TWI346996B - Substrate strip for semiconductor packages - Google Patents

Substrate strip for semiconductor packages

Info

Publication number
TWI346996B
TWI346996B TW096150989A TW96150989A TWI346996B TW I346996 B TWI346996 B TW I346996B TW 096150989 A TW096150989 A TW 096150989A TW 96150989 A TW96150989 A TW 96150989A TW I346996 B TWI346996 B TW I346996B
Authority
TW
Taiwan
Prior art keywords
semiconductor packages
substrate strip
strip
substrate
packages
Prior art date
Application number
TW096150989A
Other languages
Chinese (zh)
Other versions
TW200929451A (en
Inventor
Wen Jeng Fan
Original Assignee
Powertech Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc
Priority to TW096150989A priority Critical patent/TWI346996B/en
Publication of TW200929451A publication Critical patent/TW200929451A/en
Application granted granted Critical
Publication of TWI346996B publication Critical patent/TWI346996B/en

Links

TW096150989A 2007-12-28 2007-12-28 Substrate strip for semiconductor packages TWI346996B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096150989A TWI346996B (en) 2007-12-28 2007-12-28 Substrate strip for semiconductor packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096150989A TWI346996B (en) 2007-12-28 2007-12-28 Substrate strip for semiconductor packages

Publications (2)

Publication Number Publication Date
TW200929451A TW200929451A (en) 2009-07-01
TWI346996B true TWI346996B (en) 2011-08-11

Family

ID=44864480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096150989A TWI346996B (en) 2007-12-28 2007-12-28 Substrate strip for semiconductor packages

Country Status (1)

Country Link
TW (1) TWI346996B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416687B (en) * 2010-12-28 2013-11-21 Powertech Technology Inc Substrate strip with thinned plating layer at mold gate
TWI657516B (en) * 2018-07-27 2019-04-21 矽品精密工業股份有限公司 Carrier structure and package structure

Also Published As

Publication number Publication date
TW200929451A (en) 2009-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees