TWI566441B - Light emitting diode device and leadframe array for packaging light emitting diode - Google Patents

Description

Light-emitting diode device and bracket array for encapsulating light-emitting diode

The invention relates to a stent array, in particular to a stent array and a light emitting diode device for encapsulating a light emitting diode.

Light Emitting Diode (LED) is a kind of semiconductor component. Due to its small size, long life and low power consumption, the LED has been widely used in various lighting devices and electronic devices. . Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic side view of the prior art light-emitting diode device 1 , and FIG. 2 is a schematic plan view of the stent module 10 in FIG. 1 . As shown in FIG. 1 , the light-emitting diode device 1 includes a bracket module 10 , a reflector 12 , and a light-emitting diode 14 . The bracket module 10 includes two brackets 100, wherein the two brackets 100 are juxtaposed to each other, and each bracket 100 includes a fixed crystal platform 102. The reflector 12 encloses the stent module 10 and exposes a portion of the upper surface 1020 of the fixed crystal platform 102. The light emitting diode 14 is disposed on a portion of the upper surface 1020 of the die bonding platform 102.

As shown in FIG. 1 , each of the brackets 100 further includes a bonding pad 106 extending from the lower surface 1022 of the bonding platform 102 , wherein the height h1 of the bonding pads 106 is equal to the height h2 of the bonding platform 102 , and the solid crystal platform The vertical distance d1 between the outer side edge 1024 of the 102 and the bond pad 106 is equal to the vertical distance d2 between the inner side edge 1026 of the die bonding platform 102 and the bond pad 106. When the bracket 100 is reduced, the height h1 and the vertical distance d1 are both reduced, so that the joint area of the reflector 12 and the bracket 100 at the corner is reduced. At this time, the bonding strength between the reflector 12 and the bracket 100 is also lowered, so that the overall structural strength of the light-emitting diode device 1 is also lowered.

In addition, as shown in FIG. 2, the three sides of the solid crystal platform 102 have only outward protrusions. A single pin 104 is shown. Generally, the material of the stent 100 is a metal (for example, copper), and the material of the reflector 12 is a polymer material. The reflector 12 is coated with a portion of the die bonding platform 102 and the pins 104 by a transfer molding process such that the reflector 12 and the bracket 100 are coupled through the pins 104. However, when the light-emitting diode device 1 has a miniaturization requirement, the bracket 100 needs to be reduced accordingly, so that the contact area of the bracket 100 with the reflector 12 is also reduced. At this time, the bonding strength between the reflector 12 and the bracket 100 is lowered, so that the overall structural strength of the LED device 1 is also reduced.

The invention provides a bracket array and a light emitting diode device for encapsulating a light emitting diode to solve the above problems.

According to an embodiment, the LED device of the present invention comprises a bracket module, a reflector and a light emitting diode. The bracket module comprises two brackets, and the two brackets are arranged side by side. Each bracket comprises a solid crystal platform and a bonding pad. The solid crystal platform comprises an upper surface and a lower surface, and the bonding pads extend from the lower surface of the fixed crystal platform. The width of the bonding pad is smaller than the width of the solid crystal platform, and the height of the bonding pad is greater than the height of the solid crystal platform. The reflector covers the stent module and exposes a portion of the upper surface of the solid crystal platform. The light emitting diode is connected across a portion of the upper surface of the two solid crystal platform.

Preferably, at least one side of the fixed crystal platform has at least two pins protruding outward.

Preferably, each of the three sides of the fixed crystal platform has at least two legs protruding outward.

Preferably, the die bonding platform has at least one hole and at least a portion of the hole is filled by the reflector.

According to another embodiment, the LED device of the present invention comprises a bracket module, a reflector and a light emitting diode. The bracket module comprises two brackets, and the two brackets are arranged side by side. Each bracket comprises a solid crystal platform and a bonding pad. The solid crystal platform comprises an upper surface and a lower surface, and the bonding pads extend from the lower surface of the fixed crystal platform. The width of the bonding pad is smaller than the width of the bonding platform. The bonding platform has an outer side and an inner side, and the vertical distance between the outer side and the bonding pad is greater than the vertical distance between the inner side and the bonding pad. The reflector covers the bracket module and exposes the portion of the solid crystal platform Part of the surface. The light emitting diode is connected across a portion of the upper surface of the two solid crystal platform.

Preferably, at least one side of the fixed crystal platform has at least two pins protruding outward.

Preferably, each of the three sides of the fixed crystal platform has at least two legs protruding outward.

Preferably, the die bonding platform has at least one hole and at least a portion of the hole is filled by the reflector.

According to another embodiment, the stent array for packaging a light-emitting diode of the present invention comprises a frame, a plurality of bracket modules, and a reflector. Each of the bracket modules includes two brackets, and the two brackets are arranged side by side. Each bracket includes a solid crystal platform and a bonding pad. The solid crystal platform includes an upper surface and a lower surface, and the bonding pads extend from the lower surface of the fixed crystal platform. . The width of the bonding pad is smaller than the width of the solid crystal platform, and the height of the bonding pad is greater than the height of the solid crystal platform. The bracket modules are arranged in an array in the frame. The reflector is disposed in the frame and covers the bracket module and exposes a portion of the upper surface of the fixed crystal platform.

According to another embodiment, the stent array for packaging a light-emitting diode of the present invention comprises a frame, a plurality of bracket modules, and a reflector. Each of the bracket modules includes two brackets, and the two brackets are arranged side by side. Each bracket includes a solid crystal platform and a bonding pad. The solid crystal platform includes an upper surface and a lower surface, and the bonding pads extend from the lower surface of the fixed crystal platform. . The width of the bonding pad is smaller than the width of the bonding platform. The bonding platform has an outer side and an inner side, and the vertical distance between the outer side and the bonding pad is greater than the vertical distance between the inner side and the bonding pad. The bracket modules are arranged in an array in the frame. The reflector is disposed in the frame and covers the bracket module and exposes a portion of the upper surface of the fixed crystal platform.

In summary, the present invention increases the height of the bonding pad and/or increases the vertical distance between the outer side of the bonding platform and the bonding pad to increase the bonding area of the reflector and the bracket at the corner, thereby increasing the overall bonding strength. . In addition, at least one side of the solid crystal platform of the bracket may have at least two pins protruding outward to further increase the bonding area of the reflector and the bracket, thereby increasing the bonding strength. Furthermore, the present invention can form at least one hole in the fixed crystal platform by filling the reflector in the hole, In order to further increase the degree of occlusion of the reflector and the stent, thereby increasing the bonding strength.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

1, 2‧‧‧Lighting diode device

3‧‧‧ bracket array

10, 20, 20', 20", 20'''‧‧‧ bracket modules

12, 22‧‧‧ reflectors

14, 24‧‧‧Lighting diodes

30‧‧‧Frame

32‧‧‧ cutting line

100, 200‧‧‧ bracket

102, 202‧‧‧ solid crystal platform

104, 204‧‧‧ feet

106, 206‧‧‧ joint pads

208‧‧‧ hole

1020, 2020‧‧‧ upper surface

1022, 2022‧‧‧ lower surface

1024, 2024‧‧‧ outside side

1026, 2026‧‧‧ inside side

H1, h2, H1, H2‧‧‧ height

D1, d2, D1, D2‧‧‧ vertical distance

W1, W2‧‧‧ width

A-A‧‧‧ hatching

Figure 1 is a side elevational view of a prior art light emitting diode device.

Figure 2 is a top plan view of the bracket module in Figure 1.

3 is a top plan view of a stent array for encapsulating a light-emitting diode according to a first embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view of the light-emitting diode device of Fig. 3 taken along line A-A.

Figure 5 is a top plan view of a stent module in accordance with a second embodiment of the present invention.

Figure 6 is a top plan view of a stent module in accordance with a third embodiment of the present invention.

Figure 7 is a top plan view of a stent module in accordance with a fourth embodiment of the present invention.

Referring to FIG. 3 and FIG. 4, FIG. 3 is a top plan view of a stent array 3 for encapsulating the LEDs 24 according to the first embodiment of the present invention, and FIG. 4 is a bipolar diagram of FIG. A schematic cross-sectional view of the body device 2 along the line AA. As shown in FIG. 3, the stent array 3 of the present invention can be used to simultaneously package a plurality of light-emitting diodes 24.

As shown in FIGS. 3 and 4, the stent array 3 includes a frame 30, a plurality of stent modules 20, and a reflector 22. Each of the bracket modules 20 includes two brackets 200. The two brackets 200 are juxtaposed to each other. Each bracket 200 includes a fixed crystal platform 202 and a bonding pad 206. The fixed crystal platform 202 includes an upper surface 2020 and a lower surface 2022. The bond pad 206 extends from the lower surface 2022 of the die attach platform 202, wherein the width W1 of the bond pad 206 is less than the width W2 of the die attach platform 202. In addition, each of the three sides of the solid crystal platform 202 has an outwardly projecting pin 204.

In this embodiment, the bracket module 20 can be disposed in the frame 30 in an array manner. The plurality of light emitting diodes 24 are simultaneously packaged. Adjacent bracket modules 20 are interconnected by pins 204. In addition, the peripheral bracket module 20 is coupled to the frame 30 by pins 204.

In the present invention, the bracket module 20 disposed in the frame 30 in an array manner can be etched from a metal plate (for example, a copper plate), and the frame 30 and the bracket module 20 can be integrally formed. Then, the reflector 22 is further covered by the transfer molding process, wherein the material of the reflector 22 can be a polymer material (for example, epoxy resin) or silicone. At this time, the reflector 22 is disposed in the frame 30 and covers the bracket module 20 and exposes a portion of the upper surface 2020 of the fixed crystal platform 202. Then, each of the light-emitting diodes 24 is connected across a part of the upper surface 2020 of the adjacent two-solid crystal platform 202 to encapsulate the light-emitting diodes 24. After the package is completed, it can be cut along the cutting line 32 shown in FIG. 3 to obtain a plurality of light-emitting diode devices 2. In this embodiment, the two brackets 200 of each bracket module 20 are symmetrically disposed and electrically different, and the LEDs 24 are illuminated by being connected to the electrically different two brackets 200.

In this embodiment, the height H1 of the bonding pad 206 is greater than the height H2 of the die bonding platform 202. In addition, the die bonding platform 202 has an outer side 2024 and an inner side 2026. The vertical distance D1 between the outer side 2024 and the bonding pad 206 is greater than the vertical distance D2 between the inner side 2026 and the bonding pad 206. By increasing the height H1 of the bonding pad 206 and increasing the vertical distance D1 between the outer side 2024 of the bonding platform 202 and the bonding pad 206, the present invention can effectively increase the bonding area of the reflector 22 and the bracket 200 at the corner, thereby increasing The combined strength of the overall structure. It should be noted that the present invention may also increase the height H1 of the bonding pad 206 or increase the vertical distance D1 between the outer side 2024 of the bonding platform 202 and the bonding pad 206, depending on the practical application.

Please refer to FIG. 5, which is a top plan view of a bracket module 20' according to a second embodiment of the present invention. The main difference between the bracket module 20 ′ and the bracket module 20 is that at least one side of the solid crystal platform 202 of the bracket 200 of the bracket module 20 ′ has at least two pins 204 protruding outward. In this embodiment, each of the three sides of the solid crystal platform 202 has at least two legs 204 protruding outwardly, but not limited thereto. For example, one side of the solid crystal platform 202 may have at least two pins 204 protruding outward, and the other two sides of the crystal substrate 202 may have outward A single pin 204 that protrudes. In addition, the pins 204 can be arranged at equal intervals, so that each of the pins 204 can be uniformly stressed to increase the structural strength, but the pitch design of the pins 204 is not limited thereto. The bracket module 20 of Figures 3 and 4 can be replaced by the bracket module 20' of Figure 5. Since at least one side of the solid crystal platform 202 of the bracket 200 has at least two pins 204 protruding outward, the present invention can effectively increase the bonding area of the reflector 22 and the bracket 200, thereby increasing the bonding strength. It should be noted that the components of the same reference numerals as those shown in the third and fourth figures in FIG. 5 have substantially the same principle of operation, and are not described herein again.

Please refer to FIG. 6. FIG. 6 is a top plan view of a bracket module 20" according to a third embodiment of the present invention. The main difference between the bracket module 20" and the bracket module 20 is that the bracket module 20 The solid crystal platform 202 of the bracket 200 has at least one hole 208 extending through the upper surface and the lower surface of the solid crystal platform 202. As shown in Fig. 6, the four corners of the solid crystal platform 202 of the bracket 200 have four holes 208. The hole 208 is circular. The bracket module 20 in FIGS. 3 and 4 can be replaced by the bracket module 20" in FIG. In other words, the present invention can form at least one hole 208 on the die bonding platform 202, and the reflector 22 filled in the hole 208 can further increase the bite strength of the reflector 22 and the bracket 200, thereby increasing the bonding strength. In practical applications, at least a portion of the holes 208 are filled by the reflector 22 to increase the bonding strength of the reflector 22 to the bracket 200. Preferably, the aperture 208 can be completely filled by the reflector 22. It should be noted that the number, position and shape of the holes 208 can be designed according to practical applications, and are not limited to the embodiment shown in FIG. 6 . In addition, elements of the same reference numerals as those shown in FIGS. 3 and 4 have substantially the same principle of operation, and are not described herein again.

Please refer to FIG. 7. FIG. 7 is a top plan view of a bracket module 20''' according to a fourth embodiment of the present invention. The main difference between the bracket module 20 ′′′ and the bracket module 20 ′′ described above is that the hole 208 of the bracket module 20 ′′′ is polygonal (for example, the square shown in FIG. 7 ). The components of the same reference numerals as those shown in FIG. 6 are substantially the same, and will not be described again.

In summary, the present invention increases the height of the bonding pad and/or increases the outer side of the bonding platform. The vertical distance between the edge and the bonding pad increases the bonding area of the reflector and the bracket at the corner, thereby increasing the overall bonding strength. In addition, at least one side of the solid crystal platform of the bracket may have at least two pins protruding outward to further increase the bonding area of the reflector and the bracket, thereby increasing the bonding strength. Furthermore, the present invention can form at least one hole in the solid crystal platform, and fill the reflector in the hole to further increase the bite strength of the reflector and the bracket, thereby increasing the bonding strength of the overall structure.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

2‧‧‧Lighting diode device

3‧‧‧ bracket array

20‧‧‧ bracket module

22‧‧‧ reflector

24‧‧‧Lighting diode

30‧‧‧Frame

32‧‧‧ cutting line

200‧‧‧ bracket

202‧‧‧Solid crystal platform

204‧‧‧ pins

2020‧‧‧ upper surface

A-A‧‧‧ hatching

Claims (17)

