TW330763U - Electromagnetic interference suppressor - Google Patents

Electromagnetic interference suppressor

Info

Publication number
TW330763U
TW330763U TW085208065U TW85208065U TW330763U TW 330763 U TW330763 U TW 330763U TW 085208065 U TW085208065 U TW 085208065U TW 85208065 U TW85208065 U TW 85208065U TW 330763 U TW330763 U TW 330763U
Authority
TW
Taiwan
Prior art keywords
electromagnetic interference
interference suppressor
suppressor
electromagnetic
interference
Prior art date
Application number
TW085208065U
Other languages
Chinese (zh)
Inventor
Mitsuharu Sato
Shigeyoshi Yoshida
Tadakuni Sato
Toshihisa Inabe
Hitoshi Togawa
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=11595546&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW330763(U) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tokin Corp filed Critical Tokin Corp
Publication of TW330763U publication Critical patent/TW330763U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/032—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
    • H01F1/10—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites, e.g. [(Ba,Sr)O(Fe2O3)6] ferrites with hexagonal structure
    • H01F1/11—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites, e.g. [(Ba,Sr)O(Fe2O3)6] ferrites with hexagonal structure in the form of particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/18—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
    • H01F10/30—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the intermediate layers, e.g. seed, buffer, template, diffusion preventing, cap layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
TW085208065U 1994-01-20 1994-06-22 Electromagnetic interference suppressor TW330763U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00486494A JP3401650B2 (en) 1994-01-20 1994-01-20 Electromagnetic interference suppressor

Publications (1)

Publication Number Publication Date
TW330763U true TW330763U (en) 1998-04-21

Family

ID=11595546

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085208065U TW330763U (en) 1994-01-20 1994-06-22 Electromagnetic interference suppressor

Country Status (3)

Country Link
JP (1) JP3401650B2 (en)
KR (1) KR100329677B1 (en)
TW (1) TW330763U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9674992B2 (en) 2014-07-07 2017-06-06 Iteq Corporation Electromagnetic interference shielding film

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0935927A (en) * 1995-07-20 1997-02-07 Tokin Corp Composite magnetic body and electromagnetic interference suppressor using the same
US6972097B2 (en) 1995-07-20 2005-12-06 Nec Tokin Corporation Composite magnetic material and electromagnetic interference suppressor member using the same
JPH0993034A (en) * 1995-09-22 1997-04-04 Tokin Corp Compound magnetic substance, manufacture of the same and electromagnetic interference suppresser
JPH1074613A (en) 1996-08-30 1998-03-17 Tokin Corp Tape, adhesive tape and self-fusion tape
WO1998009788A1 (en) * 1996-09-03 1998-03-12 Tokin Corporation Method of manufacturing composite magnetic sheet
DE69727207T2 (en) * 1996-09-09 2004-11-25 Nec Tokin Corp., Sendai HIGHLY CONDUCTING MAGNETIC MIXING MATERIAL
JPH1098274A (en) * 1996-09-24 1998-04-14 Tokin Corp Portable electric equipment
JPH10229292A (en) * 1997-02-17 1998-08-25 Kitagawa Ind Co Ltd Electromagnetic wave interference suppressor
JP3475386B2 (en) * 1997-09-01 2003-12-08 Ｎｅｃトーキン株式会社 Electromagnetic interference suppressor
WO2001024205A1 (en) * 1999-09-28 2001-04-05 Tokin Corporation Composite magnetic sheet and method of producing the same
JP2001126910A (en) * 1999-10-25 2001-05-11 Tokin Corp Composite magnetic material, composite magnetic material sheet and manufacturing method of them
EP1146591A2 (en) 2000-04-10 2001-10-17 Hitachi, Ltd. Electromagnetic wave absorber, method of manufacturing the same and appliance using the same
JP2002329995A (en) 2001-05-07 2002-11-15 Shin Etsu Chem Co Ltd Electromagnetic wave absorbing body
JP3922039B2 (en) 2002-02-15 2007-05-30 株式会社日立製作所 Electromagnetic wave absorbing material and various products using the same
AU2002313962A1 (en) * 2002-08-08 2004-02-25 In-Hyun Cho Power saving equipment
WO2004086837A1 (en) 2003-03-25 2004-10-07 Shin-Etsu Polymer Co., Ltd. Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods
JP2005142551A (en) * 2003-10-17 2005-06-02 Nitta Ind Corp Magnetic shielding sheet and input corresponding display
JP4700905B2 (en) * 2003-12-10 2011-06-15 三井化学株式会社 Multilayer board
JP4417377B2 (en) 2004-02-24 2010-02-17 信越ポリマー株式会社 Electromagnetic wave noise suppressing body, structure with electromagnetic wave noise suppressing function, and manufacturing method thereof
CN101069461B (en) 2004-12-03 2010-12-08 新田股份有限公司 Electromagnetic interference suppressor, antenna device and electronic information transmitting apparatus
KR100701832B1 (en) * 2005-06-15 2007-04-02 (주)창성 Thin multi-layered electro-magnetic absorption film by controlling surface resistance
WO2007037494A1 (en) * 2005-09-30 2007-04-05 Nitta Corporation Sheet body, antenna device, and electronic information transmission device
US8723054B2 (en) 2007-04-11 2014-05-13 Toda Kogyo Corporation Electromagnetic noise suppression sheet, flat cable for high-frequency signals, flexible printed circuit board, and process for producing the electromagnetic noise suppression sheet
JP5324105B2 (en) * 2008-01-29 2013-10-23 スリーエム イノベイティブ プロパティズ カンパニー Electromagnetic interference suppression sheet comprising a pressure sensitive adhesive layer having a structured surface
JP4655156B2 (en) 2009-02-03 2011-03-23 ソニー株式会社 Radiation reduction device
CN103609207B (en) 2011-06-17 2017-04-12 户田工业株式会社 electromagnetic wave interference suppressor
JP6122249B2 (en) * 2012-03-30 2017-04-26 株式会社神戸製鋼所 Resin-coated metal plate with excellent electromagnetic shielding properties
EP2938175A4 (en) 2012-12-19 2016-11-02 Toda Kogyo Corp Electromagnetic interference suppression body
JPWO2015076387A1 (en) 2013-11-25 2017-03-16 旭化成株式会社 Noise absorbing sheet
KR20150130915A (en) 2014-05-14 2015-11-24 티디케이가부시기가이샤 Magnetism suppressing sheet and manufacturing method thereof
JP2016032081A (en) * 2014-07-30 2016-03-07 公益財団法人鉄道総合技術研究所 Electromagnetic wave shielding material and equipment housing body
WO2017010447A1 (en) 2015-07-14 2017-01-19 戸田工業株式会社 Ferrite laminate and noise suppression sheet
JP6795300B2 (en) * 2015-12-17 2020-12-02 東洋インキＳｃホールディングス株式会社 Electromagnetic wave suppression sheet and electromagnetic wave suppression adhesive sheet using it, electromagnetic wave suppression resin composition, electromagnetic wave suppression layer
JP6706569B2 (en) * 2016-11-21 2020-06-10 大同特殊鋼株式会社 Electromagnetic field shield sheet
JP2019125662A (en) * 2018-01-16 2019-07-25 富士通コンポーネント株式会社 High frequency module
CN109041556A (en) * 2018-07-16 2018-12-18 苏州微磁新材料有限公司 Absorbing material and its preparation method and application

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4989461A (en) * 1972-12-26 1974-08-27
JPS5547479B2 (en) * 1974-04-17 1980-11-29
JPS5458301A (en) * 1977-10-19 1979-05-11 Nippon Telegr & Teleph Corp <Ntt> Electromagnetic wave absorbing body
JPS58101499A (en) * 1981-12-12 1983-06-16 山本　博章 Electrically shielding artificial resin
JPS5947796A (en) * 1982-09-13 1984-03-17 ティーディーケイ株式会社 Electromagnetic shield material
JPS5982799A (en) * 1982-11-02 1984-05-12 ティーディーケイ株式会社 Radio wave absorber
JPS59158593A (en) * 1983-02-28 1984-09-08 ティーディーケイ株式会社 Composite electromagnetic shielding material
JPS59169198A (en) * 1983-03-17 1984-09-25 ティーディーケイ株式会社 Radio wave absorber
JPS6147626U (en) * 1984-08-30 1986-03-31 大日本印刷株式会社 multilayer sheet
JPS63246900A (en) * 1987-04-02 1988-10-13 Tdk Corp Composite radio wave absorber
JPH0320498U (en) * 1989-07-07 1991-02-28
JPH03217082A (en) * 1990-01-22 1991-09-24 Sumitomo Metal Ind Ltd Radiowave absorbing material
JPH04150098A (en) * 1990-10-12 1992-05-22 Nec Corp Radio wave absorptive material
JP2648702B2 (en) * 1991-01-16 1997-09-03 防衛庁技術研究本部長 Manufacturing method of millimeter wave radio wave absorber
JPH0527059A (en) * 1991-07-16 1993-02-05 Riken Corp Composite body for radio wave absorption
JP3234956B2 (en) * 1992-08-25 2001-12-04 株式会社トーキン Printed circuit board and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9674992B2 (en) 2014-07-07 2017-06-06 Iteq Corporation Electromagnetic interference shielding film

Also Published As

Publication number Publication date
JPH07212079A (en) 1995-08-11
KR100329677B1 (en) 2002-09-05
JP3401650B2 (en) 2003-04-28
KR950034304A (en) 1995-12-28

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