TWI341403B - Optical transceiver module having a dual segment molded lead frame connector - Google Patents

Optical transceiver module having a dual segment molded lead frame connector

Info

Publication number
TWI341403B
TWI341403B TW095132504A TW95132504A TWI341403B TW I341403 B TWI341403 B TW I341403B TW 095132504 A TW095132504 A TW 095132504A TW 95132504 A TW95132504 A TW 95132504A TW I341403 B TWI341403 B TW I341403B
Authority
TW
Taiwan
Prior art keywords
lead frame
transceiver module
optical transceiver
frame connector
molded lead
Prior art date
Application number
TW095132504A
Other languages
English (en)
Other versions
TW200728790A (en
Inventor
Donald A Ice
Stephen T Nelson
Darin J Douma
Original Assignee
Finisar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Finisar Corp filed Critical Finisar Corp
Publication of TW200728790A publication Critical patent/TW200728790A/zh
Application granted granted Critical
Publication of TWI341403B publication Critical patent/TWI341403B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
    • H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
    • H01R13/6315—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only allowing relative movement between coupling parts, e.g. floating connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Optical Communication System (AREA)
TW095132504A 2005-09-26 2006-09-01 Optical transceiver module having a dual segment molded lead frame connector TWI341403B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/236,123 US7144259B2 (en) 2004-02-27 2005-09-26 Optical transceiver module having a dual segment molded lead frame connector

Publications (2)

Publication Number Publication Date
TW200728790A TW200728790A (en) 2007-08-01
TWI341403B true TWI341403B (en) 2011-05-01

Family

ID=37900082

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132504A TWI341403B (en) 2005-09-26 2006-09-01 Optical transceiver module having a dual segment molded lead frame connector

Country Status (6)

