TWI685009B - Light source board, manufacturing method thereof, and luminous keyboard using the same - Google Patents

Light source board, manufacturing method thereof, and luminous keyboard using the same Download PDF

Info

Publication number
TWI685009B
TWI685009B TW108102911A TW108102911A TWI685009B TW I685009 B TWI685009 B TW I685009B TW 108102911 A TW108102911 A TW 108102911A TW 108102911 A TW108102911 A TW 108102911A TW I685009 B TWI685009 B TW I685009B
Authority
TW
Taiwan
Prior art keywords
conductive circuit
circuit layer
layer
wires
substrate
Prior art date
Application number
TW108102911A
Other languages
Chinese (zh)
Other versions
TW202004809A (en
Inventor
黃恒儀
何信政
陳在宇
鄭鴻川
Original Assignee
達方電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 達方電子股份有限公司 filed Critical 達方電子股份有限公司
Priority to TW108102911A priority Critical patent/TWI685009B/en
Publication of TW202004809A publication Critical patent/TW202004809A/en
Application granted granted Critical
Publication of TWI685009B publication Critical patent/TWI685009B/en

Links

Images

Landscapes

  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

A light source board includes a substrate, a composite conductive wire layer, a first protective layer and a plurality of light sources. The substrate has a long side, a first short side and a second short side. The composite conductive wire layer is disposed on the substrate. The composite conductive wire layer has a wire portion and a plurality of pad portions. The wire portion is formed of at least a first conductive wire layer. The pad portions are formed of at least the first conductive wire layer and a second conductive wire layer stacked on the first conductive wire layer. A conductivity of the second conductive wire layer is higher than a conductivity of the first conductive wire layer. The wire portion is electrically coupled with the pad portions. The first protective layer is disposed on the composite conductive wire layer and exposes the pad portions. The light sources are disposed on the pad portions, respectively.

Description

光源燈板、其製作方法、及應用其之發光鍵盤 Light source lamp board, manufacturing method thereof, and luminous keyboard using the same

本發明是有關於一種電路板、其製作方法、及應用其之鍵盤。本發明特別是有關於一種光源燈板、其製作方法、及應用其之發光鍵盤。 The invention relates to a circuit board, a manufacturing method thereof, and a keyboard using the circuit board. The invention particularly relates to a light source lamp board, a manufacturing method thereof, and a light-emitting keyboard using the same.

人們對於周遭的生活工具,除了基本功能的完善之外,往往也會追求美感、使用上的舒適感等其他附加價值。舉例來說,就鍵盤而言,在基本的打字應用之外,由於有時人們會在光線不足的情況下使用電腦系統,因此發光鍵盤隨之誕生。而在鍵盤附加上發光的功能之後,又對應地產生再進一步地改善發光均勻度、增加發光的多樣性、薄化鍵盤等需求。 In addition to the improvement of basic functions, people often pursue other added values such as beauty and comfort in use. For example, as far as the keyboard is concerned, in addition to basic typing applications, because people sometimes use computer systems in low-light situations, a light-emitting keyboard is born. After the keyboard is added with a light-emitting function, there is a corresponding need to further improve the uniformity of light-emitting, increase the diversity of light-emitting, and thin the keyboard.

本發明是關於一種光源燈板、其製作方法、及應用其之發光鍵盤。應用此種光源燈板之發光鍵盤可進一步地改善使用體驗。 The invention relates to a light source lamp board, a manufacturing method thereof, and a light-emitting keyboard using the same. The use of the light-emitting keyboard of the light source lamp board can further improve the user experience.

根據一些實施例,一種光源燈板包括一基板、一複合導電線路層、一第一保護層以及複數個光源。基板具有一長邊側、一第一短邊側與一第二短邊側。複合導電線路層設置於基板上。複合導電線路層具有一導線部及複數個接墊部。導線部係至少由一第一導電線路層所構成。接墊部係至少由第一導電線路層和堆疊在第一導電線路層上的一第二導電線路層所構成。第二導電線路層的導電性高於第一導電線路層的導電性。導線部電性偶接接墊部。第一保護層設置於複合導電線路層上,並曝露出接墊部。光源分別設置於接墊部上。 According to some embodiments, a light source lamp board includes a substrate, a composite conductive circuit layer, a first protective layer, and a plurality of light sources. The substrate has a long side, a first short side, and a second short side. The composite conductive circuit layer is disposed on the substrate. The composite conductive circuit layer has a wire part and a plurality of pad parts. The wire part is composed of at least a first conductive circuit layer. The pad portion is composed of at least a first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer. The conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer. The lead part is electrically coupled to the pad part. The first protective layer is disposed on the composite conductive circuit layer and exposes the pad portion. The light sources are respectively arranged on the pad parts.

根據一些實施例,一種光源燈板的製作方法包括以下步驟。首先,提供一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側。在基板上形成一複合導電線路層,該複合導電線路層具有一導線部及複數個接墊部,導線部電性偶接接墊部。形成複合導電線路層包括在基板上形成一第一導電線路層以及在第一導電線路層上形成一第二導電線路層,第二導電線路層的導電性高於第一導電線路層的導電性。導線部係至少由第一導電線路層所構成,接墊部係至少由第一導電線路層和堆疊在第一導電線路層上的第二導電線路層所構成。在複合導電線路層上形成一第一保護層,該第一保護層曝露出接墊部。並且,在該複數個接墊部上設置複數個光源。 According to some embodiments, a method for manufacturing a light source lamp board includes the following steps. First, a substrate is provided. The substrate has a long side, a first short side, and a second short side. A composite conductive circuit layer is formed on the substrate. The composite conductive circuit layer has a lead portion and a plurality of pad portions. The lead portion is electrically coupled to the pad portion. Forming a composite conductive circuit layer includes forming a first conductive circuit layer on the substrate and forming a second conductive circuit layer on the first conductive circuit layer, the second conductive circuit layer having higher conductivity than the first conductive circuit layer . The wire portion is composed of at least a first conductive circuit layer, and the pad portion is composed of at least a first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer. A first protective layer is formed on the composite conductive circuit layer, and the first protective layer exposes the pad portion. In addition, a plurality of light sources are provided on the plurality of pad portions.

根據一些實施例,一種發光鍵盤包括複數個鍵帽以及一光源燈板。光源燈板設置於該複數個鍵帽下方。光源燈板包 括一基板、一複合導電線路層、一第一保護層及複數個光源。基板具有一長邊側、一第一短邊側與一第二短邊側。複合導電線路層設置於基板上。複合導電線路層具有一導線部及複數個接墊部。導線部係至少由一第一導電線路層所構成。接墊部係至少由第一導電線路層和堆疊在第一導電線路層上的一第二導電線路層所構成。第二導電線路層的導電性高於第一導電線路層的導電性。導線部電性偶接接墊部。第一保護層設置於複合導電線路層上,並曝露出接墊部。光源分別設置於接墊部上。光源發出的光線可向上行進而抵達該複數個鍵帽。 According to some embodiments, a light-emitting keyboard includes a plurality of key caps and a light source light board. The light source lamp board is arranged under the plurality of key caps. Light source lamp board package It includes a substrate, a composite conductive circuit layer, a first protective layer and a plurality of light sources. The substrate has a long side, a first short side, and a second short side. The composite conductive circuit layer is disposed on the substrate. The composite conductive circuit layer has a wire part and a plurality of pad parts. The wire part is composed of at least a first conductive circuit layer. The pad portion is composed of at least a first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer. The conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer. The lead part is electrically coupled to the pad part. The first protective layer is disposed on the composite conductive circuit layer and exposes the pad portion. The light sources are respectively arranged on the pad parts. The light emitted by the light source can travel upward to reach the plurality of keycaps.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to have a better understanding of the above and other aspects of the present invention, the following examples are specifically described in conjunction with the accompanying drawings as follows:

100、300、540、640、740、840、940‧‧‧光源燈板 100, 300, 540, 640, 740, 840, 940

110、310、541‧‧‧基板 110, 310, 541‧‧‧ substrate

120、320、550‧‧‧複合導電線路層 120, 320, 550‧‧‧ composite conductive circuit layer

121、321‧‧‧導線部 121、321‧‧‧Wire Department

122、322、557‧‧‧接墊部 122, 322, 557‧‧‧ pad part

123A、123B、123C‧‧‧電阻提高部分 123A, 123B, 123C

124‧‧‧電阻裝置 124‧‧‧Resistance device

125、325‧‧‧第一導電線路層 125, 325‧‧‧ First conductive circuit layer

126、326‧‧‧第二導電線路層 126, 326‧‧‧ Second conductive circuit layer

130、330‧‧‧第一保護層 130, 330 ‧‧‧ first protective layer

140、340、560‧‧‧光源 140, 340, 560

140A、140B、140C、140D、140E、140F‧‧‧LED光源 140A, 140B, 140C, 140D, 140E, 140F ‧‧‧ LED light source

150、150A、150B、150C、150D、350‧‧‧第二保護層 150, 150A, 150B, 150C, 150D, 350 second protection layer

151B‧‧‧擴散粒子 151B‧‧‧Diffusion particles

210、220、230、240、250、260、410、420、430、440、450、460‧‧‧步驟 210, 220, 230, 240, 250, 260, 410, 420, 430, 440, 450, 460

510、610、710、810、910‧‧‧鍵帽 510, 610, 710, 810, 910

510M‧‧‧中心線 510M‧‧‧Centerline

520‧‧‧薄膜開關層 520‧‧‧ membrane switch layer

521、621、721、821、921‧‧‧開關電極層 521, 621, 721, 821, 921‧‧‧ switch electrode layer

522、622、722、822、922‧‧‧支撐結構 522, 622, 722, 822, 922 ‧‧‧ support structure

523‧‧‧橡皮彈性體 523‧‧‧rubber elastomer

524‧‧‧剪刀腳結構 524‧‧‧Scissor foot structure

525、625、725、825、925‧‧‧連接結構 525, 625, 725, 825, 925 ‧‧‧ connection structure

526、531‧‧‧開口 526, 531‧‧‧ opening

530、630、730、830、930‧‧‧底板 530, 630, 730, 830, 930

542‧‧‧長邊側 542‧‧‧Long side

543‧‧‧第一短邊側 543‧‧‧First short side

544‧‧‧第二短邊側 544‧‧‧second short side

545‧‧‧排線尾部 545‧‧‧Tail

546‧‧‧延伸導線 546‧‧‧Extension wire

547‧‧‧預定彎折部 547‧‧‧Scheduled bending part

551‧‧‧高電位第一導線 551‧‧‧High potential first wire

552‧‧‧高電位第二導線 552‧‧‧High potential second wire

552S、555S‧‧‧S字形路徑 552S, 555S‧‧‧S-shaped path

553‧‧‧高電位第三導線 553‧‧‧High potential third wire

554‧‧‧低電位第三導線 554‧‧‧Low potential third wire

555‧‧‧低電位第二導線 555‧‧‧Low potential second wire

556‧‧‧低電位第一導線 556‧‧‧Low potential first lead

558‧‧‧正電極 558‧‧‧Positive electrode

559‧‧‧負電極 559‧‧‧Negative electrode

第1A~1D圖為根據一些實施例之光源燈板及其中複合導電線路層的示意圖。 FIGS. 1A-1D are schematic diagrams of a light source lamp board and a composite conductive circuit layer therein according to some embodiments.

第2A~2C圖為具有根據各種不同實施例之封裝結構的LED光源的示意圖。 2A~2C are schematic diagrams of LED light sources having packaging structures according to various embodiments.

第3A~3C圖為具有根據各種不同實施例之封裝膠層的LED光源的示意圖。 Figures 3A~3C are schematic diagrams of LED light sources with encapsulant layers according to various embodiments.

