TW480616B - Chemical mechanical polishing system and apparatus - Google Patents

Abstract

This invention provides a wafer carrier apparatus in chemical mechanical polishing equipment, which at least consists of a wafer carrier module used to hold a wafer face down; a retaining ring and a conditioning module connected with the wafer carrier module to protect the wafer edge from contacting with a polishing pad and thus deforming through polishing and to perform a conditioning step for the polishing pad; and a first supply module connected with the retaining ring and the conditioning module to rotate and push down the retaining ring and the conditioning module and to supply chemicals for the retaining ring and the conditioning module.

Description

480616 — V. Description of the Invention (1) 5-1 Field of the Invention: The present invention relates to a chemical mechanical polishing equipment system, and more particularly to a wafer carrier device in a chemical mechanical polishing equipment system. 5-2 Background of the Invention: The fabrication of a semiconductor integrated circuit is a process with many complicated steps. It generates many tiny structures in response to different electrical properties. These tiny structures combine to become an applied component. As the accumulation of worries on Shixi wafers becomes more and more multi-layered, the problems caused by uneven surfaces become more and more serious.

And it has a major impact on wafer performance and yield. In the manufacturing process, the step of removing excess material is called a planarization process. The technology of CMP 1 ^ f to planarize the surface of a silicon wafer is chemical mechanical polishing (% mechanical polishing technology of the optical table i generally involves the use of a fixed, circular polishing pad and a pollshlng pad) and a The supporter provides a wafer with two chemical pads, including abrasive ... Including the _ m π + wafer frame mold tm, a chemical mechanical polishing system, the traditional 110 is drawn and drawn, and 12, a supply module 13〇 、 —Polishing pad module 14〇

Page 4 480616 V. Description of the invention (2) and a finishing module 150. The polishing pad on the circular polishing table in the polishing pad module 14 is traditionally made of a blanket-like surface made of polyurea (b 1 〇w η polyurethane) containing many tiny holes to promote the flow of abrasive fluid to it. Under the wafer. The wafer rack module 1 2 0 provides a holder (h ο 1 d e r) to hold the wafer downward to resist the rotation pad. The conventional retaining ring 12 5 in the wafer rack module 120 can prevent the wafer edge from being deformed by contact with the polishing pad. On the other hand, the supply module 130 includes a rotation system (32, a pressure system 134, and a chemical system 1 36. The rotation system 1 3 2 is generally used for the wafer rack module 1 2 0 The rotary motion of the pressure system 1 3 4 is responsible for providing the downward force of the wafer holder 120 to bring the wafer into contact with the polishing pad. The chemical supply system 1 3 6 is responsible for supplying abrasives containing erosion and additives. Furthermore, finishing Module 1 50 includes a finishing chemical system (c 0 nd ^ ti 〇ningchemica 1

Sytem) 154 and robotic arm system 155. The finishing chemical system 154 Negative shell fluid, Ying Zhengli fluid ’robot arm system 1 5 5 is responsible for the mechanical actions of the finishing process. For the chemical mechanical polishing system 110, it is very important to provide a smooth and controlled change in polishing rate. However, the traditional chemical machinery; ^ grinding system, 'first 1 1 〇 /, 忐 in non-simultaneous (e χ a sit U) or simultaneous but not really synchronous _, ^ lme ~ in-situ) pad conditioning (pad conditioning Wang Fangzhong maintained Shu Li Xing, and the speed was nine; that is, the pad finishing step could not be completed with the polishing structure of the famous structure of the tongue 7. The smaller I can be manufactured in the temple.

480616 V. Description of the invention (3) Mechanical grinding research The cost is relatively high, the cost of space is relatively high, and the cost is very high. The factory uses the factory's construction team to mold the physical structure, and it is halfway in the square platform. 5-3 Purpose and summary of the invention: research. Mechanical steps and machine learning and learning to normalize the real kind of steps. One step to provide the perfect circle of Mingming crystal to give power to the principle, throwing the whole principle, and the whole scene of the United States and the United States: the mingling of the back of the seed. The system of light) is described on the system e and a v is placed on i and the c is polished by c. (Machine er) f'J aone ^ learn the system, t, the system, and the force ο a C pressure to supply the lifter and the turn of the head of the reunification of the unified and other independent use of the independent and independent development. According to the purpose described above, a rack carrier is disclosed for a wafer carrier device in a chemical mechanical polishing device, which includes at least a wafer rack module for holding a wafer so that Face down; a pinch ring is connected to the finishing module and the wafer rack module, which is used to protect the edge of the wafer from grinding deformation of the part in contact with a polishing pad, and performs a finishing step of the polishing pad (c ο nditi ο ning); and a first supply module connected to the pinning ring and the finishing module, which is used to rotate, press down the pinning ring and the finishing module, and supply chemicals for the pinning ring and the finishing module finishing.

