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六、發明說明： 【發明所屬之技術領域】 [0001]本發明涉及一種脆性材料基板切割方法，特別係一種雷 射切割脆性材料基板之切割方法。 【先前技術】 [匿]隨著技術的不斷發展，液晶顯示裝置（TFT_LCD)由於其 自身特性已廣泛應用於消費領域内。液晶顯示裝置通常 由兩塊玻璃基板、收容於兩塊玻璃基板内之液晶及若干 電路組成。液晶可以於電場影響下改變排列方式來進行 元成顯不動作。為了形成不同尺寸之液晶顯示面板，通 常需要對較大之液晶顯示面板進行切割以滿足不同需求 [0003] 採用雷射切割玻璃基板的過程中，大都以刀輪、鑽石刀 或氣體雷射先行於玻璃基板表面産生預切割線，隨即以 雷射光束加熱基板表面，再以冷卻液冷卻基板表面。完 成上述過程後，玻璃基板會因急劇產生之溫度差而產生 應力之變化，使先前由刀輪、鑽石刀或氣體雷射於坡壤 基板表面所産生之預切割線產生裂紋並向下成長，進而 貫穿整個基板斷面使其完全開裂。 [0004] 然而，在此雷射切割玻璃基板方法中，刀輪或鑽石刀於 玻璃基板表面形成預切割線時會於玻璃基板上産生中央 裂痕（Median Crack)、徑向裂痕（Radial Crack)及橫 向裂痕（Lateral Crack)，上述各種裂痕通常被稱之& 一次微裂痕（First Micro-Chipping)，其可能會造成 材料表面的損傷，採用氣體雷射於玻璃基板表面形成預 09513043^^^^ A0101 第3頁/共13頁 1013015354-0 1362370 101年.01月13日修正替换英 切割線時也會出現同樣的問題。另，根據脆性材料破壞 力學理論（Griffith，s law): [0005] σ f = klc/(Y*c)i/2 [0006] 其中，σ為材料之破壞強^ ; k為材料之破裂韌性，係 1 1 c 材料的一種本質特性；γ為常數，與裂痕之幾何形狀有關 ，當裂痕為橢圓時，γ= π ;C為裂痕尺寸大小。 [0007] 由於刀輪或鑽石刀切割時産生一次微裂痕，使得C值很大 ’又因為材料之破壞強度變小則玻璃基板強度隨之下降 ’這樣就很容易使玻璃基板受到嚴重的損傷，影響玻璃 基板之品質。隨著玻璃基板厚度越來越薄，切割時所産 生之裂痕就更加容易産生。可見，上述雷射切割方法會 對玻璃基板産生較大損傷，進而影響到産品良率。 [0008] 有繁於此，有必要提供一種脆性材料基板切割方法以克 服上述不利情況的發生。 【發明内容】 [0009] 以下將以實施例說明一種脆性材料基板切割方法。 [0010] 该脆性材料基板切割方法包括以下步驟：提供一個脆性 材料基板；利用第一雷射光束於該脆性材料基板表面形 成預切割線，該第一雷射光束係由固態雷射器産生；利 用第二雷射光束沿著預切割線加熱該脆性材料基板，該 第二雷射光束於該脆性材料基板表面預切割線位置形成 之光斑為橢圓形，該光斑之長軸與短軸分別平行及垂直 於預切割線之延伸方向；沿著預切割線噴射冷卻流體於 脆性材料基板表面以使該脆性材料基板沿預切割線開裂 〇9513〇43#單編號 AOl〇1 笛 4 百，“， 1013015354-0 1362370 101年.01.月13日俊正替换頁 ，該冷卻流體到達該脆性材料基板表面之位置與橢圓形 光斑中心的距離小於50毫米。 [0011]相較於先如技術，所述脆性材料基板切割方法利用固態 雷射器産生之雷射光束於脆性材料基板上形成預切割線 ，其可避免利用傳統刀輪或鑽石刀，甚至氣體雷射光束 來形成預切割線所産生微裂痕之缺陷，進而可保證切割 品質，提南産品良率。 【實施方式】 [0012] 下面結合附圖對本發明作進一步詳細說明。 [0013] 請參考圖1，本發明實施例提供之脆性材料基板切割方法 ，其包括以下步驟： [0014] (1)提供一個脆性材料基板20，該脆性材料基板2〇可以為 玻璃基板、陶瓷基板、石英基板、矽晶片（SiHc〇n Wafer)等。 [0015] (2)利用由固態雷射器210産生之第一雷射光束24〇於該 脆性材料基板20表面形成預切割線（Pre__crack)23。具 體步驟如下所述： [0016] 將待加工之脆性材料基板20放置於承栽台（圖未示）上； 由固態雷射器210産生之第一雷射光束240經過第一反射 鏡220後被導引至第一聚焦鏡組230 ’第一聚焦鏡組23〇 將第一雷射光束240之能量聚集於脆性材料基板2〇之表面 ’進而將脆性材料基板20表面之材料汽化以於其上沿著 切割方向B形成預切割線23。在此’固態雷射器210産生 之第一雷射光束240和氣體雷射光束相比，更容易控制形 1013015354-0 〇95i3〇43户'早編波Αοιοι 第5頁/共I3頁 1362370 __VI. Description of the Invention: [Technical Field] The present invention relates to a method for cutting a brittle material substrate, and more particularly to a method for cutting a laser-cut brittle material substrate. [Prior Art] [Hidden] With the continuous development of technology, liquid crystal display devices (TFT_LCD) have been widely used in the consumer field due to their own characteristics. The liquid crystal display device usually consists of two glass substrates, liquid crystals housed in two glass substrates, and a plurality of circuits. The liquid crystal can change the arrangement under the influence of the electric field to perform the display. In order to form liquid crystal display panels of different sizes, it is usually necessary to cut a large liquid crystal display panel to meet different needs. [0003] In the process of laser cutting a glass substrate, most of them are preceded by a cutter wheel, a diamond knife or a gas laser. A pre-cut line