Country Link
US (2) US7144259B2 (zh)
EP (1) EP1943887A4 (zh)
JP (1) JP2009510836A (zh)
CN (1) CN101273672A (zh)
TW (1) TWI341403B (zh)
WO (1) WO2007038026A1 (zh)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7562804B2 (en) * 2004-02-27 2009-07-21 Finisar Corporation Methods for manufacturing optical modules using lead frame connectors
US7503112B2 (en) * 2004-02-27 2009-03-17 Finisar Corporation Methods for manufacturing lead frame connectors for optical transceiver modules
US7258264B2 (en) * 2004-02-27 2007-08-21 Finisar Corporation Methods for manufacturing optical modules using lead frame connectors
JP4525478B2 (ja) * 2004-06-16 2010-08-18 住友電気工業株式会社 放熱フィンを備えた光サブアセンブリ
US20060110164A1 (en) * 2004-11-19 2006-05-25 Kirk Cook Multiple PCBA transceiver
JP4403964B2 (ja) * 2004-12-28 2010-01-27 日立電線株式会社 光トランシーバ
US7473107B2 (en) * 2005-04-29 2009-01-06 Finisar Corporation Molded lead frame connector with mechanical attachment members
US7563035B2 (en) * 2005-04-29 2009-07-21 Finisar Corporation Connector for box optical subassembly
US7540747B2 (en) * 2005-04-29 2009-06-02 Finisar Corporation Molded lead frame connector with one or more passive components
US8447153B2 (en) * 2006-04-27 2013-05-21 Finisar Corporation Low inductance optical transmitter submount assembly
US8093710B2 (en) * 2007-03-30 2012-01-10 Finisar Corporation Non-uniform feedthrough and lead configuration for a transistor outline package
JP2008263122A (ja) * 2007-04-13 2008-10-30 Oki Electric Ind Co Ltd 光モジュール装置
US7621678B2 (en) * 2007-05-31 2009-11-24 Finisar Corporation Electromagnetic radiation shield for an optical subassembly
US7762729B2 (en) * 2007-05-31 2010-07-27 Finisar Corporation Electromagnetic radiation shield for an optical subassembly
US7731431B2 (en) * 2007-05-31 2010-06-08 Finisar Corporation Electromagnetic radiation shield for an optical subassembly
US8217482B2 (en) * 2007-12-21 2012-07-10 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared proximity sensor package with reduced crosstalk
DE102008029104B3 (de) * 2008-06-20 2010-01-14 Hansatronic Gmbh Verfahren zur Herstellung eines mehrteiligen Hybridbauteils
JP5241549B2 (ja) * 2009-02-09 2013-07-17 富士通テン株式会社 車両用アンテナのコネクタ
DE102009001792A1 (de) * 2009-03-24 2010-09-30 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Verfahren zur Herstellung von umspritzten Steckerkontakten
US8420999B2 (en) * 2009-05-08 2013-04-16 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Metal shield and housing for optical proximity sensor with increased resistance to mechanical deformation
JP5310239B2 (ja) * 2009-05-09 2013-10-09 富士通株式会社 接続端子および伝送線路
US8957380B2 (en) * 2009-06-30 2015-02-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared attenuating or blocking layer in optical proximity sensor
US9525093B2 (en) 2009-06-30 2016-12-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared attenuating or blocking layer in optical proximity sensor
US8779361B2 (en) * 2009-06-30 2014-07-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components
US8081466B2 (en) * 2009-07-06 2011-12-20 Rockwell Automation Technologies, Inc. Overmolded electronics enclosure
US7972068B2 (en) * 2009-07-20 2011-07-05 Finisar Corporation Header assembly for communications module
US8143608B2 (en) * 2009-09-10 2012-03-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Package-on-package (POP) optical proximity sensor
US8716665B2 (en) * 2009-09-10 2014-05-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Compact optical proximity sensor with ball grid array and windowed substrate
US8350216B2 (en) * 2009-09-10 2013-01-08 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Miniaturized optical proximity sensor
US9733357B2 (en) * 2009-11-23 2017-08-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared proximity sensor package with improved crosstalk isolation
DE102010015225A1 (de) * 2010-04-15 2011-10-20 Phoenix Contact Gmbh & Co. Kg Leadframe und Anschlussdose mit einem Leadframe
JP2012002993A (ja) * 2010-06-16 2012-01-05 Sumitomo Electric Ind Ltd 光ファイバ位置決め部品及びその製造方法
US8167644B2 (en) * 2010-06-30 2012-05-01 Tyco Electronics Corporation Electrical connector for an electronic module
DE102010041121A1 (de) * 2010-09-21 2012-03-22 Robert Bosch Gmbh Schaltungsträger sowie Verfahren zur Herstellung eines Schaltungsträgers
US8841597B2 (en) 2010-12-27 2014-09-23 Avago Technologies Ip (Singapore) Pte. Ltd. Housing for optical proximity sensor
CN106842440A (zh) * 2012-03-05 2017-06-13 纳米精密产品股份有限公司 用于耦合光纤输入/输出的具有结构化反射表面的耦合装置
US20160274318A1 (en) 2012-03-05 2016-09-22 Nanoprecision Products, Inc. Optical bench subassembly having integrated photonic device
WO2013152841A1 (de) * 2012-04-11 2013-10-17 Bender & Wirth Gmbh & Co. Stromleitender verbinder und verfahren zur herstellung eines verbinders
CN202712528U (zh) * 2012-06-05 2013-01-30 番禺得意精密电子工业有限公司 电连接器
US9297972B2 (en) * 2012-07-30 2016-03-29 Glenair, Inc. Advanced fiber-optic contact and method
JP2014071414A (ja) * 2012-10-01 2014-04-21 Sumitomo Electric Ind Ltd 光モジュール及び光モジュールの製造方法
US9983414B2 (en) 2012-10-23 2018-05-29 Nanoprecision Products, Inc. Optoelectronic module having a stamped metal optic
JP6055661B2 (ja) * 2012-11-16 2016-12-27 日本オクラロ株式会社 光モジュール及び光送受信装置
US9819107B2 (en) * 2013-11-26 2017-11-14 Glenair, Inc. Advanced panel mount connector and method
CN103676038B (zh) * 2013-12-30 2017-02-22 上海斐讯数据通信技术有限公司 Bosa 光器件的引脚固定弯折治具
JP6090527B2 (ja) * 2014-02-28 2017-03-08 日立金属株式会社 コネクタ及びコネクタ付ケーブル
KR101722049B1 (ko) * 2014-09-02 2017-03-31 에스엘 주식회사 차량용 램프 장치 및 그 제조 방법
FR3032561B1 (fr) * 2015-02-05 2023-05-12 Valeo Vision Dispositif de connexion d’une source lumineuse a un dispositif d’alimentation electrique
US10353157B2 (en) * 2015-11-24 2019-07-16 Corning Optical Communications, Llc Backplane optical connectors and optical connections incorporating the same
US10802239B2 (en) * 2016-07-07 2020-10-13 Afl Telecommunications Llc Optical fiber trunk cable breakout canisters and assemblies
CN109479379B (zh) * 2016-07-07 2022-03-08 莫列斯有限公司 微型配电盒及采用专用电子封装技术制造微型配电盒的方法
US10295768B2 (en) * 2016-07-08 2019-05-21 Finisar Corporation Chip on leadframe optical subassembly
JP1633047S (zh) * 2018-07-25 2019-06-03
JP2020098249A (ja) * 2018-12-17 2020-06-25 住友電気工業株式会社 光トランシーバ
CN109904657A (zh) * 2019-03-11 2019-06-18 贸联电子(昆山)有限公司 连接器
CN110417481A (zh) * 2019-07-09 2019-11-05 广东九联科技股份有限公司 一种用于无源光网络的改进型rosa
US11490517B2 (en) * 2019-07-31 2022-11-01 ABB Power Electronics, Inc. Interposer printed circuit boards for power modules
US11252821B2 (en) * 2019-08-13 2022-02-15 CoreLed Systems, LLC Optical surface-mount devices
US11923151B2 (en) * 2020-02-03 2024-03-05 Kemet Electronics Corporation Structural lead frame
CN113991418B (zh) * 2021-12-27 2022-03-15 成都英思嘉半导体技术有限公司 用于信号传输线路特征阻抗匹配的管座及高频光发射器件

