TWI685009B - Light source board, manufacturing method thereof, and luminous keyboard using the same - Google Patents
Light source board, manufacturing method thereof, and luminous keyboard using the same Download PDFInfo
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Abstract
Description
本發明是有關於一種電路板、其製作方法、及應用其之鍵盤。本發明特別是有關於一種光源燈板、其製作方法、及應用其之發光鍵盤。 The invention relates to a circuit board, a manufacturing method thereof, and a keyboard using the circuit board. The invention particularly relates to a light source lamp board, a manufacturing method thereof, and a light-emitting keyboard using the same.
人們對於周遭的生活工具,除了基本功能的完善之外,往往也會追求美感、使用上的舒適感等其他附加價值。舉例來說,就鍵盤而言,在基本的打字應用之外,由於有時人們會在光線不足的情況下使用電腦系統,因此發光鍵盤隨之誕生。而在鍵盤附加上發光的功能之後,又對應地產生再進一步地改善發光均勻度、增加發光的多樣性、薄化鍵盤等需求。 In addition to the improvement of basic functions, people often pursue other added values such as beauty and comfort in use. For example, as far as the keyboard is concerned, in addition to basic typing applications, because people sometimes use computer systems in low-light situations, a light-emitting keyboard is born. After the keyboard is added with a light-emitting function, there is a corresponding need to further improve the uniformity of light-emitting, increase the diversity of light-emitting, and thin the keyboard.
本發明是關於一種光源燈板、其製作方法、及應用其之發光鍵盤。應用此種光源燈板之發光鍵盤可進一步地改善使用體驗。 The invention relates to a light source lamp board, a manufacturing method thereof, and a light-emitting keyboard using the same. The use of the light-emitting keyboard of the light source lamp board can further improve the user experience.
根據一些實施例,一種光源燈板包括一基板、一複合導電線路層、一第一保護層以及複數個光源。基板具有一長邊側、一第一短邊側與一第二短邊側。複合導電線路層設置於基板上。複合導電線路層具有一導線部及複數個接墊部。導線部係至少由一第一導電線路層所構成。接墊部係至少由第一導電線路層和堆疊在第一導電線路層上的一第二導電線路層所構成。第二導電線路層的導電性高於第一導電線路層的導電性。導線部電性偶接接墊部。第一保護層設置於複合導電線路層上,並曝露出接墊部。光源分別設置於接墊部上。 According to some embodiments, a light source lamp board includes a substrate, a composite conductive circuit layer, a first protective layer, and a plurality of light sources. The substrate has a long side, a first short side, and a second short side. The composite conductive circuit layer is disposed on the substrate. The composite conductive circuit layer has a wire part and a plurality of pad parts. The wire part is composed of at least a first conductive circuit layer. The pad portion is composed of at least a first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer. The conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer. The lead part is electrically coupled to the pad part. The first protective layer is disposed on the composite conductive circuit layer and exposes the pad portion. The light sources are respectively arranged on the pad parts.
根據一些實施例,一種光源燈板的製作方法包括以下步驟。首先,提供一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側。在基板上形成一複合導電線路層,該複合導電線路層具有一導線部及複數個接墊部,導線部電性偶接接墊部。形成複合導電線路層包括在基板上形成一第一導電線路層以及在第一導電線路層上形成一第二導電線路層,第二導電線路層的導電性高於第一導電線路層的導電性。導線部係至少由第一導電線路層所構成,接墊部係至少由第一導電線路層和堆疊在第一導電線路層上的第二導電線路層所構成。在複合導電線路層上形成一第一保護層,該第一保護層曝露出接墊部。並且,在該複數個接墊部上設置複數個光源。 According to some embodiments, a method for manufacturing a light source lamp board includes the following steps. First, a substrate is provided. The substrate has a long side, a first short side, and a second short side. A composite conductive circuit layer is formed on the substrate. The composite conductive circuit layer has a lead portion and a plurality of pad portions. The lead portion is electrically coupled to the pad portion. Forming a composite conductive circuit layer includes forming a first conductive circuit layer on the substrate and forming a second conductive circuit layer on the first conductive circuit layer, the second conductive circuit layer having higher conductivity than the first conductive circuit layer . The wire portion is composed of at least a first conductive circuit layer, and the pad portion is composed of at least a first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer. A first protective layer is formed on the composite conductive circuit layer, and the first protective layer exposes the pad portion. In addition, a plurality of light sources are provided on the plurality of pad portions.
