TWI669211B - 片材、金屬網格、及其等之製造方法 - Google Patents
片材、金屬網格、及其等之製造方法 Download PDFInfo
- Publication number
- TWI669211B TWI669211B TW107126214A TW107126214A TWI669211B TW I669211 B TWI669211 B TW I669211B TW 107126214 A TW107126214 A TW 107126214A TW 107126214 A TW107126214 A TW 107126214A TW I669211 B TWI669211 B TW I669211B
- Authority
- TW
- Taiwan
- Prior art keywords
- electroless plating
- plating film
- resin layer
- main surface
- exposed
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 67
- 239000002184 metal Substances 0.000 title claims description 67
- 238000000034 method Methods 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000000463 material Substances 0.000 title description 5
- 238000007772 electroless plating Methods 0.000 claims abstract description 231
- 229920005989 resin Polymers 0.000 claims abstract description 117
- 239000011347 resin Substances 0.000 claims abstract description 117
- 239000002245 particle Substances 0.000 claims abstract description 70
- 229920000128 polypyrrole Polymers 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000011230 binding agent Substances 0.000 claims abstract description 25
- 239000003054 catalyst Substances 0.000 claims description 25
- 238000007747 plating Methods 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 83
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 25
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 229910052763 palladium Inorganic materials 0.000 description 11
- 229920002799 BoPET Polymers 0.000 description 9
- 229910001453 nickel ion Inorganic materials 0.000 description 9
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 8
- -1 poly(N-vinylcarbazole) Polymers 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 238000007654 immersion Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 229910002855 Sn-Pd Inorganic materials 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920002098 polyfluorene Polymers 0.000 description 2
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 101100493706 Caenorhabditis elegans bath-38 gene Proteins 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002816 nickel compounds Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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Abstract
