TWI447398B - Substrate inspection device and substrate inspection method - Google Patents

Description

Substrate inspection device and substrate inspection method

The present invention relates to an inspection apparatus and an inspection method for inspecting a low temperature inspection of a test object such as a semiconductor wafer, and more particularly to a substrate inspection apparatus and substrate inspection which can stabilize the dew point in the inspection chamber and perform high-temperature inspection with high reliability. method.

In the conventional inspection apparatus, a load chamber and a probe chamber adjacent to each other are provided, and an object to be inspected (for example, a semiconductor wafer) from the load chamber is subjected to electrical property inspection in the probe chamber. The loading chamber 1 is provided with a storage unit that accommodates a plurality of inspection objects (for example, semiconductor wafers) in a cassette unit, and a wafer transfer mechanism that carries out the wafer W one by one from the cassette, and performs pre-alignment of the semiconductor wafer. Pre-alignment mechanism. The probe chamber includes a mounting table on which a semiconductor wafer is placed and has a temperature adjustment mechanism for adjusting the semiconductor wafer to a desired temperature, and a probe card having a plurality of probes disposed above the mounting table, and an execution semiconductor The alignment mechanism of the majority of the electrode pads of the wafer and the alignment of the plurality of probes is controlled by the control device, and the semiconductor wafer on the mounting table is adjusted to the desired temperature by the temperature adjustment mechanism to make the semiconductor wafer Most of the electrode pads are in electrical contact with a plurality of probes to perform electrical property inspection of a plurality of devices formed on the semiconductor wafer. In particular, when the semiconductor wafer is inspected in a negative low temperature region, the probe chamber is sealed, and the indoor air is maintained at a specific dew point to prevent frost and ice formation on the semiconductor wafer.

Moreover, there are a transport mechanism, a mounting table, etc. in the loading chamber and the probe chamber. Since the machine is driven, dust such as particles or oil mist is generated from the driving portion of the driving machine, and the inspection is poor. Therefore, an FFU (Fan Filter Unit) is generally installed in the inspection apparatus to circulate air in the inspection apparatus to remove particulates.

For example, Patent Document 1 describes a microenvironment that can be applied to an inspection device. In the micro-environment device, the FFU is attached to the upper portion of the casing that houses the transport mechanism, and the clean air is supplied to the casing by the FFU in a downflow manner, and is exhausted from the floor. Further, Patent Document 2 describes a substrate processing apparatus including an FFU. The substrate processing apparatus includes a wall surface that surrounds the processing chamber and a two-layer structure surrounding the casing, and supplies clean air from the space between the wall surfaces of the FFU attached to the ceiling of the casing, and is formed in the treatment. The four wall apertures of the chamber supply clean air into the processing chamber and form a spiral flow within the processing chamber and exhaust from the floor side.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-220773

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-034648

However, for example, when performing a low-temperature inspection of a semiconductor wafer, for example, the probe chamber is sealed, so that the conventional FFU-like clean air cannot be passed through the probe chamber in a downflow manner. Therefore, the use of the FFU allows the clean air to circulate in the form of the probe chamber. However, because the FFU has to have a large installation space and a large amount of air, there is a problem that the dew point in the probe room is unstable. question.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate inspection apparatus and a substrate inspection method which can reduce the size of a circulation device of an air, stabilize the dew point in the probe chamber, and perform low-temperature inspection with high reliability. .

The substrate inspection device according to the first aspect of the present invention is characterized in that the substrate inspection device that adjusts the electrical properties of the test object by adjusting the test object placed on the mounting table to a specific temperature in a low temperature region is provided. And a circulation device disposed along a side surface of the probe chamber and circulating dry air in the probe chamber, and a control device for controlling a machine including the circulation device and the mounting table in the probe chamber, the substrate inspection device The circulation device includes a blower unit that circulates dry air in the probe chamber, and a filter unit that removes dust from dry air circulated through the blower unit.

Further, in the substrate inspection device according to the second aspect of the invention, in the invention described in the first aspect of the invention, the means for supplying dry air to the probe chamber is provided.

Further, in the invention according to claim 1 or 2, the air blowing unit includes a first filter and a blower, and the filter unit has a first 2 filters.

Furthermore, the substrate inspection described in item 4 of the patent application scope of the present invention In the invention described in any one of claims 1 to 3, the circulation device has a heat dissipating device.

In the substrate inspection method according to the fifth aspect of the invention, the method of performing the inspection of the object to be inspected by adjusting the temperature of the object to be inspected on the mounting table to a low temperature region is performed. a probe chamber for characteristic inspection, and a circulation device disposed along a side surface of the probe chamber and circulating dry air in the probe chamber while circulating dust, and controlling a mounting table including the circulation device and the probe chamber The inspection apparatus of the control device of the apparatus performs the electrical property inspection by cooling the object to be inspected to the low temperature region, and the substrate inspection method is characterized in that the substrate is cooled to a low temperature region by using the mounting table. And a process of circulating dry air in the probe chamber using the above-described circulation device, and a process of removing dust in the dry air during the drying air cycle, and a process of controlling the air volume of the circulation device using the above control device.

Further, in the invention according to the fifth aspect of the invention, the method for inspecting the substrate according to the fifth aspect of the invention is that the discharge air amount of the circulation device to the probe chamber is set to 146 to 172L. /Minute.

Further, the substrate inspection method according to the invention of claim 5, wherein the invention of the invention of the invention is provided in the invention described in claim 5, wherein the method of supplying dry air to the probe chamber is provided.

According to the present invention, it is possible to provide a device capable of making the air circulation device small The substrate is inspected and the dew point in the probe chamber is stabilized, and a substrate inspection device and a substrate inspection method for performing low-temperature inspection with high reliability are performed.

Hereinafter, the present invention will be described based on the embodiment shown in Figs. In the drawings, Fig. 1 is a configuration diagram showing an embodiment of an inspection apparatus according to the present invention, and Fig. 2 is a front elevational view showing a part of a front surface of the inspection apparatus shown in Fig. 1, and a third view. The figure is a perspective view showing the air blowing unit shown in Fig. 1, and Fig. 4 is a perspective view showing the fan of the air blowing unit shown in Fig. 3, and Fig. 5 is an exploded view showing the filtering of the inspection apparatus shown in Fig. 1. An oblique view of the unit.

The inspection apparatus 10 of the present embodiment includes a loading chamber 11, a probe chamber 12, and a circulation device 13 as shown in Fig. 1, and the probe chamber 12 is controlled by the circulation device 13 under the control of the control device 14. The dry air inside circulates to enable the semiconductor wafer W to perform electrical property inspection while in a temperature atmosphere of a negative region. Therefore, the pipe 15 for supplying dry air is connected to the probe chamber 12, and dry air is supplied into the probe chamber 12 at the time of low temperature inspection to secure a specific dew point. After the specific dry air is filled in the probe chamber 12, the circulation device 13 is driven under the control of the control device 14 to keep the dew point in the probe chamber 12 constant. Further, in Fig. 1, 15A is a pipe for discharging the air in the probe chamber 12.

As shown in FIGS. 1 and 2, the loading chamber 11 includes a cassette housing portion for housing a cassette C for accommodating, for example, 25 semiconductor wafers W, and a semiconductor wafer W is transported one by one from the shutter C. The wafer transport mechanism 111 and the semiconductor wafer W are transported by the wafer transport mechanism 111 A pre-alignment mechanism 112 that performs pre-alignment of the semiconductor wafer W is performed.

As shown in FIGS. 1 and 2, the probe chamber 12 includes a mounting table 121 on which the semiconductor wafer W is placed, and a probe card 122 having a plurality of probes 122A disposed above the mounting table 121, and The alignment mechanism 123 for executing the alignment of the plurality of electrode pads of the semiconductor wafer W on the mounting table 121 and the plurality of probes 122A is formed under the control of the control device 14, and the mounting table 121 and the alignment mechanism 123 cooperate to execute the semiconductor. After the alignment of the majority of the electrode pads of the wafer W device and the plurality of probes 122A of the probe card 122, electrical characteristics of the devices of the semiconductor wafer W are performed. The probe chamber 12 has a structure that is kept airtight.

As shown in FIG. 2, the mounting table 121 moves the semiconductor wafer W in the X and Y directions via the XY table 124, and causes the semiconductor wafer W to face the Z direction via a lifting drive mechanism (not shown) and a θ mechanism. And moving in the θ direction. The stage 121 has a temperature adjustment mechanism (not shown) therein, and when the temperature is low temperature, the semiconductor wafer W can be cooled by the temperature adjustment mechanism to set a specific temperature in the negative region. Further, at the time of the high temperature inspection, the semiconductor wafer W is heated by the temperature adjustment mechanism to be set to a specific temperature in the high temperature region.

As shown in FIG. 2, the alignment mechanism 123 includes a first camera 123A that moves between the mounting table 121 and the probe card 122, a second camera 123B attached to the side of the mounting table 11, and a fixed first camera. The alignment bridge 123C of 123A moves a pair of left and right guide rails 123D that guide the alignment bridge 123C between the back side of the probe chamber 12 and the probe center (the extension line on the center of the probe card). The first camera 123A moves between the back side of the probe chamber and the probe center via the alignment bridge 123C and the guide rail 123D, and photographs the semiconductor wafer W on the mounting table 121 moving in the X and Y directions at the center of the probe. The second camera 123B moves directly below the probe 122A of the probe card 122 via the mounting table 121, and the probe 122A is photographed at this position.

Further, the control device 14 is mainly constituted by a computer having, for example, a program or other program for driving the circulation device 13, a memory unit (not shown) for storing various materials, and arithmetic processing and processing various materials. Central processing unit (not shown).

Further, as shown in Fig. 1, the circulation device 13 includes a blower unit 131 that circulates the dry air in the probe chamber 12 from the suction port 12A formed on the back surface of the probe chamber 12, and is present in the blower unit. The filter unit 132 that is between the 131 and the discharge port 12B formed on the back surface of the probe chamber 12 and that removes dust from the dry air during the circulation of the dry air is miniaturized so as to be disposed along the outer side of the back of the probe chamber 12. The size. Any one of the suction port 12A of the probe chamber 12, the air blowing unit 131, the air blowing unit 131, and the filter unit 132, and the filter unit 132 and the discharge port 12B of the probe chamber 12 are connected via a pipe 133.

As shown in FIGS. 1 to 3, the air blowing unit 131 includes a first filter (hereinafter referred to as a "pre-filter") 134, a blower (fan) 135, and a first housing that houses the first housing. 136 is mounted on the back of the probe chamber 12. The pre-filter 134 is a filter that removes dust such as fine particles or oil mist having a relatively large particle diameter by the air sucked from the probe chamber 12 by the fan 135, and reduces the load on the filter 132. As the pre-filter 134, for example, an air filter for coarse dust is used.

As shown in FIG. 3 and FIG. 4, the first casing 136 is a main body 136A that is open in a rectangular shape and houses the two fan 135, and the upper surface of the sealed body 136A is opened and covered to be mounted on the two fans. The lid body 136B of the pre-filter 134 on the suction side of the 135 is configured to be airtight. As shown in Fig. 3, the main body 136A has a rectangular frame body 136C and a plate member 136D that is detachably attached to five openings other than the upper opening of the frame body 136C. A pipe connecting member 133A on the discharge side of the fan 135 is attached to the plate member 136D which forms one side of the main body 136A. Further, as shown in Fig. 3, the lid body 136B has a rectangular portion 136E for accommodating the pre-filter 134 on the side connected to the main body 136A, and is continuously provided from the upper surface of the rectangular portion 136E to the upper side. The quadrangular frustum portion 136F. A pipe connecting member 133B on the suction side of the fan 135 is attached to the quadrangular frustum portion 136F. The two fans 135 are arranged in parallel with the plate member 136D fixed to the bottom surface of the main body 136A by the attachment member 136G as shown in Fig. 4 . Further, in Fig. 3, a plate member 136D on one side is omitted for partially indicating the inside of the body 136A.

The fan 135 is connected to the power supply circuit 138 via the switch circuit 137 as shown in Fig. 1. The switching circuit 137 and the power supply circuit 138 are under the control of the control device 14. Then, the amount of wind of the fan 135 is controlled by the control device 14 controlling the voltage of the power supply circuit 138. The fan 135 uses a small fan. Since the small fan 135 has a small air volume, it is difficult for one fan 135 to stably maintain the dew point (for example, -70 ° C) of the dry air in the negative temperature region in the probe chamber 12. Therefore, in the present embodiment, two fans 135 are used. When the amount of wind of the fan 135 becomes large, it is difficult to increase the amount of circulating air in the probe chamber 12 to ensure a stable dew point.

The pre-filter 134 of the air blowing unit 131 is configured to remove dust such as particles or oil mist having a relatively large particle diameter from the air sucked from the suction port 12A of the probe chamber 12, and to reduce the load of the filter unit 132. Device. As such a filter, for example, an air filter for coarse dust or the like is used.

The filter unit 132 includes a second filter (main filter) 139 and a second case 140 that houses the main filter 139 as shown in Figs. 1 and 5, and is disposed, for example, on the back surface of the probe chamber 12. It is installed below the air blowing unit 131. The main filter 139 is a filter that removes particles or oil mist having a small particle diameter remaining in the dry air passing through the air blowing unit 131. As the main filter 139, for example, a HEPA filter or the like is used.

As shown in FIG. 5, the second casing 140 is formed by fitting the members 140A and 140B which are formed in a rectangular funnel shape to the opening sides of the respective diameter-expanding paths, and has a structure in which the inside is airtight. A flat rectangular space is formed in the intermediate portion of the second casing 140, and the main filter 139 is housed in the space. The funnel-shaped member 140A on the upper side is formed on a quadrangular frustum, and a connecting member 133C for connecting to a pipe 133 that communicates with the two fans 135 is attached to the funnel portion. The funnel-shaped member 140B on the lower side is formed on a quadrangular frustum deeper than the upper side, and a connecting member 133D for connecting to the pipe 133 that communicates with the discharge port 12B of the probe chamber 12 is attached to the lower surface.

Further, a heat sink (not shown) may be provided between the air blowing unit 131 and the filter unit 132. In this way, by providing the heat sink, even if the temperature of the dry air is raised during the passage of the air blowing unit 131, the temperature of the dry air can be lowered by the heat sink to stabilize the temperature of the dry air in the probe chamber 12. Further, although not shown, a dew point meter under the control of the control device 14 is provided in the probe chamber 12, and the dew point monitors the dew point in the probe chamber 12 so that the dew point in the probe chamber 12 becomes slightly In a certain way, it is controlled by the control device 14.

Since the circulation device 13 has the above configuration, even if dust such as particles or oil mist is generated in the probe chamber 12, the dry air in the probe chamber 12 is circulated by the fan 135 under the control of the control device 14. During the circulation of the dry air 14, the pre-filter 134 and the main filter 139 remove the dust in two stages, and the dry air in the probe chamber 12 can be cleaned and the dry air in the probe chamber 12 is cleaned. The dew point remains slightly constant and the reliability of the inspection can be improved.

Next, an embodiment of the inspection method of the present invention using the above-described inspection apparatus 10 will be described.

First, under the control of the control device 14, the wafer transfer mechanism 111 in the load chamber 11 is driven, and one semiconductor wafer W is carried out from the cassette C, pre-aligned by the pre-alignment mechanism 112, and then transported to the probe. The chamber 12 is placed on the mounting table 121. At this time, in the probe chamber 12, the pipes 15 and 15A are replaced with dry air. The dew point of the dry air is adjusted to, for example, -70 °C.

When the wafer W is placed on the mounting table 121, the temperature adjustment mechanism of the mounting table 121 cools the semiconductor wafer W on the mounting table 121, and is set to, for example, -60 °C. During this period, the circulation device 13 is driven, and the two fans 135 circulate the dry air in the probe chamber 12 by the air volume shown in Table 1. The air volume is preferably in the range of 128 to 150 L/min on the suction side and 146 to 172 L/min in the discharge side. The difference between the air volume on the discharge side and the air volume on the suction side is caused by the pressure loss in the pre-filter 134 or the like. By circulating the dry air by the above air volume, it is possible to prevent the deterioration of the leak point of the dry air in the probe chamber 12 and stabilize the desired dew point. When the air volume of the two fans 135 is out of the above range, the dew point of the dry air in the probe chamber 12 becomes unstable, which is not preferable. The circulating air volume of the dry air is appropriately adjusted by the volume inside the probe chamber 12. Further, when the volume of the air volume probe chamber 12 is 400 L.

By performing the electrical characteristic inspection of the semiconductor wafer W while circulating the dry air with the above air volume, the inspection can be performed in a clean dry air atmosphere having a frequently stable dew point, and the inspection with high reliability can be performed.

Further, by providing a heat sink between the air blowing unit 131 and the filter unit 132, the dew point in the probe chamber 12 can be made more stable.

As described above, according to the present embodiment, the circulation device 13 including the probe chamber 12 and the back surface of the probe chamber 12 and circulating the dry air in the probe chamber 12 is used, and The inspection device 10 that controls the control device 14 of the device including the circulation device 13 and the mounting table 121 in the probe chamber 12, and when the semiconductor wafer W is cooled to a low temperature region to perform electrical property inspection, is provided with the use mounting table 121. a process of cooling the semiconductor wafer W to a low temperature region by the temperature adjustment mechanism, a process of circulating the dry air in the probe chamber 12 using the circulation device 13, and a process of removing dust in the dry air during the circulation of the dry air, Since the control device 14 controls the amount of the air volume of the circulation device 13, the dew point can be stabilized and dried in a clean manner by miniaturizing the circulation device 13 and preventing deterioration of the dew point of the dry air in the probe chamber 12. Perform high-reliability inspections in an air atmosphere.