根據一些實施例,一種發光鍵盤包括複數個鍵帽以及一光源燈板。光源燈板設置於該複數個鍵帽下方。光源燈板包 括一基板、一複合導電線路層、一第一保護層及複數個光源。基板具有一長邊側、一第一短邊側與一第二短邊側。複合導電線路層設置於基板上。複合導電線路層具有一導線部及複數個接墊部。導線部係至少由一第一導電線路層所構成。接墊部係至少由第一導電線路層和堆疊在第一導電線路層上的一第二導電線路層所構成。第二導電線路層的導電性高於第一導電線路層的導電性。導線部電性偶接接墊部。第一保護層設置於複合導電線路層上,並曝露出接墊部。光源分別設置於接墊部上。光源發出的光線可向上行進而抵達該複數個鍵帽。 According to some embodiments, a light-emitting keyboard includes a plurality of key caps and a light source light board. The light source lamp board is arranged under the plurality of key caps. Light source lamp board package It includes a substrate, a composite conductive circuit layer, a first protective layer and a plurality of light sources. The substrate has a long side, a first short side, and a second short side. The composite conductive circuit layer is disposed on the substrate. The composite conductive circuit layer has a wire part and a plurality of pad parts. The wire part is composed of at least a first conductive circuit layer. The pad portion is composed of at least a first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer. The conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer. The lead part is electrically coupled to the pad part. The first protective layer is disposed on the composite conductive circuit layer and exposes the pad portion. The light sources are respectively arranged on the pad parts. The light emitted by the light source can travel upward to reach the plurality of keycaps.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to have a better understanding of the above and other aspects of the present invention, the following examples are specifically described in conjunction with the accompanying drawings as follows:
100、300、540、640、740、840、940‧‧‧光源燈板 100, 300, 540, 640, 740, 840, 940
110、310、541‧‧‧基板 110, 310, 541‧‧‧ substrate
120、320、550‧‧‧複合導電線路層 120, 320, 550‧‧‧ composite conductive circuit layer
121、321‧‧‧導線部 121、321‧‧‧Wire Department
122、322、557‧‧‧接墊部 122, 322, 557‧‧‧ pad part
123A、123B、123C‧‧‧電阻提高部分 123A, 123B, 123C
124‧‧‧電阻裝置 124‧‧‧Resistance device
125、325‧‧‧第一導電線路層 125, 325‧‧‧ First conductive circuit layer
126、326‧‧‧第二導電線路層 126, 326‧‧‧ Second conductive circuit layer
130、330‧‧‧第一保護層 130, 330 ‧‧‧ first protective layer
140、340、560‧‧‧光源 140, 340, 560
140A、140B、140C、140D、140E、140F‧‧‧LED光源 140A, 140B, 140C, 140D, 140E, 140F ‧‧‧ LED light source
150、150A、150B、150C、150D、350‧‧‧第二保護層 150, 150A, 150B, 150C, 150D, 350 second protection layer
151B‧‧‧擴散粒子 151B‧‧‧Diffusion particles
210、220、230、240、250、260、410、420、430、440、450、460‧‧‧步驟 210, 220, 230, 240, 250, 260, 410, 420, 430, 440, 450, 460
510、610、710、810、910‧‧‧鍵帽 510, 610, 710, 810, 910
510M‧‧‧中心線 510M‧‧‧Centerline
520‧‧‧薄膜開關層 520‧‧‧ membrane switch layer
521、621、721、821、921‧‧‧開關電極層 521, 621, 721, 821, 921‧‧‧ switch electrode layer
522、622、722、822、922‧‧‧支撐結構 522, 622, 722, 822, 922 ‧‧‧ support structure
523‧‧‧橡皮彈性體 523‧‧‧rubber elastomer
524‧‧‧剪刀腳結構 524‧‧‧Scissor foot structure
525、625、725、825、925‧‧‧連接結構 525, 625, 725, 825, 925 ‧‧‧ connection structure
526、531‧‧‧開口 526, 531‧‧‧ opening
530、630、730、830、930‧‧‧底板 530, 630, 730, 830, 930
542‧‧‧長邊側 542‧‧‧Long side
543‧‧‧第一短邊側 543‧‧‧First short side
544‧‧‧第二短邊側 544‧‧‧second short side
545‧‧‧排線尾部 545‧‧‧Tail
546‧‧‧延伸導線 546‧‧‧Extension wire
547‧‧‧預定彎折部 547‧‧‧Scheduled bending part
551‧‧‧高電位第一導線 551‧‧‧High potential first wire
552‧‧‧高電位第二導線 552‧‧‧High potential second wire
552S、555S‧‧‧S字形路徑 552S, 555S‧‧‧S-shaped path
553‧‧‧高電位第三導線 553‧‧‧High potential third wire
554‧‧‧低電位第三導線 554‧‧‧Low potential third wire
555‧‧‧低電位第二導線 555‧‧‧Low potential second wire
556‧‧‧低電位第一導線 556‧‧‧Low potential first lead
558‧‧‧正電極 558‧‧‧Positive electrode
559‧‧‧負電極 559‧‧‧Negative electrode
第1A~1D圖為根據一些實施例之光源燈板及其中複合導電線路層的示意圖。 FIGS. 1A-1D are schematic diagrams of a light source lamp board and a composite conductive circuit layer therein according to some embodiments.
第2A~2C圖為具有根據各種不同實施例之封裝結構的LED光源的示意圖。 2A~2C are schematic diagrams of LED light sources having packaging structures according to various embodiments.
第3A~3C圖為具有根據各種不同實施例之封裝膠層的LED光源的示意圖。 Figures 3A~3C are schematic diagrams of LED light sources with encapsulant layers according to various embodiments.
第4A~4D圖為根據各種不同實施例之光源燈板的第二保護層的示意圖。 4A-4D are schematic diagrams of the second protective layer of the light source lamp board according to various embodiments.
第5圖為第1A~1D圖所示之光源燈板的製作方法的流程圖。 FIG. 5 is a flowchart of the method for manufacturing the light source lamp board shown in FIGS. 1A to 1D.
第6A~6C圖為根據另一些實施例之光源燈板及其中複合導電線路層的示意圖。 6A~6C are schematic diagrams of a light source lamp board and a composite conductive circuit layer therein according to other embodiments.
第7圖為第6A~6C圖所示之光源燈板的製作方法的流程圖。 FIG. 7 is a flowchart of the method for manufacturing the light source lamp board shown in FIGS. 6A to 6C.
第8A~8D圖為根據一些實施例之發光鍵盤的各層的示意圖。 8A-8D are schematic diagrams of layers of a light-emitting keyboard according to some embodiments.
第9圖為第8A~8D圖所示之發光鍵盤的其中一個鍵的俯視示意圖。 FIG. 9 is a schematic top view of one key of the light-emitting keyboard shown in FIGS. 8A-8D.
第10圖為第8A~8D圖所示之發光鍵盤的其中一個鍵的側視示意圖。 Figure 10 is a schematic side view of one of the keys of the illuminated keyboard shown in Figures 8A~8D.
第11圖為根據另一些實施例之發光鍵盤的其中一個鍵的側視示意圖。 FIG. 11 is a schematic side view of one key of a light-emitting keyboard according to other embodiments.
第12圖為根據又一些實施例之發光鍵盤的其中一個鍵的側視示意圖。 FIG. 12 is a schematic side view of one key of a light-emitting keyboard according to still other embodiments.
第13圖為根據再一些實施例之發光鍵盤的其中一個鍵的側視示意圖。 FIG. 13 is a schematic side view of one key of a light-emitting keyboard according to still other embodiments.
第14圖為根據又另一些實施例之發光鍵盤的其中一個鍵的側視示意圖。 FIG. 14 is a schematic side view of one key of a light-emitting keyboard according to still other embodiments.
以下將配合所附圖式對於各種不同的實施例進行更詳細的說明,實施例及所附圖式僅用於描述和解釋目的,而不用於限制目的。可以理解的是,在結構方面,可增加其他元件、移除部分元件、結合部分元件、和/或進行任何其他可允許的調整。並且,以單數型態描述的元件亦允許存在複數個該元件的情 況。在方法方面,可能調整步驟的順序、增加其他步驟、省略部分步驟、結合部分步驟、和/或進行任何其他可允許的調整。為了清楚起見,圖式中的元件可能並未依照實際比例繪示,並省略部分元件和/或元件符號。可以預期的是,即使未作描述,在任何可允許的情況下,能夠將一實施例中的元件和特徵納入於另一實施例中。 In the following, various different embodiments will be described in more detail in conjunction with the accompanying drawings. The embodiments and the accompanying drawings are only used for description and explanation purposes, but not for limitation purposes. It can be understood that, in terms of structure, other elements may be added, some elements may be removed, some elements may be combined, and/or any other allowable adjustments may be made. In addition, elements described in the singular form are also allowed to exist in the plural condition. In terms of methods, it is possible to adjust the order of the steps, add other steps, omit some steps, combine some steps, and/or make any other allowable adjustments. For the sake of clarity, the elements in the drawings may not be drawn according to actual scale, and some elements and/or element symbols are omitted. It is expected that even if not described, the elements and features in one embodiment can be incorporated into another embodiment under any permissible circumstances.
在本發明的一方面,提供一種光源燈板,其包括一基板、一複合導電線路層、一第一保護層以及複數個光源。基板具有一長邊側、一第一短邊側與一第二短邊側。複合導電線路層設置於基板上。複合導電線路層具有一導線部及複數個接墊部。導線部係至少由一第一導電線路層所構成。接墊部係至少由第一導電線路層和堆疊在第一導電線路層上的一第二導電線路層所構成。第二導電線路層的導電性高於第一導電線路層的導電性。導線部電性偶接接墊部。第一保護層設置於複合導電線路層上,並曝露出接墊部。光源分別設置於接墊部上。 In one aspect of the present invention, a light source lamp board is provided, which includes a substrate, a composite conductive circuit layer, a first protective layer, and a plurality of light sources. The substrate has a long side, a first short side, and a second short side. The composite conductive circuit layer is disposed on the substrate. The composite conductive circuit layer has a wire part and a plurality of pad parts. The wire part is composed of at least a first conductive circuit layer. The pad portion is composed of at least a first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer. The conductivity of the second conductive circuit layer is higher than that of the first conductive circuit layer. The lead part is electrically coupled to the pad part. The first protective layer is disposed on the composite conductive circuit layer and exposes the pad portion. The light sources are respectively arranged on the pad parts.