本發明之片材1具備：樹脂層4，其包含黏合劑2及聚吡咯粒子3；無電解鍍膜7，其設置於樹脂層4之一個主面4a側，並具有第1無電解鍍膜5及第2無電解鍍膜6；以及透明基材8，其設置於樹脂層4之另一個主面4b側。聚吡咯粒子3之至少一部分具有自樹脂層4之一個主面4a露出之露出面3a，露出面3a分散於樹脂層4之一個主面4a上。第1無電解鍍膜5以包圍聚吡咯粒子3之各者之露出面3a之方式設置於樹脂層4之一個主面4a上。第2無電解鍍膜6以覆蓋第1無電解鍍膜5之方式設置，第2無電解鍍膜6之一個主面6a具備對應於第1無電解鍍膜5之凹部6r。
Description
本發明係關於一種片材、金屬網格(metal mesh)及其等之製造方法。
近年來，作為被用於觸控面板等電子零件之電極用構件，嘗試了將銅與銀等金屬之微細配線圖案化為網格狀之金屬網格之開發。
金屬網格與先前之使用如ITO(氧化銦錫)那樣之透明導電膜之情形相較，於能夠實現低成本化以及低電阻化方面表現優異，但係於將金屬網格作為觸控面板等之電極用構件來使用之情形時，與ITO相較有時不可視性會成為問題。
作為不可視性被提高之金屬網格，眾所周知有由銅層與黑化金屬層構成之金屬網格。例如，作為黑化金屬層，於專利文獻1以及2中公開有使用腐蝕速度較銅慢之金屬氧化物等之金屬網格或使用了鋅層之金屬網格等。
又，於專利文獻3中記載有一種附有膜之玻璃板，其中，多層膜進行積層而成之積層膜被形成於玻璃板上，並且積層膜具備被形成於玻璃板上之至少包含貴金屬之無機物膜、與被形成於該無機物膜上之電鍍金屬膜，根據同一文獻，積層膜於自玻璃板側觀察之情形時為黑色。 [先前技術文獻] [專利文獻]
專利文獻1：日本特開2014-150118號公報 專利文獻2：日本特開2015-229260號公報 專利文獻3：日本特開2016-74582號公報
[發明所欲解決之問題]
專利文獻1以及2所記載之金屬網格因能夠藉由設置黑化金屬層形成黑色面故而能夠於某種程度上使不可視性提高，但根據本發明者之研究探討，可判明即使為此種金屬網格，自所謂反射率高之觀點出發仍有改善之餘地。
又，專利文獻3所記載之附有膜之玻璃板難以提高玻璃板與積層膜之密接性。
本發明係鑒於上述狀況研究而成者，其目的在於關於由設置於基材上之鍍膜而形成之金屬網格、以及用於製造該金屬網格之片材，抑制反射率並改善基材與鍍膜之密接性。 [解決問題之技術手段]
本發明所提供之片材具備：樹脂層，其包含黏合劑及複數個聚吡咯粒子；無電解鍍膜，其設置於樹脂層之一個主面側並具有第1無電解鍍膜及第2無電解鍍膜；以及透明基材，其設置於樹脂層之另一個主面側。複數個聚吡咯粒子中之至少一部分具有自樹脂層之一個主面露出之露出面，複數個露出面分散於樹脂層之一個主面上。第1無電解鍍膜係以分別包圍聚吡咯粒子之複數個露出面之方式設置於樹脂層之一個主面上。第2無電解鍍膜以覆蓋第1無電解鍍膜之方式設置，且第2無電解鍍膜之第1無電解鍍膜側之主面形成沿著第1無電解鍍膜表面之凹部。
本發明之片材能夠抑制反射率並且能夠提高透明基材與鍍膜之密接性。
於自無電解鍍膜側俯視樹脂層之一個主面之時，第1無電解鍍膜之最長直徑之平均值可為18～90 nm，於該主面所佔之第1無電解鍍膜之面積比率可為80～99%。
第2無電解鍍膜之與第1無電解鍍膜相反側之主面可為粗糙面。
本發明進而提供上述本發明之片材之製造方法。本發明之片材之製造方法具備：將包含黏合劑及複數個聚吡咯粒子之樹脂層形成於透明基材上之步驟，即複數個聚吡咯粒子中之至少一部分具有自樹脂層之一個主面露出之露出面且複數個露出面分散於樹脂層之一個主面上，並且透明基材設置於樹脂層之另一個主面側之步驟；使包含觸媒之溶液接觸於聚吡咯粒子之露出面而形成分別附著於複數個露出面之觸媒核之步驟；以包圍複數個露出面之各者及觸媒核之方式將第1無電解鍍膜形成於樹脂層之一個主面上之步驟；以及以覆蓋第1無電解鍍膜之方式形成第2無電解鍍膜之步驟，即第2無電解鍍膜之第1無電解鍍膜側之主面形成沿著第1無電解鍍膜表面之凹部之步驟。
本發明進而提供具備藉由對上述之本發明之片材上之無電解鍍膜進行蝕刻而形成具有網格狀圖案之無電解鍍膜之步驟之金屬網格製造方法。
作為金屬網格之一個形態，本發明提供一種金屬網格(以下為了方便起見有時亦稱為「第1金屬網格」)，其具備：樹脂層，其包含黏合劑及複數個聚吡咯粒子；無電解鍍膜，其以於樹脂層之一個主面側形成網格狀圖案之方式設置並具有第1無電解鍍膜及第2無電解鍍膜；以及透明基材，其設置於樹脂層之另一個主面側。於第1金屬網格上，複數個聚吡咯粒子中之至少一部分具有自樹脂層之一個主面露出之露出面，複數個露出面分散於樹脂層之一個主面上。第1無電解鍍膜以分別包圍聚吡咯粒子之複數個露出面之各者之方式設置於樹脂層之一個主面上。第2無電解鍍膜以覆蓋第1無電解鍍膜之方式設置，且第2無電解鍍膜之第1無電解鍍膜側之主面形成沿著第1無電解鍍膜表面之凹部。
