TWI420616B - Substrate cleaning apparatus and method for cleaning substrate - Google Patents

Description

Substrate cleaning machine and substrate cleaning method

The invention relates to a cleaning machine and a cleaning method, and in particular to a substrate cleaning machine and a substrate cleaning method.

Due to the rapid advancement of flat panel display technology, its applications have gradually extended from computer screens to home TVs. In the case of a thin film transistor liquid crystal display (TFT-LCD) process, the cleaning step is often connected to before, during, and after the steps of coating, lithography, and etching to maintain the surface cleanliness of the display substrate during production.

The cleaning method of the substrate surface includes chemical and physical cleaning methods. For example, it is a physical cleaning method to scrub the surface of the substrate with the cilia on the surface of the brush wheel in rotation to achieve cleaning. At present, the wet cleaning equipment used for cleaning the surface of the substrate is mainly after the surface of the substrate is sprayed with pure water, and then the surface of the substrate is cleaned by contact type polishing, and then the surface of the substrate is treated by using a gas knife gas or the like. The residual liquid on it is blown dry.

However, the cleaning effect of cleaning the surface of the substrate on which the film layer has been formed by the above conventional cleaning method accounts for about 1% to 1.5% of the defect rate of the existing product in production. That is to say, when the substrate is subjected to the cleaning process by the above-described cleaning method, it is easy to cause damage to the formed film layer on the substrate during the cleaning process, thereby causing an increase in the defect rate of the product.

The invention provides a substrate cleaning machine table, which can effectively remove particles and dirt on the substrate to protect the surface of the substrate from damage, thereby achieving a better cleaning effect.

The present invention further provides a substrate cleaning method which is suitable for the above-described machine and which has the above advantages.

The present invention provides a substrate cleaning machine that includes a first support member, a second support member, a continuous fabric, and a nozzle. The first support member and the second support member are respectively disposed on the traveling path of the substrate, and the substrate is adapted to sequentially pass over the first support member and the second support member along the traveling path. The continuous web is adapted to advance in the feed direction and the feed direction is opposite to the direction of movement of the substrate. The first support member and the second support member bear against the continuous fabric to form a first cleaning zone and a second cleaning zone, respectively, on the path of travel. The nozzle is adapted to spray the cleaning fluid onto the continuous fabric of the first cleaning zone.

In an embodiment of the invention, the cleaning liquid comprises an organic solvent.

In an embodiment of the invention, the first support member or the second support member comprises a roller.

In an embodiment of the invention, the continuous fabric comprises a dust-free cloth.

In an embodiment of the invention, the substrate cleaning machine further includes a first static elimination device disposed on the travel path and located before the first support member. In an embodiment of the invention, the substrate cleaning machine further includes a contact dust removing device disposed on the traveling path and located between the first static eliminating device and the first supporting member.

In an embodiment of the invention, the substrate cleaning machine further includes a Duster Roller disposed on the travel path and located behind the second support member. In an embodiment of the invention, the substrate cleaning machine further includes a second static elimination device disposed on the travel path and behind the cleaning adhesive wheel.

In an embodiment of the invention, the substrate cleaning machine further includes a reclaiming device disposed at a starting position of the traveling path for acquiring the substrate.

The present invention further provides a substrate cleaning method suitable for use in a substrate cleaning machine for cleaning a substrate, wherein the substrate cleaning machine includes a first support member, a second support member, and a continuous fabric disposed on a travel path of the substrate. The continuous fabric is supported by the first support member and the second support member to form a first cleaning zone and a second cleaning zone, respectively, on the travel path. The substrate cleaning method includes the following steps. First, the cleaning liquid is sprayed onto the continuous fabric of the first cleaning zone. Then, the substrate is sequentially passed through the first cleaning zone and the second cleaning zone along the traveling path while the continuous fabric is advanced in a feeding direction, wherein the feeding direction is opposite to the moving direction of the substrate.

In an embodiment of the invention, the method further includes the step of cleaning the adhesive wheel on the travel path, and cleaning the substrate by the step of cleaning the adhesive wheel after the substrate is cleaned by the second cleaning zone.

In an embodiment of the invention, the method further includes the second static elimination step on the travel path, and performing a second static elimination step on the substrate before the substrate enters the first cleaning area for cleaning.

In an embodiment of the invention, the method further includes a first static elimination step on the travel path, and performing a first static elimination step on the substrate before the substrate enters the first cleaning area for cleaning.

In an embodiment of the invention, the method further includes a contact dust removal step on the travel path, and performing a contact dust removal step on the substrate after the substrate performs the first static elimination step and before the substrate enters the first cleaning region cleaning. .

Based on the above, the substrate cleaning machine of the present invention can sequentially pass the first cleaning zone and the second cleaning zone, so that the continuous fabric located on the first cleaning zone and the continuous fabric located on the second cleaning zone can be The surface of the substrate is cleaned. Wherein, the nozzle sprays the cleaning liquid on the continuous fabric of the first cleaning zone, so that the substrate can be effectively removed after the first substrate and the second cleaning zone are sequentially passed through without protecting the substrate surface from damage. The particles on the substrate are dirty and get a better dust removal effect. Especially for cleaning substrates with exposed electrodes or special film layers, it has better cleaning and dust removal performance.

In addition, the present invention also provides a substrate cleaning method for the above substrate cleaning machine, which can perform a cleaning process on the substrate, so that the substrate can be prevented from being damaged during the cleaning process and at the same time achieving better Dust removal effect.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a schematic view of a substrate cleaning machine according to an embodiment of the present invention, FIG. 2 is a partial schematic view of the substrate cleaning machine of FIG. 1, and FIG. 3 is a flow chart of a substrate cleaning method suitable for the cleaning machine of FIG. Figure. Referring to FIG. 1 and FIG. 2 simultaneously, the substrate cleaning machine 100 of the present embodiment includes a first support member 110, a second support member 120, a continuous fabric 130, and a nozzle 140. The first support member 110 and the second support member 120 are respectively disposed on the traveling path P1 of the substrate 150, and the substrate 150 is adapted to sequentially pass over the first support member 110 and the second support member 120 along the traveling path P1. In the embodiment, the first support member 110 and the second support member 120 are illustrated by rollers, but are not limited thereto. In addition, the number of the first support members 110 of the present embodiment is illustrated by at least two, as shown in FIGS. 1 and 2. In addition, the substrate 150 of the embodiment may be a glass substrate, an active device array substrate, or other suitable substrate. The present embodiment is illustrated by cleaning the substrate with the exposed electrode.

With continued reference to FIGS. 1 and 2, the continuous fabric 130 is adapted to advance along the feed direction D1, and the feed direction D1 is opposite to the direction of movement D2 of the substrate 150. The first support member 110 and the second support member 120 bear against the continuous fabric 130 to form a first cleaning zone C1 and a second cleaning zone C2, respectively, on the travel path P1, as shown in FIG. Additionally, the nozzle 140 is adapted to spray the cleaning fluid 142 onto the continuous fabric 130 of the first cleaning zone C1. In the present embodiment, the continuous fabric 130 is exemplified by a dust-free cloth, and the cleaning liquid 142 may be an organic solvent, wherein the organic solvent may be alcohol or acetone.

In detail, when the substrate 150 moves in the moving direction D2 in the traveling path P1, the substrate 150 sequentially passes through the first cleaning area C1 and the second cleaning area C2, wherein the nozzle 140 is sprayed with such as alcohol or acetone. The cleaning liquid 142 is on the continuous fabric 130 located in the first cleaning zone C1. Therefore, when the substrate 150 passes through the first cleaning zone C1, the continuous fabric 130 located on the first cleaning zone can clean the adhesive residue on the surface of the substrate 150. Or foreign matter adhered to the surface of the substrate 150. That is, when the substrate 150 passes through the first cleaning zone C1, the substrate cleaning machine 100 can clean the surface of the substrate 150 in a wet cleaning manner.

In addition, when the substrate 150 passes through the first cleaning zone C1 and enters the second cleaning zone C2, since the nozzle 140 only sprays the cleaning liquid 142 to the first cleaning zone C1, the continuous fabric 130 located on the second cleaning zone C2 is It will be in a dry state (eg dry clean cloth). Since the substrate 150 may have debris of the continuous fabric 130 (such as fibers of the dust-free cloth) after passing through the first cleaning zone C1, the substrate 150 passing through the second cleaning zone C2 is continuous on the second cleaning zone C2. The fabric 130 can clean the substrate 150 to leave debris of the continuous fabric 130 after passing through the first cleaning zone C1, and wipe the cleaning liquid 142 on the substrate 150 to prevent the cleaning solution 142 from being wiped dry.

It should be noted that since the debris containing the cleaning liquid 142 may adhere to the surface of the substrate 150 after the cleaning liquid 142 is dried, the continuous fabric 130 located in the second cleaning zone C2 may also provide external force on such debris. The adhesion between it and the surface of the substrate 150 is weakened, and such debris is carried away from the surface of the substrate 150 by a subsequent cleaning mechanism. In other words, the substrate cleaning machine 100 of the present embodiment may further include a cleaning roller 160 (Duster Roller) disposed on the traveling path P1 and located behind the second support member 120, as shown in FIG. In the present embodiment, the cleaning adhesive wheel 160 can be used to clean the substrate 150 from debris or foreign matter remaining on the substrate 150 after passing through the second cleaning zone C2.

In addition, in order to further clean the foreign matter that may remain on the substrate 150, the substrate cleaning machine 100 may further include a second static elimination device 170 disposed on the traveling path P1 and located behind the cleaning adhesive wheel 160, as shown in FIG. Show. In this embodiment, after the substrate 150 passes through the cleaning roller 160, most of the foreign matter remaining on the substrate 150 should be removed, but some of the particles may be electrostatically adsorbed on the surface of the substrate 150 and may remain on the substrate. 150, on the surface, therefore, in order to further clean the substrate 150, the substrate cleaning machine 100 can eliminate the electrostatic adsorption force between the particles and the surface on the surface of the substrate 150 by using the second static elimination device 170, and the static elimination device The 170 may contain a dust suction device (not shown) for further removing particles on the surface of the substrate 150.

In addition, before the substrate 150 is transferred to the first support member 110 and the second support member 120, the substrate cleaning machine 100 can perform an initial cleaning operation on the substrate 150, for example, first cleaning the electrostatic particles or other dust on the substrate 150. . In other words, the substrate cleaning machine 100 may further include a first static electricity eliminating device 180 and a contact dust removing device 190, wherein the first static electricity eliminating device 180 is disposed on the traveling path P1 of the substrate 150 and located before the first supporting member 110, and contacts The dust removing device 190 is also disposed on the traveling path P1 of the substrate 150 and located between the first static eliminating device 180 and the first support member 110, as shown in FIG.

In this embodiment, before the substrate 150 is transferred to the first cleaning area C1, the first static elimination device 180 can be used to eliminate static electricity on the surface of the substrate 150, so that the particles on the substrate 150 cannot generate static electricity with the surface of the substrate 150. The first static eliminating device 180 may also include a dust removing device (not shown) to further remove the particles located on the surface of the substrate 150. Likewise, in order to minimize the surface of the substrate 150 before it is transferred to the first cleaning zone C1, the substrate cleaning machine 100 can also use the contact dust removal device 190 to remove particles on the surface of the substrate 150. The contact dust removing device 190 may include a brush (not shown) and a dust collecting device (not shown), wherein the brush is adapted to provide an external force to adhere to the surface of the substrate 150 to reduce the adhesion between the particles and the surface. And the dust suction device further removes particles adhering to the surface of the substrate 150.

In the embodiment, the substrate cleaning machine 100 further includes a reclaiming device 102 disposed at a starting position of the traveling path P1 for acquiring the substrate 150, as shown in FIG. In the present embodiment, the reclaiming device 102 is mainly used to acquire the substrate 150, and the substrate 150 is placed at the starting position of the traveling path P1, so that the substrate 150 can be moved on the traveling path P1, thereby After passing through the cleaning mechanisms 180, 190, 110, 120, 160, and 170 described above, the surface of the substrate 150 can be protected from damage and a better dust removal effect can be achieved.

In the substrate cleaning machine 100, since the substrate 150 passes through the first cleaning area C1 and the second cleaning area C2 in sequence, the nozzle 140 sprays the cleaning liquid 142 on the continuous fabric 130 of the first cleaning area C1, so the first The continuous fabric 130 on the cleaning zone C1 and the continuous fabric 130 on the second cleaning zone C2 sequentially clean the surface of the substrate 150 to protect the surface of the substrate 150 from damage and at the same time achieve better dust removal effect, especially in applications. It has better cleaning and dust removal performance on the substrate with exposed electrode or special film layer.