在本發明的另一方面,提供一種此類光源燈板的製作方法,其包括以下步驟。首先,提供一基板,該基板具有一長邊側、一第一短邊側與一第二短邊側。在基板上形成一複合導電線路層,該複合導電線路層具有一導線部及複數個接墊部,導線部電性偶接接墊部。形成複合導電線路層包括在基板上形成一第一導電線路層以及在第一導電線路層上形成一第二導電線路層,第二導電線路層的導電性高於第一導電線路層的導電性。導線部 係至少由第一導電線路層所構成,接墊部係至少由第一導電線路層和堆疊在第一導電線路層上的第二導電線路層所構成。在複合導電線路層上形成一第一保護層,該第一保護層曝露出接墊部。並且,在該複數個接墊部上設置複數個光源。 In another aspect of the present invention, a method for manufacturing such a light source lamp board is provided, which includes the following steps. First, a substrate is provided. The substrate has a long side, a first short side, and a second short side. A composite conductive circuit layer is formed on the substrate. The composite conductive circuit layer has a lead portion and a plurality of pad portions. The lead portion is electrically coupled to the pad portion. Forming a composite conductive circuit layer includes forming a first conductive circuit layer on the substrate and forming a second conductive circuit layer on the first conductive circuit layer, the second conductive circuit layer having higher conductivity than the first conductive circuit layer . Wire section It is composed of at least a first conductive circuit layer, and the pad portion is composed of at least a first conductive circuit layer and a second conductive circuit layer stacked on the first conductive circuit layer. A first protective layer is formed on the composite conductive circuit layer, and the first protective layer exposes the pad portion. In addition, a plurality of light sources are provided on the plurality of pad portions.
現在請參照第1A~1D圖,以得到對於上述光源燈板更清楚的理解。第1A~1D圖示出一光源燈板100及其中的複合導電線路層120。第1A圖以俯視視角繪示光源燈板100的複合導電線路層120,但為了清楚起見省略光源燈板100中大部分的其他元件。第1B圖和第1C圖分別為光源燈板100沿著第1A圖中的剖面線1B-1B’和剖面線1C-1C’的剖面圖。如第1B圖和第1C圖所示,光源燈板100包括基板110、複合導電線路層120、第一保護層130及光源140,光源140底面有正負兩個電極接點,分別電性連接兩個複合導電線路層120,如此構成迴路以便自電源接收電能。
Now please refer to figures 1A~1D for a clearer understanding of the above light source lamp board. FIGS. 1A to 1D show a light
基板110可使用任何適用之基板。根據一些實施例,使用可供印刷製程使用的基板。在一些實施例中,使用可撓曲基板。舉例來說,基板110可由聚對苯二甲酸乙二酯(PET)製作而成。
The
複合導電線路層120設置於基板110上。如第1A圖所示,複合導電線路層120具有導線部121及接墊部122。接墊部122寬度係可配合光源140尺寸大小而調整;當光源140尺寸較大時,接墊部122寬度可以大於導線部121寬度,以增加較大尺寸光源140和接墊部122的焊接面積;當光源140尺寸較小時,接墊部
122寬度可以小於導線部121寬度,便足以固定較小尺寸光源140。導線部121電性偶接接墊部122。舉例來說,可如第1A圖所示,導線部121藉由物理連接接墊部122而與接墊部122電性偶接。第1B圖和第1C圖示出複合導電線路層120的一第一導電線路層125和一第二導電線路層126,第二導電線路層126堆疊在第一導電線路層125上,二者用於構成複合導電線路層120。第二導電線路層126的導電性高於第一導電線路層125的導電性。在一些實施例中,第一導電線路層125的材料可包括銅膏、鎳膏、和銀膠之中至少一者,第二導電線路層126的材料可包括鍍銀、鍍錫、鍍鎳、和鍍金之中至少一者。在光源燈板100中,導線部121係至少由第一導電線路層125所構成,並可視電阻大小需求,選擇性地局部或整體更包括第二導電線路層126。當導線部121需要較低單位長度電阻時,導線部121可由第一導電線路層125和第二導電線路層126所共同構成。當導線部121需要較高單位長度電阻時,導線部121可僅具有第一導電線路層125,並未再覆蓋第二導電線路層126。在一些實施例中,為了要降低複合導電線路層120上所流經電流大小,複合導電線路層120可更包括一電阻提高部分123。該電阻提高部分例如可為但不受限於第1D圖所示之電阻提高部分123A~123C的任一者或其組合。請參照第1D圖,(1)電阻提高部分123A係僅具有第一導電線路層125,但未設置第二導電線路層126;(2)電阻提高部分123B係僅具有第一導電線路層125,且刻意作S形延伸以使第一導電線路層125的長度增加和/或寬度減
少;(3)電阻提高部分123C係複合導電線路層120具有斷路間隙,並於斷路兩相對端點之間串聯設置一電阻裝置124。
The composite
請再次參照第1B圖和第1C圖,第一保護層130設置於複合導電線路層120上,並曝露出接墊部122。第一保護層130可由PET、紫外線固化膠(UV paste)或類似材料形成。
Please refer to FIGS. 1B and 1C again. The first
光源140分別設置於接墊部122上。光源140可為LED光源。舉例來說,可採用如第2A圖所示之具有塑膠引線式晶片載體(PLCC)封裝結構的LED光源140A。可採用如第2B圖所示之具有打線式封裝結構的LED光源140B。或者,可採用如第2C圖所示之具有晶片級封裝(CSP)結構的LED光源140C。在一些實施例中,可改變封裝結構中的封裝膠層的型態,以達成特定光學效果。舉例來說,可採用其中封裝膠層具有勻光結構的LED光源,例如第3A圖所示之LED光源140D,其係在封裝膠層的表面形成擴散微結構(例如微透鏡(micro lens))。可採用其中封裝膠層具有聚光結構的LED光源,例如第3B圖所示之的LED光源140E,其係將封裝膠層的表面形成為具有單一球面凸出結構而達成聚光效果。或者,可採用其中封裝膠層具有散光結構的LED光源,例如第3C圖所示之LED光源140F,其係將封裝膠層表面形成為具有單一球面凹入結構而達成散光效果。
The
可以理解的是,雖然實施例是關於光源燈板而著重在光源的例子,但其他電子元件也可採用類似方式設置在接墊部 上。亦即,在一些實施例中,可存在部分的接墊部是提供用於除了光源之外的其他電子元件的電性偶接。 It can be understood that, although the embodiment is an example focusing on the light source with respect to the light source lamp board, other electronic components may also be arranged in the pad part in a similar manner on. That is, in some embodiments, a portion of the pad portion may be provided for electrical coupling of other electronic components besides the light source.
在一些實施例中,如第1B圖和第1C圖所示,光源燈板100可更具有一第二保護層150。第二保護層150設置於第一保護層130和光源140上。根據一些實施例,第二保護層150可進一步地具有勻光結構、和/或聚光或散光結構。舉例來說,可如第4A圖所示,在第二保護層150A的表面形成擴散微結構(例如微透鏡),以達成勻光效果。或者,如第4B圖所示,在第二保護層150B中加入擴散粒子151B,以達成勻光效果。擴散粒子151B可為二氧化鈦、二氧化矽、螢光粉或類似物。此外,可如第4C圖所示,將第二保護層150C的表面形成為具有單一球面凸出結構,以達成聚光效果。或者,可如第4D圖所示,將第二保護層150D的表面形成為具有單一球面凹入結構而達成散光效果。第二保護層150可由PET、紫外線固化膠或類似材料形成。第二保護層150的材料可相同或不同於第一保護層130的材料。
In some embodiments, as shown in FIGS. 1B and 1C, the light
請參照第5圖,其為光源燈板100的製作方法的流程圖。在步驟210,提供基板110。基板110可具有一長邊側、一第一短邊側與一第二短邊側。在步驟220,在基板110上形成複合導電線路層120的第一導電線路層125。在步驟230,在第一導電線路層125上形成第二導電線路層126,第二導電線路層126的導電性高於第一導電線路層125的導電性。在一些實施例中,形成第一導電線路層125包括進行一印刷製程,形成第二導電線路層126
包括進行一鍍膜製程。舉例來說,用於形成第一導電線路層125的印刷製程可包括塗佈一導電膠體,該導電膠體為銅膏、鎳膏、和銀膠之中至少一者。用於形成第二導電線路層126的鍍膜製程可包括化鍍或電鍍一金屬,該金屬為銀、錫、鎳、和金之中至少一者。例如在一些實施例中,可藉由網版印刷銀膠而形成第一導電線路層125,並藉由化鍍銅而形成第二導電線路層126。複合導電線路層120的導線部121係至少由第一導電線路層125所構成並可進一步包括第二導電線路層126,接墊部122係至少由第一導電線路層125和第二導電線路層126所構成。之後,在步驟240,在複合導電線路層120上形成第一保護層130,第一保護層130曝露出接墊部122。由於形成第一保護層130係在形成第二導電線路層126之後進行,第一保護層130覆蓋第二導電線路層126位在接墊部122之外的部分,例如覆蓋導線部121。在步驟250,在接墊部122上設置光源140。可選擇性地進行步驟260。於步驟260,在第一保護層130和光源140上形成第二保護層150。第二保護層150可具有勻光結構、和/或聚光或散光結構。
Please refer to FIG. 5, which is a flowchart of a method for manufacturing the light
現在請參照第6A~6C圖,其示出另一光源燈板300及其中的複合導電線路層320,其中第6A圖以俯視視角繪示光源燈板300的複合導電線路層320,但為了清楚起見省略光源燈板300中大部分的其他元件,第6B圖和第6C圖分別為光源燈板300沿著第6A圖中的剖面線6B-6B’和剖面線6C-6C’的剖面圖。光源燈板300包括基板310、複合導電線路層320、第一保護層330及
光源340,並可選擇性地包括第二保護層350,其中基板310、第一保護層330、光源340及第二保護層350類似於上述光源燈板100的對應元件,為求簡潔,在此省略對其進一步的描述,僅將重點放在型態上具有差異的複合導電線路層320。
Now please refer to FIGS. 6A to 6C, which show another light
如第6A~6C圖所示,在光源燈板300中,複合導電線路層320的第二導電線路層326僅設置於接墊部322。導線部321並不包括電組較低/導電性較高的第二導電線路層326。舉例來說,導線部321可僅由第一導電線路層325所構成。然而,並不排除在導線部321設置導電性與第一導電線路層325相仿或較低的其他層的情況。類似於複合導電線路層120,第一導電線路層325的材料可包括銅膏、鎳膏、和銀膠之中至少一者,第二導電線路層326的材料可包括鍍銀、鍍錫、鍍鎳、和鍍金之中至少一者。此外,複合導電線路層320也可包括一電阻提高部分,例如類似於第1D圖所示之電阻提高部分123B,增加第一導電線路層325的長度和/或減少第一導電線路層325的寬度,或類似於電阻提高部分123C係複合導電線路層320具有斷路,並於斷路兩相對端點之間串聯設置一電阻裝置。
As shown in FIGS. 6A to 6C, in the light
請參照第7圖,其為光源燈板300的製作方法的流程圖。為求簡潔,在此可能省略部分類似於參照第5圖所述之製作方法的細節。在步驟410,提供基板310。在步驟420,在基板310上形成複合導電線路層320的第一導電線路層325。接著,在步驟430,先形成第一保護層330,第一保護層330曝露出接墊部322。
之後,在步驟440,以第一保護層330作為遮罩,形成複合導電線路層320的第二導電線路層326,第二導電線路層326僅形成在接墊部322。在步驟450,在接墊部322上設置光源340。可選擇性地進行步驟460。於步驟460,在第一保護層330和光源340上形成第二保護層350。
Please refer to FIG. 7, which is a flowchart of a method of manufacturing the light
以上已提供本發明之光源燈板及其製作方法的實施例。在本發明的又一方面,提供一種發光鍵盤,其應用上述光源燈板。此種發光鍵盤包括複數個鍵帽以及一光源燈板。光源燈板設置於該複數個鍵帽下方。光源燈板可為根據上述任一實施例之光源燈板。光源發出的光線可向上行進而抵達該複數個鍵帽。 The embodiments of the light source lamp board of the present invention and the manufacturing method thereof have been provided above. In still another aspect of the present invention, a light-emitting keyboard is provided, which uses the above-mentioned light source lamp board. The light-emitting keyboard includes a plurality of key caps and a light source lamp board. The light source lamp board is arranged under the plurality of key caps. The light source lamp board may be the light source lamp board according to any of the above embodiments. The light emitted by the light source can travel upward to reach the plurality of keycaps.
現在請參照第8A~8D圖、第9圖、及第10圖,以得到對於上述發光鍵盤的進一步理解。第8A~8D圖分別示出根據一些實施例之一發光鍵盤自上而下配置的各層。第9圖和第10圖分別為該發光鍵盤的其中一個鍵的俯視和側視示意圖。 Now please refer to Figures 8A~8D, Figure 9, and Figure 10 for a further understanding of the above illuminated keyboard. FIGS. 8A to 8D respectively show the layers arranged from top to bottom according to one of the embodiments. Fig. 9 and Fig. 10 are schematic diagrams of the top and side views of one key of the light-emitting keyboard, respectively.
