TW510642U - Heat dissipating - Google Patents

Heat dissipating

Info

Publication number
TW510642U
TW510642U TW089213775U TW89213775U TW510642U TW 510642 U TW510642 U TW 510642U TW 089213775 U TW089213775 U TW 089213775U TW 89213775 U TW89213775 U TW 89213775U TW 510642 U TW510642 U TW 510642U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
dissipating
heat
Prior art date
Application number
TW089213775U
Other languages
Chinese (zh)
Inventor
Chin-Yi Hu
Original Assignee
Tranyoung Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tranyoung Technology Corp filed Critical Tranyoung Technology Corp
Priority to TW089213775U priority Critical patent/TW510642U/en
Priority to US09/819,484 priority patent/US20020017378A1/en
Publication of TW510642U publication Critical patent/TW510642U/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
TW089213775U 2000-08-09 2000-08-09 Heat dissipating TW510642U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW089213775U TW510642U (en) 2000-08-09 2000-08-09 Heat dissipating
US09/819,484 US20020017378A1 (en) 2000-08-09 2001-03-27 Heat ventilation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW089213775U TW510642U (en) 2000-08-09 2000-08-09 Heat dissipating

Publications (1)

Publication Number Publication Date
TW510642U true TW510642U (en) 2002-11-11

Family

ID=21671395

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089213775U TW510642U (en) 2000-08-09 2000-08-09 Heat dissipating

Country Status (2)

Country Link
US (1) US20020017378A1 (en)
TW (1) TW510642U (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
MXPA03004441A (en) * 2000-11-20 2005-01-25 Intel Corp High performance heat sink configurations for use in high density packaging applications.
US6657862B2 (en) * 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6671172B2 (en) 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US6705144B2 (en) 2001-09-10 2004-03-16 Intel Corporation Manufacturing process for a radial fin heat sink
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US6981542B2 (en) * 2003-10-29 2006-01-03 Rotys Inc. Multi-heatsink integrated cooler
US20050161196A1 (en) * 2004-01-22 2005-07-28 Hsieh Hsin-Mao Heat radiator for a CPU
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US7143820B2 (en) * 2004-12-31 2006-12-05 Intel Corporation Systems for improved heat exchanger
WO2006109929A1 (en) * 2005-04-11 2006-10-19 Zalman Tech Co., Ltd. Apparatus for cooling computer parts and method of manufacturing the same
CN100456206C (en) * 2005-12-30 2009-01-28 富准精密工业(深圳)有限公司 Heat abstractor assembling
US20070181288A1 (en) * 2006-02-08 2007-08-09 Bing Chen Combination of a heat sink and a fan
JP2008091644A (en) * 2006-10-02 2008-04-17 Nippon Densan Corp Heat sink, and heat sink cooling apparatus
JP2008166465A (en) * 2006-12-28 2008-07-17 Nippon Densan Corp Heat sink fan
US8256258B2 (en) * 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
TWM339033U (en) * 2008-04-16 2008-08-21 Asia Vital Components Co Ltd Heat sink
CN101662918B (en) * 2008-08-27 2012-10-10 富准精密工业(深圳)有限公司 Heat radiating device
US7972037B2 (en) 2008-11-26 2011-07-05 Deloren E. Anderson High intensity replaceable light emitting diode module and array
CN101765351B (en) * 2008-12-22 2012-12-26 富准精密工业(深圳)有限公司 Heat-dissipation device
US20110000641A1 (en) * 2009-07-06 2011-01-06 Xiaozhen Zeng Radiating fin structure and heat sink thereof
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
KR101217224B1 (en) * 2010-05-24 2012-12-31 아이스파이프 주식회사 Heat-dissipating device for electronic apparatus
CN106960831B (en) * 2017-03-23 2019-05-07 东莞市奎鑫五金制品有限公司 A kind of electronic heat sink
CN110437888A (en) * 2019-08-21 2019-11-12 中冶焦耐(大连)工程技术有限公司 A kind of exhaust gas cooler
TWD210771S (en) * 2020-04-09 2021-04-01 宏碁股份有限公司 Heat-dissipation fin

Also Published As

Publication number Publication date
US20020017378A1 (en) 2002-02-14

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees