TWI690686B - Cooling device - Google Patents

Cooling device Download PDF

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TWI690686B
TWI690686B TW107138573A TW107138573A TWI690686B TW I690686 B TWI690686 B TW I690686B TW 107138573 A TW107138573 A TW 107138573A TW 107138573 A TW107138573 A TW 107138573A TW I690686 B TWI690686 B TW I690686B
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cooling
tank
cooling liquid
cooling device
liquid
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TW107138573A
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TW202018243A (en
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鄭再魁
陳虹汝
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英業達股份有限公司
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Abstract

A cooling device is configured to apply to cool a heat component. The cooling device includes a tank, a cover and a cooling liquid. The tank has a bottom surface, a cooling liquid input and a cooling liquid output. The cover is connected to the tank. The cover and the tank together form a space which is configured to place the heat component. The cooling liquid is located in the space.

Description

冷卻裝置Cooling device

本發明係關於一種冷卻裝置,特別是一種具有冷卻液輸入口以及冷卻液輸出口之冷卻裝置。 The invention relates to a cooling device, in particular to a cooling device with a cooling fluid inlet and a cooling fluid outlet.

現行常見之兩相浸入式冷卻系統係提供一槽體,槽體分為液體段以及蒸氣段。液體段位於槽體下側且容置有一易揮發且低沸點之冷卻液,蒸氣段位於槽體上側且容置有一散熱器。使用者將伺服器浸泡於冷卻液中,藉由冷卻液吸收伺服器的熱量來達到冷卻伺服器的效果。冷卻液吸收到一定的熱量後便會蒸發為氣態的冷卻液蒸氣,並且冷卻液蒸氣會往上集中於槽體之蒸氣段。冷卻液蒸氣接觸到較低溫的散熱器後,冷卻液蒸氣的熱量傳導至散熱器。冷卻液蒸氣的熱量一旦散失後便會冷凝成液態的冷卻液,冷卻液受到重力作用而回到槽體下側的液體段。如此一來,伺服器所發出的熱量便能被冷卻液帶至槽體上側之蒸氣段,再透過連接散熱器的管路將熱量帶離兩相浸入式冷卻系統之槽體。 The current common two-phase immersion cooling system provides a tank, which is divided into a liquid section and a vapor section. The liquid section is located on the lower side of the tank body and contains a volatile and low boiling point cooling liquid, and the vapor section is located on the upper side of the tank body and contains a radiator. The user immerses the server in the cooling liquid, and the cooling liquid absorbs the heat of the server to achieve the effect of cooling the server. After the cooling fluid absorbs a certain amount of heat, it will evaporate into gaseous cooling fluid vapor, and the cooling fluid vapor will concentrate upwards on the vapor section of the tank. After the coolant vapor contacts the cooler radiator, the heat of the coolant vapor is transferred to the radiator. Once the heat of the cooling liquid vapor is dissipated, it will condense into liquid cooling liquid, and the cooling liquid will return to the liquid section on the lower side of the tank by gravity. In this way, the heat generated by the server can be brought to the steam section on the upper side of the tank by the cooling liquid, and then the heat is taken away from the tank of the two-phase immersion cooling system through the pipeline connected to the radiator.

然而,在冷卻液蒸發為冷卻液蒸氣前,蒸氣段內部原本便已存在空氣。當冷卻液蒸氣進入蒸氣段後,蒸氣段內部的氣體則為空氣與冷卻液蒸氣之混合物。如此一來,與散熱器接觸之氣體並非純冷卻液蒸氣,使得冷卻液蒸氣將熱量傳導至散熱器的效率較差。再者,當使用者打開槽體以進行設備維修、拿取伺服器或放置伺服器時,槽體之蒸氣 段的冷卻液蒸氣容易散逸至大氣中。若使用者多次操作開閉槽體,便有可能造成冷卻液不足的現象。此外,槽體的外殼常會設有開孔以供線材進入槽體並電性連接伺服器,使伺服器透過線材與槽體外部進行電源與訊號的交換。但槽體外殼之開孔與線材之間的縫隙形狀較為不規則,不易對此縫隙徹底密封。冷卻液蒸氣便有可能從此縫隙逸出,最終亦會造成冷卻液不足。 However, before the cooling liquid evaporates into the cooling liquid vapor, air already exists inside the vapor section. When the coolant vapor enters the vapor section, the gas inside the vapor section is a mixture of air and coolant vapor. As a result, the gas in contact with the radiator is not pure coolant vapor, making the coolant vapor less efficient at transferring heat to the radiator. Furthermore, when the user opens the tank for equipment maintenance, picks up the server or places the server, the vapor of the tank The cooling liquid vapor of the section is easily dissipated into the atmosphere. If the user repeatedly opens and closes the tank, it may cause insufficient coolant. In addition, the shell of the tank is often provided with an opening for the wire to enter the tank and be electrically connected to the server, so that the server exchanges power and signals through the wire and the outside of the tank. However, the shape of the gap between the opening of the tank shell and the wire is relatively irregular, and it is not easy to completely seal the gap. The coolant vapor may escape from this gap, which will eventually cause insufficient coolant.

本發明在於提供一種冷卻裝置,藉以解決先前技術中兩相浸入式冷卻系統之散熱效率較差以及冷卻液容易逸失的問題。 The present invention is to provide a cooling device, so as to solve the problems of poor heat dissipation efficiency of the two-phase immersion cooling system and the easy escape of the cooling liquid in the prior art.

本發明之一實施例所揭露之冷卻裝置,適用於冷卻一發熱元件。冷卻裝置包含一槽體、一蓋體以及一冷卻液。槽體具有一底面、一冷卻液輸入口以及一冷卻液輸出口。蓋體連接於槽體。蓋體與槽體形成一容置空間,容置空間適用於容置發熱元件。冷卻液位於容置空間。 The cooling device disclosed in an embodiment of the present invention is suitable for cooling a heating element. The cooling device includes a tank, a cover and a cooling liquid. The tank body has a bottom surface, a coolant inlet and a coolant outlet. The cover body is connected to the groove body. The cover body and the groove body form an accommodating space, and the accommodating space is suitable for accommodating the heating element. Coolant is located in the storage space.

