TWI629770B - Method for separating flexible display from carrier substrate - Google Patents
Method for separating flexible display from carrier substrate Download PDFInfo
- Publication number
- TWI629770B TWI629770B TW105125318A TW105125318A TWI629770B TW I629770 B TWI629770 B TW I629770B TW 105125318 A TW105125318 A TW 105125318A TW 105125318 A TW105125318 A TW 105125318A TW I629770 B TWI629770 B TW I629770B
- Authority
- TW
- Taiwan
- Prior art keywords
- flexible display
- carrier substrate
- display
- flexible
- separating
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000000926 separation method Methods 0.000 claims abstract description 12
- 238000001179 sorption measurement Methods 0.000 claims description 10
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 21
- 239000010408 film Substances 0.000 description 23
- 230000035882 stress Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000009429 distress Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Crystal (AREA)
Abstract
本發明為有關一種軟性顯示器與承載基板分離之方法，其分離之步驟係為，先在承載基板上成型軟性顯示器之基礎薄膜，並於基礎薄膜上成型軟性顯示器之顯示區，且對承載基板上之軟性顯示器進行切割，即可自承載基板上切割後之軟性顯示器的一側邊予以掀起，再利用微孔性吸著平台吸著軟性顯示器，而透過機械加工施力將承載基板脫離軟性顯示器，即可由微孔性吸著平台上將軟性顯示器取下，並可達到保持軟性顯示器的平整度、不捲曲變形之目的，並有效避免在軟性顯示器內部產生內應力集中現象，則可供順利進行後續加工作業、製程。 The invention relates to a method for separating a flexible display from a carrier substrate. The separation step is: firstly forming a base film of the flexible display on the carrier substrate, and then forming a display area of the flexible display on the base film. The flexible display can be cut by lifting one side of the flexible display after being cut on the carrier substrate, and then using the microporous suction platform to attract the flexible display, and the mechanical substrate is used to release the carrier substrate from the flexible display. The flexible display can be removed from the microporous suction platform, and the purpose of maintaining the flatness of the flexible display, not curling and deforming, and effectively avoiding the phenomenon of internal stress concentration inside the flexible display, can be smoothly followed up. Processing operations and processes.
Description
本發明係提供一種軟性顯示器與承載基板分離之方法，尤指可保持軟性顯示器的平整度、避免分離過程產生內應力之分離方法，利用機械加工方式對承載基板施力，以供承載基板脫離軟性顯示器，可降低分離作業的成本，達到避免軟性顯示器產生捲曲變形現象之目的。 The invention provides a method for separating a flexible display from a carrier substrate, particularly a separation method that can maintain the flatness of the flexible display and avoid internal stress during the separation process. The carrier substrate is forced by mechanical processing to release the carrier substrate from the softness. The display can reduce the cost of the separation operation and achieve the purpose of avoiding the curl deformation of the flexible display.
按，傳統應用於顯示影音訊號之映像管電視機或陰極射線管顯示器(Cathode ray tube)等螢幕，因傳統螢幕之體積大又笨重，不論搬運或安裝應用均相當不方便，而隨著科技不斷進步，影音顯示器已朝向薄型化、平面化及輕量化等方向發展前進，各式液晶顯示器、發光二極體(LED)顯示器或有機發光二極體(OLED)顯示器等，且因體積較輕薄、重量大幅減少、並較不佔空間位置，則已完全取代了傳統的螢幕，被廣泛應用在電視、電腦等，作為影音訊號顯示螢幕之用途。 According to the traditional screens such as video tube televisions or cathode ray tube displays that display audio and video signals, the traditional screens are large and bulky, which makes it very inconvenient to handle or install. However, with the continuous development of technology, With progress, audiovisual displays have been moving towards thinner, flatter, and lighter directions. Various liquid crystal displays, light-emitting diode (LED) displays, or organic light-emitting diode (OLED) displays, etc. The weight is greatly reduced, and it takes up less space. It has completely replaced the traditional screen, and is widely used in televisions, computers, etc. as the display screen of audio and video signals.