作為金屬網格之另一個形態，本發明提供一種金屬網格(以下為了方便起見有時稱為「第2金屬網格」)，其具備：透明基材；樹脂層，其以於透明基材上形成網格狀圖案之方式設置且包含黏合劑及複數個聚吡咯粒子；以及無電解鍍膜，其一面覆蓋樹脂層一面沿著樹脂層之網格狀圖案設置於透明基材上，並且具有第1無電解鍍膜及第2無電解鍍膜。於第2金屬網格上，複數個聚吡咯粒子中之至少一部分具有自樹脂層表面露出之露出面，複數個露出面分散於樹脂層之表面上。第1無電解鍍膜以分別包圍聚吡咯粒子之複數個露出面之各者之方式設置於樹脂層之表面上。第2無電解鍍膜以覆蓋第1無電解鍍膜之方式設置，第2無電解鍍膜之第1無電解鍍膜側之表面形成沿著第1無電解鍍膜表面之凹部。
本發明之上述之金屬網格能夠抑制反射率並且能夠提高透明基材與鍍膜之密接性。
上述之金屬網格之第2無電解鍍膜之與第1無電解鍍膜相反側之表面可為粗糙面。 [發明效果]
根據本發明，可提供一種能夠抑制反射率並且基材與鍍膜之密接性高之片材及其製造方法。又，根據本發明，可提供一種具有與上述片材相同之效果之金屬網格及其製造方法。
以下，一面適當地參照圖式一面對本發明之較佳實施形態詳細地進行說明。
[片材] 圖1係表示片材之一個實施形態之模式剖視圖。如圖1所示，本實施形態之片材1具備：包含黏合劑2及複數個聚吡咯粒子3之樹脂層4、設置於樹脂層4之一個主面4a側並具有第1無電解鍍膜5及第2無電解鍍膜6之無電解鍍膜7、以及設置於樹脂層4之另一個主面4b側之透明基材8。複數個聚吡咯粒子3之至少一部分具有自樹脂層4之一個主面4a露出之露出面3a，複數個露出面3a分散於樹脂層4之一個主面4a上。第1無電解鍍膜5係以分別包圍複數個聚吡咯粒子3之複數個露出面3a之方式設置於樹脂層4之一個主面4a上，第2無電解鍍膜6以覆蓋第1無電解鍍膜5之方式設置，第2無電解鍍膜6之第1無電解鍍膜5側之主面6a形成沿著第1無電解鍍膜5表面之凹部6r。
根據上述之片材1，能夠抑制作為金屬網格時之反射率並且能夠提高基材與鍍膜之密接性。本發明者等人如以下般推測能夠獲得此種之效果之理由。
首先，於設置有黑化金屬層之先前金屬網格中，無法將反射率抑制得較低之理由認為係起因於黑化金屬層均勻存在，即黑化金屬層之大部分具有平滑面。相對於此，於本發明之片材1中，因第1無電解鍍膜5以包圍複數個聚吡咯粒子3之各者之露出面3a之方式設置於樹脂層4之一個主面4a上，故而推測具有平滑面之區域少，且藉此便可將反射率抑制得較低。又，認為藉由將無電解鍍膜7及透明基材8夾著樹脂層4積層，能夠提高無電解鍍膜7與透明基材8之密接性。
作為黏合劑2並無特別之限定，例如可列舉聚氯乙烯系樹脂、聚碳酸酯系樹脂、聚苯乙烯系樹脂、聚甲基丙烯酸甲酯系樹脂、聚酯系樹脂、聚碸系樹脂、聚苯醚系樹脂、聚丁二烯系樹脂、聚(N-乙烯基咔唑)[poly (N-vinyl carbazole)]系樹脂、烴系樹脂、酮系樹脂、苯氧基系樹脂、聚醯胺系樹脂、乙基纖維素系樹脂、醋酸乙烯酯系樹脂、ABS系樹脂、聚胺酯系樹脂、三聚氰胺樹脂、丙烯酸樹脂、不飽和聚酯系樹脂、醇酸系樹脂、環氧系樹脂、矽系樹脂等。自既確保樹脂層4之透明性又進而使鍍膜析出性以及密接性提高之觀點出發，較佳為黏合劑2包含三聚氰胺樹脂。
聚吡咯粒子3較佳具有10～100 nm之平均粒徑，進而較佳具有20～50 nm之平均粒徑。若聚吡咯粒子3之平均粒徑於上述數值範圍內，則能夠於製作片材以及金屬網格時進而有效地抑制反射率。於此，平均粒徑可藉由雷射繞射散射法進行測定，於自小粒徑側描繪體積累積粒度分佈曲線之情形時，能夠作為對應於體積累積成為50%之粒徑之值算出。
樹脂層4中之黏合劑2以及聚吡咯粒子3之質量比並無特別限制，自有效地形成無電解鍍膜之觀點以及更有效地抑制反射率之觀點出發，較佳為例如黏合劑：聚吡咯粒子=2：1～15：1。樹脂層4之厚度亦無特別限制，但自既更有效地抑制反射率又確保樹脂層之透明性之觀點出發，較佳為例如10～100 nm，進而較佳為50～80 nm。
自有效地抑制反射率並進而發揮不可視性之觀點以及確保於藉由蝕刻將無電解鍍膜7圖案化之情形時之良好之蝕刻性(防止因過度之蝕刻而引起之斷線)之觀點出發，第1無電解鍍膜5較佳包含選自由鎳、鈀、金、銀以及該等金屬之化合物所成之群組中之至少1種。又，自更有效地確保上述蝕刻性之觀點出發，更佳為第1無電解鍍膜5進而包含磷，於此情形時之磷之含量相對於第1無電解鍍膜5之總質量可為8質量%以下。
第1無電解鍍膜5於自無電解鍍膜7側俯視樹脂層4之一個主面4a之時，較佳為第1無電解鍍膜5之最長直徑之平均值為18～90 nm。若第1無電解鍍膜5之最長直徑之平均值為18 nm以上，則能夠藉由第1無電解鍍膜5更有效地抑制反射率，若上述平均值為90 nm以下，則能夠減少第1無電解鍍膜5中之具有平滑面之區域，結果能夠更有效地抑制反射率。
於自無電解鍍膜7側俯視樹脂層4之一個主面4a之時，第1無電解鍍膜5中於樹脂層4之一個主面4a所佔之第1無電解鍍膜5之面積比率較佳為80～99%。若該面積比率為80%以上，則能夠由第1無電解鍍膜5進而有效地抑制反射率，若面積比率為99%以下，則能夠減少第1無電解鍍膜5中之具有平滑面之區域，結果能夠更有效地抑制反射率。
於此，第1無電解鍍膜5之最長直徑之平均值以及於樹脂層4之一個主面4a所佔之第1無電解鍍膜5之面積比率能夠由SEM照片之圖像分析進行測定。具體而言藉由以20萬倍之倍率自無電解鍍膜7側觀察片材1，以縱500 μm、橫600 μm之視野獲取SEM照片之圖像，實測視野內之各第1無電解鍍膜5之最長直徑，藉由對各實測值進行平均化能夠算出最長直徑之平均值。又，面積比率可藉由自視野內之各個第1無電解鍍膜5之最長直徑以及最短直徑測定第1無電解鍍膜5之各者之面積，並算出其合計值與視野內之面積之比率而求得。
自降低電阻之觀點出發，第2無電解鍍膜6較佳包含選自銅、鎳、銀以及該等金屬之化合物中之至少1種，進而較佳含有銅。又，上述之第1無電解鍍膜5以及第2無電解鍍膜6可以包含互相相同或者不同種類之金屬或者金屬化合物，但較佳為包含互相不同種類之金屬或者金屬化合物，進而較佳為第1無電解鍍膜5包含鎳或者鎳化合物並且第2無電解鍍膜6包含銅。
第2無電解鍍膜6之厚度並無特別之限制，自更有效地抑制反射率之觀點出發，較佳為例如0.3～10 μm，進而較佳為0.5～10 μm。尤其是若第2無電解鍍膜6之厚度為0.3 μm以上，則能夠更有效地保持第2無電解鍍膜6之連續性。
透明基材8無特別之限制，但自容易獲得透過率高而且反射率低之片材之觀點出發，較佳包含選自聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯以及聚醯亞胺中之至少1種。透明基材8之厚度亦無特別限制，但自更有效地抑制反射率之觀點出發較佳為例如3～50 μm。
又，本實施形態之片材例如可於複數個聚吡咯粒子3之各個露出面3a與第1無電解鍍膜5之間具備觸媒核(未圖示)。藉由具備觸媒核而能夠進而提高聚吡咯粒子與第1無電解鍍膜之密接性，並且能夠有效地將上述之第1無電解鍍膜5之最長直徑以及於樹脂層4之一個主面4a所佔之第1無電解鍍膜5之面積比率調整為所希望之值。作為觸媒核例如可以使用選自鈀、銀、鉑、金、鎳、銅以及該等金屬之化合物中之至少1種。觸媒核之量以及大小並無特別之限制，例如可將觸媒核之量設定為0.1～1.8 μg/cm2
，並且可將觸媒核之大小設定為3～120 nm。
圖2係表示片材之另一個實施形態之模式剖視圖。如圖2所示，本實施形態之片材1中，第2無電解鍍膜6之與第1無電解鍍膜5相反側之主面6b亦可為粗糙面6s。藉此，能夠進而提高片材1之不可視性。
本實施形態之片材1能夠由例如以下上述之方法進行製造。即，本實施形態之片材1之製造方法具備：第一步驟，該步驟係於透明基材8上形成包含黏合劑2及複數個聚吡咯粒子3之樹脂層4，且複數個聚吡咯粒子3之至少一部分具有自樹脂層4之一個主面4a露出之露出面3a且複數個露出面3a分散於樹脂層4之一個主面4a上並且透明基材8設置於樹脂層之另一個主面4b側；第二步驟，該步驟係使含有觸媒之溶液接觸於聚吡咯粒子3之露出面3a而形成分別附著於複數個露出面3a之觸媒核；第三步驟，該步驟係以包圍複數個露出面3a之各者與觸媒核之方式於樹脂層4之一個主面4a上形成第1無電解鍍膜5；以及第四步驟，該步驟係以覆蓋第1無電解鍍膜5之方式形成第2無電解鍍膜6，且第2無電解鍍膜6之第1無電解鍍膜5側之主面6a形成沿著第1無電解鍍膜5表面之凹部6r。
於第一步驟中，作為於透明基材上形成樹脂層之方法，例如可列舉調製包含黏合劑及聚吡咯粒子之樹脂組合物，並將所獲得之樹脂組合物塗佈於透明基材上並進行乾燥之方法。藉由經歷第一步驟能夠獲得下述之第1積層體，該第1積層體具備：透明基材、以及於透明基材上包含黏合劑以及複數個聚吡咯粒子之樹脂層，複數個聚吡咯粒子中之至少一部分具有自樹脂層之一個主面露出之露出面，複數個露出面分散於樹脂層之一個主面上。樹脂組合物中之黏合劑以及聚吡咯粒子之質量比並無特別之限制，但自更有效地抑制反射率之觀點出發，較佳為例如黏合劑：聚吡咯粒子=2：1～15：1。
於第二步驟中，作為形成觸媒核之方法，例如可列舉於將由第一步驟獲得之第1積層體浸漬於含有觸媒之溶液中之後，執行水洗等之方法等。藉此，就能夠特別地使觸媒核吸附於聚吡咯粒子之露出面。藉由經歷第二步驟，能夠獲得第2積層體，即，形成有分別附著於第1積層體上之複數個露出面之觸媒核之積層體。
於第三步驟中，作為形成第1無電解鍍膜之方法，例如可列舉於將於第二步驟中獲得之第2積層體浸漬於包含特定之金屬之第1無電解鍍液槽內之後進行水洗等之方法等。第1無電解鍍液槽之處理條件並無特別之限制，例如於使用包含0.1～2.0 g/L之特定金屬之第1無電解鍍液槽之情形時，處理溫度為70～90℃，且處理時間為10～120秒。藉由經歷第三步驟，能夠獲得第3積層體，該積層體以包圍第2積層體上之複數個露出面之各者與觸媒核之方式於樹脂層之一個主面上形成有第1無電解鍍膜。