In addition, the substrate 150 may be configured with a cleaning mechanism before or after sequentially passing through the first cleaning area C1 and the second cleaning area C2 to perform front-end cleaning or back-stage cleaning on the substrate 150, respectively, such as cleaning the sticky wheel 160 and the second. The electrostatic elimination device 170, the first static elimination device 180, and the contact dust removal device 190 are disposed such that the cleaning effect of the substrate cleaning machine 100 on the substrate 150 can be further improved, thereby effectively reducing the number of particles on the substrate 150 and The overall cleanliness of the substrate 150 is improved.

Based on the above, please refer to FIG. 1 , FIG. 2 and FIG. 3 simultaneously. This embodiment also proposes a substrate cleaning method which is applied to the substrate cleaning machine 100 described above to clean the substrate 150 described above. In the embodiment, the substrate cleaning method includes at least the following steps.

First, in step 301 of FIG. 3, the cleaning liquid 142 described above is sprayed onto the continuous fabric 130 of the first cleaning zone C1. Then, in step 302 of FIG. 3, the substrate 150 is sequentially passed through the first cleaning area C1 and the second cleaning area C2 along the traveling path P1, and at the same time, the continuous fabric 130 is advanced along the feeding direction D1, wherein the feeding is performed. The direction D1 is opposite to the moving direction D2 of the substrate 150.

In the method of cleaning the substrate in the embodiment, after the substrate 150 passes through the second cleaning area C2, the cleaning roller step is performed by the cleaning cleaning wheel 160 to clean the substrate 150, wherein the cleaning adhesive wheel 160 is set. On the travel path P1 and after the second support member 120, as shown in step S303 of FIG.

In addition, after the step of cleaning the adhesive wheel to clean the substrate 150, the second static elimination step is performed on the substrate by the second static elimination device 170, wherein the second static elimination device 170 is disposed on the travel path P1 and located at After cleaning the adhesive wheel 160, the steps S304 of FIG. 1 and FIG. 3 are shown.

In this embodiment, the cleaning method may further include performing a first static elimination step on the substrate 150 using the first static elimination device 180 before the substrate 150 enters the first cleaning area C1, wherein the first static elimination device The 180 is disposed on the travel path P1 and located before the first support member 110, as shown in step S305 of FIGS. 1 and 3.

In this embodiment, the cleaning method may further perform a contact dust removal step on the substrate using the contact dust removing device 190 after the substrate performs the first static elimination step and before the substrate enters the first cleaning region, wherein the contact method The dust removing device 190 is disposed on the traveling path P1 and located between the first static electricity eliminating device 180 and the first support member 110, as shown in step S306 of FIGS. 1 and 3.

In the embodiment, the cleaning method may further include: acquiring the substrate 150 by using the picking device 102, and setting the substrate 150 in the traveling path before performing the first static eliminating step on the substrate 150 by using the first static eliminating device 180. At the starting position of P1, as shown in steps S307 of Figs. 1 and 3.

In summary, the substrate cleaning machine and the substrate cleaning method of the present invention have at least the following advantages. First, the substrate cleaning machine sequentially passes the first cleaning zone and the second cleaning zone, so that the continuous fabric located on the first cleaning zone and the continuous fabric located on the second cleaning zone can sequentially face the substrate. The surface is cleaned. Wherein, since the nozzle sprays the cleaning liquid on the continuous fabric of the first cleaning area, the substrate can be effectively protected from the damage of the surface of the substrate after sequentially passing through the first cleaning area and the second cleaning area. The particles and dirt on the substrate are removed to achieve a better dust removal effect. Especially for cleaning substrates with exposed electrodes or special film layers, it has better cleaning and dust removal performance.

In addition, the substrate cleaning machine may be configured with a cleaning mechanism to perform front cleaning or rear cleaning on the substrate before or after the first cleaning area and the second cleaning area are sequentially passed through the substrate, wherein the cleaning mechanism may be clean and sticky. Wheel, first static elimination device, second static elimination device, and contact dust removal device. In this way, the cleaning effect of the substrate cleaning machine on the substrate can be further improved, and the number of particles on the substrate can be effectively reduced to improve the cleanliness of the entire substrate. The invention also provides a substrate cleaning method for the above substrate cleaning machine, which can perform a cleaning process on the substrate, so that the substrate can be prevented from being damaged during the cleaning process and at the same time achieve better dust removal effect. .

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

100. . . Substrate cleaning machine

102. . . Reclaiming device

110. . . First support

120. . . Second support

130. . . Continuous fabric

140. . . nozzle

142. . . Cleaning fluid

150. . . Substrate

160. . . Cleaning the sticky wheel

170. . . Second static elimination device

180. . . First static elimination device

190. . . Contact dust collector

C1. . . First cleaning area

C2. . . Second cleaning area

D1. . . Feed direction

D2. . . Direction of movement

P1. . . Travel path

S301～S307. . . step

1 is a schematic view of a substrate cleaning machine in accordance with an embodiment of the present invention.

2 is a partial schematic view of the substrate cleaning machine of FIG. 1.

3 is a flow chart showing the steps of a substrate cleaning method suitable for the cleaning machine of FIG. 1.

110. . . First support

120. . . Second support

130. . . Continuous fabric

140. . . nozzle

142. . . Cleaning fluid

150. . . Substrate

C1. . . First cleaning area

C2. . . Second cleaning area

D1. . . Feed direction

D2. . . Direction of movement

P1. . . Travel path

Claims (14)

A substrate cleaning machine includes: a first support member and a second support member respectively disposed on a travel path of a substrate, and the substrate is adapted to sequentially pass the first support member along the travel path Above the second support member; a continuous fabric adapted to advance in a feeding direction opposite to a moving direction of the substrate, and the first support member and the second support member bear against the continuous fabric Forming a first cleaning zone and a second cleaning zone on the traveling path, respectively; and a nozzle adapted to spray a cleaning liquid on the continuous fabric of the first cleaning zone. The substrate cleaning machine of claim 1, wherein the cleaning liquid comprises an organic solvent. The substrate cleaning machine of claim 1, wherein the first support member or the second support member comprises a roller. The substrate cleaning machine of claim 1, wherein the continuous fabric comprises a dust-free cloth. The substrate cleaning machine of claim 1, further comprising a Duster Roller disposed on the traveling path and located behind the second support member. The substrate cleaning machine of claim 1, further comprising a first static elimination device disposed on the travel path and located before the first support member. The substrate cleaning machine of claim 6, further comprising a contact dust removing device disposed on the traveling path and located between the first static eliminating device and the first supporting member. The substrate cleaning machine of claim 5, further comprising a second static elimination device disposed on the traveling path and located behind the cleaning adhesive wheel. The substrate cleaning machine of claim 1, further comprising a reclaiming device disposed at a starting position of the traveling path for acquiring the substrate. A substrate cleaning method is applied to a substrate cleaning machine for cleaning a substrate, the substrate cleaning machine comprising a first support member, a second support member and a continuous fabric disposed on a traveling path of the substrate. The continuous fabric is supported by the first support member and the second support member to respectively form a first cleaning area and a second cleaning area on the traveling path. The substrate cleaning method includes: spraying a cleaning liquid on the On the continuous fabric of the first cleaning zone; and sequentially passing the substrate along the travel path through the first cleaning zone and the second cleaning zone while advancing the continuous fabric in a feed direction, wherein the feeding The direction is opposite to a direction of movement of the substrate. The substrate cleaning method of claim 10, further comprising a step of cleaning the adhesive wheel on the traveling path, after the substrate is cleaned by the second cleaning area, cleaning the substrate by the cleaning adhesive wheel step . The substrate cleaning method of claim 10, further comprising a second static elimination step on the traveling path, performing the first static elimination step on the substrate before the substrate enters the first cleaning area for cleaning . The substrate cleaning method of claim 11, further comprising a first static elimination step on the travel path and after the cleaning adhesive wheel step to clean the substrate by the cleaning adhesive wheel step Thereafter, the first static elimination step is performed on the substrate. The substrate cleaning method of claim 13, further comprising a contact dust removing step on the traveling path, after the substrate performs the first static elimination step and before the substrate enters the first cleaning area cleaning And performing the contact dust removal step on the substrate.