而透過電子科技的再進步，利用平面型顯示器再發展進步成為軟性顯示器(或稱為可撓性顯示器、薄膜顯示器或液晶面板等)，因軟性顯示器的體積更加輕、薄，並可方便收納、攜帶，更不會佔用太大、太多的空間位置，也使軟性顯示器成為目前顯示器發展的趨勢，並應用在 各種電子產品的顯示螢幕；因軟性顯示器的厚度可能會在1mm以下，而且採用塑膠類材質(例如PI、PET或PE等各式薄膜)作為上、下基板形成保護作用，若在加工製程中未能保持軟性顯示器的平整度，導致軟性顯示器產生扭曲、變形等現象，將造成軟性顯示器進行後續加工作業時的不便與困擾。 Through the further advancement of electronic technology, the use of flat-panel displays has been further developed to become flexible displays (also known as flexible displays, thin-film displays, or LCD panels, etc.). Because flexible displays are lighter and thinner, and can be easily stored, Carrying, it will not take up too much space too much, also make the flexible display become the current trend of display development, and applied in Display screens of various electronic products; because the thickness of flexible displays may be less than 1mm, and plastic materials (such as various films such as PI, PET, or PE) are used as the upper and lower substrates to protect the substrate. It can maintain the flatness of the flexible display, causing distortion and deformation of the flexible display, which will cause inconvenience and distress to the flexible display in subsequent processing operations.
然，軟性顯示器(成品或半成品等)在製作程序中，都會在承載基板上製作一層基礎薄膜後，再於基礎薄膜上成型軟性顯示器，即可將軟性顯示器自承載基板上取下，但目前自承載基板上將軟性顯示器取出之作業方式，請參閱第六圖所示，係可將承載基板A表面上的軟性顯示器B的顯示區B1底部基礎薄膜B2之一側邊B21予以掀起，而使軟性顯示器B的該側邊B21與承載基板A表面形成預分離狀態，再透過機械加工機具C夾持承載基板A表面上預分離的軟性顯示器B側邊B21，以將軟性顯示器B自承載基板A上取出，但軟性顯示器B受到加工機具C的拉扯，容易造成在軟性顯示器B內部形成內應力集中現象，將造成軟性顯示器B顯示狀態不良、不清晰，且因軟性顯示器B非常薄，受到加工機具C自承載基板A上拉扯取出後，容易導致軟性顯示器B發生捲曲變形情況，即無法進行後續的加工製程。 However, in the production process of flexible displays (finished or semi-finished products, etc.), a base film is formed on a carrier substrate, and then a flexible display is formed on the base film. The flexible display can be removed from the carrier substrate. For the operation method of taking out the flexible display on the carrier substrate, please refer to the sixth figure, which can lift one side B21 of the base film B2 at the bottom of the display area B1 of the flexible display B on the surface of the carrier substrate A to make the flexible The side B21 of the display B forms a pre-separated state with the surface of the carrier substrate A, and then the pre-separated soft display B side B21 on the surface of the carrier substrate A is clamped by the machining tool C, so that the flexible display B is mounted on the carrier substrate A Take out, but the flexible display B is pulled by the processing tool C, which will easily cause the internal stress concentration phenomenon in the flexible display B, which will cause the display state of the flexible display B to be poor and unclear, and because the flexible display B is very thin, it will be affected by the processing tool C After being pulled out from the carrier substrate A, it is easy to cause the flexible display B to curl and deform, that is, it is impossible to perform subsequent Engineering process.
請參閱第七圖所示，有業者為了保護軟性顯示器B表面不受外部細屑、灰塵等沾附，而在軟性顯示器B的顯示區B1表面貼附輔助膜片B3，但軟性顯示器B的基礎薄膜B2之側邊B21、輔助膜片B3的側緣邊B31受到加工機具C的拉扯時，還是會在軟性顯示器B內部形成內應力集中現象，影響軟性顯示器B的顯示效果不良、不清晰，且因多 了輔助膜片B3貼附在軟性顯示器B的顯示區B1上，反而造成軟性顯示器B的顯示區B1的顯示品質不佳、影響軟性顯示器B整體撓性彎曲度不理想。 Please refer to the seventh figure. In order to protect the surface of the flexible display B from external fine debris, dust, etc., an auxiliary film B3 is attached to the surface of the display area B1 of the flexible display B. However, the foundation of the flexible display B is When the side edge B21 of the film B2 and the side edge B31 of the auxiliary diaphragm B3 are pulled by the processing tool C, an internal stress concentration phenomenon will still be formed inside the flexible display B, which affects the display effect of the flexible display B and is not clear, and Indo Because the auxiliary film B3 is attached to the display area B1 of the flexible display B, the display quality of the display area B1 of the flexible display B is poor, which affects the overall flexibility of the flexible display B and is not ideal.