於第四步驟中，作為形成第2無電解鍍膜之方法，例如可列舉於將於第三步驟中獲得之第3積層體浸漬於包含特定金屬之第2無電解鍍液槽內之後進行水洗等之方法等。第2無電解鍍液槽之處理條件並無特別之限制，例如於使用包含1～5 g/L之特定金屬之第2無電解鍍液槽之情形時，處理溫度為25～50℃且處理時間為5～60分鐘。藉由經歷第四步驟能夠形成形成有第2無電解鍍膜之片材，該第2無電解鍍膜以覆蓋第3積層體上之第1無電解鍍膜並且第1無電解鍍膜側之主面形成沿著第1無電解鍍膜表面之凹部之方式形成。
於本實施形態之片材之製造方法中，於上述第四步驟之後亦可進而具備對上述第2無電解鍍膜之與第1無電解鍍膜相反側之主面進行粗糙面化之步驟。粗糙面化例如既可由粗化處理形成粗糙面亦可由電鍍處理形成粗糙面。
[第1金屬網格] 本實施形態之第1金屬網格具備：包含黏合劑及複數個聚吡咯粒子之樹脂層、以於樹脂層之一個主面側形成網格狀黏合劑之方式設置並具有第1無電解鍍膜以及第2無電解鍍膜之無電解鍍膜、以及設置於樹脂層之另一個主面側之透明基材，複數個聚吡咯粒子中之至少一部分具有自樹脂層之一個主面露出之露出面，複數個露出面分散於樹脂層之一個主面上，第1無電解鍍膜以分別包圍複數個聚吡咯粒子之露出面之方式設置於樹脂層之一個主面上，第2無電解鍍膜以覆蓋第1無電解鍍膜之方式設置，第2無電解鍍膜之第1無電解鍍膜側之主面形成沿著第1無電解鍍膜表面之凹部。
此種第1金屬網格例如能夠藉由由對上述之本實施形態之片材中之無電解鍍膜進行蝕刻形成具有網格狀圖案之無電解鍍膜而製造。
圖3係表示製造第1金屬網格10之步驟之一個實施形態之概略圖。如圖3所示，首先準備本實施形態之片材1(圖3A)，於該片材1之無電解鍍膜7上之與樹脂層4相反側之主面上形成網格狀之抗蝕圖案9(圖3B)。作為形成網格狀之抗蝕圖案9之方法並無特別之限制，能夠適當採用公知之方法，例如可列舉藉由印刷法與噴墨法以及光微影法等形成網格狀之抗蝕圖案之方法、於形成抗蝕膜之後對該抗蝕膜進行圖案曝光以及顯影而圖案化為網格狀之方法等。之後，將抗蝕圖案9作為遮罩，藉由蝕刻無電解鍍膜7形成具有網格狀圖案之無電解鍍膜7'，最後除去抗蝕圖案9(圖3C)。藉此，能夠形成具有網格狀圖案之第1無電解鍍膜5'以及具有第2無電解鍍膜6'之無電解鍍膜7'。
[第2金屬網格] 本實施形態之第2金屬網格具備透明基材、以於透明基材上形成網格狀圖案之方式設置並且包含黏合劑及複數個聚吡咯粒子之樹脂層、以及一面覆蓋樹脂層一面沿著樹脂層之網格狀圖案設置於透明基材上並且具有第1無電解鍍膜及第2無電解鍍膜之無電解鍍膜，複數個聚吡咯粒子中之至少一部分具有自樹脂層表面露出之露出面，複數個露出面分散於樹脂層之表面上，第1無電解鍍膜以分別包圍聚吡咯粒子之複數個露出面之方式設置於樹脂層之表面上，第2無電解鍍膜以覆蓋第1無電解鍍膜之方式設置，且第2無電解鍍膜之第1無電解鍍膜側之主面形成沿著第1無電解鍍膜表面之凹部。
此種第2金屬網格例如能夠藉由以下之方法製造。
圖4係表示製造第2金屬網格20之步驟之一個實施形態之概略圖。如圖4所示，首先將具有網格狀圖案之樹脂層4'形成於基材8上(圖4A)。作為形成具有網格狀圖案之樹脂層4'之方法並無特別限制，能夠適當採用公知之方法，例如可列舉由印刷法與噴墨法以及光微影法等形成具有網格狀圖案之樹脂層4'之方法等。
之後，使包含觸媒之溶液接觸於分散於樹脂層4'表面上之複數個聚吡咯粒子之露出面，形成附著於複數個露出面之各者之觸媒核。之後，以包圍複數個露出面之各者與觸媒核之方式將第1無電解鍍膜5'形成於樹脂層4'之表面上。觸媒核以及第1無電解鍍膜5'之形成方法可採用與於上述片材之製造方法中所述之方法相同之方法。
之後，藉由以覆蓋樹脂層4'以及第1無電解鍍膜5'之方式將第2無電解鍍膜6'形成於透明基材8上，能夠形成第2金屬網格(圖4B)。此時，第2無電解鍍膜6'之第1無電解鍍膜5'側之主面形成沿著第1無電解鍍膜5'表面之凹部。形成第2無電解鍍膜6'之方法可採用與於上述片材之製造方法中所述之方法相同之方法。
上述之本實施形態之片材及金屬網格能夠抑制反射率並且基材與鍍膜之密接性高，因此能夠適宜使用於智慧型手機、平板終端、PC等之觸控面板感測器等。能夠適宜使用於觸控面板感測器之片材以及金屬網格之反射率例如為20%以下，較佳為15%以下，進而較佳為10%以下。
關於本實施形態之片材，藉由經過以視需要對無電解鍍膜進行之蝕刻形成具有配線圖案之無電解鍍膜之步驟，能夠製造配線基板。配線基板藉由進而視需要安裝發光元件以及被動零件等電子零件亦能獲得顯示裝置。 [實施例]
以下示出實施例以及比較例來具體說明本發明，但本發明並不限制於下述之實施例。
[片材之製作] (實施例1) 加入1.5 mmol陰離子界面活性劑PELEX OT-P(花王株式會社製，商品名)、50 ml甲苯以及100 ml離子交換水，保持於20℃並進行攪拌而獲得乳化液。將21.2 mmol吡咯單體添加到所獲得之乳化液中，並進行1小時攪拌之後，添加6 mmol過硫酸銨並進行2小時之聚合反應。於反應結束後回收有機層並用離子交換水清洗數次，獲得分散於甲苯之平均粒徑為40 nm之聚吡咯粒子。 相對於所獲得之聚吡咯粒子1質量份添加5質量份之黏合劑SUPER BECKAMINE J-820(DIC株式會社製，商品名)而製作樹脂組合物(黏合劑與聚吡咯粒子之質量比=5：1)。將獲得之樹脂組合物塗佈於PET薄膜(東洋紡織株式會社製，商品名：COSMOSHINE A4100)並進行乾燥，獲得於PET薄膜上具備厚度為60 μm之聚吡咯粒子露出於表面之樹脂層之第1積層體。 接著，將第1積層體浸漬於包含1 g/L鈀離子之水溶液中，經水洗之後進而將第1積層體浸漬於含有10 g/L次磷酸之水溶液中，藉由水洗而獲得觸媒核已被吸附於聚吡咯粒子之露出面之第2積層體。將第2積層體浸漬於含有0.5 g/L之鎳離子之無電解鍍液槽，於該鍍液槽之溫度為82℃之條件下執行20秒無電解電鍍處理，獲得形成有具有凹凸表面之第1無電解鍍膜之第3積層體。繼而，將第3積層體浸漬於含有3 g/L銅離子之無電解鍍液槽中，於鍍液槽之溫度為38℃之條件下執行45分鐘之無電解電鍍處理，製作於第1無電解鍍膜之凹凸表面上形成有第2無電解鍍膜之片材。第2無電解鍍膜之厚度為1 μm，並形成沿著第1無電解鍍膜表面之凹部。
(實施例2) 除了將浸漬於含有鎳離子之無電解鍍液槽之時間設為30秒鐘之外，進行與實施例1相同之操作，獲得片材。
(實施例3) 除了將浸漬於含有鎳離子之無電解鍍液槽之時間設定為40秒鐘之外，進行與實施例1相同之操作，獲得片材。
(實施例4) 除了將浸漬於含有鎳離子之無電解鍍液槽之時間設定為50秒鐘之外，進行與實施例1相同之操作，獲得片材。
(實施例5) 除了將浸漬於含有鎳離子之無電解鍍液槽之時間設定為60秒鐘之外，進行與實施例1相同之操作，獲得片材。
(實施例6) 除了將浸漬於含有鎳離子之無電解鍍液槽之時間設定為90秒鐘之外，進行與實施例1相同之操作，獲得片材。
(實施例7) 除了將浸漬於含有鎳離子之無電解鍍液槽之時間設定為120秒鐘之外，進行與實施例1相同之操作，獲得片材。
(比較例1) 以厚度成為20 nm之方式用濺射法將鈀製膜於PET薄膜(東洋紡織株式會社製，商品名：COSMOSHINE A4100)上，獲得積層體。繼而，將所獲得之積層體浸漬於含有0.5 g/L之鎳離子之無電解鍍液槽中，於該鍍液槽之溫度82℃下，進行20秒鐘之無電解電鍍處理，得到形成有具有平滑表面之第1無電解鍍膜之第3積層體。接著，將第3積層體浸漬於含有0.1 g/L鈀離子之水溶液中，於水洗後將其浸漬於含有3 g/L銅離子之無電解鍍液槽中，於鍍液槽之溫度38℃下執行45分鐘之無電解電鍍處理，製得於含有鎳之第1無電解鍍膜表面上形成有含有銅之第2無電解鍍膜之片材。含有銅之第2無電解鍍膜之厚度為1 μm。
(比較例2) 以厚度成為20 nm之方式用濺射法將鎳製膜於PET薄膜(東洋紡織株式會社製，商品名：COSMOSHINE A4100)上，並獲得形成有具有平滑表面之膜之第3積層體。接著，將第3積層體浸漬於含有0.1 g/L鈀離子之水溶液中，於水洗後將其浸漬於含有10 g/L之次磷酸之水溶液中，然後進行水洗。之後，浸漬於含有3 g/L銅離子之無電解鍍液槽中，於鍍液槽之溫度為38℃之條件下執行45分鐘之無電解電鍍處理，並製得於含有鎳之膜之表面上形成有含有銅之第2無電解鍍膜之片材。無電解鍍膜之厚度為1 μm。
(比較例3) 於25℃下將PET薄膜(東洋紡織株式會社製，商品名：COSMOSHINE A4100)浸漬於Sn-Pd膠體溶液中5分鐘，於水洗後將其浸漬於含有0.5 g/L鎳離子之無電解鍍液槽中，於該鍍液槽之溫度為82℃下執行20秒鐘之無電解電鍍處理，製得形成有具有凹凸表面之第1無電解鍍膜之第3積層體。繼而，將第3積層體浸漬於含有0.1 g/L之鈀離子之水溶液中，於水洗之後將其浸漬於含有3 g/L銅離子之無電解鍍液槽中，於鍍液槽之溫度38℃下進行45分鐘之無電解電鍍處理，並製得於含有鎳之膜之凹凸表面上形成有含有銅之第2無電解鍍膜之片材。
[片材之評價] (第1無電解鍍膜之最長直徑以及面積比率之測定) 由SEM照片之圖像分析來測定於上述各個實施例以及比較例中獲得之第3積層體中之第1無電解鍍膜之最長直徑以及面積比率。測定係藉由於縱500 μm與橫600 μm之視野中以20萬倍之倍率觀察各個第3積層體而進行，算出各個第1無電解鍍膜之最長直徑之平均值以及於視野所佔之第1無電解鍍膜之面積比率。又，於比較例1以及比較例2中製作之第3積層體因膜之表面為平滑，故而無法測定最長直徑。將測定結果示於表1中。
(反射率之測定) 使用分光光度計Spectrophotometer CM-5(日本KONICA MINOLTA, INC.製，產品名)並按照JIS K 8729之方法測定於上述各個實施例及比較例中獲得之片材上之來自PET薄膜側之光之反射率。將測定結果示於表1中。若反射率為20%以下，可謂係反射率被抑制得較低之良好之片材。
[金屬網格之製作] 藉由光微影法將L/S=5/10 μm之網格狀抗蝕圖案形成於上述各個實施例以及比較例中獲得之片材之無電解鍍膜上。之後，將其浸漬於5%過硫酸鈉水溶液中，於25℃下執行5分鐘蝕刻，藉由除去抗蝕劑而製作金屬網格。
[金屬網格之評價] (密接性之評價) 將所獲得之金屬網格捲繞於直徑1 mm之不鏽鋼棒上，按照以下之評價基準評價無電解鍍膜之密接性。將結果示於表1中。 A：即使於被捲繞500次後亦未看到鍍膜之剝離。 B：捲繞未達500次已看到鍍膜之剝離。
(蝕刻性之評價) 目視觀察有無由蝕刻引起之線路斷線，按照以下上述評價基準來評價蝕刻性。將評價結果示於表1中。 A：於進行蝕刻時未看到線路之斷線。 B：於進行蝕刻時看到了線路之斷線。
[表1]
如由實施例1～7之結果所示可知，本發明之片材能夠將反射率抑制得較低並且能夠提高基材與鍍膜之密接性。進而，顯示了於進行蝕刻之時未看到線路斷線並具備優異之蝕刻性。
相對於此，於用濺射法將鈀膜設置於PET薄膜上之後形成鎳鍍膜之比較例1、以及用濺射法直接將鎳膜形成於PET薄膜上之比較例2中，形成含有鎳之膜之大部分具有平滑面之連續膜，且無法將反射率抑制得較低。進而，若如比較例1般設置膜，則因銅鍍膜優先被蝕刻，故而顯示出容易發生斷線。又，於藉由浸漬於Sn-Pd膠體溶液而使鈀粒子附著於PET薄膜上之後形成鎳鍍膜之比較例3中，因未使用樹脂層而形成鍍膜，故而鈀粒子未充分附著而無法確保密接性。又，因於未附著鈀粒子之部分上形成之鍍膜形成有具有平滑面之連續膜，故而亦無法將反射率抑制得較低。
1‧‧‧片材
2‧‧‧黏合劑
3‧‧‧聚吡咯粒子
3a‧‧‧露出面
4、4'‧‧‧樹脂層
4a‧‧‧一個主面
4b‧‧‧另一個主面
5、5'‧‧‧第1無電解鍍膜
6、6'‧‧‧第2無電解鍍膜
6a‧‧‧一個主面
6b‧‧‧另一個主面
6r‧‧‧凹部
6s‧‧‧粗糙面
7、7'‧‧‧無電解鍍膜
8‧‧‧透明基材
9‧‧‧抗蝕圖案
10‧‧‧第1金屬網格
20‧‧‧第2金屬網格
圖1係表示片材之一實施形態之模式剖視圖。 圖2係表示片材之另一實施形態之模式剖視圖。 圖3A～圖3C係表示製造金屬網格之步驟之一實施形態之概略圖。 圖4A、圖4B係表示製造金屬網格之步驟之另一實施形態之概略圖。
Claims (9)
- 一種片材，其具備：樹脂層，其包含黏合劑及複數個聚吡咯粒子；無電解鍍膜，其設置於上述樹脂層之一個主面側，並具有第1無電解鍍膜及第2無電解鍍膜；以及透明基材，其設置於上述樹脂層之另一個主面側；且複數個上述聚吡咯粒子中之至少一部分具有自上述樹脂層之上述一個主面露出之露出面，複數個上述露出面分散於上述樹脂層之上述一個主面上，上述第1無電解鍍膜係以包圍上述聚吡咯粒子之複數個上述露出面之各者之方式設置於上述樹脂層之上述一個主面上，上述第2無電解鍍膜係以覆蓋上述第1無電解鍍膜之方式設置，上述第2無電解鍍膜之上述第1無電解鍍膜側之主面形成沿著上述第1無電解之鍍膜表面之凹部。
- 如請求項1之片材，其中於自上述無電解鍍膜側俯視上述樹脂層之上述一個主面時，上述第1無電解鍍膜之最長直徑之平均值為18~90nm。
- 如請求項1或2之片材，其中於自上述無電解鍍膜側俯視上述樹脂層之上述一個主面之時，於上述一個主面所佔之上述第1無電解鍍膜之面積比率為80~99%。
- 如請求項1或2之片材，其中上述第2無電解鍍膜之與上述第1無電解 鍍膜相反側之主面係粗糙面。
- 一種片材之製造方法，其具備以下步驟：於透明基材上形成包含黏合劑及複數個聚吡咯粒子之樹脂層，複數個上述聚吡咯粒子之至少一部分具有自上述樹脂層之一個主面露出之露出面且複數個上述露出面分散於上述樹脂層之上述一個主面上，且上述透明基材設置於上述樹脂層之另一個主面側；使包含觸媒之溶液接觸於上述聚吡咯粒子之上述露出面而形成附著於複數個上述露出面之各者之觸媒核；以包圍複數個上述露出面之各者及上述觸媒核之方式於上述樹脂層之上述一個主面上形成第1無電解鍍膜；以及以覆蓋上述第1無電解鍍膜之方式形成第2無電解鍍膜，上述第2無電解鍍膜之上述第1無電解鍍膜側之主面形成沿著上述第1無電解鍍膜表面之凹部。
- 一種金屬網格之製造方法，其具備藉由對如請求項1~4中任一項之片材中之上述無電解鍍膜進行之蝕刻，而形成具有網格狀圖案之無電解鍍膜之步驟。
- 一種金屬網格，其具備：樹脂層，其包含黏合劑及複數個聚吡咯粒子；無電解鍍膜，其以於上述樹脂層之一個主面側形成網格狀圖案之方式設置，並具有第1無電解鍍膜及第2無電解鍍膜；以及透明基材，其設置於上述樹脂層之另一個主面側；且 複數個上述聚吡咯粒子之至少一部分具有自上述樹脂層之上述一個主面露出之露出面，且複數個上述露出面分散於上述樹脂層之上述一個主面上，上述第1無電解鍍膜以包圍上述聚吡咯粒子之複數個上述露出面之各者之方式設置於上述樹脂層之上述一個主面上，上述第2無電解鍍膜以覆蓋上述第1無電解鍍膜之方式設置，上述第2無電解鍍膜之上述第1無電解鍍膜側之主面形成沿著上述第1無電解鍍膜表面之凹部。