請參照第8A圖,其為發光鍵盤的複數個鍵帽510的示意圖。可以理解的是,鍵帽510可以任何適用之方式排列,且/或可具有任何適用之字符組合,不受限於如圖所示者。發光鍵盤的鍵帽510的字符部分,例如第9圖中的「?」和「/」,可具有透光性。在一些實施例中,不同位置的字符可具有不同的顏色,例如是使用不同顏色的透明塗漆,藉此增加發光的多樣性和使用的便利性。
Please refer to FIG. 8A, which is a schematic diagram of a plurality of
請參照第8B圖,其為發光鍵盤選擇性的薄膜開關層520的示意圖。薄膜開關層520設置於鍵帽510下方。根據一些實施例,薄膜開關層520可包括如第10圖所示之一開關電極層521與複數組支撐結構522。開關電極層521包括複數個開關電極(未繪示,位於橡皮彈性體523下方),當複數個鍵帽510其中之一被按壓時,可觸發對應的開關電極導通。支撐結構522設置於開關電極層521上,分別偶接對應的鍵帽510和底板530,支撐結構522可支撐鍵帽510上下運動。當鍵帽510被外力按壓時,鍵帽510向下運動而抵接觸發開關電極;當外力消失,鍵帽510可在按壓結束後被恢復力源(例如橡皮彈性體(rubber dome)、極性互斥磁鐵對、金屬彈簧/彈片)向上推動而不再抵接觸發開關電極。舉例來說,如第10圖所示,每組支撐結構522可包括鍵盤常用的橡皮彈性體523、剪刀腳結構524、及連接結構525。在鍵帽510被按壓時,橡皮彈性體523被壓扁,使得橡皮彈性體523底面凸柱進而抵接觸發其下方的開關電極導通。剪刀腳結構524可協助支撐鍵帽510,進而使得反饋力道平均而改善手感。連接結構525用於將剪刀腳結構524偶接至下方的底板530。然而,亦可使用任何其他適用之結構,不須受限於此。薄膜開關層520可具有複數個開口526,每個鍵帽510至少對應到該複數個開口526其中之一。
Please refer to FIG. 8B, which is a schematic diagram of a selective
請參照第8C圖,其為發光鍵盤選擇性的底板530的示意圖。底板530設置於鍵帽510下方。底板530具有複數個開口531,每個鍵帽510至少對應到該複數個開口531其中之一。開口
531可至少部分地與開口526重疊,如此使光源燈板540發出光線能無阻礙地向上行進。如第10圖的實施例所示,開關電極層521可設置於底板530上,光源燈板540(示於第8D圖)可設置於底板530下,二者藉由底板530彼此分離。此外,連接結構525可為自底板530沖壓向上折起並與底板530一體成型的卡勾,如第10圖所示者。
Please refer to FIG. 8C, which is a schematic diagram of a
請參照第8D圖,其為發光鍵盤的光源燈板540的示意圖。光源燈板540可為根據上述任一實施例之光源燈板,例如光源燈板100或光源燈板300。開口531與開口526部分重疊,光源燈板540上的光源560係位於開口531與開口526重疊部分下方,使得光源發出的光線可無阻礙、低損耗地穿過開口531(與開口526)而向上行進而抵達鍵帽510。對應於每個鍵帽510下方可具有一或多個光源560。
Please refer to FIG. 8D, which is a schematic diagram of the light
光源燈板540的基板541具有一長邊側542、一第一短邊側543與一第二短邊側544。如第8D圖所示,光源燈板540可更具有一排線尾部545。排線尾部545係自長邊側542延伸而出。排線尾部545具有複數條延伸導線546與一預定彎折部547。基板541可由一可撓曲材質構成。於對應預定彎折部547處,基板541可接受一外力而撓曲。延伸導線546可視為複合導電線路層550在排線尾部545的延伸部分。然而,無論是使用上述之光源燈板100或光源燈板300作為光源燈板540,延伸導線546於預定彎折部547內僅由第一導電線路層所構成,材料本身可撓曲性較低的第二
導電線路層並未延伸於預定彎折部547內。藉此,可避免第二導電線路層在預定彎折部547內受到彎折而斷裂,導致延伸導線546的電流傳遞品質不穩定。
The
如第8D圖所示,複合導電線路層550可包括複數條高電位第一導線551、複數條高電位第二導線552、複數條低電位第一導線556及複數條低電位第二導線555。在此,高電位導線與低電位導線可理解為正負極線路。根據一些實施例,高電位第一導線551從排線尾部545延伸至第一短邊側543中間位置。高電位第二導線552從第一短邊側543中間位置以實質平行於長邊側542方式延伸至複數個接墊部557附近。低電位第二導線555從該複數個接墊部557附近以實質平行於長邊側542方式延伸至第二短邊側544中間位置。低電位第一導線556從第二短邊側544中間位置延伸至排線尾部545。在一些實施例中,如第8D圖所示,高電位第二導線552於鄰近第一短邊側543中間位置分別對應具有複數個S字形路徑552S,該複數個S字形路徑552S長度不同,藉以調整使通過複數條高電位第二導線552的電流值實質相等。在一些實施例中,低電位第二導線555也可具有類似的S字形路徑555S。根據一些實施例,如第8D圖所示,光源燈板540(之複合導電線路層550)可更具有複數條高電位第三導線553與複數條低電位第三導線554。請配合參照第9圖,每個接墊部557具有一正電極558與一負電極559。高電位第三導線553與低電位第三導線554實質上平行於第一短邊側543而延伸。高電位第三導線553分別電性偶接高
電位第二導線552其中之一與對應之接墊部557的正電極558,低電位第三導線554分別電性偶接該複數條低電位第二導線555其中之一與對應之接墊部557的負電極559。可以理解的是,複合導電線路層550的配置方式不須受限於此,只要是光源燈板540可容許的配置方式即可。舉例來說,在光源燈板540的空間能提供更大的布線彈性的情況下,第二高電位導線552與第二低電位導線555可不須以實質平行於長邊側542的方式延伸。
As shown in FIG. 8D, the composite
現在請參照第9圖,在一些實施例中,對應於每個鍵帽510下方具有至少兩個光源560。為了提供每個光源560電性偶接,對應於每個鍵帽510下方可具有高電位第三導線553其中至少兩條、低電位第三導線554其中至少兩條、與至少兩個接墊部557。如第9圖所示,至少兩個的接墊部557係分別位於鍵帽551中心線551M的相對兩側邊下方,讓位於支撐結構522相對兩側的鍵帽510底面均能接收到適當強度照明。當然,光源與對應的複合導電線路層550的配置不須受限於此。舉例來說,在一些實施例中,鍵帽510和支撐結構522的設計保持中心區域鏤空或透明可透光,此時,即使每個鍵帽510下方只設置一個光源560也足以均勻照亮整個鍵帽。至此已藉由第8A~8D圖至第10圖,對一種類型的發光鍵盤的結構配置有具體的理解。然而,也可採用其他類型的發光鍵盤。
Referring now to FIG. 9, in some embodiments, there are at least two
舉例來說,如第10圖所示,在上述的發光鍵盤中,由上至下依序是鍵帽510、薄膜開關層520的支撐結構522、薄膜
開關層520的開關電極層521、底板530、及光源燈板540,而支撐結構522的連接結構525為延伸自底板530向上折起並與底板530一體成型的卡勾。
For example, as shown in FIG. 10, in the above-mentioned light-emitting keyboard, from top to bottom are the
在根據另一些實施例之發光鍵盤中,如第11圖所示,由上至下可依序是鍵帽610、支撐結構622、光源燈板640、開關電極層621、及底板630,而支撐結構622的連接結構625亦為延伸自底板630並與底板630一體成型的卡勾。此種發光鍵盤與第10圖之發光鍵盤的差異在於光源燈板640的位置,光源燈板640是位於開關電極層621上方。
In a light-emitting keyboard according to other embodiments, as shown in FIG. 11, from top to bottom, the
在根據又一些實施例之發光鍵盤中,如第12圖所示,由上至下依序是鍵帽710、支撐結構722、開關電極層721、底板730、及光源燈板740,而支撐結構722的連接結構725為結合至底板730的連接塑膠構件。此種發光鍵盤與第10圖之發光鍵盤的差異在於連接結構的設計。
In the light-emitting keyboard according to still other embodiments, as shown in FIG. 12, from top to bottom are the
在根據再一些實施例之發光鍵盤中,如第13圖所示,由上至下依序是鍵帽810、支撐結構822、光源燈板840、開關電極層821、及底板830,而支撐結構822的連接結構825為結合至開關電極層821的連接塑膠構件。此種發光鍵盤與第12圖之發光鍵盤的差異在於光源燈板840的位置與連接結構825的配置,光源燈板840是位於開關電極層821上方,連接結構825結合至開關電極層821而非底板830。
In the light-emitting keyboard according to still other embodiments, as shown in FIG. 13, from top to bottom are the
在根據又另一些實施例之發光鍵盤中,如第14圖所示,由上至下依序是鍵帽910、支撐結構922、開關電極層921、光源燈板940、及底板930,而支撐結構922的連接結構925為結合至開關電極層921的連接塑膠構件。此種發光鍵盤和第13圖之發光鍵盤的差異在於光源燈板940的位置,光源燈板940是位於開關電極層921與底板930之間。
In the light-emitting keyboard according to still other embodiments, as shown in FIG. 14, the
無論是哪種類型,在根據實施例的發光鍵盤中,每個鍵帽下方皆設置有光源,因此可確保發光均勻度。此外,由於是使用光源燈板來發光,相較於使用具有導光板之背光模組的發光鍵盤,可進一步地減少鍵盤厚度並降低耗電量。 Regardless of the type, in the light-emitting keyboard according to the embodiment, a light source is provided under each keycap, so uniformity of light emission can be ensured. In addition, since the light source is used to emit light, compared with the light-emitting keyboard with a backlight module having a light guide plate, the thickness of the keyboard can be further reduced and the power consumption can be reduced.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be deemed as defined by the scope of the attached patent application.
100‧‧‧光源燈板 100‧‧‧Light source lamp board
110‧‧‧基板 110‧‧‧ substrate
120‧‧‧複合導電線路層 120‧‧‧composite conductive circuit layer
121‧‧‧導線部 121‧‧‧Wire Department
122‧‧‧接墊部 122‧‧‧Pad part
125‧‧‧第一導電線路層 125‧‧‧ First conductive circuit layer
126‧‧‧第二導電線路層 126‧‧‧Second conductive circuit layer
130‧‧‧第一保護層 130‧‧‧The first protective layer
140‧‧‧光源 140‧‧‧Light source
150‧‧‧第二保護層 150‧‧‧Second protective layer
Claims (22)
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TWI777816B (en) * | 2021-10-15 | 2022-09-11 | 達方電子股份有限公司 | Lighting keyswitch with wild-angle illumination function |
US11977250B2 (en) | 2022-03-31 | 2024-05-07 | Darfon Electronics Corp. | Lighting keyboard, backlight module and lighting substrate |
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