is formed on the surface of the glass substrate, and then the surface of the substrate is heated by a laser beam, and the surface of the substrate is cooled by a cooling liquid. After the above process is completed, the glass substrate will undergo a change in stress due to a sharp temperature difference, so that the pre-cut line previously generated by the cutter wheel, the diamond knife or the gas laser on the surface of the slope substrate is cracked and grows downward. Further, the entire substrate section is completely cracked. [0004] However, in the laser cutting glass substrate method, when a cutter wheel or a diamond blade forms a pre-cut line on the surface of the glass substrate, a Median Crack, a Radial Crack, and a Radial Crack are generated on the glass substrate. Lateral crack, the above various cracks are often referred to as & First Micro-Chipping, which may cause damage to the surface of the material, using gas lasers on the surface of the glass substrate to form pre-09513043^^^^ A0101 Page 3 of 13 1013015354-0 1362370 101. On January 13th, the same problem occurs when the replacement of the British cutting line is corrected. In addition, according to the theory of brittle material failure mechanics (Griffith, s law): [0005] σ f = klc / (Y * c) i / 2 [0006] where σ is the fracture strength of the material ^ k is the fracture toughness of the material , an essential property of the 1 1 c material; γ is a constant, related to the geometry of the crack, when the crack is an ellipse, γ = π; C is the size of the crack. [0007] The micro-crack is generated when the cutter wheel or the diamond knife is cut, so that the C value is large, and the strength of the glass substrate is decreased because the breaking strength of the material is reduced. Thus, the glass substrate is easily damaged. Affect the quality of the glass substrate. As the thickness of the glass substrate becomes thinner, cracks generated during cutting are more likely to occur. It can be seen that the above laser cutting method causes large damage to the glass substrate, thereby affecting the product yield. [0008] In view of this, it is necessary to provide a brittle material substrate cutting method to overcome the above disadvantages. SUMMARY OF THE INVENTION [0009] A brittle material substrate cutting method will be described below by way of examples. [0010] The brittle material substrate cutting method comprises the steps of: providing a substrate of a brittle material; forming a pre-cut line on the surface of the brittle material substrate by using a first laser beam, the first laser beam being generated by a solid-state laser; The brittle material substrate is heated along the pre-cut line by using the second laser beam, and the spot formed by the second laser beam at the pre-cut line position on the surface of the brittle material substrate is elliptical, and the long axis and the short axis of the spot are respectively parallel And perpendicular to the extending direction of the pre-cut line; spraying a cooling fluid along the pre-cut line on the surface of the brittle material substrate to cause the brittle material substrate to be cracked along the pre-cut line 〇9513〇43# single number AOl〇1 flute 4, ", 1013015354-0 1362370 101 years. 