A light-emitting diode device comprises: a bracket module comprising two brackets, the two brackets being side by side, each bracket comprising a solid crystal platform and a bonding pad, the solid crystal platform comprising an upper surface and a lower surface, At least one side of the die bonding platform has at least two legs protruding outward, and the bonding pad extends from the lower surface of the die bonding platform, the width of the bonding pad being smaller than the width of the die bonding platform, the solid At least one side of the crystal platform has at least two legs protruding outward, and the height of the bonding pad is greater than the height of the solid crystal platform; a reflector covering the bracket module and exposing the solid crystal platform a portion of the upper surface; and a light emitting diode connected across the upper surface of the portion of the two solid crystal platforms. The illuminating diode device of claim 1, wherein the die bonding platform has an outer side and an inner side, and a vertical distance between the outer side and the bonding pad is greater than the inner side and the bonding pad The vertical distance between the two. The light-emitting diode device of claim 1, wherein each of the three sides of the fixed crystal platform has at least two pins protruding outwardly. The illuminating diode device of claim 1, wherein the pins are equally spaced. The light emitting diode device of any one of claims 1 to 2, wherein the die bonding platform has at least one hole, and at least a portion of the hole is filled by the reflector. The light-emitting diode device of claim 5, wherein the hole is circular or polygonal. A light-emitting diode device comprises: a bracket module comprising two brackets, the two brackets being side by side, each bracket comprising a solid crystal platform and a bonding pad, the solid crystal platform comprising an upper surface and a lower surface, At least one side of the die bonding platform has at least two pins protruding outward, and the bonding pad extends from the lower surface of the die bonding platform, and the width of the bonding pad is smaller than the width of the die bonding platform The solid crystal platform has an outer side and an inner side, and a vertical distance between the outer side and the bonding pad is greater than a vertical distance between the inner side and the bonding pad; a reflector covering the a bracket module exposing a portion of the upper surface of the solid crystal platform; and a light emitting diode bridging a portion of the upper surface of the two fixed crystal platforms. The illuminating diode device of claim 7, wherein each of the three sides of the fixed crystal platform has at least two pins protruding outwardly. The illuminating diode device of claim 7, wherein the pins are equally spaced. The light emitting diode device of claim 7, wherein the die bonding platform has at least one hole, and at least a portion of the hole is filled by the reflector. The light emitting diode device of claim 10, wherein the hole is circular or polygonal. An array of brackets for encapsulating a light-emitting diode comprises: a frame; a plurality of bracket modules, each of the bracket modules comprising two brackets, the two brackets being side by side, each bracket comprising a solid crystal platform and a bracket a bonding pad, the die bonding platform includes an upper surface and a lower surface, and at least one side of the die bonding platform has at least two pins protruding outward, and the bonding pad extends from the lower surface of the die bonding platform, The width of the bonding pad is smaller than the width of the bonding platform, the height of the bonding pad is greater than the height of the bonding platform, the bracket modules are arranged in an array in the frame; and a reflector is disposed on the frame The bracket modules are covered and exposed to expose a portion of the upper surface of the solid crystal platform. The stent array of claim 12, wherein the die bonding platform has an outer side and an inner side, and a vertical distance between the outer side and the bonding pad is greater than a vertical distance between the inner side and the bonding pad distance. An array of brackets for encapsulating a light emitting diode, comprising: a frame; a plurality of bracket modules, each of the bracket modules includes two brackets, the two brackets are juxtaposed to each other, each bracket includes a solid crystal platform and a bonding pad, the solid crystal platform includes an upper surface and a lower surface, the solid At least one side of the crystal platform has at least two legs protruding outward, and the bonding pad extends from the lower surface of the die bonding platform, the width of the bonding pad is smaller than the width of the die bonding platform, and the bonding platform Having an outer side and an inner side, the vertical distance between the outer side and the bonding pad is greater than the vertical distance between the inner side and the bonding pad, and the bracket modules are arranged in an array on the frame And a reflector disposed in the frame and covering the bracket modules and exposing a portion of the upper surface of the fixed crystal platforms. A light-emitting diode device comprises: a bracket module comprising two brackets, the two brackets being side by side, each bracket comprising a solid crystal platform and a bonding pad, the solid crystal platform comprising an upper surface and a lower surface, At least one side of the solid crystal platform has at least two legs protruding outward, and the bonding pad extends from the lower surface of the die bonding platform; a reflector covering the bracket module and exposing the a portion of the upper surface of the solid crystal platform; and a light emitting diode spanning a portion of the upper surface of the two solid crystal platforms. The illuminating diode device of claim 15, wherein the pins are equally spaced. The light emitting diode device of claim 15, wherein the die bonding platform has at least one perforation, and the perforations are filled by the reflector.