第4A~4D圖為根據各種不同實施例之光源燈板的第二保護層的示意圖。 4A-4D are schematic diagrams of the second protective layer of the light source lamp board according to various embodiments.

第5圖為第1A~1D圖所示之光源燈板的製作方法的流程圖。 FIG. 5 is a flowchart of the method for manufacturing the light source lamp board shown in FIGS. 1A to 1D.

第6A~6C圖為根據另一些實施例之光源燈板及其中複合導電線路層的示意圖。 6A~6C are schematic diagrams of a light source lamp board and a composite conductive circuit layer therein according to other embodiments.

第7圖為第6A~6C圖所示之光源燈板的製作方法的流程圖。 FIG. 7 is a flowchart of the method for manufacturing the light source lamp board shown in FIGS. 6A to 6C.

第8A~8D圖為根據一些實施例之發光鍵盤的各層的示意圖。 8A-8D are schematic diagrams of layers of a light-emitting keyboard according to some embodiments.

第9圖為第8A~8D圖所示之發光鍵盤的其中一個鍵的俯視示意圖。 FIG. 9 is a schematic top view of one key of the light-emitting keyboard shown in FIGS. 8A-8D.

第10圖為第8A~8D圖所示之發光鍵盤的其中一個鍵的側視示意圖。 Figure 10 is a schematic side view of one of the keys of the illuminated keyboard shown in Figures 8A~8D.

第11圖為根據另一些實施例之發光鍵盤的其中一個鍵的側視示意圖。 FIG. 11 is a schematic side view of one key of a light-emitting keyboard according to other embodiments.

第12圖為根據又一些實施例之發光鍵盤的其中一個鍵的側視示意圖。 FIG. 12 is a schematic side view of one key of a light-emitting keyboard according to still other embodiments.

第13圖為根據再一些實施例之發光鍵盤的其中一個鍵的側視示意圖。 FIG. 13 is a schematic side view of one key of a light-emitting keyboard according to still other embodiments.

第14圖為根據又另一些實施例之發光鍵盤的其中一個鍵的側視示意圖。 FIG. 14 is a schematic side view of one key of a light-emitting keyboard according to still other embodiments.

以下將配合所附圖式對於各種不同的實施例進行更詳細的說明,實施例及所附圖式僅用於描述和解釋目的,而不用於限制目的。可以理解的是,在結構方面,可增加其他元件、移除部分元件、結合部分元件、和/或進行任何其他可允許的調整。並且,以單數型態描述的元件亦允許存在複數個該元件的情 況。在方法方面,可能調整步驟的順序、增加其他步驟、省略部分步驟、結合部分步驟、和/或進行任何其他可允許的調整。為了清楚起見,圖式中的元件可能並未依照實際比例繪示,並省略部分元件和/或元件符號。可以預期的是,即使未作描述,在任何可允許的情況下,能夠將一實施例中的元件和特徵納入於另一實施例中。 In the following, various different embodiments will be described in more detail in conjunction with the accompanying drawings. The embodiments and the accompanying drawings are only used for description and explanation purposes, but not for limitation purposes. It can be understood that, in terms of structure, other elements may be added, some elements may be removed, some elements may be combined, and/or any other allowable adjustments may be made. In addition, elements described in the singular form are also allowed to exist in the plural condition. In terms of methods, it is possible to adjust the order of the steps, add other steps, omit some steps, combine some steps, and/or make any other allowable adjustments. For the sake of clarity, the elements in the drawings may not be drawn according to actual scale, and some elements and/or element symbols are omitted. It is expected that even if not described, the elements and features in one embodiment can be incorporated into another embodiment under any permissible circumstances.

在本發明的一方面,提供一種光源燈板,其包括一基板、一複合導電線路層、一第一保護層以及複數個光源。基板具有一長邊側、一第一短邊側與一第二短邊側。複合導電線路層設置於基板上。複合導電線路層具有一導線部及複數個接墊部。導線部係至少由一第一導電線路層所構成。接墊部係至少由第一導電線路層和堆疊在第一導電線路層上的一第二導電線路層所構成。第二導電線路層的導電性高於第一導電線路層的導電性。導線部電性偶接接墊部。第一保護層設置於複合導電線路層上,並曝露出接墊部。光源分別設置於接墊部上。 In one aspect of the present invention, a light source lamp board is provided, which includes a substrate, a composite conductive circuit layer, a first protective layer, and a plurality of light sources. The substrate has a long side, a first short side, and a second short side. The composite conductive circuit layer is disposed on the substrate. The composite conductive circuit layer has a wire part and a plurality of pad parts. The wire part is composed of at least a first conductive circuit layer. The pad portion is composed of at least a first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer. The conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer. The lead part is electrically coupled to the pad part. The first protective layer is disposed on the composite conductive circuit layer and exposes the pad portion. The light sources are respectively arranged on the pad parts.

在本發明的另一方面,提供一種此類光源燈板的製作方法,其包括以下步驟。首先,提供一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側。在基板上形成一複合導電線路層,該複合導電線路層具有一導線部及複數個接墊部,導線部電性偶接接墊部。形成複合導電線路層包括在基板上形成一第一導電線路層以及在第一導電線路層上形成一第二導電線路層,第二導電線路層的導電性高於第一導電線路層的導電性。導線部 係至少由第一導電線路層所構成,接墊部係至少由第一導電線路層和堆疊在第一導電線路層上的第二導電線路層所構成。在複合導電線路層上形成一第一保護層,該第一保護層曝露出接墊部。並且,在該複數個接墊部上設置複數個光源。 In another aspect of the present invention, a method for manufacturing such a light source lamp board is provided, which includes the following steps. First, a substrate is provided. The substrate has a long side, a first short side, and a second short side. A composite conductive circuit layer is formed on the substrate. The composite conductive circuit layer has a lead portion and a plurality of pad portions. The lead portion is electrically coupled to the pad portion. Forming a composite conductive circuit layer includes forming a first conductive circuit layer on the substrate and forming a second conductive circuit layer on the first conductive circuit layer, the second conductive circuit layer having higher conductivity than the first conductive circuit layer . Wire section It is composed of at least a first conductive circuit layer, and the pad portion is composed of at least a first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer. A first protective layer is formed on the composite conductive circuit layer, and the first protective layer exposes the pad portion. In addition, a plurality of light sources are provided on the plurality of pad portions.

現在請參照第1A~1D圖,以得到對於上述光源燈板更清楚的理解。第1A~1D圖示出一光源燈板100及其中的複合導電線路層120。第1A圖以俯視視角繪示光源燈板100的複合導電線路層120,但為了清楚起見省略光源燈板100中大部分的其他元件。第1B圖和第1C圖分別為光源燈板100沿著第1A圖中的剖面線1B-1B’和剖面線1C-1C’的剖面圖。如第1B圖和第1C圖所示,光源燈板100包括基板110、複合導電線路層120、第一保護層130及光源140,光源140底面有正負兩個電極接點,分別電性連接兩個複合導電線路層120,如此構成迴路以便自電源接收電能。 Now please refer to figures 1A~1D for a clearer understanding of the above light source lamp board. FIGS. 1A to 1D show a light source lamp board 100 and a composite conductive circuit layer 120 therein. FIG. 1A illustrates the composite conductive circuit layer 120 of the light source lamp board 100 from a top view, but most of the other elements in the light source lamp board 100 are omitted for clarity. FIGS. 1B and 1C are cross-sectional views of the light source lamp panel 100 along the cross-sectional line 1B-1B' and the cross-sectional line 1C-1C' in FIG. 1A, respectively. As shown in FIGS. 1B and 1C, the light source lamp board 100 includes a substrate 110, a composite conductive circuit layer 120, a first protective layer 130, and a light source 140. The bottom surface of the light source 140 has two positive and negative electrode contacts, which are electrically connected to the two A composite conductive circuit layer 120, thus forming a loop to receive power from the power source.

基板110可使用任何適用之基板。根據一些實施例,使用可供印刷製程使用的基板。在一些實施例中,使用可撓曲基板。舉例來說,基板110可由聚對苯二甲酸乙二酯(PET)製作而成。 The substrate 110 can use any suitable substrate. According to some embodiments, substrates available for the printing process are used. In some embodiments, a flexible substrate is used. For example, the substrate 110 may be made of polyethylene terephthalate (PET).

複合導電線路層120設置於基板110上。如第1A圖所示,複合導電線路層120具有導線部121及接墊部122。接墊部122寬度係可配合光源140尺寸大小而調整;當光源140尺寸較大時,接墊部122寬度可以大於導線部121寬度,以增加較大尺寸光源140和接墊部122的焊接面積;當光源140尺寸較小時,接墊部 122寬度可以小於導線部121寬度,便足以固定較小尺寸光源140。導線部121電性偶接接墊部122。舉例來說,可如第1A圖所示,導線部121藉由物理連接接墊部122而與接墊部122電性偶接。第1B圖和第1C圖示出複合導電線路層120的一第一導電線路層125和一第二導電線路層126,第二導電線路層126堆疊在第一導電線路層125上,二者用於構成複合導電線路層120。第二導電線路層126的導電性高於第一導電線路層125的導電性。在一些實施例中,第一導電線路層125的材料可包括銅膏、鎳膏、和銀膠之中至少一者,第二導電線路層126的材料可包括鍍銀、鍍錫、鍍鎳、和鍍金之中至少一者。在光源燈板100中,導線部121係至少由第一導電線路層125所構成,並可視電阻大小需求,選擇性地局部或整體更包括第二導電線路層126。當導線部121需要較低單位長度電阻時,導線部121可由第一導電線路層125和第二導電線路層126所共同構成。當導線部121需要較高單位長度電阻時,導線部121可僅具有第一導電線路層125,並未再覆蓋第二導電線路層126。在一些實施例中,為了要降低複合導電線路層120上所流經電流大小,複合導電線路層120可更包括一電阻提高部分123。該電阻提高部分例如可為但不受限於第1D圖所示之電阻提高部分123A~123C的任一者或其組合。請參照第1D圖,(1)電阻提高部分123A係僅具有第一導電線路層125,但未設置第二導電線路層126;(2)電阻提高部分123B係僅具有第一導電線路層125,且刻意作S形延伸以使第一導電線路層125的長度增加和/或寬度減 少;(3)電阻提高部分123C係複合導電線路層120具有斷路間隙,並於斷路兩相對端點之間串聯設置一電阻裝置124。 The composite conductive circuit layer 120 is disposed on the substrate 110. As shown in FIG. 1A, the composite conductive circuit layer 120 has a lead portion 121 and a pad portion 122. The width of the pad part 122 can be adjusted according to the size of the light source 140; when the size of the light source 140 is larger, the width of the pad part 122 can be larger than the width of the lead part 121, so as to increase the welding area of the larger size light source 140 and the pad part 122 ; When the size of the light source 140 is small, the pad part The width of 122 may be smaller than the width of the wire portion 121, which is enough to fix the light source 140 of a smaller size. The lead portion 121 is electrically coupled to the pad portion 122. For example, as shown in FIG. 1A, the lead portion 121 is electrically coupled to the pad portion 122 by physically connecting the pad portion 122. FIGS. 1B and 1C show a first conductive circuit layer 125 and a second conductive circuit layer 126 of the composite conductive circuit layer 120. The second conductive circuit layer 126 is stacked on the first conductive circuit layer 125, both of which are used于 constituting the composite conductive circuit layer 120. The conductivity of the second conductive circuit layer 126 is higher than that of the first conductive circuit layer 125. In some embodiments, the material of the first conductive circuit layer 125 may include at least one of copper paste, nickel paste, and silver paste, and the material of the second conductive circuit layer 126 may include silver plating, tin plating, nickel plating, And at least one of gold plating. In the light source lamp panel 100, the lead portion 121 is at least composed of the first conductive circuit layer 125, and the second conductive circuit layer 126 may be selectively partially or entirely selected according to the resistance requirement. When the wire portion 121 requires a lower resistance per unit length, the wire portion 121 may be composed of the first conductive circuit layer 125 and the second conductive circuit layer 126 together. When the wire portion 121 requires a higher resistance per unit length, the wire portion 121 may only have the first conductive circuit layer 125 and no longer cover the second conductive circuit layer 126. In some embodiments, in order to reduce the amount of current flowing on the composite conductive circuit layer 120, the composite conductive circuit layer 120 may further include a resistance increasing portion 123. The resistance increasing portion may be, for example but not limited to, any one or a combination of the resistance increasing portions 123A to 123C shown in FIG. 1D. Please refer to FIG. 1D, (1) the resistance increasing portion 123A only has the first conductive wiring layer 125, but the second conductive wiring layer 126 is not provided; (2) the resistance increasing portion 123B only has the first conductive wiring layer 125, And deliberately extended in an S shape to increase the length and/or width of the first conductive circuit layer 125 Less; (3) The resistance increasing portion 123C-based composite conductive circuit layer 120 has a break gap, and a resistance device 124 is provided in series between two opposite ends of the break.

請再次參照第1B圖和第1C圖,第一保護層130設置於複合導電線路層120上,並曝露出接墊部122。第一保護層130可由PET、紫外線固化膠(UV paste)或類似材料形成。 Please refer to FIGS. 1B and 1C again. The first protective layer 130 is disposed on the composite conductive circuit layer 120 and exposes the pad portion 122. The first protective layer 130 may be formed of PET, UV paste, or the like.

光源140分別設置於接墊部122上。光源140可為LED光源。舉例來說,可採用如第2A圖所示之具有塑膠引線式晶片載體(PLCC)封裝結構的LED光源140A。可採用如第2B圖所示之具有打線式封裝結構的LED光源140B。或者,可採用如第2C圖所示之具有晶片級封裝(CSP)結構的LED光源140C。在一些實施例中,可改變封裝結構中的封裝膠層的型態,以達成特定光學效果。舉例來說,可採用其中封裝膠層具有勻光結構的LED光源,例如第3A圖所示之LED光源140D,其係在封裝膠層的表面形成擴散微結構(例如微透鏡(micro lens))。可採用其中封裝膠層具有聚光結構的LED光源,例如第3B圖所示之的LED光源140E,其係將封裝膠層的表面形成為具有單一球面凸出結構而達成聚光效果。或者,可採用其中封裝膠層具有散光結構的LED光源,例如第3C圖所示之LED光源140F,其係將封裝膠層表面形成為具有單一球面凹入結構而達成散光效果。 The light sources 140 are respectively disposed on the pad parts 122. The light source 140 may be an LED light source. For example, an LED light source 140A having a plastic leaded chip carrier (PLCC) packaging structure as shown in FIG. 2A may be used. The LED light source 140B having a wire-type packaging structure as shown in FIG. 2B may be used. Alternatively, an LED light source 140C having a wafer level package (CSP) structure as shown in FIG. 2C may be used. In some embodiments, the type of the encapsulant layer in the encapsulation structure can be changed to achieve a specific optical effect. For example, an LED light source in which the encapsulant layer has a uniform light structure may be used, such as the LED light source 140D shown in FIG. 3A, which forms a diffusion microstructure (such as a micro lens) on the surface of the encapsulant layer . An LED light source in which the encapsulant layer has a light-concentrating structure may be used, such as the LED light source 140E shown in FIG. 3B, which forms the surface of the encapsulant layer to have a single spherical convex structure to achieve the light-concentrating effect. Alternatively, an LED light source in which the encapsulating adhesive layer has a light-scattering structure may be used, such as the LED light source 140F shown in FIG. 3C, which forms the surface of the encapsulating adhesive layer to have a single spherical concave structure to achieve the light-scattering effect.

可以理解的是,雖然實施例是關於光源燈板而著重在光源的例子,但其他電子元件也可採用類似方式設置在接墊部 上。亦即,在一些實施例中,可存在部分的接墊部是提供用於除了光源之外的其他電子元件的電性偶接。 It can be understood that, although the embodiment is an example focusing on the light source with respect to the light source lamp board, other electronic components may also be arranged in the pad part in a similar manner on. That is, in some embodiments, a portion of the pad portion may be provided for electrical coupling of other electronic components besides the light source.

在一些實施例中,如第1B圖和第1C圖所示,光源燈板100可更具有一第二保護層150。第二保護層150設置於第一保護層130和光源140上。根據一些實施例,第二保護層150可進一步地具有勻光結構、和/或聚光或散光結構。舉例來說,可如第4A圖所示,在第二保護層150A的表面形成擴散微結構(例如微透鏡),以達成勻光效果。或者,如第4B圖所示,在第二保護層150B中加入擴散粒子151B,以達成勻光效果。擴散粒子151B可為二氧化鈦、二氧化矽、螢光粉或類似物。此外,可如第4C圖所示,將第二保護層150C的表面形成為具有單一球面凸出結構,以達成聚光效果。或者,可如第4D圖所示,將第二保護層150D的表面形成為具有單一球面凹入結構而達成散光效果。第二保護層150可由PET、紫外線固化膠或類似材料形成。第二保護層150的材料可相同或不同於第一保護層130的材料。 In some embodiments, as shown in FIGS. 1B and 1C, the light source lamp board 100 may further have a second protective layer 150. The second protective layer 150 is disposed on the first protective layer 130 and the light source 140. According to some embodiments, the second protective layer 150 may further have a uniform light structure, and/or a light-concentrating or light-scattering structure. For example, as shown in FIG. 4A, a diffusion microstructure (such as a microlens) may be formed on the surface of the second protective layer 150A to achieve a uniform light effect. Alternatively, as shown in FIG. 4B, diffusion particles 151B are added to the second protective layer 150B to achieve a uniform light effect. The diffusion particles 151B may be titanium dioxide, silicon dioxide, phosphor, or the like. In addition, as shown in FIG. 4C, the surface of the second protective layer 150C may be formed to have a single spherical convex structure to achieve a light-concentrating effect. Alternatively, as shown in FIG. 4D, the surface of the second protective layer 150D may be formed to have a single spherical concave structure to achieve the astigmatism effect. The second protective layer 150 may be formed of PET, ultraviolet curable glue, or the like. The material of the second protective layer 150 may be the same or different from the material of the first protective layer 130.

請參照第5圖,其為光源燈板100的製作方法的流程圖。在步驟210,提供基板110。基板110可具有一長邊側、一第一短邊側與一第二短邊側。在步驟220,在基板110上形成複合導電線路層120的第一導電線路層125。在步驟230,在第一導電線路層125上形成第二導電線路層126,第二導電線路層126的導電性高於第一導電線路層125的導電性。在一些實施例中,形成第一導電線路層125包括進行一印刷製程,形成第二導電線路層126 包括進行一鍍膜製程。舉例來說,用於形成第一導電線路層125的印刷製程可包括塗佈一導電膠體,該導電膠體為銅膏、鎳膏、和銀膠之中至少一者。用於形成第二導電線路層126的鍍膜製程可包括化鍍或電鍍一金屬,該金屬為銀、錫、鎳、和金之中至少一者。例如在一些實施例中,可藉由網版印刷銀膠而形成第一導電線路層125,並藉由化鍍銅而形成第二導電線路層126。複合導電線路層120的導線部121係至少由第一導電線路層125所構成並可進一步包括第二導電線路層126,接墊部122係至少由第一導電線路層125和第二導電線路層126所構成。之後,在步驟240,在複合導電線路層120上形成第一保護層130,第一保護層130曝露出接墊部122。由於形成第一保護層130係在形成第二導電線路層126之後進行,第一保護層130覆蓋第二導電線路層126位在接墊部122之外的部分,例如覆蓋導線部121。在步驟250,在接墊部122上設置光源140。可選擇性地進行步驟260。於步驟260,在第一保護層130和光源140上形成第二保護層150。第二保護層150可具有勻光結構、和/或聚光或散光結構。 Please refer to FIG. 5, which is a flowchart of a method for manufacturing the light source lamp board 100. At step 210, a substrate 110 is provided. The substrate 110 may have a long side, a first short side, and a second short side. In step 220, the first conductive circuit layer 125 of the composite conductive circuit layer 120 is formed on the substrate 110. In step 230, a second conductive circuit layer 126 is formed on the first conductive circuit layer 125, and the conductivity of the second conductive circuit layer 126 is higher than that of the first conductive circuit layer 125. In some embodiments, forming the first conductive circuit layer 125 includes performing a printing process to form the second conductive circuit layer 126 Including a coating process. For example, the printing process for forming the first conductive circuit layer 125 may include coating a conductive paste, the conductive paste being at least one of copper paste, nickel paste, and silver paste. The plating process for forming the second conductive circuit layer 126 may include electroplating or electroplating a metal, the metal being at least one of silver, tin, nickel, and gold. For example, in some embodiments, the first conductive circuit layer 125 may be formed by screen printing silver paste, and the second conductive circuit layer 126 may be formed by electroless copper plating. The lead portion 121 of the composite conductive circuit layer 120 is composed of at least the first conductive circuit layer 125 and may further include a second conductive circuit layer 126, and the pad portion 122 is at least composed of the first conductive circuit layer 125 and the second conductive circuit layer 126 constituted. Thereafter, in step 240, a first protective layer 130 is formed on the composite conductive circuit layer 120, and the first protective layer 130 exposes the pad portion 122. Since the first protective layer 130 is formed after the second conductive circuit layer 126 is formed, the first protective layer 130 covers the portion of the second conductive circuit layer 126 outside the pad part 122, for example, covers the wire part 121. In step 250, a light source 140 is provided on the pad portion 122. Step 260 can be selectively performed. In step 260, a second protective layer 150 is formed on the first protective layer 130 and the light source 140. The second protective layer 150 may have a uniform light structure, and/or a light-concentrating or light-scattering structure.

現在請參照第6A~6C圖,其示出另一光源燈板300及其中的複合導電線路層320,其中第6A圖以俯視視角繪示光源燈板300的複合導電線路層320,但為了清楚起見省略光源燈板300中大部分的其他元件,第6B圖和第6C圖分別為光源燈板300沿著第6A圖中的剖面線6B-6B’和剖面線6C-6C’的剖面圖。光源燈板300包括基板310、複合導電線路層320、第一保護層330及 光源340,並可選擇性地包括第二保護層350,其中基板310、第一保護層330、光源340及第二保護層350類似於上述光源燈板100的對應元件,為求簡潔,在此省略對其進一步的描述,僅將重點放在型態上具有差異的複合導電線路層320。 Now please refer to FIGS. 6A to 6C, which show another light source lamp panel 300 and the composite conductive circuit layer 320 therein, wherein FIG. 6A shows the composite conductive circuit layer 320 of the light source lamp panel 300 from a top view, but for clarity For the sake of omitting most of the other components of the light source lamp panel 300, FIGS. 6B and 6C are cross-sectional views of the light source lamp panel 300 along section line 6B-6B' and section line 6C-6C' in FIG. 6A, respectively. . The light source lamp board 300 includes a substrate 310, a composite conductive circuit layer 320, a first protective layer 330 and The light source 340, and may optionally include a second protective layer 350, wherein the substrate 310, the first protective layer 330, the light source 340, and the second protective layer 350 are similar to the corresponding components of the light source lamp board 100 described above, for simplicity, here The further description thereof is omitted, and only the focus is on the composite conductive circuit layer 320 having a difference in type.

如第6A~6C圖所示,在光源燈板300中,複合導電線路層320的第二導電線路層326僅設置於接墊部322。導線部321並不包括電組較低/導電性較高的第二導電線路層326。舉例來說,導線部321可僅由第一導電線路層325所構成。然而,並不排除在導線部321設置導電性與第一導電線路層325相仿或較低的其他層的情況。類似於複合導電線路層120,第一導電線路層325的材料可包括銅膏、鎳膏、和銀膠之中至少一者,第二導電線路層326的材料可包括鍍銀、鍍錫、鍍鎳、和鍍金之中至少一者。此外,複合導電線路層320也可包括一電阻提高部分,例如類似於第1D圖所示之電阻提高部分123B,增加第一導電線路層325的長度和/或減少第一導電線路層325的寬度,或類似於電阻提高部分123C係複合導電線路層320具有斷路,並於斷路兩相對端點之間串聯設置一電阻裝置。 As shown in FIGS. 6A to 6C, in the light source lamp board 300, the second conductive circuit layer 326 of the composite conductive circuit layer 320 is only provided on the pad portion 322. The lead portion 321 does not include the second conductive circuit layer 326 having a lower electrical group and a higher conductivity. For example, the wire portion 321 may be composed of the first conductive circuit layer 325 only. However, it is not excluded that the lead portion 321 is provided with another layer having a conductivity similar to or lower than that of the first conductive wiring layer 325. Similar to the composite conductive circuit layer 120, the material of the first conductive circuit layer 325 may include at least one of copper paste, nickel paste, and silver paste, and the material of the second conductive circuit layer 326 may include silver plating, tin plating, plating At least one of nickel and gold plating. In addition, the composite conductive circuit layer 320 may also include a resistance increasing portion, such as the resistance increasing portion 123B shown in FIG. 1D, to increase the length of the first conductive circuit layer 325 and/or reduce the width of the first conductive circuit layer 325 Or, similar to the resistance-increasing part 123C composite conductive circuit layer 320 has an open circuit, and a resistance device is provided in series between two opposite ends of the open circuit.

請參照第7圖,其為光源燈板300的製作方法的流程圖。為求簡潔,在此可能省略部分類似於參照第5圖所述之製作方法的細節。在步驟410,提供基板310。在步驟420,在基板310上形成複合導電線路層320的第一導電線路層325。接著,在步驟430,先形成第一保護層330,第一保護層330曝露出接墊部322。 之後,在步驟440,以第一保護層330作為遮罩,形成複合導電線路層320的第二導電線路層326,第二導電線路層326僅形成在接墊部322。在步驟450,在接墊部322上設置光源340。可選擇性地進行步驟460。於步驟460,在第一保護層330和光源340上形成第二保護層350。 Please refer to FIG. 7, which is a flowchart of a method of manufacturing the light source lamp board 300. For simplicity, some details similar to the manufacturing method described with reference to FIG. 5 may be omitted here. At step 410, a substrate 310 is provided. In step 420, the first conductive circuit layer 325 of the composite conductive circuit layer 320 is formed on the substrate 310. Next, in step 430, a first protective layer 330 is formed first, and the first protective layer 330 exposes the pad portion 322. Then, in step 440, the first protective layer 330 is used as a mask to form the second conductive circuit layer 326 of the composite conductive circuit layer 320, and the second conductive circuit layer 326 is formed only on the pad portion 322. At step 450, a light source 340 is provided on the pad portion 322. Step 460 can be selectively performed. In step 460, a second protective layer 350 is formed on the first protective layer 330 and the light source 340.

以上已提供本發明之光源燈板及其製作方法的實施例。在本發明的又一方面,提供一種發光鍵盤,其應用上述光源燈板。此種發光鍵盤包括複數個鍵帽以及一光源燈板。光源燈板設置於該複數個鍵帽下方。光源燈板可為根據上述任一實施例之光源燈板。光源發出的光線可向上行進而抵達該複數個鍵帽。 The embodiments of the light source lamp board of the present invention and the manufacturing method thereof have been provided above. In still another aspect of the present invention, a light-emitting keyboard is provided, which uses the above-mentioned light source lamp board. The light-emitting keyboard includes a plurality of key caps and a light source lamp board. The light source lamp board is arranged under the plurality of key caps. The light source lamp board may be the light source lamp board according to any of the above embodiments. The light emitted by the light source can travel upward to reach the plurality of keycaps.

現在請參照第8A~8D圖、第9圖、及第10圖,以得到對於上述發光鍵盤的進一步理解。第8A~8D圖分別示出根據一些實施例之一發光鍵盤自上而下配置的各層。第9圖和第10圖分別為該發光鍵盤的其中一個鍵的俯視和側視示意圖。 Now please refer to Figures 8A~8D, Figure 9, and Figure 10 for a further understanding of the above illuminated keyboard. FIGS. 8A to 8D respectively show the layers arranged from top to bottom according to one of the embodiments. Fig. 9 and Fig. 10 are schematic diagrams of the top and side views of one key of the light-emitting keyboard, respectively.

請參照第8A圖,其為發光鍵盤的複數個鍵帽510的示意圖。可以理解的是,鍵帽510可以任何適用之方式排列,且/或可具有任何適用之字符組合,不受限於如圖所示者。發光鍵盤的鍵帽510的字符部分,例如第9圖中的「?」和「/」,可具有透光性。在一些實施例中,不同位置的字符可具有不同的顏色,例如是使用不同顏色的透明塗漆,藉此增加發光的多樣性和使用的便利性。 Please refer to FIG. 8A, which is a schematic diagram of a plurality of key caps 510 of a light-emitting keyboard. It can be understood that the keycaps 510 can be arranged in any suitable manner, and/or can have any suitable character combination, not limited to those shown in the figure. The character portion of the keycap 510 of the light-emitting keyboard, such as "?" and "/" in Figure 9, may have light transmission. In some embodiments, the characters in different positions may have different colors, for example, different colors of transparent paint are used, thereby increasing the diversity of lighting and the convenience of use.

請參照第8B圖,其為發光鍵盤選擇性的薄膜開關層520的示意圖。薄膜開關層520設置於鍵帽510下方。根據一些實施例,薄膜開關層520可包括如第10圖所示之一開關電極層521與複數組支撐結構522。開關電極層521包括複數個開關電極(未繪示,位於橡皮彈性體523下方),當複數個鍵帽510其中之一被按壓時,可觸發對應的開關電極導通。支撐結構522設置於開關電極層521上,分別偶接對應的鍵帽510和底板530,支撐結構522可支撐鍵帽510上下運動。當鍵帽510被外力按壓時,鍵帽510向下運動而抵接觸發開關電極;當外力消失,鍵帽510可在按壓結束後被恢復力源(例如橡皮彈性體(rubber dome)、極性互斥磁鐵對、金屬彈簧/彈片)向上推動而不再抵接觸發開關電極。舉例來說,如第10圖所示,每組支撐結構522可包括鍵盤常用的橡皮彈性體523、剪刀腳結構524、及連接結構525。在鍵帽510被按壓時,橡皮彈性體523被壓扁,使得橡皮彈性體523底面凸柱進而抵接觸發其下方的開關電極導通。剪刀腳結構524可協助支撐鍵帽510,進而使得反饋力道平均而改善手感。連接結構525用於將剪刀腳結構524偶接至下方的底板530。然而,亦可使用任何其他適用之結構,不須受限於此。薄膜開關層520可具有複數個開口526,每個鍵帽510至少對應到該複數個開口526其中之一。 Please refer to FIG. 8B, which is a schematic diagram of a selective membrane switch layer 520 of a light-emitting keyboard. The membrane switch layer 520 is disposed under the keycap 510. According to some embodiments, the membrane switch layer 520 may include one of the switch electrode layers 521 and the complex array support structure 522 as shown in FIG. The switch electrode layer 521 includes a plurality of switch electrodes (not shown, located below the rubber elastic body 523). When one of the plurality of key caps 510 is pressed, the corresponding switch electrode can be triggered to conduct. The support structure 522 is disposed on the switch electrode layer 521 and coupled to the corresponding keycap 510 and the bottom plate 530 respectively. The support structure 522 can support the keycap 510 to move up and down. When the keycap 510 is pressed by an external force, the keycap 510 moves downward to contact the switch electrode; when the external force disappears, the keycap 510 can be restored by a force source (such as a rubber dome) and polar The pair of repelling magnets, metal springs/shrappers) are pushed upwards and no longer touch the switch electrodes. For example, as shown in FIG. 10, each support structure 522 may include a rubber elastic body 523, a scissor structure 524, and a connection structure 525, which are commonly used in keyboards. When the key cap 510 is pressed, the rubber elastic body 523 is flattened, so that the convex column on the bottom surface of the rubber elastic body 523 is in contact with the switch electrode below it to conduct. The scissor foot structure 524 can assist in supporting the keycap 510, thereby averaging the feedback force and improving the feel. The connection structure 525 is used to couple the scissor foot structure 524 to the bottom plate 530 below. However, any other suitable structure can also be used without being limited to this. The membrane switch layer 520 may have a plurality of openings 526, and each keycap 510 corresponds to at least one of the plurality of openings 526.

請參照第8C圖,其為發光鍵盤選擇性的底板530的示意圖。底板530設置於鍵帽510下方。底板530具有複數個開口531,每個鍵帽510至少對應到該複數個開口531其中之一。開口 531可至少部分地與開口526重疊,如此使光源燈板540發出光線能無阻礙地向上行進。如第10圖的實施例所示,開關電極層521可設置於底板530上,光源燈板540(示於第8D圖)可設置於底板530下,二者藉由底板530彼此分離。此外,連接結構525可為自底板530沖壓向上折起並與底板530一體成型的卡勾,如第10圖所示者。 Please refer to FIG. 8C, which is a schematic diagram of a selective bottom plate 530 of a light-emitting keyboard. The bottom plate 530 is disposed below the key cap 510. The bottom plate 530 has a plurality of openings 531, and each keycap 510 corresponds to at least one of the plurality of openings 531. Opening 531 may at least partially overlap the opening 526, so that the light emitted from the light source lamp board 540 can travel upward without obstruction. As shown in the embodiment of FIG. 10, the switch electrode layer 521 may be disposed on the bottom plate 530, and the light source lamp board 540 (shown in FIG. 8D) may be disposed under the bottom plate 530, and the two are separated from each other by the bottom plate 530. In addition, the connecting structure 525 may be a hook that is folded upward from the bottom plate 530 by punching and integrally formed with the bottom plate 530, as shown in FIG.

請參照第8D圖,其為發光鍵盤的光源燈板540的示意圖。光源燈板540可為根據上述任一實施例之光源燈板,例如光源燈板100或光源燈板300。開口531與開口526部分重疊,光源燈板540上的光源560係位於開口531與開口526重疊部分下方,使得光源發出的光線可無阻礙、低損耗地穿過開口531(與開口526)而向上行進而抵達鍵帽510。對應於每個鍵帽510下方可具有一或多個光源560。 Please refer to FIG. 8D, which is a schematic diagram of the light source lamp board 540 of the light-emitting keyboard. The light source lamp board 540 may be the light source lamp board according to any of the above embodiments, such as the light source lamp board 100 or the light source lamp board 300. The opening 531 and the opening 526 partially overlap, and the light source 560 on the light source lamp board 540 is located below the overlapping portion of the opening 531 and the opening 526, so that the light emitted by the light source can pass through the opening 531 (and the opening 526) upward without obstruction and low loss Continue to reach the keycap 510. Corresponding to each keycap 510 there may be one or more light sources 560.

光源燈板540的基板541具有一長邊側542、一第一短邊側543與一第二短邊側544。如第8D圖所示,光源燈板540可更具有一排線尾部545。排線尾部545係自長邊側542延伸而出。排線尾部545具有複數條延伸導線546與一預定彎折部547。基板541可由一可撓曲材質構成。於對應預定彎折部547處,基板541可接受一外力而撓曲。延伸導線546可視為複合導電線路層550在排線尾部545的延伸部分。然而,無論是使用上述之光源燈板100或光源燈板300作為光源燈板540,延伸導線546於預定彎折部547內僅由第一導電線路層所構成,材料本身可撓曲性較低的第二 導電線路層並未延伸於預定彎折部547內。藉此,可避免第二導電線路層在預定彎折部547內受到彎折而斷裂,導致延伸導線546的電流傳遞品質不穩定。 The substrate 541 of the light source lamp board 540 has a long side 542, a first short side 543 and a second short side 544. As shown in FIG. 8D, the light source lamp board 540 may further have a line tail 545. The cable tail 545 extends from the long side 542. The cable tail 545 has a plurality of extension wires 546 and a predetermined bending portion 547. The substrate 541 can be made of a flexible material. At a position corresponding to the predetermined bending portion 547, the base plate 541 can be flexed by an external force. The extension wire 546 can be regarded as an extension of the composite conductive circuit layer 550 at the tail portion 545 of the cable. However, no matter whether the light source lamp board 100 or the light source lamp board 300 described above is used as the light source lamp board 540, the extension wire 546 is only composed of the first conductive circuit layer in the predetermined bending portion 547, and the material itself has low flexibility Second The conductive circuit layer does not extend within the predetermined bending portion 547. In this way, the second conductive circuit layer can be prevented from being bent and broken in the predetermined bending portion 547, resulting in unstable current transmission quality of the extension wire 546.

如第8D圖所示,複合導電線路層550可包括複數條高電位第一導線551、複數條高電位第二導線552、複數條低電位第一導線556及複數條低電位第二導線555。在此,高電位導線與低電位導線可理解為正負極線路。根據一些實施例,高電位第一導線551從排線尾部545延伸至第一短邊側543中間位置。高電位第二導線552從第一短邊側543中間位置以實質平行於長邊側542方式延伸至複數個接墊部557附近。低電位第二導線555從該複數個接墊部557附近以實質平行於長邊側542方式延伸至第二短邊側544中間位置。低電位第一導線556從第二短邊側544中間位置延伸至排線尾部545。在一些實施例中,如第8D圖所示,高電位第二導線552於鄰近第一短邊側543中間位置分別對應具有複數個S字形路徑552S,該複數個S字形路徑552S長度不同,藉以調整使通過複數條高電位第二導線552的電流值實質相等。在一些實施例中,低電位第二導線555也可具有類似的S字形路徑555S。根據一些實施例,如第8D圖所示,光源燈板540(之複合導電線路層550)可更具有複數條高電位第三導線553與複數條低電位第三導線554。請配合參照第9圖,每個接墊部557具有一正電極558與一負電極559。高電位第三導線553與低電位第三導線554實質上平行於第一短邊側543而延伸。高電位第三導線553分別電性偶接高 電位第二導線552其中之一與對應之接墊部557的正電極558,低電位第三導線554分別電性偶接該複數條低電位第二導線555其中之一與對應之接墊部557的負電極559。可以理解的是,複合導電線路層550的配置方式不須受限於此,只要是光源燈板540可容許的配置方式即可。舉例來說,在光源燈板540的空間能提供更大的布線彈性的情況下,第二高電位導線552與第二低電位導線555可不須以實質平行於長邊側542的方式延伸。 As shown in FIG. 8D, the composite conductive circuit layer 550 may include a plurality of high potential first wires 551, a plurality of high potential second wires 552, a plurality of low potential first wires 556, and a plurality of low potential second wires 555. Here, the high-potential wire and the low-potential wire can be understood as positive and negative lines. According to some embodiments, the high-potential first wire 551 extends from the tail portion 545 of the cable to the middle of the first short side 543. The high-potential second conductive wire 552 extends from the middle position of the first short side 543 to the vicinity of the plurality of pad portions 557 substantially parallel to the long side 542. The low-potential second conducting wire 555 extends from the vicinity of the plurality of pad portions 557 substantially parallel to the long side 542 to the middle position of the second short side 544. The low-potential first wire 556 extends from the middle position of the second short side 544 to the tail portion 545 of the cable. In some embodiments, as shown in FIG. 8D, the high-potential second conductive wire 552 has a plurality of S-shaped paths 552S in the middle adjacent to the first short side 543, the plurality of S-shaped paths 552S having different lengths, thereby The adjustment makes the current values passing through the plurality of high-potential second wires 552 substantially equal. In some embodiments, the low-potential second wire 555 may also have a similar S-shaped path 555S. According to some embodiments, as shown in FIG. 8D, the light source lamp board 540 (the composite conductive circuit layer 550) may further have a plurality of high potential third wires 553 and a plurality of low potential third wires 554. Please refer to FIG. 9 together, each pad portion 557 has a positive electrode 558 and a negative electrode 559. The high-potential third conductive wire 553 and the low-potential third conductive wire 554 extend substantially parallel to the first short side 543. The high potential third conductor 553 is electrically coupled high One of the potential second wires 552 and the positive electrode 558 of the corresponding pad portion 557, and the low potential third wire 554 are electrically coupled to one of the plurality of low potential second wires 555 and the corresponding pad portion 557, respectively The negative electrode 559. It can be understood that the configuration method of the composite conductive circuit layer 550 does not need to be limited thereto, as long as it is an allowable configuration method of the light source lamp board 540. For example, in the case where the space of the light source lamp board 540 can provide greater wiring flexibility, the second high-potential wire 552 and the second low-potential wire 555 need not extend substantially parallel to the long side 542.

現在請參照第9圖,在一些實施例中,對應於每個鍵帽510下方具有至少兩個光源560。為了提供每個光源560電性偶接,對應於每個鍵帽510下方可具有高電位第三導線553其中至少兩條、低電位第三導線554其中至少兩條、與至少兩個接墊部557。如第9圖所示,至少兩個的接墊部557係分別位於鍵帽551中心線551M的相對兩側邊下方,讓位於支撐結構522相對兩側的鍵帽510底面均能接收到適當強度照明。當然,光源與對應的複合導電線路層550的配置不須受限於此。舉例來說,在一些實施例中,鍵帽510和支撐結構522的設計保持中心區域鏤空或透明可透光,此時,即使每個鍵帽510下方只設置一個光源560也足以均勻照亮整個鍵帽。至此已藉由第8A~8D圖至第10圖,對一種類型的發光鍵盤的結構配置有具體的理解。然而,也可採用其他類型的發光鍵盤。 Referring now to FIG. 9, in some embodiments, there are at least two light sources 560 under each keycap 510. In order to provide electrical coupling for each light source 560, corresponding to each keycap 510, there may be at least two of high potential third wires 553, at least two of low potential third wires 554, and at least two pad portions 557. As shown in FIG. 9, at least two of the pad portions 557 are located below the opposite sides of the centerline 551M of the keycap 551, so that the bottom surfaces of the keycaps 510 on opposite sides of the support structure 522 can be properly received Intensity lighting. Of course, the configuration of the light source and the corresponding composite conductive circuit layer 550 need not be limited thereto. For example, in some embodiments, the design of the keycap 510 and the support structure 522 keeps the central area hollow or transparent and transparent, even if only one light source 560 is arranged under each keycap 510, it is enough to evenly illuminate the whole keycap. So far, through FIGS. 8A to 8D to FIG. 10, a specific understanding of the structural configuration of a type of light-emitting keyboard has been made. However, other types of illuminated keyboards can also be used.

舉例來說,如第10圖所示,在上述的發光鍵盤中,由上至下依序是鍵帽510、薄膜開關層520的支撐結構522、薄膜 開關層520的開關電極層521、底板530、及光源燈板540,而支撐結構522的連接結構525為延伸自底板530向上折起並與底板530一體成型的卡勾。 For example, as shown in FIG. 10, in the above-mentioned light-emitting keyboard, from top to bottom are the keycap 510, the support structure 522 of the membrane switch layer 520, the membrane The switch electrode layer 521 of the switch layer 520, the bottom plate 530, and the light source lamp board 540, and the connection structure 525 of the support structure 522 is a hook extending upward from the bottom plate 530 and folded integrally with the bottom plate 530.

在根據另一些實施例之發光鍵盤中,如第11圖所示,由上至下可依序是鍵帽610、支撐結構622、光源燈板640、開關電極層621、及底板630,而支撐結構622的連接結構625亦為延伸自底板630並與底板630一體成型的卡勾。此種發光鍵盤與第10圖之發光鍵盤的差異在於光源燈板640的位置,光源燈板640是位於開關電極層621上方。 In a light-emitting keyboard according to other embodiments, as shown in FIG. 11, from top to bottom, the keycap 610, the support structure 622, the light source lamp board 640, the switch electrode layer 621, and the bottom plate 630 can be supported in order. The connection structure 625 of the structure 622 is also a hook extending from the bottom plate 630 and integrally formed with the bottom plate 630. The difference between this kind of light-emitting keyboard and the light-emitting keyboard in FIG. 10 lies in the position of the light source lamp board 640, which is located above the switch electrode layer 621.

在根據又一些實施例之發光鍵盤中,如第12圖所示,由上至下依序是鍵帽710、支撐結構722、開關電極層721、底板730、及光源燈板740,而支撐結構722的連接結構725為結合至底板730的連接塑膠構件。此種發光鍵盤與第10圖之發光鍵盤的差異在於連接結構的設計。 In the light-emitting keyboard according to still other embodiments, as shown in FIG. 12, from top to bottom are the keycap 710, the support structure 722, the switch electrode layer 721, the bottom plate 730, and the light source lamp board 740, and the support structure The connecting structure 725 of 722 is a connecting plastic member coupled to the bottom plate 730. The difference between this light-emitting keyboard and the light-emitting keyboard in FIG. 10 is the design of the connection structure.

在根據再一些實施例之發光鍵盤中,如第13圖所示,由上至下依序是鍵帽810、支撐結構822、光源燈板840、開關電極層821、及底板830,而支撐結構822的連接結構825為結合至開關電極層821的連接塑膠構件。此種發光鍵盤與第12圖之發光鍵盤的差異在於光源燈板840的位置與連接結構825的配置,光源燈板840是位於開關電極層821上方,連接結構825結合至開關電極層821而非底板830。 In the light-emitting keyboard according to still other embodiments, as shown in FIG. 13, from top to bottom are the keycap 810, the support structure 822, the light source lamp board 840, the switch electrode layer 821, and the bottom plate 830, and the support structure The connection structure 825 of 822 is a connection plastic member bonded to the switch electrode layer 821. The difference between this kind of light-emitting keyboard and the light-emitting keyboard in FIG. 12 is the position of the light source lamp board 840 and the arrangement of the connection structure 825. The light source lamp board 840 is located above the switch electrode layer 821, and the connection structure 825 is coupled to the switch electrode layer 821 instead of Bottom plate 830.

在根據又另一些實施例之發光鍵盤中,如第14圖所示,由上至下依序是鍵帽910、支撐結構922、開關電極層921、光源燈板940、及底板930,而支撐結構922的連接結構925為結合至開關電極層921的連接塑膠構件。此種發光鍵盤和第13圖之發光鍵盤的差異在於光源燈板940的位置,光源燈板940是位於開關電極層921與底板930之間。 In the light-emitting keyboard according to still other embodiments, as shown in FIG. 14, the keycap 910, the support structure 922, the switch electrode layer 921, the light source lamp board 940, and the bottom plate 930 are supported in order from top to bottom. The connection structure 925 of the structure 922 is a connection plastic member bonded to the switch electrode layer 921. The difference between this light-emitting keyboard and the light-emitting keyboard in FIG. 13 is the position of the light source lamp board 940, which is located between the switch electrode layer 921 and the bottom plate 930.

無論是哪種類型,在根據實施例的發光鍵盤中,每個鍵帽下方皆設置有光源,因此可確保發光均勻度。此外,由於是使用光源燈板來發光,相較於使用具有導光板之背光模組的發光鍵盤,可進一步地減少鍵盤厚度並降低耗電量。 Regardless of the type, in the light-emitting keyboard according to the embodiment, a light source is provided under each keycap, so uniformity of light emission can be ensured. In addition, since the light source is used to emit light, compared with the light-emitting keyboard with a backlight module having a light guide plate, the thickness of the keyboard can be further reduced and the power consumption can be reduced.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be deemed as defined by the scope of the attached patent application.

100‧‧‧光源燈板 100‧‧‧Light source lamp board

110‧‧‧基板 110‧‧‧ substrate

120‧‧‧複合導電線路層 120‧‧‧composite conductive circuit layer

121‧‧‧導線部 121‧‧‧Wire Department

122‧‧‧接墊部 122‧‧‧Pad part

125‧‧‧第一導電線路層 125‧‧‧ First conductive circuit layer

126‧‧‧第二導電線路層 126‧‧‧Second conductive circuit layer

130‧‧‧第一保護層 130‧‧‧The first protective layer

140‧‧‧光源 140‧‧‧Light source

150‧‧‧第二保護層 150‧‧‧Second protective layer

Claims (22)

一種光源燈板,包括:一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;一複合導電線路層,設置於該基板上,該複合導電線路層具有:一導線部,該導線部係至少由一第一導電線路層所構成;及複數個接墊部,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的一第二導電線路層所構成,該第二導電線路層的導電性高於該第一導電線路層的導電性,該導線部電性偶接該複數個接墊部;一第一保護層,設置於該複合導電線路層上,並曝露出該複數個接墊部;複數個光源,分別設置於該複數個接墊部上;以及一排線尾部,其中該複合導電線路層更包括:複數條高電位第一導線,該複數條高電位第一導線從該排線尾部延伸至該第一短邊側中間位置;複數條高電位第二導線,該複數條高電位第二導線從該第一短邊側中間位置以實質平行於該長邊側方式延伸至該複數個接墊部附近; 複數條低電位第二導線,該複數條低電位第二導線從該複數個接墊部附近以實質平行於該長邊側方式延伸至該第二短邊側中間位置;以及複數條低電位第一導線,該複數條低電位第一導線從該第二短邊側中間位置延伸至該排線尾部。 A light source lamp board includes: a substrate having a long side, a first short side and a second short side; a composite conductive circuit layer is disposed on the substrate, the composite conductive circuit layer has : A wire portion, which is composed of at least a first conductive circuit layer; and a plurality of pad portions, the plurality of pad portions are at least composed of the first conductive circuit layer and stacked on the first conductive circuit A second conductive circuit layer on the layer, the conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer, the lead portion is electrically coupled to the plurality of pad portions; a first A protective layer is disposed on the composite conductive circuit layer and exposes the plurality of pad portions; a plurality of light sources are respectively disposed on the plurality of pad portions; and a row of wire tails, wherein the composite conductive circuit layer is more Including: a plurality of high-potential first wires, the plurality of high-potential first wires extending from the tail of the cable to the middle position of the first short side; a plurality of high-potential second wires, the plurality of high-potential second wires Extending from the middle position of the first short side to the vicinity of the plurality of pad portions substantially parallel to the long side; A plurality of low-potential second wires, the plurality of low-potential second wires extending from the vicinity of the plurality of pad portions substantially parallel to the long side to the middle position of the second short side; and the plurality of low-potential first A wire, the plurality of low-potential first wires extending from the middle of the second short side to the tail of the cable. 如申請專利範圍第1項所述之光源燈板,其中該導線部更包括該第二導電線路層。 The light source lamp panel as described in item 1 of the patent application scope, wherein the lead portion further includes the second conductive circuit layer. 如申請專利範圍第1項所述之光源燈板,其中該第二導電線路層僅設置於該複數個接墊部。 The light source lamp panel as described in Item 1 of the patent application scope, wherein the second conductive circuit layer is only provided on the plurality of pad portions. 如申請專利範圍第1項所述之光源燈板,其中該第一導電線路層的材料包括銅膏、鎳膏、和銀膠之中至少一者,該第二導電線路層的材料包括鍍銀、鍍錫、鍍鎳、和鍍金之中至少一者。 The light source lamp panel as described in item 1 of the patent application scope, wherein the material of the first conductive circuit layer includes at least one of copper paste, nickel paste, and silver paste, and the material of the second conductive circuit layer includes silver plating , Tin plating, nickel plating, and gold plating. 如申請專利範圍第1項所述之光源燈板,其中該光源燈板更具有複數條高電位第三導線與複數條低電位第三導線,每個該接墊部具有一正電極與一負電極,該複數條高電位第三導線與該複數條低電位第三導線實質上平行於該第一短邊側而延伸,該複數條高電位第三導線分別電性偶接該複數條高電位第二導線其中之一與對應之該接墊部的該正電極,該複數條低電位第三導線分別電性偶接該複數條低電位第二導線其中之一與對應之該接墊部的該負電極。 The light source lamp board as described in item 1 of the patent application range, wherein the light source lamp board further has a plurality of high potential third wires and a plurality of low potential third wires, each of the pad parts has a positive electrode and a negative electrode Electrodes, the plurality of high potential third wires and the plurality of low potential third wires extend substantially parallel to the first short side, the plurality of high potential third wires are electrically coupled to the plurality of high potentials, respectively One of the second wires and the positive electrode of the corresponding pad part, the plurality of low-potential third wires are electrically coupled to one of the plurality of low-potential second wires and the corresponding one of the pad part, respectively The negative electrode. 如申請專利範圍第1項所述之光源燈板,其中該複數條高電位第二導線於鄰近該第一短邊側中間位置分別對應具有複數個S字形路徑,該複數個S字形路徑長度不同,藉以調整使通過該複數條高電位第二導線的電流值實質相等。 The light source lamp panel as described in item 1 of the patent application range, wherein the plurality of high-potential second wires respectively have a plurality of S-shaped paths in the middle position adjacent to the first short side, and the plurality of S-shaped paths have different lengths , So that the current values passing through the plurality of high-potential second wires are substantially equal. 一種光源燈板,包括:一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;一複合導電線路層,設置於該基板上,該複合導電線路層具有:一導線部,該導線部係至少由一第一導電線路層所構成;及複數個接墊部,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的一第二導電線路層所構成,該第二導電線路層的導電性高於該第一導電線路層的導電性,該導線部電性偶接該複數個接墊部;一第一保護層,設置於該複合導電線路層上,並曝露出該複數個接墊部;以及複數個光源,分別設置於該複數個接墊部上;其中該基板係由一可撓曲材質構成,其中該光源燈板更具有一排線尾部,該排線尾部具有複數條延伸導線與一預定彎折部,於對應該預定彎折部處,該基板可接受一外力而撓曲,該複數條 延伸導線於該預定彎折部內僅由該第一導電線路層所構成,該第二導電線路層並未延伸於該預定彎折部內。 A light source lamp board includes: a substrate having a long side, a first short side and a second short side; a composite conductive circuit layer is disposed on the substrate, the composite conductive circuit layer has : A wire portion, which is composed of at least a first conductive circuit layer; and a plurality of pad portions, the plurality of pad portions are at least composed of the first conductive circuit layer and stacked on the first conductive circuit A second conductive circuit layer on the layer, the conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer, the lead portion is electrically coupled to the plurality of pad portions; a first A protective layer is disposed on the composite conductive circuit layer and exposes the plurality of pad portions; and a plurality of light sources are respectively disposed on the plurality of pad portions; wherein the substrate is composed of a flexible material, The light source lamp board further has a row of tails, the tail of the row has a plurality of extension wires and a predetermined bending part, and the substrate can be flexed by an external force at a position corresponding to the predetermined bending part. The extension wire is only composed of the first conductive circuit layer in the predetermined bending portion, and the second conductive circuit layer does not extend in the predetermined bending portion. 一種光源燈板,包括:一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;一複合導電線路層,設置於該基板上,該複合導電線路層具有:一導線部,該導線部係至少由一第一導電線路層所構成;及複數個接墊部,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的一第二導電線路層所構成,該第二導電線路層的導電性高於該第一導電線路層的導電性,該導線部電性偶接該複數個接墊部;一第一保護層,設置於該複合導電線路層上,並曝露出該複數個接墊部;以及複數個光源,分別設置於該複數個接墊部上;其中該複合導電線路層更包括一電阻提高部分,該電阻提高部分係未設置該第二導電線路層、增加該電阻提高部分處之該第一導電線路層的長度或減少該電阻提高部分處之該第一導電線路層的寬度、和/或設置一電阻裝置。 A light source lamp board includes: a substrate having a long side, a first short side and a second short side; a composite conductive circuit layer is disposed on the substrate, the composite conductive circuit layer has : A wire portion, which is composed of at least a first conductive circuit layer; and a plurality of pad portions, the plurality of pad portions are at least composed of the first conductive circuit layer and stacked on the first conductive circuit A second conductive circuit layer on the layer, the conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer, the lead portion is electrically coupled to the plurality of pad portions; a first A protective layer is disposed on the composite conductive circuit layer and exposes the plurality of pad portions; and a plurality of light sources are respectively disposed on the plurality of pad portions; wherein the composite conductive circuit layer further includes a resistance increasing portion , The resistance increasing portion is not provided with the second conductive wiring layer, increasing the length of the first conductive wiring layer at the resistance increasing portion or reducing the width of the first conductive wiring layer at the resistance increasing portion, and/or Set up a resistance device. 一種光源燈板,包括: 一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;一複合導電線路層,設置於該基板上,該複合導電線路層具有:一導線部,該導線部係至少由一第一導電線路層所構成;及複數個接墊部,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的一第二導電線路層所構成,該第二導電線路層的導電性高於該第一導電線路層的導電性,該導線部電性偶接該複數個接墊部;一第一保護層,設置於該複合導電線路層上,並曝露出該複數個接墊部;複數個光源,分別設置於該複數個接墊部上;以及一第二保護層,設置於該第一保護層和該些光源上,其中該第二保護層具有勻光結構、和/或聚光或散光結構。 A light source lamp board, including: A substrate, the substrate has a long side, a first short side and a second short side; a composite conductive circuit layer is provided on the substrate, the composite conductive circuit layer has: a wire portion, the wire The part is composed of at least a first conductive circuit layer; and a plurality of pad parts, the plurality of pad parts are at least composed of the first conductive circuit layer and a second conductive layer stacked on the first conductive circuit layer The circuit layer is formed, the conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer, the wire part is electrically coupled to the plurality of pad parts; a first protective layer is provided on the composite A plurality of pad portions exposed on the conductive circuit layer; a plurality of light sources are respectively disposed on the plurality of pad portions; and a second protective layer is disposed on the first protective layer and the light sources, The second protective layer has a uniform light structure, and/or a light-concentrating or light-scattering structure. 一種光源燈板的製作方法,包括:提供一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;在該基板上形成一複合導電線路層,其中該複合導電線路層具有一導線部及複數個接墊部,該導線部電性偶接該複數個接墊部,形成該複合導電線路層包括:在該基板上形成一第一導電線路層;及 在該第一導電線路層上形成一第二導電線路層,該第二導電線路層的導電性高於該第一導電線路層的導電性;其中該導線部係至少由該第一導電線路層所構成,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的該第二導電線路層所構成;在該複合導電線路層上形成一第一保護層,該第一保護層曝露出該複數個接墊部;以及在該複數個接墊部上設置複數個光源,其中形成該第一保護層係在形成該第二導電線路層之後進行,該第一保護層覆蓋該第二導電線路層位在該複數個接墊部之外的部分。 A method for manufacturing a light source lamp board includes: providing a substrate with a long side, a first short side and a second short side; forming a composite conductive circuit layer on the substrate, wherein the compound The conductive circuit layer has a wire portion and a plurality of pad portions, the wire portion is electrically coupled to the plurality of pad portions, and forming the composite conductive circuit layer includes: forming a first conductive circuit layer on the substrate; and Forming a second conductive circuit layer on the first conductive circuit layer, the conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer; wherein the wire portion is at least composed of the first conductive circuit layer The plurality of pad portions is composed of at least the first conductive circuit layer and the second conductive circuit layer stacked on the first conductive circuit layer; a first protection is formed on the composite conductive circuit layer Layer, the first protective layer exposes the plurality of pad parts; and a plurality of light sources are provided on the plurality of pad parts, wherein forming the first protective layer is performed after forming the second conductive circuit layer, the The first protective layer covers the portion of the second conductive circuit layer outside the plurality of pad portions. 如申請專利範圍第10項所述之光源燈板的製作方法,其中形成該第一導電線路層包括進行一印刷製程,形成該第二導電線路層包括進行一鍍膜製程。 The method for manufacturing a light source lamp board as described in item 10 of the patent application scope, wherein forming the first conductive circuit layer includes performing a printing process, and forming the second conductive circuit layer includes performing a coating process. 如申請專利範圍第11項所述之光源燈板的製作方法,其中該印刷製程包括塗佈一導電膠體,該導電膠體為銅膏、鎳膏、和銀膠之中至少一者。 The method for manufacturing a light source lamp board as described in item 11 of the patent application range, wherein the printing process includes coating a conductive paste, the conductive paste being at least one of copper paste, nickel paste, and silver paste. 如申請專利範圍第11項所述之光源燈板的製作方法,其中該鍍膜製程包括化鍍或電鍍一金屬,該金屬為銀、錫、鎳、和金之中至少一者。 The method for manufacturing a light source lamp panel as described in item 11 of the patent application range, wherein the coating process includes electroplating or electroplating a metal, the metal being at least one of silver, tin, nickel, and gold. 一種光源燈板的製作方法,包括: 提供一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;在該基板上形成一複合導電線路層,其中該複合導電線路層具有一導線部及複數個接墊部,該導線部電性偶接該複數個接墊部,形成該複合導電線路層包括:在該基板上形成一第一導電線路層;及在該第一導電線路層上形成一第二導電線路層,該第二導電線路層的導電性高於該第一導電線路層的導電性;其中該導線部係至少由該第一導電線路層所構成,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的該第二導電線路層所構成;在該複合導電線路層上形成一第一保護層,該第一保護層曝露出該複數個接墊部;以及在該複數個接墊部上設置複數個光源;其中形成該第二導電線路層係在形成該第一保護層之後,以該第一保護層作為遮罩進行。 A method for manufacturing light source lamp board, including: A substrate is provided, the substrate has a long side, a first short side and a second short side; a composite conductive circuit layer is formed on the substrate, wherein the composite conductive circuit layer has a wire portion and a plurality of A pad portion, the wire portion is electrically coupled to the plurality of pad portions to form the composite conductive circuit layer includes: forming a first conductive circuit layer on the substrate; and forming a first conductive circuit layer on the first conductive circuit layer Two conductive circuit layers, the conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer; wherein the wire portion is at least composed of the first conductive circuit layer, and the plurality of pad portions are at least Consisting of the first conductive circuit layer and the second conductive circuit layer stacked on the first conductive circuit layer; forming a first protective layer on the composite conductive circuit layer, the first protective layer exposing the plural Pad parts; and providing a plurality of light sources on the pad parts; wherein forming the second conductive circuit layer is performed after forming the first protective layer, using the first protective layer as a mask. 一種光源燈板的製作方法,包括:提供一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;在該基板上形成一複合導電線路層,其中該複合導電線路層具有一導線部及複數個接墊部,該導線部電性偶接該複數個接墊部,形成該複合導電線路層包括: 在該基板上形成一第一導電線路層;及在該第一導電線路層上形成一第二導電線路層,該第二導電線路層的導電性高於該第一導電線路層的導電性;其中該導線部係至少由該第一導電線路層所構成,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的該第二導電線路層所構成;在該複合導電線路層上形成一第一保護層,該第一保護層曝露出該複數個接墊部;在該複數個接墊部上設置複數個光源;以及在該第一保護層和該複數個光源上形成一第二保護層,其中該第二保護層具有勻光結構、和/或聚光或散光結構。 A method for manufacturing a light source lamp board includes: providing a substrate with a long side, a first short side and a second short side; forming a composite conductive circuit layer on the substrate, wherein the compound The conductive circuit layer has a wire portion and a plurality of pad portions. The wire portion is electrically coupled to the plurality of pad portions to form the composite conductive circuit layer includes: Forming a first conductive circuit layer on the substrate; and forming a second conductive circuit layer on the first conductive circuit layer, the conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer; Wherein the wire portion is composed of at least the first conductive circuit layer, and the plurality of pad portions is composed of at least the first conductive circuit layer and the second conductive circuit layer stacked on the first conductive circuit layer Forming a first protective layer on the composite conductive circuit layer, the first protective layer exposing the plurality of pad portions; a plurality of light sources are provided on the plurality of pad portions; and the first protective layer and A second protective layer is formed on the plurality of light sources, wherein the second protective layer has a uniform light structure and/or a light-concentrating or light-scattering structure. 一種發光鍵盤,包括:複數個鍵帽;以及一光源燈板,設置於該複數個鍵帽下方,包括:一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;一複合導電線路層,設置於該基板上,該複合導電線路層具有:一導線部,該導線部係至少由一第一導電線路層所構成;及複數個接墊部,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的一第二導電線路層所構 成,該第二導電線路層的導電性高於該第一導電線路層的導電性,該導線部電性偶接該複數個接墊部;一第一保護層,設置於該複合導電線路層上,並曝露出該複數個接墊部;複數個光源,分別設置於該複數個接墊部上,該複數個光源發出的光線可向上行進而抵達該複數個鍵帽;以及一第二保護層,設置於該第一保護層和該些光源上,該第二保護層具有勻光結構、和/或聚光或散光結構。 A light-emitting keyboard, comprising: a plurality of key caps; and a light source lamp board, arranged under the plurality of key caps, comprising: a substrate, the substrate has a long side, a first short side and a second short Side; a composite conductive circuit layer, disposed on the substrate, the composite conductive circuit layer has: a wire portion, the wire portion is at least composed of a first conductive circuit layer; and a plurality of pad portions, the plurality of Each pad portion is composed of at least the first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer The conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer, the lead portion is electrically coupled to the plurality of pad portions; a first protective layer is provided on the composite conductive circuit layer And expose the plurality of pad parts; the plurality of light sources are respectively disposed on the plurality of pad parts, and the light emitted by the plurality of light sources can travel upward to reach the plurality of key caps; and a second protection A layer is disposed on the first protective layer and the light sources, and the second protective layer has a uniform light structure and/or a light-concentrating or light-scattering structure. 一種發光鍵盤,包括:複數個鍵帽;以及一光源燈板,設置於該複數個鍵帽下方,包括:一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;一複合導電線路層,設置於該基板上,該複合導電線路層具有:一導線部,該導線部係至少由一第一導電線路層所構成;及複數個接墊部,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的一第二導電線路層所構成,該第二導電線路層的導電性高於該第一導電線路層的導電性,該導線部電性偶接該複數個接墊部; 一第一保護層,設置於該複合導電線路層上,並曝露出該複數個接墊部;以及複數個光源,分別設置於該複數個接墊部上,該複數個光源發出的光線可向上行進而抵達該複數個鍵帽;其中該光源燈板更具有一排線尾部,該排線尾部具有複數條延伸導線與一預定彎折部,該複數條延伸導線於該預定彎折部內僅由該第一導電線路層所構成,該第二導電線路層並未延伸於該預定彎折部內。 A light-emitting keyboard, comprising: a plurality of key caps; and a light source lamp board, arranged under the plurality of key caps, comprising: a substrate, the substrate has a long side, a first short side and a second short Side; a composite conductive circuit layer, disposed on the substrate, the composite conductive circuit layer has: a wire portion, the wire portion is at least composed of a first conductive circuit layer; and a plurality of pad portions, the plurality of Each pad portion is composed of at least the first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer, the second conductive circuit layer has higher conductivity than the first conductive circuit layer Conductivity, the wire part is electrically coupled to the plurality of pad parts; A first protective layer is disposed on the composite conductive circuit layer and exposes the plurality of pad portions; and a plurality of light sources are respectively disposed on the plurality of pad portions, and the light emitted by the plurality of light sources can be directed upward To reach the plurality of keycaps; wherein the light source lamp panel further has a row of tails, the row of tails has a plurality of extension wires and a predetermined bending portion, the plurality of extension wires in the predetermined bending portion only consists of The first conductive circuit layer is formed, and the second conductive circuit layer does not extend within the predetermined bending portion. 一種發光鍵盤,包括:複數個鍵帽;以及一光源燈板,設置於該複數個鍵帽下方,包括:一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;一複合導電線路層,設置於該基板上,該複合導電線路層具有:一導線部,該導線部係至少由一第一導電線路層所構成;及複數個接墊部,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的一第二導電線路層所構成,該第二導電線路層的導電性高於該第一導電線路層的導電性,該導線部電性偶接該複數個接墊部; 一第一保護層,設置於該複合導電線路層上,並曝露出該複數個接墊部;以及複數個光源,分別設置於該複數個接墊部上,該複數個光源發出的光線可向上行進而抵達該複數個鍵帽;其中該光源燈板更具有一排線尾部,其中該複合導電線路層包括:複數條高電位第一導線,該複數條高電位第一導線從該排線尾部延伸至該第一短邊側中間位置;複數條高電位第二導線,該複數條高電位第二導線從該第一短邊側中間位置以實質平行於該長邊側方式延伸至該複數個接墊部附近;複數條低電位第二導線,該複數條低電位第二導線從該複數個接墊部附近以實質平行於該長邊側方式延伸至該第二短邊側中間位置;以及複數條低電位第一導線,該複數條低電位第一導線從該第二短邊側中間位置延伸至該排線尾部。 A light-emitting keyboard, comprising: a plurality of key caps; and a light source lamp board, arranged under the plurality of key caps, comprising: a substrate, the substrate has a long side, a first short side and a second short Side; a composite conductive circuit layer, disposed on the substrate, the composite conductive circuit layer has: a wire portion, the wire portion is at least composed of a first conductive circuit layer; and a plurality of pad portions, the plurality of Each pad portion is composed of at least the first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer, the second conductive circuit layer has higher conductivity than the first conductive circuit layer Conductivity, the wire part is electrically coupled to the plurality of pad parts; A first protective layer is disposed on the composite conductive circuit layer and exposes the plurality of pad portions; and a plurality of light sources are respectively disposed on the plurality of pad portions, and the light emitted by the plurality of light sources can be directed upward To reach the plurality of keycaps; wherein the light source lamp board further has a row of wire tails, wherein the composite conductive circuit layer includes: a plurality of high-potential first wires, the plurality of high-potential first wires run from the tail Extending to the middle position of the first short side; a plurality of high potential second wires, the plurality of high potential second wires extending from the middle position of the first short side to the plurality of substantially parallel to the long side Near the pad portion; a plurality of low-potential second wires extending from the vicinity of the plurality of pad portions to the middle position of the second short-side side substantially parallel to the long-side side; and A plurality of low-potential first wires, the plurality of low-potential first wires extend from the middle position of the second short side to the tail of the cable. 如申請專利範圍第18項所述之發光鍵盤,其中該複數條高電位第二導線於鄰近該第一短邊側中間位置分別對應具有複數個S字形路徑,該複數個S字形路徑長度不同,藉以調整使通過該複數條高電位第二導線的電流值實質相等。 The luminous keyboard as described in item 18 of the patent application range, wherein the plurality of high-potential second wires respectively have a plurality of S-shaped paths in the middle position adjacent to the first short side, and the plurality of S-shaped paths have different lengths, Through this adjustment, the current values passing through the plurality of high-potential second wires are substantially equal. 一種發光鍵盤,包括:複數個鍵帽;以及 一光源燈板,設置於該複數個鍵帽下方,包括:一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;一複合導電線路層,設置於該基板上,該複合導電線路層具有:一導線部,該導線部係至少由一第一導電線路層所構成;及複數個接墊部,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的一第二導電線路層所構成,該第二導電線路層的導電性高於該第一導電線路層的導電性,該導線部電性偶接該複數個接墊部;一第一保護層,設置於該複合導電線路層上,並曝露出該複數個接墊部;以及複數個光源,分別設置於該複數個接墊部上,該複數個光源發出的光線可向上行進而抵達該複數個鍵帽;其中該光源燈板更具有複數條高電位第三導線與複數條低電位第三導線,每個該接墊部具有一正電極與一負電極,該複數條高電位第三導線與該複數條低電位第三導線實質上平行於該第一短邊側而延伸,該複數條高電位第三導線分別電性偶接該複數條高電位第二導線其中之一與對應之該接墊部的該正電極,該複數條低電位第三導線分別電性偶接該複數條低電位第二導線其中之一與對應之該接墊部的該負電極。 A luminous keyboard, including: a plurality of keycaps; and A light source lamp board, disposed under the plurality of key caps, includes: a substrate having a long side, a first short side, and a second short side; a composite conductive circuit layer disposed on the On the substrate, the composite conductive circuit layer has: a wire portion, the wire portion is composed of at least a first conductive circuit layer; and a plurality of pad portions, the plurality of pad portions are at least composed of the first conductive circuit Layer and a second conductive circuit layer stacked on the first conductive circuit layer, the conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer, and the wire portion is electrically coupled to the A plurality of pad parts; a first protective layer disposed on the composite conductive circuit layer and exposing the plurality of pad parts; and a plurality of light sources respectively disposed on the plurality of pad parts, the plurality of The light emitted by the light source can travel upward to reach the plurality of keycaps; wherein the light source lamp board further has a plurality of high potential third wires and a plurality of low potential third wires, each of the pad parts has a positive electrode and a Negative electrode, the plurality of high potential third wires and the plurality of low potential third wires extend substantially parallel to the first short side, the plurality of high potential third wires are electrically coupled to the plurality of high wires respectively One of the potential second wires and the positive electrode of the corresponding pad portion, the plurality of low potential third wires are electrically coupled to one of the plurality of low potential second wires and the corresponding pad portion, respectively The negative electrode. 如申請專利範圍第20項所述之發光鍵盤,其中,對應於每個鍵帽下方具有:該複數條高電位第三導線其中至少兩條,該複數條低電位第三導線其中至少兩條,與至少兩個該接墊部,且至少兩個該接墊部係分別位於該鍵帽中心線的相對兩側邊下方。 The illuminated keyboard as described in item 20 of the patent application range, corresponding to each keycap has at least two of the plurality of high-potential third wires and at least two of the plurality of low-potential third wires, At least two of the pad portions, and at least two of the pad portions are respectively located under opposite sides of the centerline of the keycap. 一種發光鍵盤,包括:複數個鍵帽;一光源燈板,設置於該複數個鍵帽下方,包括:一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側;一複合導電線路層,設置於該基板上,該複合導電線路層具有:一導線部,該導線部係至少由一第一導電線路層所構成;及複數個接墊部,該複數個接墊部係至少由該第一導電線路層和堆疊在該第一導電線路層上的一第二導電線路層所構成,該第二導電線路層的導電性高於該第一導電線路層的導電性,該導線部電性偶接該複數個接墊部;一第一保護層,設置於該複合導電線路層上,並曝露出該複數個接墊部;以及複數個光源,分別設置於該複數個接墊部上,該複數個光源發出的光線可向上行進而抵達該複數個鍵帽;以及 一底板,設置於該複數個鍵帽下方,該底板具有複數個開口,每個該鍵帽至少對應到該複數個開口其中之一,且該複數個光源係位於該複數個開口下方,使得該複數個光源發出的光線可穿過該複數個開口而向上行進而抵達該複數個鍵帽。 A light-emitting keyboard, comprising: a plurality of key caps; a light source lamp board, arranged under the plurality of key caps, comprising: a substrate, the substrate has a long side, a first short side and a second short side Side; a composite conductive circuit layer, disposed on the substrate, the composite conductive circuit layer has: a wire portion, the wire portion is at least composed of a first conductive circuit layer; and a plurality of pad portions, the plurality of The pad portion is composed of at least the first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer, the second conductive circuit layer has a higher conductivity than the first conductive circuit layer Conductivity, the lead portion is electrically coupled to the plurality of pad portions; a first protective layer is disposed on the composite conductive circuit layer and exposes the plurality of pad portions; and the plurality of light sources are respectively disposed at On the plurality of pad parts, the light emitted by the plurality of light sources can travel upward to reach the plurality of keycaps; and A bottom plate is disposed under the plurality of key caps, the bottom plate has a plurality of openings, each key cap corresponds to at least one of the plurality of openings, and the plurality of light sources are located under the plurality of openings, so that the The light emitted by the plurality of light sources can pass through the plurality of openings and travel upward to reach the plurality of key caps.
TW108102911A 2018-05-31 2018-05-31 Light source board, manufacturing method thereof, and luminous keyboard using the same TWI685009B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW108102911A TWI685009B (en) 2018-05-31 2018-05-31 Light source board, manufacturing method thereof, and luminous keyboard using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108102911A TWI685009B (en) 2018-05-31 2018-05-31 Light source board, manufacturing method thereof, and luminous keyboard using the same

Publications (2)

Publication Number Publication Date
TW202004809A TW202004809A (en) 2020-01-16
TWI685009B true TWI685009B (en) 2020-02-11

Family

ID=69942234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108102911A TWI685009B (en) 2018-05-31 2018-05-31 Light source board, manufacturing method thereof, and luminous keyboard using the same

Country Status (1)

Country Link
TW (1) TWI685009B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12061353B2 (en) 2022-04-08 2024-08-13 Darfon Electronics Corp. Backlit module and key for backlit keyboard

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI777816B (en) * 2021-10-15 2022-09-11 達方電子股份有限公司 Lighting keyswitch with wild-angle illumination function
US11977250B2 (en) 2022-03-31 2024-05-07 Darfon Electronics Corp. Lighting keyboard, backlight module and lighting substrate

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258214A (en) * 2007-03-31 2008-10-23 Sumitomo Metal Electronics Devices Inc Multilayer wiring board for mounting light-emitting device, and its manufacturing method
US20140264417A1 (en) * 2013-03-14 2014-09-18 Shinko Electric Industries Co., Ltd. Wiring board and light emitting device
TW201530588A (en) * 2012-11-21 2015-08-01 Primax Electronics Ltd Luminous keyboard
TWM528464U (en) * 2015-07-30 2016-09-11 閎暉實業股份有限公司 Lighting input device
US20160351619A1 (en) * 2015-04-23 2016-12-01 Alliance Sports Group, L.P. Method and Apparatus for Chip-On Board Flexible Light Emitting Diode
CN206921733U (en) * 2017-05-24 2018-01-23 群光电能科技股份有限公司 Have water-proof function can adjustment formula keyboard
CN206961730U (en) * 2017-05-24 2018-02-02 群光电能科技股份有限公司 Have water-proof function can adjustment formula keyboard and its light emitting module

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258214A (en) * 2007-03-31 2008-10-23 Sumitomo Metal Electronics Devices Inc Multilayer wiring board for mounting light-emitting device, and its manufacturing method
TW201530588A (en) * 2012-11-21 2015-08-01 Primax Electronics Ltd Luminous keyboard
US20140264417A1 (en) * 2013-03-14 2014-09-18 Shinko Electric Industries Co., Ltd. Wiring board and light emitting device
US20160351619A1 (en) * 2015-04-23 2016-12-01 Alliance Sports Group, L.P. Method and Apparatus for Chip-On Board Flexible Light Emitting Diode
TWM528464U (en) * 2015-07-30 2016-09-11 閎暉實業股份有限公司 Lighting input device
CN206921733U (en) * 2017-05-24 2018-01-23 群光电能科技股份有限公司 Have water-proof function can adjustment formula keyboard
CN206961730U (en) * 2017-05-24 2018-02-02 群光电能科技股份有限公司 Have water-proof function can adjustment formula keyboard and its light emitting module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12061353B2 (en) 2022-04-08 2024-08-13 Darfon Electronics Corp. Backlit module and key for backlit keyboard

Also Published As

Publication number Publication date
TW202004809A (en) 2020-01-16

Similar Documents

Publication Publication Date Title
TWI685010B (en) Light source board
US8035121B2 (en) Package for light emitting device having a lens spaced from a light emitting device module
JP4953839B2 (en) PCB package
EP2346100B1 (en) Light emitting apparatus and lighting system
TWI462343B (en) Light emitting device
US20140151211A1 (en) Luminous keyboard
TWI685009B (en) Light source board, manufacturing method thereof, and luminous keyboard using the same
US7985973B2 (en) Semiconductor light-emitting device and method of fabricating the same
US20150085527A1 (en) Light source module, fabrication method therefor, and backlight unit including the same
EP2492983B1 (en) Light emitting device
US8901581B2 (en) Semiconductor light emitting device having multi-cell array and manufacturing method thereof, light emitting module, and illumination apparatus
CN106133930B (en) Semiconductor unit, semiconductor device, light emitting apparatus, display apparatus, and semiconductor device manufacturing method
CN109114457B (en) Light source lamp panel, manufacturing method thereof and light-emitting keyboard applying light source lamp panel
KR20220162656A (en) Semiconductor light emitting diode
JP2011023620A (en) Wiring board
KR20160087103A (en) Printed Circuit Board, Manufacturing method thereof, LED module and LED lamp with using the same
KR100646569B1 (en) Light emitting device package and method for fabricating the same
US10895372B2 (en) Light source board, manufacturing method thereof, and luminous keyboard using the same
US20150085225A1 (en) Led backlight unit and led display device including the same
TW202103315A (en) Twistable light emitting diode display module
US20100232179A1 (en) Printed circuit board and back light module using the same
CN111048560A (en) Display device
US20220412541A1 (en) Illuminating circuit structure
TWI760224B (en) Illuminated keyboard and light source assembly
CN212841398U (en) Light source device