480616 V. Description of the invention (4) 5-4 Detailed description of the invention: The design of the present invention can be widely used in many semiconductor designs. When the present invention is described by a preferred embodiment of the method of the present invention, it is known in this field. Those skilled in the art should recognize that many modules can be changed, and these general replacements undoubtedly do not depart from the spirit and scope of the present invention. Second, the present invention is described in detail with schematic diagrams below. In detailing the embodiments of the present invention, the schematic diagram of the architecture of the system will not be partially enlarged according to the general scale for the convenience of explanation, but it should not be used as a limited recognition. In this embodiment, a wafer carrier device in a chemical mechanical polishing device is disclosed, which includes at least a wafer rack module for holding a wafer with its face down; a pinning ring and finishing The module is connected to the wafer rack module, which is used to protect the edge of the wafer from abrasion deformation caused by contact with a polishing pad, and a finishing step (c ο nditi οn ing) of the polishing pad is performed; and a first The supply module is connected with the pinning ring and the finishing module, and is used for rotating and pressing the pinting ring and the finishing module, and supplying the chemicals for the pinning ring and the finishing module. A chemical mechanical polishing system includes at least a wafer frame module including at least a holder for holding a wafer with its face down; a polishing surface module includes at least a polishing pad for providing a polishing pad. Movement and fixation; a pinch ring is connected with the finishing module and the wafer rack module, which is used to protect the wafer from contact with the polishing pad, and performs a conditioning step of the polishing pad; first supply

480616 I V. Description of the invention (5) Module and pinning ring 敕 '^^ -— The module rotates and presses Γ ΐ to connect, which is used to make the platform °' Sl — W, and supply the pinning ring and Ϊ́ ΐ ϋ & 彳 与 and finishing mouth, and the second two for the shoulders 桓 桓 桓 傲 门 门 门 门 门 正 正 正 正 架 架 架 架 架……: ..., two-day yen frame module connection, complex Dry things. Get out of the house and supply the wafer rack module hug field, which is used to make the crystal first use chemicals. Second schematic. A wafer module 50 and a round frame module 3 4 for holding and a chemical frame mold shown in a schematic diagram for polishing to hold 20 downward wafer racks connected to a school for group 20 The die k is used to provide the polishing phase module 40 for the wafer, and it includes a module that is based on the mechanical research 20 and a pad module P, which is used to fix the strength of the package and the system holder in the present invention. System pin down ring 40. The face of the crystal is directed to include a spin of 360 ° rotation to resist the addition of linear or chemical chemistry, including 10 ° and finishing under the round frame mold. Crystal transfer system transfer system operation. Pressure polishing pad, such as rotary table, mechanical polishing system, a wafer rack for module 2 5, — group 2 0 includes Caimu round frame supply mold 32, a pressure 3 2 is responsible for the polishing force supply system. The structure of the polishing system on the supply of chemicals, such as abrasives, etc. Module 3 0 organizes the supply and closes the circuit and the 3G and crystal supply system. During the light process 3 4 is responsible for the system 36. Polishing 塾 The key of the present invention lies in pinning and finishing the module 25. The pinning and sorting module group 2 5 not only plays the role of pinning, but also has the function of sorting. The pinch = the finishing module 2 5 includes a retaining ring connected to the wafer rack module 2 0; the retaining ring is made of the material of a traditional finisher, such as diamond planar grit The material of the traditional restraint ring is taken ^, so the restraint ring can be regarded as a finishing cry. Close

480616 V. Description of the invention (6) Of course, the pinning ring in the present invention has the flexibility to match the manufacturing process, so its material is not limited to the material of the traditional finisher. The advantage of combining the restraint ring with the finishing function is that the space occupied by the chemical mechanical polishing system 10 is reduced, because the robot arm system can be omitted. On the other hand, the finishing supply module 50 is connected to the pinning and finishing module 25, and the ring rotation system 54 and the ring pressure supply system 56 in the finishing supply module 50 are responsible for the action and restraint of the ring rotation. The power of pressure. The ring pressure supply system 56 can supply the force of air pressure or oil pressure to push down the pinch ring. In this way, the rotation of the containment ring and the pressing force are separated from the holder in the wafer rack module 20 independently. Furthermore, a finishing chemical system 56 is used to supply chemicals required during the finishing process. The combination of the finishing supply module 50 and the pinning and finishing module 2 5 can activate the polishing pad at the same time as polishing the wafer (simultaneously synchronize r ea 1-i η -situ) to combine it with wafer polishing (rea 1 time). Furthermore, a fixed polishing rate ensures that the surface of the polishing pad is consistent. It is an object of the present invention to provide a restraint ring with an additional finisher function. The pinning ring is made of the material of a conventional finisher and can perform the finishing process; on the other hand, a supply system different from the holder can make the gripper perform the finishing work more elastically. The third figure illustrates a schematic cross-sectional view of the chemical mechanical polishing equipment of the present invention. A wafer rack module 7 8 includes a holder 7 5 capable of holding a wafer 74. A holding ring 7 2 is connected to a finishing supply module 7 6. The finishing supply module 7 6 is used for

480616 V. Description of the invention (7) Responsible for the rotation action, pressure supply and supply of chemicals for the pinch ring 72 of the present invention. The pinch ring 76 can be in contact with a polishing pad 70 and perform the finishing work of the polishing pad 70. On the other hand, the wafer rack module 78 is connected to a wafer rack supply module 80. The wafer rack supply module 80 is responsible for the rotation of the wafer rack module 78, pressure supply and polishing chemistry. Supply of goods. The above are merely preferred embodiments of the present invention, and are not intended to limit the scope of patent application for the present invention; all other equivalent changes or modifications made without departing from the spirit disclosed by the present invention shall be included in the following Application

Page 10 480616 Brief description of the diagram The first diagram is a schematic diagram of the structure of a conventional CMP equipment; the second diagram is a schematic diagram of the structure of a CMP equipment of the present invention; Representative symbols: 10 Chemical mechanical polishing system 2 0 Wafer frame core group 25 Retaining ring and finishing module 30 Wafer frame supply module 3 2 Rotating system 34 Pressure supply system 36 Chemical supply system 4 0 Polishing pad module 50 Finishing Supply module 54 ring rotation system 5 6 ring pressure supply system 7 0 polishing ring 72 pin ring 7 4 wafer 75 holder 7 6 finishing supply module

Page 11 480616 Brief description of drawings 7 8 Wafer cores 80 Wafer supply modules 1 1 0 Chemical mechanical polishing system 1 2 0 Wafer modules 125 Retaining ring 1 3 0 Supply modules 1 3 2 Rotary system 1 3 4 Pressure system 1 3 6 Chemical supplies system 1 4 0 Polishing pad module 1 5 0 Finishing module 154 conditioning chemical system 1 5 5 Robotic arm system

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Claims (1)

48U010 The first supply module is connected with the pinning ring and the finishing module, and the supply branch set is used to rotate and press the pinting ring and the finishing module. '卞 ^ ^ JE: ^ ^ m 4 The device of item 1 includes at least a holder (h ο 1 der) for grasping the wafer holder module in which the wafer is held so that the wafer faces downward. 'The pinch ring described above and a pinch ring made of a whole material. 5 If the device in the scope of patent application item 1 includes at least a diamond surface frosting $ 13Page 480616 Case No. 90104644 Amendment VI. Application for Patent Scope 6 · For the device of the scope of patent application for Item 5, the above-mentioned first supply group includes at least: ~ A rotating system is used to rotate the pinning ring; A pressure supply system is used to supply air pressure to press down the pinch ring; and a finishing supply system is used to supply the finishing chemicals. 7. The device according to item 6 of the patent application, wherein the above-mentioned pressure supply system further includes a means for supplying oil pressure to push down the pinch ring. 8 · — Seeding a wafer to make a surface throw motion and fixation of a ring and finishing and the implementation of the first supply mold should hold the mechanical mechanical grinding of the round frame module to the down side; the smooth surface module to the fixed A ring supply and finishing module is used to maintain a polishing pad, a supply module module is used to set a polishing group to make the ring and a finishing mold second supply module to make the wafer rack chemicals. System 'The system includes at least:》 Including a holder (h ο 1 der) for holding a crystal, including a polishing pad, for providing the polishing pad, the group is connected to the wafer rack module, and the restraint晶圆 The wafer avoids contact with the polishing pad and is subjected to a conditioning step; the wafer is connected to the pinning ring and a finishing module, and the pinning ring and the finishing module are rotated, pressed, and used for group finishing chemicals; And ', connected to the wafer rack module, the second supply module rotates, presses down, and supplies the wafer rack module 480616 _Case No. 90104644_Year Month Amendment_ VI. Patent Application Scope 9. The system of item 8 of the patent application scope, in which the above-mentioned pinning ring and finishing module at least include a pinning ring made of diamond flat frosted material. 10. The system according to item 9 of the scope of patent application, wherein the above-mentioned first supply module includes at least: a rotation system for rotating the pinch ring; a pressure supply system for supplying air pressure to bring down the pinch ring; and A finishing supply system is used to supply the finishing chemicals. It should be under pressure as described above. The system of the system under pressure is related to the 10 items of the concession. The oil conservancy should be used exclusively for application. For example, the system 1 system should be provided for the second part of the system. Li Zhuan, please apply for a package including as little as one group to produce a product, the production of a rotary pressure cyclone holder should hold the responsibility should be used for the use of all the systems The light throw Xuanshi mouth crystal should be used to use the system of materials and learning •, and use it to throw to the optical shelf to hold a piece of this product. Fan Li, please apply for as little as f & c il The description of pad light throwing is on the whole. The description of the term of the line of action should be described in the above. 8 Fan Li Page 15 480616 Case No. 90104644_Year Month Day Amendment 6. Scope of patent application Movement includes at least one rotation movement. 1BI Page 16