;步驟242:等待第五時段;步驟244:將變數i加1,判斷變數i是否等於預定次數N?若是,進入步驟246,若否,進入步驟230;步驟246:執行功能操作。
Step 205: Start; Step 210: Open the
第2圖至第4圖中,當提及開啟一閥,表示若該閥原本為關閉,可將該閥開啟,若該閥原本為開啟,可維持其開啟。同理,第2圖中,當提及關閉一 閥,表示若該閥原本為開啟,可將該閥關閉,若該閥原本為關閉,可維持其關閉。 In Figures 2 to 4, when referring to opening a valve, it means that if the valve is originally closed, the valve can be opened, and if the valve is originally open, it can be kept open. In the same way, in Figure 2, when it comes to closing one Valve means that if the valve is originally open, the valve can be closed, and if the valve is originally closed, it can be kept closed.
步驟216中,舉例而言,可例如為調降熱交換器130之風扇轉速、或調降熱交換器130之冷凝管之冷卻能力,以使冷卻裝置100輕微過熱。冷卻裝置100中,介電液蒸氣125可增加,且介電液蒸氣125及非為介電液蒸氣125之空氣的體積可上升,故內壓可增加。步驟218中,可使冷卻裝置100內的混合氣體(包含介電液蒸氣125及非為介電液蒸氣125之空氣)更易於進入儲氣單元160。
In
步驟222中,可例如為將熱交換器130之風扇轉速、或將熱交換器130之冷凝管之冷卻能力調降回原本的設定。步驟222可根據設置於冷卻裝置100之溫度感應器之感應結果,予以觸發,也就說,當溫度感應器感應到溫度已達門檻值,可控制熱交換器130以執行步驟222。步驟226中,可等待介電液蒸氣125冷凝。於步驟220至226中,儲氣單元160可與冷卻裝置100除了儲氣單元160以外的部份隔離,此時冷卻裝置100除了儲氣單元160以外的部份中,非為介電液蒸氣125之空氣的比例可很低,且內壓亦低,故可改善熱交換器130之效能,且可降低介電液蒸氣125之外逸。
In
如第2圖所示,步驟230至244可循環執行。步驟244之i與N可為整數,其中0iN。舉例而言,若i的初始值為0,N為5,則可將步驟230至244循環地執行5次。舉例而言,若i的初始值為0,N為7,則可將步驟230至244循環地執行7次,依此類推。
As shown in Figure 2,
步驟232中,可等待位於第一閥171及第二閥172之間的已冷凝之介電
液120滴入或流入第一管體140。步驟242中,可等待儲氣單元160之介電液蒸氣125冷凝成為介電液120,並進入第一閥171及第二閥172之間的空間。藉由反覆執行步驟230至242,可將進入儲氣單元160內的介電液120更佳地回收。步驟230至242中,可選擇性地以熱交換裝置165冷卻儲氣單元160內的介電液蒸氣125,以使介電液蒸氣125冷凝成為介電液120,及使儲氣單元160的體積收縮。
In
根據實施例,當儲氣單元160之內壓大於冷卻裝置100除了儲氣單元160以外的部份之內壓,有助於將介電液120從儲氣單元160吸回第一管體140,進而回到槽體110、第二管體150及熱交換器130之系統的循環路徑。
According to the embodiment, when the internal pressure of the air storage unit 160 is greater than the internal pressure of the part of the
根據實施例,步驟246之功能操作可為關機操作或開蓋維修操作。第3圖為實施例中,第2圖之步驟246的功能操作為開蓋維修操作時,步驟246的流程圖。第4圖為實施例中,第2圖之步驟246的功能操作為關機操作時,步驟246的流程圖。
According to an embodiment, the functional operation of
當第2圖之步驟246的功能操作為開蓋維修操作時,如第3圖所示,步驟246可包含以下步驟。
When the functional operation of
步驟250:開啟第一閥171及第三閥173,及關閉第二閥172,以使儲氣單元160之體積縮小;步驟252:等待第六時段;步驟254:關閉第一閥171、第二閥172及第三閥173;步驟256:打開槽體110之上蓋113,以檢修浸泡於槽體110之介電液120內的發熱元件188;步驟258:上蓋113是否已關閉?若是,進入步驟212;若否,進入步
驟259;及步驟259:等待第七時段;進入步驟258。
Step 250: Open the
第3圖之步驟250至252中,因第三閥173開啟,故可排出儲氣單元160內的混合氣體(包含介電液蒸氣125及非為介電液蒸氣125之空氣),從而使儲氣單元160的體積縮小,故可容納開蓋維修操作時進入冷卻裝置100之空氣。由於第一閥171為開啟且第二閥172為關閉,故位於第一閥171及第二閥172之間的介電液120可被回收而進入第一管體140。步驟254中,藉由關閉第一閥171、第二閥172及第三閥173,可更佳地避免介電液蒸氣125外洩。步驟256中,根據實施例,可於螢幕顯示「現在可開上蓋」之類的提示,以提示使用者上蓋113可開啟之時點。藉由第2圖及第3圖之流程,可處理開蓋維修產生的空氣進入冷卻裝置100之問題。
In
當第2圖之步驟246的功能操作為關機操作時,如第4圖所示,步驟246可包含以下步驟。
When the functional operation of
步驟260:開啟第一閥171及第二閥172,及關閉第三閥173;步驟262:失能浸泡於槽體110之介電液120內的發熱元件188;及步驟264:結束。
Step 260: Open the
步驟260可使儲氣單元160內的混合氣體回到第一管體140,以減少介電液120之損失。步驟262中,失能發熱元件188可例如為將伺服器關機等操作。