Further, according to the present embodiment, since the pipe 15 for supplying dry air to the probe chamber 12 is provided, a dry air atmosphere having a specific dew point in the probe chamber 12 can be formed in a short time. Further, since the circulation device 13 is provided with a heat sink, the dew point of the dry air in the probe chamber 12 can be made more stable.

Further, in the above embodiment, the air blowing unit 131 including the two fans 135 will be described. However, the number of the fans 135 can be appropriately changed in accordance with the capacity of the probe chamber 12. Further, in the above-described embodiment, the air blowing unit 131 including the pre-filter 134 is described. However, even when it is difficult to generate dust in the probe chamber 12, the pre-filter 134 is not provided. can. Further, in the above embodiment, the case where the air in the probe chamber is circulated is described, but the air in the load chamber may be circulated at the same time.

[Industry use feasibility]

The present invention can be suitably used for an inspection apparatus and an inspection method for inspecting an object to be inspected such as a semiconductor wafer.

10. . . Inspection device

12. . . Probe room

13. . . Circulator

14. . . Control device

15. . . Means of supplying dry air

121. . . Mounting table

131. . . Air supply unit

132. . . Filter unit

134. . . Pre-filter (1st filter)

139. . . Main filter (2nd filter)

W. . . Semiconductor wafer (inspected body)

Fig. 1 is a configuration diagram showing an embodiment of an inspection apparatus of the present invention.

Fig. 2 is a front elevational view showing a part of the front surface of the inspection apparatus shown in Fig. 1.

Fig. 3 is a perspective view of the air blowing unit shown in Fig. 1.

Fig. 4 is a perspective view of the fan of the air blowing unit shown in Fig. 3.

Fig. 5 is a perspective view showing the filter unit of the inspection apparatus shown in Fig. 1 in an exploded manner.

10. . . Inspection device

11. . . Loading room

12. . . Probe room

12A. . . Attraction

12B. . . Spit

13. . . Circulator

14. . . Control device

15. . . Piping

15A. . . Piping

111. . . Wafer handling mechanism

112. . . Pre-alignment mechanism

121. . . Mounting table

131. . . Air supply unit

132. . . Filter unit

133. . . Piping

134. . . Prefilter

135. . . fan

137. . . Switch circuit

138. . . Power circuit

139. . . Main filter

W. . . Semiconductor wafer

Claims (7)

A substrate inspection device includes a probe chamber that performs a specific temperature of a test object by adjusting a test object placed on a mounting table to a specific temperature in a low temperature region, and a side surface along the probe chamber a circulation device configured to circulate dry air in the probe chamber, and a control device for controlling a device including the circulation device and the mounting table in the probe chamber, wherein the substrate inspection device is characterized in that the circulation device is provided with The air blowing unit that circulates the dry air in the probe chamber and the filter unit that removes dust from the dry air circulated through the air blowing unit. The substrate inspection device according to claim 1, wherein a means for supplying dry air to the probe chamber is provided. The substrate inspection device according to the first or second aspect of the invention, wherein the air blowing unit includes a first filter and a blower, and the filter unit has a second filter. The substrate inspection device according to claim 1 or 2, wherein the circulation device has a heat dissipation device. A method for inspecting a substrate, wherein a probe chamber for performing electrical property inspection of the object to be inspected is provided with a specific temperature at which a test object placed on the mounting table is adjusted to a low temperature region, and a probe chamber along the probe chamber Arranged on the side and circulates the dry air in the probe chamber while dusting The circulation device and the inspection device for controlling the control device including the circulation device and the device of the mounting table in the probe chamber, wherein the inspection object is cooled to the low temperature region to perform electrical property inspection, and the substrate inspection method is characterized by: There is provided a process of cooling the object to be tested to a low temperature region using the above-described mounting table, a process of circulating dry air in the probe chamber using the circulation device, and a process of removing dust in the dry air during the drying air cycle. And a project for controlling the air volume of the above-described circulating device using the above control device. The substrate inspection method according to the fifth aspect of the invention, wherein the discharge device has a discharge air volume of the probe chamber of 146 to 172 L/min. The substrate inspection method according to claim 5, wherein the method of supplying dry air to the probe chamber is provided.