根據上述實施例所揭露的冷卻裝置,由於冷卻液蒸發為冷卻液蒸氣後得以從冷卻液輸出口離開容置空間,因此堆積在容置空間的冷卻液蒸氣相較於習知技術而言能夠大幅減少。此外,當上述實施例之冷卻裝置運作前,使用者得以先將容置空間內的空氣自冷卻液輸出口排出。如此一來,當上述實施例之冷卻裝置運作時,從槽體之冷卻液輸出口排出的氣體中空氣所佔比例較小。亦即排出的氣體較能接近純冷卻液蒸氣,使得排出的氣體之熱傳導效果較習知技術大幅提升。 According to the cooling device disclosed in the above embodiment, since the cooling liquid evaporates into the cooling liquid vapor and then leaves the accommodating space from the cooling liquid outlet, the cooling liquid vapor accumulated in the accommodating space can be significantly larger than the conventional technology. cut back. In addition, before the cooling device of the above embodiment is operated, the user can first discharge the air in the accommodating space from the cooling liquid outlet. In this way, when the cooling device of the above embodiment operates, the proportion of air in the gas discharged from the cooling fluid outlet of the tank is small. That is, the discharged gas is closer to the pure coolant vapor, so that the heat conduction effect of the discharged gas is greatly improved than the conventional technology.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步 的解釋。 The above description of the content of the present invention and the description of the following embodiments are used to exemplify and explain the principles of the present invention, and provide a further scope of the patent application of the present invention explanation of.

10a、10b、10c、10d、10e、10f、10g、10h:冷卻裝置 10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h: cooling device

20:發熱元件 20: heating element

22:線材 22: Wire

100a、100b、100c、100f、100g、100h:槽體 100a, 100b, 100c, 100f, 100g, 100h: tank

110a、110b、110c:底面 110a, 110b, 110c: bottom surface

120a:冷卻液輸入口 120a: coolant inlet

130a、130c:冷卻液輸出口 130a, 130c: coolant outlet

200a、200b、200c、200f、200g、200h:蓋體 200a, 200b, 200c, 200f, 200g, 200h: cover

210c:第一側 210c: first side

220c:第二側 220c: Second side

300a、300b、300d、300e、300g、300h:冷卻液 300a, 300b, 300d, 300e, 300g, 300h: coolant

310a、310a’、310b:液面 310a, 310a’, 310b: liquid level

320a、320c、320d、320e、320f、320h:冷卻液蒸氣 320a, 320c, 320d, 320e, 320f, 320h: coolant vapor

400a、400d、400g、400h:液體流道 400a, 400d, 400g, 400h: liquid flow path

500a、500b、500d、500h:蒸氣流道 500a, 500b, 500d, 500h: steam flow path

510a、510b:流入端 510a, 510b: inflow end

520a、520b:流出端 520a, 520b: outflow end

600d、600e、600g、600h:熱交換段 600d, 600e, 600g, 600h: heat exchange section

610d:第一端 610d: the first end

620d:第二端 620d: the second end

700e:散熱裝置 700e: heat sink

800f:電子連接器 800f: electronic connector

900g:泵浦裝置 900g: pumping device

1000h:充氣裝置 1000h: Inflatable device

P:平台 P: Platform

S:容置空間 S: accommodating space

D1a、D1b、D2a、D2b、D3、D4:距離 D1a, D1b, D2a, D2b, D3, D4: distance

A:填充空氣 A: Fill with air

圖1 係為根據本發明之一實施例所繪示之冷卻裝置與發熱元件的側面剖面分解示意圖。 FIG. 1 is an exploded schematic side sectional view of a cooling device and a heating element according to an embodiment of the invention.

圖2 係為圖1之冷卻裝置的側面剖面示意圖。 FIG. 2 is a schematic side sectional view of the cooling device of FIG. 1.

圖3 係為圖1之冷卻裝置作動時的側面剖面示意圖。 FIG. 3 is a schematic side sectional view of the cooling device of FIG. 1 when it is in operation.

圖4 係為根據本發明之次一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。 FIG. 4 is a schematic side sectional view of the cooling device according to the next embodiment of the present invention when it is in operation.

圖5 係為根據本發明之另一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。 5 is a schematic side cross-sectional view of the cooling device according to another embodiment of the present invention when it is in operation.

圖6 係為根據本發明之再一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。 6 is a schematic side sectional view of the cooling device according to yet another embodiment of the present invention when it is in operation.

圖7 係為根據本發明之又一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。 7 is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation.

圖8 係為根據本發明之又一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。 8 is a schematic side cross-sectional view of the cooling device according to another embodiment of the present invention when it is in operation.

圖9 係為根據本發明之又一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。 9 is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation.

圖10 係為根據本發明之又一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。 10 is a schematic side cross-sectional view of a cooling device according to another embodiment of the present invention when it is in operation.

圖11 係為圖10之冷卻裝置作動完成時的側面剖面示意圖。 FIG. 11 is a schematic side sectional view of the cooling device of FIG. 10 when the operation is completed.

以下將說明有關本發明之一實施例,首先請參閱圖1至圖2。圖1係為根據本發明之一實施例所繪示之冷卻裝置與發熱元件的側面剖面分解示意圖。圖2係為圖1之冷卻裝置的側面剖面示意圖。 The following will describe one embodiment of the present invention. Please refer to FIG. 1 to FIG. 2 first. FIG. 1 is an exploded schematic side sectional view of a cooling device and a heating element according to an embodiment of the invention. FIG. 2 is a schematic side sectional view of the cooling device of FIG. 1.

本實施例之冷卻裝置10a,適用於冷卻一發熱元件20。冷卻裝置10a包含一槽體100a、一蓋體200a以及一冷卻液300a。槽體100a具有一底面110a、一冷卻液輸入口120a以及一冷卻液輸出口130a。當槽體100a放置於如桌面之一平台P時,面向平台P的一面為底面110a。蓋體200a連接於槽體100a。在本實施例以及本發明的部份實施例中,蓋體200a與槽體100a之底面110a位於槽體100a之相對兩側,但不以此為限。在其他實施例中,蓋體可與槽體之底面相連接。在本實施例中,蓋體200a與槽體100a形成一容置空間S。容置空間S適用於容置發熱元件20,例如為伺服器。冷卻液300a位於容置空間S。在本實施例以及本發明的部份實施例中,冷卻液300a之一液面310a較發熱元件20遠離槽體100a之底面110a,亦即發熱元件20完全沉浸於冷卻液300a中,但不以此為限。在其他實施例中,發熱元件亦可僅有部份浸泡於冷卻液中,只要發熱元件的熱量能夠傳導至冷卻液即可。在本實施例以及本發明的部份實施例中,冷卻液300a可為易揮發、不導電且低沸點之液體,例如為冷媒,但不以此為限。在其他實施例中,冷卻液亦可為純水或氟化液。在本實施例中,當發熱元件20之與冷卻液300a接觸之線路訊號為1kHz(千赫)時,冷卻液300a的介電常數接近1。在本實施例以及本發明的部份實施例中,冷卻液300a的介電常數為1.8。 在本實施例中,當容置空間S同時容置有發熱元件20以及冷卻液300a時,發熱元件20所產生的熱量便可以傳導至冷卻液300a。由於冷卻液300a蒸發為冷卻液蒸氣320a後可由冷卻液輸出口130a離開容置空間S,容置空間S便不會有過多的冷卻液蒸氣320a聚集。當使用者需要打開蓋體200a以對槽體100a之內部進行設備維修或是拿取發熱元件20時,冷卻液蒸氣320a自容置空間S逸失的情況會比習知技術相對大幅降低。 The cooling device 10a of this embodiment is suitable for cooling a heating element 20. The cooling device 10a includes a tank 100a, a cover 200a, and a cooling liquid 300a. The tank body 100a has a bottom surface 110a, a coolant inlet 120a, and a coolant outlet 130a. When the tank 100a is placed on a platform P such as a desktop, the side facing the platform P is the bottom surface 110a. The cover 200a is connected to the tank 100a. In this embodiment and some embodiments of the present invention, the cover body 200a and the bottom surface 110a of the groove body 100a are located on opposite sides of the groove body 100a, but not limited thereto. In other embodiments, the cover can be connected to the bottom of the tank. In this embodiment, the cover body 200a and the groove body 100a form an accommodating space S. The accommodating space S is suitable for accommodating the heating element 20, for example, a server. The cooling liquid 300a is located in the accommodating space S. In this embodiment and some embodiments of the present invention, a liquid surface 310a of the cooling liquid 300a is farther from the bottom surface 110a of the tank 100a than the heating element 20, that is, the heating element 20 is completely immersed in the cooling liquid 300a, but not This is limited. In other embodiments, the heating element may only be partially immersed in the cooling liquid, as long as the heat of the heating element can be conducted to the cooling liquid. In this embodiment and some embodiments of the present invention, the cooling liquid 300a may be a volatile, non-conductive and low-boiling liquid, such as a refrigerant, but not limited thereto. In other embodiments, the cooling liquid may also be pure water or fluorinated liquid. In this embodiment, when the line signal of the heating element 20 in contact with the cooling liquid 300a is 1 kHz (kilohertz), the dielectric constant of the cooling liquid 300a is close to 1. In this embodiment and some embodiments of the present invention, the dielectric constant of the cooling liquid 300a is 1.8. In this embodiment, when the accommodating space S accommodates both the heating element 20 and the cooling liquid 300a, the heat generated by the heating element 20 can be conducted to the cooling liquid 300a. Since the cooling liquid 300a evaporates into the cooling liquid vapor 320a, it can leave the accommodating space S through the cooling liquid outlet 130a, so that the accommodating space S will not have too much cooling liquid vapor 320a accumulating. When the user needs to open the cover 200a to perform equipment maintenance on the interior of the tank 100a or take the heating element 20, the situation where the coolant vapor 320a escapes from the accommodating space S is relatively greatly reduced compared to the conventional technology.

在本實施例以及本發明的部份實施例中,冷卻裝置10a更包含一液體流道400a以及一蒸氣流道500a。液體流道400a透過冷卻液輸入口120a連接於槽體100a,蒸氣流道500a透過冷卻液輸出口130a連接於槽體100a。液態的冷卻液300a從液體流道400a流經冷卻液輸入口120a並進入容置空間S,氣態的冷卻液蒸氣320a從容置空間S經由冷卻液輸出口130a進入蒸氣流道500a。如此一來,當冷卻裝置10a作動時,發熱元件20的熱量傳導至冷卻液300a並且冷卻液300a蒸發為冷卻液蒸氣320a。冷卻液蒸氣320a再將熱量從容置空間S帶至蒸氣流道500a。冷卻液300a自液體流道400a進入容置空間S以補充蒸發掉的冷卻液300a。此外,由於冷卻液蒸氣320a的密度小於冷卻液300a的密度,造成冷卻液蒸氣320a的體積流率大於冷卻液300a的體積流率。為了使冷卻裝置10a處於平衡狀態,蒸氣流道500a的管徑應大於液體流道400a的管徑。如此一來,自冷卻液輸出口130a流出的冷卻液蒸氣320a之質量流率才會等於自冷卻液輸入口120a流入的冷卻液300a之質量流率,但不以此為限。在其他實施例中,亦可增加蒸氣流道 的數量,只要自冷卻液輸出口流出的冷卻液蒸氣之質量流率等於自冷卻液輸入口流入的冷卻液之質量流率即可。 In this embodiment and some embodiments of the invention, the cooling device 10a further includes a liquid flow channel 400a and a vapor flow channel 500a. The liquid flow channel 400a is connected to the tank 100a through the cooling liquid inlet 120a, and the vapor flow channel 500a is connected to the tank 100a through the cooling liquid outlet 130a. The liquid cooling liquid 300a flows from the liquid flow channel 400a through the cooling liquid inlet 120a and enters the storage space S, and the gaseous cooling liquid vapor 320a enters the vapor flow channel 500a from the storage space S via the cooling liquid output port 130a. As such, when the cooling device 10a is activated, the heat of the heating element 20 is conducted to the cooling liquid 300a and the cooling liquid 300a evaporates into the cooling liquid vapor 320a. The coolant vapor 320a then brings heat from the containing space S to the vapor flow channel 500a. The cooling liquid 300a enters the accommodating space S from the liquid flow channel 400a to supplement the evaporated cooling liquid 300a. In addition, since the density of the cooling liquid vapor 320a is smaller than the density of the cooling liquid 300a, the volume flow rate of the cooling liquid vapor 320a is greater than the volume flow rate of the cooling liquid 300a. In order to make the cooling device 10a in a balanced state, the pipe diameter of the vapor flow channel 500a should be larger than the pipe diameter of the liquid flow channel 400a. In this way, the mass flow rate of the coolant vapor 320a flowing out of the coolant output port 130a will be equal to the mass flow rate of the coolant 300a flowing in from the coolant input port 120a, but not limited to this. In other embodiments, the vapor flow channel can also be added , As long as the mass flow rate of the coolant vapor flowing from the coolant outlet is equal to the mass flow rate of the coolant flowing from the coolant inlet.

在本實施例中,冷卻液300a用以吸收來自發熱元件20所產生的熱量。當冷卻裝置10a作動時,部份冷卻液300a吸收一定的熱量後便會蒸發為氣態之冷卻液蒸氣320a。由於部份的冷卻液300a蒸發,冷卻液300a之液面310a因此降低成310a’(繪示於圖3)。請參閱圖3,圖3係為圖1之冷卻裝置作動時的側面剖面示意圖。氣態之冷卻液蒸氣320a透過冷卻液輸出口130a離開容置空間S,液態之冷卻液300a透過冷卻液輸入口120a流入容置空間S。因為液體往低處流動且氣體往高處飄散的特性,所以液體的冷卻液輸入口120a設置宜低於氣體的冷卻液輸出口130a設置。在本實施例以及本發明的部份實施例中,槽體100a之冷卻液輸入口120a較冷卻液輸出口130a靠近槽體100a之底面110a,但不以此為限。在其他實施例中,槽體之冷卻液輸入口與底面的距離可相等於冷卻液輸出口與底面的距離,只要液態之冷卻液能透過冷卻液輸入口流入容置空間且氣態之冷卻液蒸氣能透過冷卻液輸出口離開容置空間即可。 In this embodiment, the cooling liquid 300a is used to absorb the heat generated from the heating element 20. When the cooling device 10a is activated, part of the cooling liquid 300a will evaporate into gaseous cooling liquid vapor 320a after absorbing a certain amount of heat. As part of the cooling liquid 300a evaporates, the liquid surface 310a of the cooling liquid 300a is reduced to 310a' (shown in FIG. 3). Please refer to FIG. 3, which is a schematic side cross-sectional view of the cooling device of FIG. 1 when activated. The gaseous coolant vapor 320a leaves the accommodating space S through the coolant output port 130a, and the liquid coolant 300a flows into the accommodating space S through the coolant input port 120a. Because of the characteristics of the liquid flowing down and the gas sloshing up, the cooling liquid inlet 120a of the liquid is preferably lower than the cooling liquid outlet 130a of the gas. In this embodiment and some embodiments of the present invention, the coolant inlet 120a of the tank 100a is closer to the bottom surface 110a of the tank 100a than the coolant outlet 130a, but not limited thereto. In other embodiments, the distance between the coolant inlet of the tank and the bottom surface can be equal to the distance between the coolant outlet and the bottom surface, as long as the liquid coolant can flow into the accommodating space and the gaseous coolant vapor through the coolant inlet It can just leave the accommodating space through the coolant outlet.

在本實施例以及本發明的部份實施例中,蒸氣流道500a具有一流入端510a以及一流出端520a。流入端510a連接於槽體100a之冷卻液輸出口130a,且流入端510a至底面110a的距離D1a等於流出端520a至底面110a的距離D2a。亦即,蒸氣流道500a以實質上平行於底面110a的方式設置於槽體100a,但不以此為限。請參閱圖4,圖4係為根據本發明之次一實施例所繪示之冷卻裝置作動時的側面剖面 示意圖。以下僅針對本發明次一實施例與前述之部份實施例中不同之處進行說明,其餘相同之處將被省略。在本實施例以及本發明的部份實施例中,冷卻裝置10b的流入端510b至底面110b的距離D1b小於流出端520b至底面110b的距離D2b。亦即,蒸氣流道500b以傾斜方式設置於槽體100b。如此一來,冷卻液300b之液面310b能夠更加接近蓋體200b,並且確保蒸氣流道500b之流出端520b僅有冷卻液蒸氣320b流過,將冷卻液300b保持在容置空間S。 In this embodiment and some embodiments of the present invention, the vapor flow channel 500a has an inflow end 510a and a first-run outlet 520a. The inflow end 510a is connected to the coolant outlet 130a of the tank 100a, and the distance D1a from the inflow end 510a to the bottom surface 110a is equal to the distance D2a from the outflow end 520a to the bottom surface 110a. That is, the vapor flow channel 500a is provided on the tank 100a so as to be substantially parallel to the bottom surface 110a, but it is not limited thereto. Please refer to FIG. 4, which is a side cross-sectional view of the cooling device according to the next embodiment of the present invention when it is in operation Schematic. The following only describes the differences between the next embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the present invention, the distance D1b from the inflow end 510b to the bottom surface 110b of the cooling device 10b is smaller than the distance D2b from the outflow end 520b to the bottom surface 110b. That is, the vapor flow channel 500b is provided in the tank 100b in an inclined manner. In this way, the liquid surface 310b of the cooling liquid 300b can be closer to the cover 200b, and it is ensured that only the cooling liquid vapor 320b flows through the outflow end 520b of the vapor flow channel 500b, and the cooling liquid 300b is kept in the accommodating space S.