另請參閱第八圖所示，業者為了改善軟性顯示器B自承載基板A上取出所產生的缺失，改採用雷射作業模式，透過雷射發射器D朝著承載基板A背面對軟性顯示器B投射雷射光D1，並利用雷射發射器D沿著承載基板A背面一側往另側移動，而透過雷射光D1使軟性顯示器B與承載基板A表面分離，則因雷射發射器D朝承載基板A背面對軟性顯示器B投射雷射光D1，所以承載基板A的透明均質度必須非常高，否則承載基板A表面存在的微細物質，將會影響雷射光D1穿透不平均、造成軟性顯示器B無法自承載基板A表面順利脫離的情況，因此考量承載基板A的透明均質度，則其製造成本也會提高；再者利用雷射發射器D朝承載基板A投射雷射光D1的加工作業模式，因雷射相關設備的成本費用相當高，加工作業的成本必然增加，且雷射光D1亦會對軟性顯示器B的基礎薄膜B2形成些許損壞情形，影響軟性顯示器B的品質變差，不論採用那一種加工方式將軟性顯示器B自承載基板A表面取出，都存在著些許缺失與不便，實有待改善。 Please also refer to the eighth figure, in order to improve the defect caused by the flexible display B being taken out from the carrier substrate A, the operator changed to the laser operation mode and projected the flexible display B toward the back of the carrier substrate A through the laser emitter D. The laser light D1 is moved along the back side of the carrier substrate A to the other side by the laser emitter D, and the flexible display B is separated from the surface of the carrier substrate A by the laser light D1, because the laser emitter D faces the carrier substrate The back of A projects laser light D1 on the flexible display B, so the transparent uniformity of the carrier substrate A must be very high, otherwise the fine substances existing on the surface of the carrier substrate A will affect the uneven penetration of the laser light D1 and cause the flexible display B to fail The surface of the carrier substrate A is detached smoothly. Therefore, considering the transparent homogeneity of the carrier substrate A, its manufacturing cost will also increase. Furthermore, the laser emitter D is used to project the laser light D1 on the carrier substrate A. The cost of radiation related equipment is quite high, and the cost of processing operations must increase, and the laser light D1 will also cause some damage to the base film B2 of the flexible display B. This affects the quality of the flexible display B. No matter which processing method is used to remove the flexible display B from the surface of the carrier substrate A, there are some defects and inconveniences that need to be improved.
是以，如何解決將軟性顯示器自承載基板上取出，容易影響軟性顯示器的平整度及顯示品質變差之問題與困擾，且加工方式不同均容易導致成本提高、加工品質不良等之缺失，即為從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the problems and problems of taking out the flexible display from the supporting substrate, which can easily affect the flatness and poor display quality of the flexible display, and the different processing methods can easily lead to the increase of costs and poor processing quality. Those involved in this industry are eager to study the direction of improvement.
故，發明人有鑑於上述之問題與缺失，乃搜集相關資料，經由多方評估及考量，並以從事於此行業累積之多年經驗，經由不斷試作及修改，始設計出此種可順利將軟性顯示器自承載基板取出，且保持軟性顯示器的平整度，並可避免在軟性顯示器內部形成內應力集中現象，且不必貼附輔助膜片、加工成本較低之軟性顯示器與承載基板分離之方法的發明專利誕生者。 Therefore, in view of the above problems and deficiencies, the inventor collected relevant information, evaluated and considered from various parties, and based on years of experience accumulated in this industry, through continuous trial and modification, he began to design such a flexible display Take out from the carrier substrate, and maintain the flatness of the flexible display, and can avoid the formation of internal stress concentration inside the flexible display, and it is not necessary to attach an auxiliary film, and the method of separating the flexible display and the carrier substrate with lower processing costs is an invention patent The born.
本發明之主要目的乃在於該軟性顯示器與承載基板分離之步驟，係先在承載基板上成型軟性顯示器之基礎薄膜，並於基礎薄膜上再成型軟性顯示器之顯示區，且對承載基板上之軟性顯示器進行切割，即可自承載基板上切割後之軟性顯示器的一側邊予以掀起，再利用微孔性吸著平台吸著軟性顯示器，而透過機械加工施力將承載基板脫離軟性顯示器，即可由微孔性吸著平台上將軟性顯示器取下，可達到保持軟性顯示器的平整度、不捲曲變形之目的，並有效避免在軟性顯示器內部產生內應力集中現象，則可供順利進行後續加工作業、製程。 The main purpose of the present invention is to separate the flexible display from the carrier substrate. First, the base film of the flexible display is formed on the carrier substrate, and then the display area of the flexible display is formed on the base film. The display is cut, and one side of the flexible display after cutting can be lifted off from the carrier substrate. Then, the flexible display is sucked by the microporous suction platform, and the carrier substrate is released from the flexible display by mechanical processing force. Removing the flexible display from the microporous suction platform can achieve the purpose of maintaining the flatness of the flexible display, not curling and deforming, and effectively avoiding the phenomenon of internal stress concentration inside the flexible display, which can be used for subsequent processing operations, Process.
