TWI563587B - Wafer carrier, apparatus and method for processing wafer - Google Patents

Wafer carrier, apparatus and method for processing wafer

Info

Publication number
TWI563587B
TWI563587B TW102103642A TW102103642A TWI563587B TW I563587 B TWI563587 B TW I563587B TW 102103642 A TW102103642 A TW 102103642A TW 102103642 A TW102103642 A TW 102103642A TW I563587 B TWI563587 B TW I563587B
Authority
TW
Taiwan
Prior art keywords
wafer
processing
carrier
wafer carrier
processing wafer
Prior art date
Application number
TW102103642A
Other languages
Chinese (zh)
Other versions
TW201430987A (en
Inventor
Wei Hsien Hsieh
Chui Fu Chiu
Original Assignee
Nanya Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanya Technology Corp filed Critical Nanya Technology Corp
Priority to TW102103642A priority Critical patent/TWI563587B/en
Publication of TW201430987A publication Critical patent/TW201430987A/en
Application granted granted Critical
Publication of TWI563587B publication Critical patent/TWI563587B/en

Links

TW102103642A 2013-01-31 2013-01-31 Wafer carrier, apparatus and method for processing wafer TWI563587B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102103642A TWI563587B (en) 2013-01-31 2013-01-31 Wafer carrier, apparatus and method for processing wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102103642A TWI563587B (en) 2013-01-31 2013-01-31 Wafer carrier, apparatus and method for processing wafer

Publications (2)

Publication Number Publication Date
TW201430987A TW201430987A (en) 2014-08-01
TWI563587B true TWI563587B (en) 2016-12-21

Family

ID=51797015

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102103642A TWI563587B (en) 2013-01-31 2013-01-31 Wafer carrier, apparatus and method for processing wafer

Country Status (1)

Country Link
TW (1) TWI563587B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4391511A (en) * 1980-03-19 1983-07-05 Hitachi, Ltd. Light exposure device and method
US4666291A (en) * 1985-04-17 1987-05-19 Hitachi, Ltd. Light-exposure apparatus
US5724121A (en) * 1995-05-12 1998-03-03 Hughes Danbury Optical Systems, Inc. Mounting member method and apparatus with variable length supports
US20070195306A1 (en) * 2006-02-20 2007-08-23 Yun Jang-Hyun Semiconductor wafer flatness correction apparatus and method
CN101916739A (en) * 2010-07-13 2010-12-15 上海技美电子科技有限公司 Wafer carrying device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4391511A (en) * 1980-03-19 1983-07-05 Hitachi, Ltd. Light exposure device and method
US4666291A (en) * 1985-04-17 1987-05-19 Hitachi, Ltd. Light-exposure apparatus
US5724121A (en) * 1995-05-12 1998-03-03 Hughes Danbury Optical Systems, Inc. Mounting member method and apparatus with variable length supports
US20070195306A1 (en) * 2006-02-20 2007-08-23 Yun Jang-Hyun Semiconductor wafer flatness correction apparatus and method
CN101916739A (en) * 2010-07-13 2010-12-15 上海技美电子科技有限公司 Wafer carrying device

Also Published As

Publication number Publication date
TW201430987A (en) 2014-08-01

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