在本實施例以及本發明的部份實施例中,蓋體200a為一實質上平行於底面110a之一平板,但不以此為限。請參閱圖5,圖5係為根據本發明之另一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。以下僅針對本發明另一實施例與前述之部份實施例中不同之處進行說明,其餘相同之處將被省略。在本實施例以及本發明的部份實施例中,冷卻裝置10c的蓋體200c具有一第一側210c以及一第二側220c。第一側210c至底面110c的距離D3大於第二側220c至底面110c的距離D4。亦即,第一側210c較第二側220c靠近槽體100c之冷卻液輸出口130c,且第一側210c較第二側220c遠離槽體100c之底面110c。由於氣體會往高處飄散的特性,將蓋體200c之第一側210c設置成高於第二側220c可以將冷卻液蒸氣320c集中於第一側210c。並且第一側210c靠近槽體100c之冷卻液輸出口130c可以使集中在第一側210c之冷卻液蒸氣320c更容易透過冷卻液輸出口130c離開容置空間S。 In this embodiment and some embodiments of the present invention, the cover 200a is a flat plate substantially parallel to the bottom surface 110a, but it is not limited thereto. Please refer to FIG. 5, which is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the invention, the cover 200c of the cooling device 10c has a first side 210c and a second side 220c. The distance D3 from the first side 210c to the bottom surface 110c is greater than the distance D4 from the second side 220c to the bottom surface 110c. That is, the first side 210c is closer to the coolant outlet 130c of the tank 100c than the second side 220c, and the first side 210c is farther away from the bottom surface 110c of the tank 100c than the second side 220c. Due to the characteristic that the gas will scatter upward, setting the first side 210c of the cover 200c higher than the second side 220c can concentrate the coolant vapor 320c on the first side 210c. And the first side 210c is close to the coolant outlet 130c of the tank 100c so that the coolant vapor 320c concentrated on the first side 210c can more easily leave the accommodating space S through the coolant outlet 130c.

接著請參閱圖6,圖6係為根據本發明之再一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。以下僅針對本發明再一實施例 與前述之部份實施例中不同之處進行說明,其餘相同之處將被省略。在本實施例以及本發明的部份實施例中,冷卻裝置10d更包含一熱交換段600d,熱交換段600d例如為一管材,但不以此為限。在其他實施例中,熱交換段亦可為一容置槽。在本實施例以及本發明的部份實施例中,熱交換段600d具有一第一端610d以及一第二端620d。熱交換段600d透過第一端610d連接於蒸氣流道500d,熱交換段600d透過第二端620d連接於液體流道400d。熱交換段600d為一供氣態之冷卻液蒸氣320d冷凝為液態之冷卻液300d的空間。冷卻液蒸氣320d從蒸氣流道500d進入熱交換段600d之第一端610d。冷卻液蒸氣320d在第一端610d進行散熱後凝結為冷卻液300d,並隨著重力作用流經第二端620d進入液體流道400d。如此一來,從容置空間S離開的冷卻液蒸氣320d便可以經由蒸氣流道500d、熱交換段600d以及液體流道400d再以冷卻液300d的狀態回到容置空間S,形成一個冷卻液300d的封閉循環系統並維持冷卻液300d的液量。 Next, please refer to FIG. 6, which is a schematic side sectional view of the cooling device according to yet another embodiment of the present invention when it is in operation. The following is only for yet another embodiment of the present invention The differences from some of the foregoing embodiments will be described, and the remaining similarities will be omitted. In this embodiment and some embodiments of the present invention, the cooling device 10d further includes a heat exchange section 600d. The heat exchange section 600d is, for example, a pipe material, but not limited thereto. In other embodiments, the heat exchange section may also be a receiving slot. In this embodiment and some embodiments of the present invention, the heat exchange section 600d has a first end 610d and a second end 620d. The heat exchange section 600d is connected to the vapor flow channel 500d through the first end 610d, and the heat exchange section 600d is connected to the liquid flow channel 400d through the second end 620d. The heat exchange section 600d is a space for supplying gaseous cooling liquid vapor 320d to condensing into liquid cooling liquid 300d. The cooling liquid vapor 320d enters the first end 610d of the heat exchange section 600d from the vapor flow channel 500d. The cooling liquid vapor 320d condenses into the cooling liquid 300d after radiating heat at the first end 610d, and flows into the liquid flow channel 400d through the second end 620d with the action of gravity. In this way, the cooling liquid vapor 320d leaving the accommodating space S can return to the accommodating space S in the state of the cooling liquid 300d through the vapor flow path 500d, the heat exchange section 600d, and the liquid flow path 400d, forming a cooling liquid 300d Closed circulation system and maintain the volume of cooling fluid 300d.

接著請參閱圖7,圖7係為根據本發明之又一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。以下僅針對本發明又一實施例與前述之部份實施例中不同之處進行說明,其餘相同之處將被省略。在本實施例以及本發明的部份實施例中,冷卻裝置10e更包含一散熱裝置700e。散熱裝置700e例如為一水冷箱並連接於熱交換段600e。透過散熱裝置700e與熱交換段600e的接觸,將熱交換段600e內之冷卻液蒸氣320e的熱量傳導至散熱裝置700e。如此一來,便可加快冷卻液蒸氣320e在熱交換段600e內冷凝成冷卻液300e的速度。在本實施例以及 本發明的部份實施例中,散熱裝置700e例如為一水冷箱,但不以此為限。在其他實施例中,散熱裝置亦可為風扇且風扇不與熱交換段連接。風扇之出風面面對熱交換段,可加速熱交換段週遭之空氣流動。熱交換段週遭的空氣流動有助於熱交換段內之冷卻液蒸氣的散熱,加快冷卻液蒸氣在熱交換段內冷凝成冷卻液的速度。 Next, please refer to FIG. 7, which is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the invention, the cooling device 10e further includes a heat dissipation device 700e. The heat dissipation device 700e is, for example, a water cooling box and is connected to the heat exchange section 600e. Through the contact between the heat dissipation device 700e and the heat exchange section 600e, the heat of the cooling liquid vapor 320e in the heat exchange section 600e is conducted to the heat dissipation device 700e. In this way, the speed at which the cooling liquid vapor 320e condenses into the cooling liquid 300e in the heat exchange section 600e can be accelerated. In this embodiment and In some embodiments of the present invention, the heat dissipation device 700e is, for example, a water cooling box, but it is not limited thereto. In other embodiments, the heat dissipation device may also be a fan and the fan is not connected to the heat exchange section. The air outlet of the fan faces the heat exchange section, which can accelerate the air flow around the heat exchange section. The air flow around the heat exchange section helps the heat dissipation of the cooling liquid vapor in the heat exchange section and accelerates the speed at which the cooling liquid vapor condenses into the cooling liquid in the heat exchange section.

接著請參閱圖8,圖8係為根據本發明之又一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。以下僅針對本發明又一實施例與前述之部份實施例中不同之處進行說明,其餘相同之處將被省略。在本實施例以及本發明的部份實施例中,冷卻裝置10f更包含一電子連接器800f。電子連接器800f透過蓋體200f之一開孔(圖未繪示)貫穿並連接於蓋體200f。電子連接器800f用以透過線材22電性連接發熱元件20,並且電子連接器800f可與槽體100f外部進行電源與訊號的交換。亦即,容置空間S的發熱元件20可透過線材22以及電子連接器800f與槽體100f外部進行電源與訊號的交換。蓋體200f之開孔形狀例如為方形,能夠使電子連接器800f與蓋體200f之開孔間的密合效果較習知技術提升。如此一來可以避免在槽體100f或蓋體200f上透過較不規則且不易密合之開孔以供線材22離開容置空間S,進一步避免冷卻液蒸氣320f從較不規則之開孔逸失。 Next, please refer to FIG. 8, which is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the invention, the cooling device 10f further includes an electronic connector 800f. The electronic connector 800f penetrates through an opening (not shown) of the cover 200f and is connected to the cover 200f. The electronic connector 800f is used to electrically connect the heating element 20 through the wire 22, and the electronic connector 800f can exchange power and signals with the outside of the tank 100f. That is, the heating element 20 in the accommodating space S can exchange power and signals through the wire 22, the electronic connector 800f, and the outside of the tank 100f. The shape of the opening of the cover 200f is, for example, square, which can improve the adhesion effect between the electronic connector 800f and the opening of the cover 200f compared to the conventional technology. In this way, the grooves 100f or the lid 200f can be prevented from passing through the irregular and difficult-to-close openings for the wire 22 to leave the accommodating space S, and the coolant vapor 320f can be prevented from escaping from the irregular openings.

接著請參閱圖9,圖9係為根據本發明之又一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。以下僅針對本發明又一實施例與前述之部份實施例中不同之處進行說明,其餘相同之處將被省略。在本實施例以及本發明的部份實施例中,冷卻裝置10g更包含一泵浦裝置 900g。熱交換段600g例如為一容置槽。泵浦裝置900g位於液體流道400g並且透過液體流道400g連接於槽體100g與熱交換段600g,但不以此為限。在其他實施例中,泵浦裝置可位於液體流道以外的其他地方並透過冷卻液輸入口以外的開孔連接至槽體,只要泵浦裝置低於冷卻液之液面即可。在本實施例以及本發明的部份實施例中,在使用者需要將蓋體200g打開前可先透過泵浦裝置900g將冷卻液300g抽出容置空間S,並將冷卻液300g儲存在熱交換段600g。如此一來,容置空間S便不存有冷卻液300g。隨後當使用者將蓋體200g打開時,則可以避免冷卻液300g揮發至大氣中而逸失。在泵浦裝置900g作用時,泵浦裝置900g可設置例如為逆止閥(圖未繪示)來防止冷卻液300g流回容置空間S。在使用者蓋回蓋體200g而回到冷卻裝置10g工作階段時,則將逆止閥移除。但不以此為限。在其他實施例中,亦可無設置逆止閥。 Next, please refer to FIG. 9, which is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the invention, the cooling device 10g further includes a pumping device 900g. The heat exchange section 600g is, for example, a receiving slot. The pump device 900g is located in the liquid flow channel 400g and is connected to the tank body 100g and the heat exchange section 600g through the liquid flow channel 400g, but it is not limited thereto. In other embodiments, the pumping device may be located in a place other than the liquid flow path and connected to the tank through an opening other than the coolant inlet, as long as the pumping device is below the liquid level of the coolant. In this embodiment and some embodiments of the present invention, before the user needs to open the lid 200g, the cooling liquid 300g can be drawn out of the accommodating space S through the pump device 900g, and the cooling liquid 300g is stored in the heat exchange Segment 600g. As a result, there is no coolant 300g in the storage space S. Then, when the user opens the lid 200g, the cooling fluid 300g can be prevented from evaporating into the atmosphere and escaping. When the pumping device 900g functions, the pumping device 900g may be provided with, for example, a check valve (not shown) to prevent the cooling liquid 300g from flowing back to the accommodating space S. When the user replaces the lid 200g and returns to the working stage of the cooling device 10g, the check valve is removed. But not limited to this. In other embodiments, no check valve may be provided.

接著請參閱圖10以及圖11。圖10係為根據本發明之又一實施例所繪示之冷卻裝置作動時的側面剖面示意圖。圖11係為圖10之冷卻裝置作動完成時的側面剖面示意圖。以下僅針對本發明又一實施例與前述之部份實施例中不同之處進行說明,其餘相同之處將被省略。在本實施例以及本發明的部份實施例中,冷卻裝置10h更包含一充氣裝置1000h。熱交換段600h例如為一容置槽。充氣裝置1000h位於熱交換段600h並且透過蒸氣流道500h連接於槽體100h,但不以此為限。在其他實施例中,充氣裝置可位於熱交換段以外的其他地方並透過冷卻液輸出口以外的開孔連接至槽體,只要充氣裝置高於冷卻液之液面即可。在本實施例以及本發明的部份實施例中,在使用者需要將蓋體200h打 開前可先透過充氣裝置1000h將一填充空氣A灌入容置空間S,並推擠冷卻液300h以及冷卻液蒸氣320h經由液體流道400h至熱交換段600h。如此一來,如圖11所繪示,容置空間S便只有填充空氣A。隨後當使用者將蓋體200h打開時,容置空間S僅有填充空氣A散出並且可以避免冷卻液300h或冷卻液蒸氣320h揮發至大氣中而逸失。在充氣裝置1000h作用時,充氣裝置1000h可設置例如為逆止閥(圖未繪示)來防止填充空氣A流回熱交換段600h。在使用者蓋回蓋體200h而回到冷卻裝置10h工作階段時,則將逆止閥移除。但不以此為限。在其他實施例中,亦可無設置逆止閥。 Then please refer to FIG. 10 and FIG. 11. 10 is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation. 11 is a schematic side cross-sectional view of the cooling device of FIG. 10 when the operation is completed. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the invention, the cooling device 10h further includes an inflation device 1000h. The heat exchange section 600h is, for example, a receiving slot. The inflation device 1000h is located in the heat exchange section 600h and is connected to the tank body 100h through the vapor flow channel 500h, but not limited to this. In other embodiments, the inflation device may be located in a place other than the heat exchange section and connected to the tank through an opening other than the coolant outlet, as long as the inflation device is above the level of the coolant. In this embodiment and some embodiments of the invention, the user needs to hit the cover 200h Before opening, a filling air A can be filled into the accommodating space S through the inflation device 1000h, and the cooling liquid 300h and the cooling liquid vapor 320h are pushed through the liquid flow channel 400h to the heat exchange section 600h. In this way, as shown in FIG. 11, the accommodating space S is filled with air A only. Then, when the user opens the cover 200h, the accommodating space S only has the filling air A to escape and can prevent the cooling liquid 300h or the cooling liquid vapor 320h from evaporating into the atmosphere and escaping. When the inflation device 1000h functions, the inflation device 1000h may be provided with, for example, a check valve (not shown) to prevent the filling air A from flowing back to the heat exchange section 600h. When the user replaces the cover body 200h and returns to the working stage of the cooling device 10h, the check valve is removed. But not limited to this. In other embodiments, no check valve may be provided.