- 一種金屬網格，其具備：透明基材；樹脂層，其以於上述透明基材上形成網格狀圖案之方式設置，且包含黏合劑及複數個聚吡咯粒子；以及無電解鍍膜，其一面覆蓋上述樹脂層一面沿著上述樹脂層之網格狀之圖形設置於上述透明基材上且具有第1無電解鍍膜及第2無電解鍍膜；且複數個上述聚吡咯粒子之至少一部分具有自上述樹脂層表面露出之露出面，複數個上述露出面分散於上述樹脂層之表面上，上述第1無電解鍍膜以包圍上述聚吡咯粒子之複數個上述露出面之各者之方式設置於上述樹脂層之表面上，上述第2無電解鍍膜以覆蓋上述第1無電解鍍膜之方式設置，且上述第2無電解鍍膜之上述第1無電解鍍膜側之表面形成沿著上述第1無電解鍍膜表面之凹部。
- 如請求項7或8之金屬網格，其中上述第2無電解鍍膜之與上述第1無電解鍍膜相反側之表面係粗糙面。
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| JP2015229260A (ja) | 2014-06-04 | 2015-12-21 | 東レ株式会社 | 金属化積層フィルム |
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| CN105986253B (zh) * | 2015-01-30 | 2019-09-27 | 阿基里斯株式会社 | 密合性优异的镀敷物及其制造方法 |
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- 2018-07-24 JP JP2018138552A patent/JP7000269B2/ja active Active
- 2018-07-25 DE DE102018118013.6A patent/DE102018118013A1/de active Pending
- 2018-07-26 US US16/046,422 patent/US11466368B2/en active Active
- 2018-07-26 CN CN201810838084.4A patent/CN109306478B/zh active Active
- 2018-07-26 KR KR1020180087305A patent/KR102169231B1/ko active IP Right Grant
- 2018-07-27 TW TW107126214A patent/TWI669211B/zh active
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| TW200625346A (en) * | 2004-10-08 | 2006-07-16 | Toray Industries | Conductive film |
| TW200800609A (en) * | 2006-02-20 | 2008-01-01 | Daicel Chem | Porous membrane film and laminate using the same |
| TW200837217A (en) * | 2007-01-12 | 2008-09-16 | Achilles Corp | Metal plated article and method for producing it |
| TW201420350A (zh) * | 2012-09-20 | 2014-06-01 | Dainippon Ink & Chemicals | 導電性材料及其製造方法 |
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| Publication number | Publication date |
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| CN109306478B (zh) | 2021-08-03 |
| CN109306478A (zh) | 2019-02-05 |
| JP7000269B2 (ja) | 2022-02-10 |
| US20190032221A1 (en) | 2019-01-31 |
| US11466368B2 (en) | 2022-10-11 |
| KR20190013585A (ko) | 2019-02-11 |
| DE102018118013A1 (de) | 2019-01-31 |
| KR102169231B1 (ko) | 2020-10-23 |
| JP2019025914A (ja) | 2019-02-21 |
| TW201910128A (zh) | 2019-03-16 |
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