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4471158A (en) * 1981-12-11 1984-09-11 Advanced Circuit Technology, Inc. Programmable header
US4689023A (en) * 1985-08-27 1987-08-25 The Superior Electric Company Programmable electrical connector
US5295214A (en) * 1992-11-16 1994-03-15 International Business Machines Corporation Optical module with tolerant wave soldered joints
JP3535009B2 (ja) * 1998-04-10 2004-06-07 矢崎総業株式会社 回路成形体
US6123589A (en) * 1998-04-23 2000-09-26 Murata Manufacturing Co., Ltd. High-frequency connector with low intermodulation distortion
US6086413A (en) * 1998-11-24 2000-07-11 Eaton Corporation Multiple wire connector
JP3356088B2 (ja) * 1998-11-30 2002-12-09 住友電装株式会社 電気接続構造
JP2001179774A (ja) * 1999-12-28 2001-07-03 Teeantee:Kk 車両用灯具およびその製造方法
US6368158B1 (en) * 2000-07-14 2002-04-09 Chin-Mao Kan Electric connector having integrally molded terminals and guide pins
US6764336B2 (en) * 2001-02-27 2004-07-20 Hon Hai Precision Ind. Co., Ltd. Method for forming an electrical connector and an electrical connector obtained thereby
US6796852B2 (en) * 2001-07-23 2004-09-28 Sumitomo Wiring Systems, Ltd. Connector and method for producing the same
US7023705B2 (en) * 2001-08-03 2006-04-04 National Semiconductor Corporation Ceramic optical sub-assembly for optoelectronic modules
US6817782B2 (en) * 2002-02-15 2004-11-16 Finisar Corporation Optical module with simplex port cap EMI shield
US6688897B2 (en) * 2002-03-07 2004-02-10 Hon Hai Precision Ind. Co., Ltd. Electrical connector
FR2840637B1 (fr) * 2002-06-07 2004-09-24 Valeo Electronique Module electronique flexible pour poignee d'ouvrant, notamment pour vehicule automobile
TW539306U (en) * 2002-06-20 2003-06-21 Hon Hai Prec Ind Co Ltd Electrical connector
TW547852U (en) * 2002-10-04 2003-08-11 Hon Hai Prec Ind Co Ltd Low profile connector
US20040091268A1 (en) * 2002-11-01 2004-05-13 Jds Uniphase Corporation Transmitter optical sub-assembly
US6922231B1 (en) * 2003-01-23 2005-07-26 Opnext, Inc. Receiver optical sub-assembly with diagnostic signal
US7440647B2 (en) * 2003-10-09 2008-10-21 Finisar Corporation Integrated optical assembly
US6976854B2 (en) * 2003-10-17 2005-12-20 Andreas Stockhaus Arrangement for connecting the terminal contacts of an electronic component to a printed circuit board and conductor support for such an arrangement
JP4659816B2 (ja) * 2004-02-27 2011-03-30 フィニサー コーポレイション 光電子装置用リード・フレーム・コネクタ及びそのリード・フレーム・コネクタを含む光送受信装置モジュールの製造方法並びにそのリード・フレーム・コネクタを用いた光学モジュール
US6966800B2 (en) * 2004-03-22 2005-11-22 Fci Americas Technology, Inc. Overmolded electrical connector
US7252440B2 (en) * 2004-12-01 2007-08-07 Sumitomo Electric Industries, Ltd. Optical transceiver with optical sub-module thermally couples with optical transceiver without mechanical stress
JP2006332648A (ja) * 2005-05-20 2006-12-07 Sumitomo Electric Ind Ltd フレキシブル基板を用いた多ピン同軸モジュールと回路基板の結線構造

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TW200728790A (en) 2007-08-01
WO2007038026A1 (en) 2007-04-05
JP2009510836A (ja) 2009-03-12
US20060024005A1 (en) 2006-02-02
EP1943887A1 (en) 2008-07-16
EP1943887A4 (en) 2008-11-12
CN101273672A (zh) 2008-09-24
US7144259B2 (en) 2006-12-05
US7229295B2 (en) 2007-06-12
US20070003195A1 (en) 2007-01-04

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