根據上述實施例之冷卻裝置,當容置空間同時容置有發熱元件以及冷卻液時,發熱元件所產生的熱量便可以傳導至冷卻液。並且由於冷卻液蒸發為冷卻液蒸氣後可由冷卻液輸出口離開容置空間,容置空間便不會有過多的冷卻液蒸氣聚集。當使用者需要打開蓋體以對槽體之內部進行設備維修或是拿取發熱元件時,冷卻液蒸氣自容置空間逸失的情況會比習知技術相對大幅降低。 According to the cooling device of the above embodiment, when the accommodating space accommodates both the heating element and the cooling liquid, the heat generated by the heating element can be conducted to the cooling liquid. And since the cooling liquid evaporates into the cooling liquid vapor, it can leave the accommodating space through the cooling liquid output port, so that the accommodating space will not have too much coolant vapor accumulating. When the user needs to open the cover to repair the equipment inside the tank or take the heating element, the escape of the coolant vapor from the accommodating space will be relatively greatly reduced compared to the conventional technology.

此外,當冷卻裝置作動時,部份冷卻液吸收一定的熱量後便會蒸發為氣態之冷卻液蒸氣。因為液體往低處流動且氣體往高處飄散的特性,所以液體流經的冷卻液輸入口宜設置得低於氣體流經的冷卻液輸出口。液態之冷卻液能透過冷卻液輸入口較容易地流入容置空間且氣態之冷卻液蒸氣能透過冷卻液輸出口較容易地離開容置空間。 In addition, when the cooling device is activated, part of the cooling liquid will evaporate into gaseous cooling liquid vapor after absorbing a certain amount of heat. Because of the characteristics of the liquid flowing low and the gas sloshing high, the cooling fluid inlet through which the liquid flows should be set lower than the cooling fluid outlet through which the gas flows. Liquid coolant can easily flow into the storage space through the coolant inlet and gaseous coolant vapor can easily leave the storage space through the coolant outlet.

再者,冷卻裝置還設有液體流道以及蒸氣流道。當冷卻裝置作動時,發熱元件的熱量傳導至冷卻液並蒸發為冷卻液蒸氣。冷卻液 蒸氣再將熱量從容置空間帶至蒸氣流道。另外還有冷卻液自液體流道進入容置空間以補充蒸發掉的冷卻液。 Furthermore, the cooling device is also provided with a liquid flow path and a vapor flow path. When the cooling device is activated, the heat of the heating element is transferred to the cooling liquid and evaporates into the cooling liquid vapor. Coolant The steam then brings heat from the containing space to the steam flow path. In addition, the cooling liquid enters the accommodating space from the liquid flow channel to supplement the evaporated cooling liquid.

蒸氣流道還可以傾斜方式設置於槽體。如此一來,冷卻液之液面能夠更加接近蓋體。並且確保流出端僅有冷卻液蒸氣流過,將冷卻液保持在容置空間。 The steam flow channel can also be provided in the tank in an inclined manner. In this way, the liquid level of the cooling liquid can be closer to the cover. And ensure that only the cooling liquid vapor flows through the outflow end, keeping the cooling liquid in the accommodating space.

除此之外,還可將冷卻裝置之蓋體的第一側設置得較第二側高。利用氣體會往高處飄散的特性,將冷卻液蒸氣集中於第一側。並且第一側靠近槽體之冷卻液輸出口,可以使集中在第一側之冷卻液蒸氣更容易透過冷卻液輸出口離開容置空間。 In addition, the first side of the cover of the cooling device can be set higher than the second side. Taking advantage of the characteristic that the gas will scatter upward, the coolant vapor is concentrated on the first side. And the first side is close to the cooling liquid outlet of the tank, so that the cooling liquid vapor concentrated on the first side can more easily leave the accommodating space through the cooling liquid outlet.

冷卻裝置還設有熱交換段。熱交換段為一供氣態之冷卻液蒸氣冷凝為液態之冷卻液的空間。冷卻液蒸氣從容置空間離開,經過蒸氣流道、熱交換段以及液體流道再次回到容置空間,形成一個冷卻液的封閉循環系統並維持冷卻液的液量。 The cooling device is also provided with a heat exchange section. The heat exchange section is a space for supplying gaseous cooling liquid vapor to condensing into liquid cooling liquid. The cooling liquid vapor leaves the accommodating space, returns to the accommodating space through the steam flow path, the heat exchange section, and the liquid flow path, forming a closed circulation system of the cooling liquid and maintaining the liquid volume of the cooling liquid.

冷卻裝置還設有散熱裝置。透過散熱裝置與熱交換段的接觸,將熱交換段內之冷卻液蒸氣的熱量傳導至散熱裝置。如此一來,便可加快冷卻液蒸氣在熱交換段內冷凝成冷卻液的速度。 The cooling device is also provided with a heat dissipation device. The heat of the cooling liquid vapor in the heat exchange section is transmitted to the heat dissipation device through the contact of the heat dissipation device and the heat exchange section. In this way, the speed at which the coolant vapor condenses into the coolant in the heat exchange section can be accelerated.

冷卻裝置還設有電子連接器。容置空間的發熱元件可透過線材以及電子連接器與槽體外部進行電源與訊號的交換。電子連接器的設置可以使得在槽體或蓋體上開孔之形狀較為規則,如方形。而習知技術是以線材直接貫通開孔,開孔之形狀較為不規則。相較之下,設置電子連接器的密合效果較習知技術提升,可以進一步避免冷卻液蒸氣從開孔處逸失。 The cooling device is also provided with an electronic connector. The heating element in the accommodating space can exchange power and signal through the wire, the electronic connector and the outside of the tank. The arrangement of the electronic connector can make the shape of the opening in the groove or cover more regular, such as square. The conventional technique is that the wire directly penetrates the opening, and the shape of the opening is relatively irregular. In contrast, the sealing effect of the electronic connector is improved compared to the conventional technology, which can further prevent the escape of the coolant vapor from the opening.

冷卻裝置還設有泵浦裝置。泵浦裝置可將冷卻液抽出容置空間,並將冷卻液儲存在熱交換段。如此一來,容置空間便不存有冷卻液。當使用者將蓋體打開時,可以避免冷卻液揮發至大氣中而逸失。 The cooling device is also provided with a pump device. The pumping device can draw the cooling liquid out of the accommodating space and store the cooling liquid in the heat exchange section. As a result, the storage space is free of coolant. When the user opens the cover, the coolant can be prevented from evaporating into the atmosphere and escaping.

冷卻裝置還設有充氣裝置。充氣裝置可將一填充空氣灌入容置空間,並推擠冷卻液以及冷卻液蒸氣經由液體流道至熱交換段。如此一來,容置空間便只有填充空氣。當使用者將蓋體打開時,容置空間僅有填充空氣散出並且可以避免冷卻液或冷卻液蒸氣揮發至大氣中而逸失。 The cooling device is also provided with an inflation device. The inflatable device can fill a filled air into the accommodating space, and push the cooling liquid and the cooling liquid vapor through the liquid flow path to the heat exchange section. In this way, the accommodating space is filled with air only. When the user opens the lid, the accommodating space is filled with air only and can prevent the coolant or coolant vapor from evaporating into the atmosphere and escaping.

雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be subject to the scope defined in the patent application scope attached to this specification.

10d:冷卻裝置 10d: cooling device

300d:冷卻液 300d: coolant

320d:冷卻液蒸氣 320d: Coolant vapor

400d:液體流道 400d: liquid flow path

500d:蒸氣流道 500d: steam channel

600d:熱交換段 600d: heat exchange section

610d:第一端 610d: the first end

620d:第二端 620d: the second end

S:容置空間 S: accommodating space

Claims (9)

一種冷卻裝置,適用於冷卻一發熱元件,該冷卻裝置包含:一槽體,具有一底面、一冷卻液輸入口以及一冷卻液輸出口;一蓋體,連接於該槽體,該蓋體與該槽體形成一容置空間,該容置空間適用於容置該發熱元件;一充氣裝置,該充氣裝置連接於該槽體;以及一冷卻液,位於該容置空間。 A cooling device is suitable for cooling a heating element. The cooling device includes: a tank body having a bottom surface, a coolant inlet and a coolant outlet; a cover body connected to the tank body, the cover body and The tank body forms an accommodating space, the accommodating space is suitable for accommodating the heating element; an inflation device, the inflation device is connected to the trough body; and a cooling liquid, located in the accommodating space. 如申請專利範圍第1項所述之冷卻裝置,其中該槽體之該冷卻液輸入口較該冷卻液輸出口靠近該槽體之該底面。 The cooling device as described in item 1 of the patent application range, wherein the coolant inlet of the tank is closer to the bottom surface of the tank than the coolant outlet. 如申請專利範圍第2項所述之冷卻裝置,更包含一液體流道以及一蒸氣流道,該液體流道透過該冷卻液輸入口連接於該槽體,該蒸氣流道透過該冷卻液輸出口連接於該槽體。 The cooling device as described in item 2 of the patent application scope further includes a liquid flow path and a vapor flow path, the liquid flow path is connected to the tank through the cooling liquid inlet, and the vapor flow path is output through the cooling liquid The port is connected to the tank. 如申請專利範圍第3項所述之冷卻裝置,其中該蒸氣流道具有一流入端以及一流出端,該流入端連接於該槽體之該冷卻液輸出口,該流入端較該流出端靠近該槽體之該底面。 The cooling device as described in item 3 of the patent application scope, wherein the steam flow prop has an inflow end and a first-rate outflow end, the inflow end is connected to the cooling liquid outlet of the tank, the inflow end is closer to the outflow end than the outflow end The bottom surface of the tank body. 如申請專利範圍第4項所述之冷卻裝置,其中該蓋體具有一第一側以及一第二側,該第一側較該第二側靠近該槽體之該冷卻液輸出口,且該第一側較該第二側遠離該槽體之該底面。 The cooling device according to item 4 of the patent application scope, wherein the cover has a first side and a second side, the first side is closer to the coolant outlet of the tank than the second side, and the The first side is farther from the bottom surface of the tank than the second side. 如申請專利範圍第3項所述之冷卻裝置,更包含一熱交換段,該熱交換段具有一第一端以及一第二端,該熱交換段透過該第一端連接於該蒸氣流道,該熱交換段透過該第二端連接於該液體流道。 The cooling device as described in item 3 of the patent application scope further includes a heat exchange section having a first end and a second end, the heat exchange section is connected to the vapor flow channel through the first end The heat exchange section is connected to the liquid flow channel through the second end. 如申請專利範圍第6項所述之冷卻裝置,更包含一散熱裝 置,該散熱裝置連接於該熱交換段。 The cooling device as described in item 6 of the patent application scope further includes a heat sink The heat sink is connected to the heat exchange section. 如申請專利範圍第1項所述之冷卻裝置,更包含一電子連接器,該電子連接器連接於該蓋體,該電子連接器用以電性連接該發熱元件。 The cooling device as described in item 1 of the patent application further includes an electronic connector connected to the cover, and the electronic connector is used to electrically connect the heating element. 如申請專利範圍第1項所述之冷卻裝置,更包含一泵浦裝置,該泵浦裝置連接於該槽體。 The cooling device as described in item 1 of the scope of the patent application further includes a pumping device connected to the tank.
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