本發明之次要目的乃在於該軟性顯示器係為可撓性之有機發光二極體面板(OLED)、液晶顯示面板或電子紙(Electronic paper)等可供撓曲之顯示器；且承載基板係可玻璃材質之板材；而微孔性吸著平台則可為多孔性陶瓷吸著平台。 A secondary object of the present invention is that the flexible display is a flexible organic light-emitting diode panel (OLED), a liquid crystal display panel, or an electronic paper (Electronic paper) that can be flexed; and the carrier substrate is a flexible display. Plates made of glass; microporous adsorption platforms can be porous ceramic adsorption platforms.
1‧‧‧承載基板 1‧‧‧ carrier substrate
11‧‧‧施力側邊 11‧‧‧ side of force
2‧‧‧軟性顯示器 2‧‧‧ flexible display
21‧‧‧基礎薄膜 21‧‧‧ basic film
211‧‧‧側邊 211‧‧‧side
22‧‧‧顯示區 22‧‧‧display area
3‧‧‧吸著平台 3‧‧‧ Suction platform
A‧‧‧承載基板 A‧‧‧bearing substrate
B‧‧‧軟性顯示器 B‧‧‧ flexible display
B1‧‧‧顯示區 B1‧‧‧display area
B2‧‧‧基礎薄膜 B2‧‧‧ basic film
B21‧‧‧側邊 B21‧‧‧Side
B3‧‧‧輔助膜片 B3‧‧‧Auxiliary diaphragm
B31‧‧‧側緣邊 B31‧‧‧Side edge
C‧‧‧加工機具 C‧‧‧Processing tools
D‧‧‧雷射發射器 D‧‧‧Laser Launcher
D1‧‧‧雷射光 D1‧‧‧laser light
第一圖 係為本發明之流程圖。 The first figure is a flowchart of the present invention.
第二圖 係為本發明承載基板與軟性顯示器之示意圖。 The second figure is a schematic diagram of a carrier substrate and a flexible display according to the present invention.
第三圖 係為本發明軟性顯示器與承載基板呈預分離之側視圖。 The third figure is a side view of the flexible display and the carrier substrate in a pre-separated state.
第四圖 係為本發明承載基板與軟性顯示器進行分離之側視圖。 The fourth figure is a side view of the carrier substrate and the flexible display separated from each other.
第五圖 係為本發明軟性顯示器之示意圖。 The fifth figure is a schematic diagram of the flexible display of the present invention.
第六圖 係為習知軟性顯示器分離方式第一實施例之側視圖。 The sixth figure is a side view of the first embodiment of the conventional flexible display separation method.
第七圖 係為習知軟性顯示器分離方式第二實施例之側視圖。 The seventh figure is a side view of the second embodiment of the conventional flexible display separation method.
第八圖 係為習知軟性顯示器分離方式第三實施例之側視圖。 The eighth figure is a side view of the third embodiment of the conventional flexible display separation method.
為達成上述目的與功效，本發明所採用之技術手段及其構造、實施之方法等，茲繪圖就本發明之較佳實施例詳加說明其特徵與功能如下，俾利完全瞭解。 In order to achieve the above-mentioned objects and effects, the technical means adopted by the present invention, its structure, and implementation methods are described in detail below with reference to the preferred embodiments of the present invention, whose features and functions are fully understood.
請參閱第一、二、三、四、五圖所示，係分別為本發明之流程圖、承載基板與軟性顯示器之示意圖、軟性顯示器與承載基板呈預分離之側視圖、承載基板與軟性顯示器進行分離之側視圖、軟性顯示器之示意圖，由圖中所示可以清楚看出，本發明軟性顯示器與承載基板進行分離之方法，其步驟係： Please refer to the first, second, third, fourth, and fifth figures, which are flowcharts of the present invention, a schematic diagram of a carrier substrate and a flexible display, a side view of the flexible display and the carrier substrate pre-separated, the carrier substrate and the flexible display, respectively. The side view of the separation and the schematic diagram of the flexible display. As can be clearly seen from the figure, the method for separating the flexible display and the carrier substrate of the present invention has the following steps:
(A)先在承載基板1表面上成型軟性顯示器2之基礎薄膜21。 (A) First, the base film 21 of the flexible display 2 is formed on the surface of the carrier substrate 1.
(B)並於基礎薄膜21上再成型軟性顯示器2之顯示區22，且對承載基板1上之軟性顯示器2的周邊進行切割。 (B) The display area 22 of the flexible display 2 is reshaped on the base film 21, and the periphery of the flexible display 2 on the carrier substrate 1 is cut.
(C)則自承載基板1上將切割後之軟性顯示器2的基礎薄膜21一側邊211予以掀起，與承載基板1呈預分離狀態。 (C) The side 211 of the base film 21 of the cut flexible display 2 is lifted from the carrier substrate 1 to be in a pre-separated state from the carrier substrate 1.
(D)再利用微孔性吸著平台3吸著軟性顯示器2的顯示 區22表面。 (D) Reuse the microporous adsorption platform 3 to display the flexible display 2 Area 22 surface.
(E)藉由機械加工方式以機具對承載基板1施力，而將承載基板1脫離軟性顯示器2之基礎薄膜21。 (E) A mechanical processing method is used to apply force to the carrier substrate 1 to remove the carrier substrate 1 from the base film 21 of the flexible display 2.
(F)即可利用微孔性吸著平台3將軟性顯示器2自承載基板1表面取下，以供軟性顯示器2保持良好平整度，即完成承載基板1與軟性顯示器2之分離。 (F) The flexible display 2 can be used to remove the flexible display 2 from the surface of the supporting substrate 1 so that the flexible display 2 maintains a good flatness, and the separation between the supporting substrate 1 and the flexible display 2 is completed.
上述該軟性顯示器2與承載基板1分離後，保持良好平整度、並可提升產品良率，而可供順利進行後續加工作業；且該軟性顯示器2係為可撓性之有機發光二極體面板(OLED)、液晶顯示面板或電子紙(Electronic paper)等具有可撓曲、可彎折之軟性顯示器2。 After the soft display 2 is separated from the carrier substrate 1, the soft display 2 maintains a good flatness and can improve the yield of the product, which can be used for subsequent processing operations smoothly; and the soft display 2 is a flexible organic light emitting diode panel (OLED), liquid crystal display panel, electronic paper, and other flexible displays 2 which are flexible and bendable.
而上述分離作業步驟，該軟性顯示器2在承載基板1上進行加工作業時，軟性顯示器2表面並不需貼附輔助薄膜，亦不會造成軟性顯示器2的表面損傷，且不會造成加工製程的成本增加；再者，加工製程之步驟，係於基礎薄膜21一側邊211與承載基板1預分離的施力側邊11位置，透過機械加工方式以機具(圖中未示出)對承載基板1該施力側邊11施力，以將承載基板1拉離軟性顯示器2，而供承載基板1與軟性顯示器2分離，則不會在軟性顯示器2內部形成內應力集中現象，即不致影響軟性顯示器2的顯示效果，以供軟性顯示器2保持良好、清晰的顯示功能、亦可提升軟性顯示器2的產品良率，則透過機械加工方式以機具(圖中未示出)對承載基板1施力，所需成本費用也較低、效果較佳，同時該承載基板1可為玻璃材質之板材，則對承載基板1的品質、精度等要 求也不高，不必考量承載基板1的透明均質度，關於承載基板1的成本費用也可降低；且承載基板1與軟性顯示器2分離後，可保持軟性顯示器2的良好平整度，不致發生扭曲或變形現象，可提高軟性顯示器2的產品良率，並可順利進行後續加工製程，亦供軟性顯示器2具有良好顯示效果。 In the above separation operation step, when the flexible display 2 is processed on the carrier substrate 1, the surface of the flexible display 2 does not need to be affixed with an auxiliary film, nor does it cause surface damage to the flexible display 2, and it does not cause the processing process. The cost increases; further, the steps of the processing process are at the position 11 of the force side 11 where the side 211 of the base film 21 is pre-separated from the carrier substrate 1, and the carrier substrate is machined by a machine (not shown) through mechanical processing. 1 The force applying side 11 applies a force to pull the carrier substrate 1 away from the flexible display 2, and for the carrier substrate 1 to be separated from the flexible display 2, an internal stress concentration phenomenon will not be formed inside the flexible display 2, that is, the flexible display will not be affected. The display effect of 2 is provided for the flexible display 2 to maintain a good and clear display function, and also to improve the product yield of the flexible display 2. Then, a mechanical tool (not shown in the figure) is used to apply force to the carrier substrate 1 through mechanical processing. The required cost is also low and the effect is better. At the same time, the carrier substrate 1 can be a plate made of glass. Therefore, the quality and accuracy of the carrier substrate 1 are required. The requirements are not high, and it is not necessary to consider the transparent uniformity of the carrier substrate 1. The cost of the carrier substrate 1 can also be reduced; and after the carrier substrate 1 is separated from the flexible display 2, the good flatness of the flexible display 2 can be maintained without distortion. Or the deformation phenomenon can improve the product yield of the flexible display 2 and can smoothly carry out subsequent processing processes. It also provides the flexible display 2 with a good display effect.
至於上述步驟中之微孔性吸著平台3，則可為多孔性陶瓷吸著平台，並利用吸著平台3吸附軟性顯示器2的表面以及與承載基板1呈預分離的側邊211，可供軟性顯示器2不易發生捲曲、彎折等變形之情況，以確保軟性顯示器2具有良好的平整度，有助於後續加工製程亦可順利進行。 As for the microporous adsorption platform 3 in the above steps, it can be a porous ceramic adsorption platform, and the surface of the flexible display 2 and the side 211 which is pre-separated from the carrier substrate 1 can be absorbed by the adsorption platform 3, which can be used for The flexible display 2 is not prone to deformation such as curling, bending, etc., to ensure that the flexible display 2 has a good flatness, which is helpful for the subsequent processing process.
是以，以上所述僅為本發明之較佳實施例而已，非因此侷限本發明之專利範圍，本發明軟性顯示器與承載基板分離之方法，係利用承載基板1上成型軟性顯示器2之基礎薄膜21、顯示區22，並將軟性顯示器2周邊進行切割後，即將基礎薄膜21一側邊211予以掀起與承載基板1呈預分離狀，即可透過微孔性吸著平台3吸附在軟性顯示器2的顯示區22表面，而透過機械加工方式以機具對承載基板1的施力側邊11進行施力，以將承載基板1與軟性顯示器2分離，俾可達到保持軟性顯示器2的平整度、避免造成內應力集中現象，供進行後續加工作業之目的，且軟性顯示器2不易發生捲曲、變形等現象，並可提升軟性顯示器2的產品良率之實用功效，故舉凡可達成前述效果之結構、裝置皆應受本發明所涵蓋，此種簡易修飾及等效結構變化，均應同理包含於本發明之專利範圍內，合予陳明。 Therefore, the above is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. The method for separating the flexible display from the carrier substrate of the present invention is to use the base film of the flexible display 2 formed on the carrier substrate 1 21, the display area 22, and cutting the periphery of the flexible display 2, that is, the side 211 of the base film 21 is lifted up to form a pre-separation from the carrier substrate 1, and the flexible display 2 can be adsorbed on the flexible display 2 through the microporous adsorption platform 3. The surface of the display area 22 is mechanically applied to the load-bearing side 11 of the carrier substrate 1 by a machine tool to separate the carrier substrate 1 from the flexible display 2 so that the flatness of the flexible display 2 can be maintained and avoided. Causes the phenomenon of internal stress concentration for the purpose of subsequent processing operations, and the flexible display 2 is not prone to curling and deformation, and can improve the practical effectiveness of the product yield of the flexible display 2. Therefore, the structures and devices that can achieve the aforementioned effects All should be covered by the present invention. Such simple modifications and equivalent structural changes should be included in the patent scope of the present invention, Chen Ming.
故，本發明為主要針對軟性顯示器與承載基板分離之方法 進行設計，係利用承載基板上成型軟性顯示器之基礎薄膜、顯示區，並進行軟性顯示器切割後，即將基礎薄膜一側邊掀起與承載基板呈預分離狀態，再藉由微孔性吸著平台吸附顯示區表面，且透過機械加工方式利用機具對承載基板的施力側邊進行施力，以將承載基板與軟性顯示器脫離，而可達到保持軟性顯示器的平整度、提升產品良率為主要保護重點，且供軟性顯示器不易捲曲、變形、避免造成內應力集中現象，乃僅使軟性顯示器可供順利進行後續加工製程之目的，並供軟性顯示器具有良好顯示效果，實用性極佳，惟，以上所述僅為本發明之較佳實施例而已，非因此即侷限本發明之專利範圍，故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化，均應同理包含於本發明之專利範圍內，合予陳明。 Therefore, the present invention is mainly directed to a method for separating a flexible display from a carrier substrate. The design is to use the base film and display area of the flexible display formed on the carrier substrate and cut the flexible display, that is, the side of the base film is lifted up to a pre-separated state from the carrier substrate, and then adsorbed by the microporous adsorption platform The surface of the display area, and the mechanical application method is used to apply force to the load-bearing substrate side to separate the load-bearing substrate from the flexible display, so as to maintain the flatness of the flexible display and improve the product yield. And, it is not easy for the flexible display to curl, deform, and avoid the phenomenon of internal stress concentration. It is only for the purpose of making the flexible display smooth for subsequent processing, and for the flexible display to have a good display effect and excellent practicality. However, the above The description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be included in the present invention in the same way. Within the scope of the patent, Chen Ming was conferred.