In
綜上,藉由使用實施例提供的具有複數個閥之冷卻裝置及操作方法,可有效因應兩相浸入式的冷卻裝置於開蓋維修產生的問題,且可避免介電液蒸氣之逸散,對於處理本領域的難題,實有助益。 In summary, by using the cooling device with a plurality of valves and the operating method provided in the embodiments, the problems caused by the opening of the cover of the two-phase immersion cooling device can be effectively addressed, and the escape of dielectric liquid vapor can be avoided. It is really helpful for dealing with problems in this field.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The foregoing descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the present invention.
100:冷卻裝置 100: cooling device
110:槽體 110: tank
120:介電液 120: Dielectric fluid
130:熱交換器 130: heat exchanger
140:第一管體 140: first tube body
150:第二管體 150: second tube body
160:儲氣單元 160: gas storage unit
171:第一閥 171: The first valve
172:第二閥 172: Second valve
173:第三閥 173: The third valve
113:上蓋 113: upper cover
125:介電液蒸氣 125: Dielectric liquid vapor
188:發熱元件 188: heating element
1101:第一槽體接口 1101: The first slot interface
1102:第二槽體接口 1102: second slot interface
1401、1501:第一接口 1401, 1501: first interface
1402、1502:第二接口 1402, 1502: second interface
1403:第三接口 1403: third interface
1301:第一熱交換器接口 1301: First heat exchanger interface
1302:第二熱交換器接口 1302: second heat exchanger interface
1601:第一儲氣單元接口 1601: The first gas storage unit interface
1602:第二儲氣單元接口 1602: second gas storage unit interface
165:熱交換裝置 165: heat exchange device
Claims (6)
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Cited By (1)
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CN113747722A (en) * | 2021-09-26 | 2021-12-03 | 北京无线电测量研究所 | Electronic equipment case structure and contain its electronic equipment device |
Citations (3)
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TW387825B (en) * | 1997-02-05 | 2000-04-21 | Diamond Technical & Trading Co | Enclosed treatment |
TW201310872A (en) * | 2011-08-19 | 2013-03-01 | Inventec Corp | Coolant pipe of sever rack |
CN109168306A (en) * | 2018-10-26 | 2019-01-08 | 英业达科技有限公司 | cooling device |
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2019
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW387825B (en) * | 1997-02-05 | 2000-04-21 | Diamond Technical & Trading Co | Enclosed treatment |
TW201310872A (en) * | 2011-08-19 | 2013-03-01 | Inventec Corp | Coolant pipe of sever rack |
CN109168306A (en) * | 2018-10-26 | 2019-01-08 | 英业达科技有限公司 | cooling device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113747722A (en) * | 2021-09-26 | 2021-12-03 | 北京无线电测量研究所 | Electronic equipment case structure and contain its electronic equipment device |
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