01. 13th, the replacement page, the distance of the cooling fluid reaching the surface of the brittle material substrate is less than 50 mm from the center of the elliptical spot. [0011] Compared to the prior art, The brittle material substrate cutting method utilizes a laser beam generated by a solid-state laser to form a pre-cut line on a brittle material substrate, which avoids the use of a conventional cutter wheel or drill The knives, even the gas laser beam, form a defect of microcracks generated by the pre-cut line, thereby ensuring the cutting quality and the yield of the product. [Embodiment] The present invention will be further described in detail below with reference to the accompanying drawings. Referring to FIG. 1 , a method for cutting a brittle material substrate according to an embodiment of the present invention includes the following steps: [0014] (1) providing a brittle material substrate 20, which may be a glass substrate or a ceramic substrate. a quartz substrate, a germanium wafer (SiHc〇n Wafer), etc. [0015] (2) forming a pre-cut line (Pre__crack) by using a first laser beam 24 generated by the solid-state laser 210 on the surface of the brittle material substrate 20. 23. The specific steps are as follows: [0016] The brittle material substrate 20 to be processed is placed on a carrier (not shown); the first laser beam 240 generated by the solid state laser 210 passes through the first mirror 220 is then guided to the first focusing mirror group 230. The first focusing mirror group 23 聚集 concentrates the energy of the first laser beam 240 on the surface of the brittle material substrate 2', and then the material of the surface of the brittle material substrate 20. Vaporization to form a pre-cut line 23 along the cutting direction B. The first laser beam 240 produced by the 'solid-state laser 210' is more easily controlled than the gas laser beam 1013015354-0 〇95i3〇 43 households 'Early edited wave Α οιοι Page 5 / Total I3 page 1362370 __
1〇ϋ月日修正雜頁I 成預切割線之方向，使得預切割線具有較佳之直線度。 可以理解的是’根據實際需要由固態雷射器210産生之第 一雷射光束240可以直接投射於脆性材料基板20之表面， 進而於其上形成預切割線23 ;而無需利用第一反射鏡220 和第一聚焦鏡組230 » [0017] 為了使聚集於脆性材料基板20表面上之第一#射光束24〇 具有較高的能量密度，該第一雷射光束240於該脆性材料 - 基板20表面上形成之光斑21直徑應小於1毫米（mm)。 [0018] 該第一雷射光束240之波長優選355〜1064奈米（nm)， 可以理解的是，第一雷射光束240之波長小於355nra同樣 適用於本發明實施例。 [0019] 請參考圖2，於本實施例中，所述預切割線23為一V形溝 槽’該預切割線23之深度h通常大於脆性材料基板20厚度 Η的十分之一。該預切割線23之寬度d通常小於0. 02mm。 [0020] (3)利用第二雷射光束280沿著預切割線23加熱該脆性材 料基板20。具體步驟如下所述： [0〇2〗]請再參考圖卜由氣體雷射器25〇産生之第二雷射光束28〇 經過第二反射鏡260後被導引至第二聚焦鏡組270，第二 聚焦鏡組270將第二雷射光束280之能量聚集於脆性材料 基板20之表面的所述預切割線23位置，使脆性材料基板 2〇受熱膨脹而於脆性材料基板20内部産生壓應力。可以 理解的是，根據實際需要由氣體雷射器250産生之第二雷 射光束280可以直接投射於預切割線23上，從而使脆性材 料基板20受熱膨脹而於脆性材料基板20内部産生壓應力 09513043^^^ A0101 第6頁/共13頁 1013015354-0 1362370 101 年.01 月 13 日 而無需利用第二反射鏡260和第二聚焦鏡紐270。 [0022] 第二雷射光束280的選擇與脆性材料基板2〇的吸收波長相 對應。其中，該氣體雷射器250可為二氧化碳雷射器、·_ 氧化碳雷射器、氮分子雷射器、惰性氣體雷射器等。於 本實施例中’該氣體雷射器250為二氧化碳雷射器，該二 氧化碳雷射器所産生之第二雷射光束280之波長優選為 10. 6微米。 [0023] 請一併參考圖1與圖3，該第二雷射光束280於該脆性材料 基板20表面預切割線23位置形成之光斑22為橢圓形。第 二聚焦鏡組270中採用有雙折射晶體，利用該雙折射晶體 長轴和短轴不同之折射率以形成橢圓形光斑22 在此， 可以理解的是，於第二聚焦鏡組270中採用繞射元件等其 他元件亦可以形成橢圓形光斑22。該橢圓形光斑22之長 軸（b)與預切割線23之延伸方向一致，橢圓形光斑22之短 轴（a)垂直於預切割線23之延伸方向，該橢圓形光斑22之 長短軸比應大於10，亦即光斑長軸（b)與光斑之短軸（a) 滿足關係：b/a>10。該第二雷射光束280於脆性材料基 板20上之行進路徑與上述預切割線23之延伸路徑一致。 [0024] (4)將冷卻流體沿著預切割線23喷射於脆性材料基板2〇， 以使脆性材料基板20沿預切割線23開裂。 [0025] 請再參考圖1，於第二雷射光束280沿基板20之預切割線 23對其進行加熱後，冷卻系統290將冷卻流體（圖未示）沿 著加熱之預切割線23延伸方向急速以霧狀喷於脆性材料 基板20上，冷卻流體使脆性材料基板20表面之溫度急速 09513043^^^^ A0101 第7頁/共13頁 1013015354-0 1362370 1101年.01月1-3日接正 下降，脆性材料基板2〇内部因溫度急劇變化發生收縮而 産生張應力。此時，脆性材料基板20因於短時間内局部 發生急劇應力變化，而使得脆性材料基板20會沿著預切 割線産生裂紋，裂紋於切割面成長使得脆性材料基板2〇 完全開裂，從而完成對脆性材料基板2〇之切割。 [0026] 請一併參照圖3，為了達到急速冷卻的效應，該冷卻流體 到達该脆性材料基板2〇表面的位置與第二雷射光束280投 射在預切割線23上光斑22中心之距離L優選為小於50mm 〇 [0027] 冷卻系統2 9 0中之冷卻流體可以係氣體、液體或其混合物 。所述氣體為空氣、氦氣、氮氣、二氧化碳或其混合物 。所述液體為純水、酒精、丙酮、異丙醇、液態氮、液 態氦、冷卻油或其混合物。 [0028] 於本發明實施例中’使用由固態雷射器21〇産生之第一雷 射光束240可於脆性材料基板20表面形成均勻性良好且直 線度高之預切割線23 ’該預切割線23可為V形凹槽，對第 二雷射光束280有很好的導引作用，且可有效的抑制一次 微裂痕的産生，從而可以保證整個切割過程具有良好的 切割品質。 [0029] 综上所述，本發明確已符合發明專利要件，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施例， 舉凡熟悉本案技藝之人士，於援依本案發明精神所作之 等效修飾或變化’皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 09513043#單编號 A〇101 第8頁/共13頁 1013015354-0 1362370 101年.01月13日核正替換頁 [0030] 圖1係本發明實施例對脆性材料基板進行切割之狀態示意 圖。 [0031] 圖2係圖1中沿剖線11 -11之局部剖示圖。 [0032] 圖3係本發明實施例對脆性材料基板進行切割過程中脆性 材料基板之狀態俯視圖。 【主要元件符號說明】 [0033] 脆性材料基板：20 [0034] 固態雷射器：210 [0035] 第一雷射光束：240 [0036] 第一反射鏡：220 [0037] 第一聚焦鏡組：230 [0038] 預切割線：23 [0039] 光斑：21，22 [0040] 氣體雷射器：250 [0041] 第二雷射光束：280 [0042] 第二反射鏡：260 [0043] 第二聚焦鏡組：270 [0044] 冷卻系統：290 09513043产單編號 A〇101 第9頁/共13頁 1013015354-0Correct the orientation of the page I into the pre-cut line on the 1st of the month, so that the pre-cut line has better straightness. It can be understood that the first laser beam 240 generated by the solid state laser device 210 can be directly projected onto the surface of the brittle material substrate 20 according to actual needs, thereby forming a pre-cut line 23 thereon without using the first mirror. 220 and first focusing lens set 230 » [0017] In order to have a higher energy density of the first #-beam 24 聚集 collected on the surface of the brittle material substrate 20, the first laser beam 240 is on the brittle material-substrate The spot 21 formed on the surface of 20 should have a diameter of less than 1 mm (mm). [0018] The wavelength of the first laser beam 240 is preferably 355 to 1064 nanometers (nm), it being understood that the wavelength of the first laser beam 240 is less than 355 nra is also suitable for use in embodiments of the present invention. Referring to FIG. 2, in the present embodiment, the pre-cut line 23 is a V-shaped groove. The depth h of the pre-cut line 23 is generally greater than one tenth of the thickness 脆 of the brittle material substrate 20. The width d of the pre-cut line 23 is usually less than 0. 02mm. [0020] (3) The brittle material substrate 20 is heated along the pre-cut line 23 by the second laser beam 280. The specific steps are as follows: [0〇2] Please refer to FIG. 2 again. The second laser beam 28 generated by the gas laser 25〇 is guided to the second focusing mirror group 270 after passing through the second mirror 260. The second focusing lens group 270 concentrates the energy of the second laser beam 280 on the pre-cut line 23 on the surface of the brittle material substrate 20, so that the brittle material substrate 2 is thermally expanded to generate pressure inside the brittle material substrate 20. stress. It can be understood that the second laser beam 280 generated by the gas laser 250 can be directly projected onto the pre-cut line 23 according to actual needs, so that the brittle material substrate 20 is thermally expanded to generate compressive stress inside the brittle material substrate 20. 09513043^^^ A0101 Page 6 of 13 1013015354-0 1362370 101. On January 13th, it is not necessary to utilize the second mirror 260 and the second focusing mirror 270. [0022] The selection of the second laser beam 280 corresponds to the absorption wavelength of the brittle material substrate 2〇. The gas laser 250 can be a carbon dioxide laser, a carbon oxide laser, a nitrogen molecular laser, an inert gas laser, or the like. In the present embodiment, the gas laser 250 is a carbon dioxide laser, and the second laser beam 280 generated by the carbon dioxide laser preferably has a wavelength of 10.6 μm. [0023] Referring to FIG. 1 and FIG. 3 together, the spot 22 formed by the second laser beam 280 at the surface of the surface of the brittle material substrate 20 is elliptical. A birefringent crystal is used in the second focusing lens group 270, and the refractive index of the major axis and the minor axis of the birefringent crystal is different to form an elliptical spot 22. Here, it can be understood that the second focusing lens group 270 is used. Other elements such as diffractive elements may also form an elliptical spot 22. The major axis (b) of the elliptical spot 22 coincides with the extending direction of the pre-cut line 23, and the minor axis (a) of the elliptical spot 22 is perpendicular to the extending direction of the pre-cut line 23, and the length-to-minor axis ratio of the elliptical spot 22 It should be greater than 10, that is, the long axis of the spot (b) satisfies the short axis (a) of the spot: b/a > The path of travel of the second laser beam 280 on the brittle material substrate 20 coincides with the extended path of the pre-cut line 23 described above. [0024] (4) The cooling fluid is sprayed along the pre-cut line 23 on the brittle material substrate 2〇 to cause the brittle material substrate 20 to be cracked along the pre-cut line 23. [0025] Referring again to FIG. 1, after the second laser beam 280 is heated along the pre-cut line 23 of the substrate 20, the cooling system 290 extends a cooling fluid (not shown) along the heated pre-cut line 23. The direction is rapidly sprayed on the brittle material substrate 20 in a mist, and the cooling fluid causes the temperature of the surface of the brittle material substrate 20 to be rapid. 09513043^^^^ A0101 Page 7 / Total 13 pages 1013015354-0 1362370 1101. 01 1-3 When the positive electrode is lowered, the inside of the brittle material substrate 2 is shrunk due to a sudden change in temperature, and tensile stress is generated. At this time, the brittle material substrate 20 is locally subjected to a sharp stress change in a short time, so that the brittle material substrate 20 is cracked along the pre-cut line, and the crack grows on the cut surface to completely crack the brittle material substrate 2, thereby completing the pair. Cutting of the brittle material substrate 2〇. Referring to FIG. 3 together, in order to achieve the effect of rapid cooling, the position of the cooling fluid reaching the surface of the brittle material substrate 2 and the distance L of the second laser beam 280 projected on the center of the spot 22 on the pre-cut line 23 Preferably less than 50 mm 〇 [0027] The cooling fluid in the cooling system 290 can be a gas, a liquid or a mixture thereof. The gas is air, helium, nitrogen, carbon dioxide or a mixture thereof. The liquid is pure water, alcohol, acetone, isopropanol, liquid nitrogen, liquid helium, cooling oil or a mixture thereof. [0028] In the embodiment of the present invention, 'the first laser beam 240 generated by the solid-state laser 21' can be used to form a pre-cut line 23' on the surface of the brittle material substrate 20 with good uniformity and high straightness. The line 23 can be a V-shaped groove, which has a good guiding effect on the second laser beam 280, and can effectively suppress the occurrence of a micro-crack, thereby ensuring good cutting quality throughout the cutting process. [0029] In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. [Simple description of the drawing] 09513043#单号A〇101 Page 8/13 pages 1013015354-0 1362370 101. January 13th nuclear replacement page [0030] FIG. 1 is an embodiment of the present invention for a brittle material substrate A schematic diagram of the state of cutting. 2 is a partial cross-sectional view along line 11-11 of FIG. 1. 3 is a top plan view showing a state of a brittle material substrate in a process of cutting a brittle material substrate according to an embodiment of the present invention. [Main Component Symbol Description] [0033] Brittle Material Substrate: 20 [0034] Solid State Laser: 210 [0035] First Laser Beam: 240 [0036] First Mirror: 220 [0037] First Focusing Mirror : 230 [0038] Pre-cut line: 23 [0039] Spot: 21, 22 [0040] Gas laser: 250 [0041] Second laser beam: 280 [0042] Second mirror: 260 [0043] Two focusing mirrors: 270 [0044] Cooling system: 290 09513043 Production order number A〇101 Page 9/Total 13 pages 1013015354-0