綜上所述，本發明上述軟性顯示器與承載基板分離之方法於實際執行、實施時，為確實能達到其功效及目的，故本發明誠為一實用性優異之研發，為符合發明專利之申請要件，爰依法提出申請，盼 審委早日賜准本案，以保障發明人之辛苦研發、創設，倘若 鈞局審委有任何稽疑，請不吝來函指示，發明人定當竭力配合，實感德便。 To sum up, the method for separating the flexible display and the carrier substrate of the present invention in actual implementation and implementation is to achieve its efficacy and purpose. Therefore, the present invention is a research and development with excellent practicability, in order to comply with the application for an invention patent In order to protect the inventor's hard research and development and creation, I hope that the trial committee will grant the case as soon as possible. If there is any suspicion in the jury of the Bureau, please follow the instructions of the letter, and the inventor will cooperate as hard as possible.
Claims (4)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105125318A TWI629770B (en) | 2016-08-09 | 2016-08-09 | Method for separating flexible display from carrier substrate |
| CN201710482405.7A CN107706314B (en) | 2016-08-09 | 2017-06-22 | Method for separating flexible display from bearing substrate |
| JP2017141043A JP2018025776A (en) | 2016-08-09 | 2017-07-20 | Flexible display, and separation method of carrier substrate |
| KR1020170094314A KR102000826B1 (en) | 2016-08-09 | 2017-07-25 | Method of separating a flexible display from a carrier substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105125318A TWI629770B (en) | 2016-08-09 | 2016-08-09 | Method for separating flexible display from carrier substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201806135A TW201806135A (en) | 2018-02-16 |
| TWI629770B true TWI629770B (en) | 2018-07-11 |
Family
ID=61170455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105125318A TWI629770B (en) | 2016-08-09 | 2016-08-09 | Method for separating flexible display from carrier substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2018025776A (en) |
| KR (1) | KR102000826B1 (en) |
| CN (1) | CN107706314B (en) |
| TW (1) | TWI629770B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108898953B (en) * | 2018-07-04 | 2020-12-22 | 京东方科技集团股份有限公司 | Preparation method of flexible display panel, flexible display panel and display device |
| CN111463172A (en) * | 2019-01-21 | 2020-07-28 | 瀚宇彩晶股份有限公司 | Method for manufacturing electronic device |
| CN112388151B (en) * | 2019-08-16 | 2022-08-02 | 阳程科技股份有限公司 | Method for pre-separating flexible display and additional circuit board |
| CN110690158B (en) * | 2019-09-25 | 2022-03-22 | 云谷（固安）科技有限公司 | Stripping device and stripping method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201419501A (en) * | 2012-11-14 | 2014-05-16 | Lg Display Co Ltd | Method of fabricating flexible display device |
| TW201613742A (en) * | 2014-07-18 | 2016-04-16 | Nitto Denko Corp | Method for attaching optical film to optical display unit |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6149758A (en) * | 1997-06-20 | 2000-11-21 | Lintec Corporation | Sheet removing apparatus and method |
| JPH1197161A (en) * | 1997-09-16 | 1999-04-09 | Ricoh Co Ltd | Hot plate |
| US6112735A (en) * | 1999-03-02 | 2000-09-05 | Micron Technology, Inc. | Complete blade and wafer handling and support system without tape |
| JP5298760B2 (en) * | 2008-10-21 | 2013-09-25 | 日立化成株式会社 | Insulator film, resin composition, and display device |
| JP5360073B2 (en) * | 2009-02-06 | 2013-12-04 | 旭硝子株式会社 | Manufacturing method of electronic device and peeling apparatus used therefor |
| TWI410329B (en) * | 2009-03-09 | 2013-10-01 | Ind Tech Res Inst | Apparatus for releasing a flexible device and method thereof |
| JP5446790B2 (en) * | 2009-12-02 | 2014-03-19 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
| TWI523295B (en) * | 2012-11-30 | 2016-02-21 | Ｌｇ化學股份有限公司 | Organic light emitting device comprising flexible substrate and method for preparing thereof |
| KR20140142087A (en) * | 2013-06-03 | 2014-12-11 | 삼성디스플레이 주식회사 | Deposition apparatus, method for manufacturing organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
| JP2016038556A (en) * | 2014-08-11 | 2016-03-22 | 株式会社ジャパンディスプレイ | Manufacturing method of flexible display device |
| KR102329691B1 (en) * | 2014-10-13 | 2021-11-23 | 삼성디스플레이 주식회사 | Transparent display devices and methods of manufacturing transparent display devices |
| JP6447389B2 (en) * | 2014-10-27 | 2019-01-09 | 三菱ケミカル株式会社 | Laminate with resin / glass composite |
| JP6942630B2 (en) * | 2014-11-19 | 2021-09-29 | コーニング インコーポレイテッド | Processing method including peeling |
| KR102352849B1 (en) * | 2014-12-23 | 2022-01-18 | 엘지디스플레이 주식회사 | Method for manufacturing flexible display and flexible display |
| CN204857698U (en) * | 2015-07-30 | 2015-12-09 | 吴根明 | Semiconductor vacuum chuck |
-
2016
- 2016-08-09 TW TW105125318A patent/TWI629770B/en active
-
2017
- 2017-06-22 CN CN201710482405.7A patent/CN107706314B/en active Active
- 2017-07-20 JP JP2017141043A patent/JP2018025776A/en active Pending
- 2017-07-25 KR KR1020170094314A patent/KR102000826B1/en active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201419501A (en) * | 2012-11-14 | 2014-05-16 | Lg Display Co Ltd | Method of fabricating flexible display device |
| TW201613742A (en) * | 2014-07-18 | 2016-04-16 | Nitto Denko Corp | Method for attaching optical film to optical display unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107706314A (en) | 2018-02-16 |
| TW201806135A (en) | 2018-02-16 |
| JP2018025776A (en) | 2018-02-15 |
| CN107706314B (en) | 2019-10-29 |
| KR102000826B1 (en) | 2019-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI629770B (en) | Method for separating flexible display from carrier substrate | |
| TWI643753B (en) | Curved surface bonding device and method | |
| JP5949894B2 (en) | GLASS LAMINATE, ITS MANUFACTURING METHOD, DISPLAY PANEL MANUFACTURING METHOD, AND DISPLAY PANEL OBTAINED BY THE MANUFACTURING METHOD | |
| TWI428243B (en) | Method for debonding a flexible device | |
| WO2013151075A1 (en) | Glass film fracturing method and glass film laminate body | |
| JP3211002U (en) | Flexible adsorption bonding chuck | |
| JP2014220436A (en) | Sticking and separating method and separating device | |
| US11225057B2 (en) | Bonded article of thin glass on support substrate, preparation method and use thereof | |
| TWI632982B (en) | Plate retaining device | |
| JP2014031270A (en) | Sheet application method and sheet application device | |
| WO2016026208A1 (en) | Manufacturing method of flexible display and flexible display | |
| TW201618224A (en) | Substrate platform mechanism | |
| CN109264123B (en) | Holding device for sheet material | |
| TWI659847B (en) | Stripping device and method for laminated body, and manufacturing method of electronic component | |
| TWM512211U (en) | Substrate stage mechanism | |
| TWI468787B (en) | Temporary bonding method and bonding apparatus thereof | |
| TW201433462A (en) | Method for processing laminate and processed laminate | |
| KR101362298B1 (en) | Apparatus and method of bonding substrates using jig-type flexible pad | |
| JP2017024950A (en) | Manufacturing method of glass film and manufacturing method of electronic device including glass film | |
| JP2008122555A (en) | Optical film sticking method and device, and manufacturing method of display panel | |
| TW201800264A (en) | Film type infrared absorbing filter and method for manufacturing thereof Improving optical characteristics and simplifying manufacturing processes | |
| TW201900401A (en) | Method for processing a substrate | |
| KR101384695B1 (en) | Apparatus and method of bonding substrates using flexible film | |
| TWI496693B (en) | Layered flexible device and the method of fabricating a display apparatus using the same | |
| TW201542386A (en) | Display panel and carrying device, and manufacturing method of the display panel |