TW202232717A - Display device and manufacturing method thereof - Google Patents

Abstract

A display device and a manufacturing method thereof are provided. The display device includes a light-emitting element package including a first substrate, at least one light-emitting element, an encapsulation layer, and conductive pads. The first substrate has opposite upper and lower surfaces, and the edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, wherein the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The conductive pads are disposed on the lower surface of the first substrate, and respectively electrically connected to the positive electrode and the negative electrode of the light-emitting element.

Description

Display device and method of manufacturing the same

The present disclosure relates to a display device and a method of manufacturing the same.

Color displays typically consist of pixels that emit three colors of light: red, green, and blue. The display is, for example, a liquid crystal display, an organic light emitting diode display or a micro light-emitting diode (Light-emitting diode, LED) display. Micro LED displays use micro LEDs to emit light. The biggest challenge in making micro-LED displays is how to place a large number of micro-LEDs at precise locations on the display substrate to form an array of pixels. The method of placing the micro-LEDs is, for example, picking up the micro-LEDs one by one from a supply substrate by a pick-and-place assembly, and then sequentially placing the micro-LEDs on the display substrate. Alternatively, a mass transfer method can be used to use the auxiliary substrate as a stamper, fill the micro-LEDs thereon, and then place the micro-LEDs on the display substrate by the stamper. However, the complexity and cost of the above-mentioned techniques increase rapidly as pixel density increases and display size decreases.

In view of the above, there is an urgent need for a new fabrication method to overcome the above problems.

The present disclosure provides a light-emitting element package including a first substrate, at least one light-emitting element, a packaging layer and a plurality of conductive pads. The first substrate has opposite upper and lower surfaces, and the edge of the lower surface has a notch. At least one light-emitting element is disposed on the upper surface of the first substrate, wherein the light-emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. A plurality of conductive pads are disposed on the lower surface of the first substrate, and are respectively electrically connected to the positive electrode and the negative electrode of the light-emitting element.

In some embodiments, the light emitting elements include red light emitting elements, green light emitting elements and blue light emitting elements, wherein the red light emitting elements, green light emitting elements and blue light emitting elements each have a positive electrode and a negative electrode.

In some embodiments, the conductive pads are electrically connected to the positive electrodes and the negative electrodes of the red light-emitting element, the green light-emitting element, and the blue light-emitting element, respectively.

In some embodiments, the conductive pads include a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad, the first conductive pad is electrically connected to the positive electrode of the red light emitting element, and the second conductive pad is electrically connected to the positive electrode of the red light emitting element. The third conductive pad is electrically connected to the positive electrode of the blue light emitting element, the fourth conductive pad is electrically connected to the negative electrodes of the red light emitting element, the green light emitting element and the blue light emitting element.

In some embodiments, the lower surfaces of the conductive pads are each polygonal.

In some embodiments, the lower surfaces of the conductive pads are substantially flush.

In some embodiments, the outline of the light emitting element package in a plan view is a polygon.

In some embodiments, the outline of the light emitting element package in a plan view is a quadrilateral.

In some embodiments, the light-emitting element package further includes a post disposed on the encapsulation layer.

In some embodiments, the light-emitting element package further includes an adhesive layer disposed between the pillar and the packaging layer.

The present disclosure provides a display device including the light-emitting element package of any one of the foregoing embodiments, a second substrate, and a plurality of conductive junctions. The second substrate has a groove and a protrusion, and the protrusion extends from the sidewall of the groove. A plurality of conductive junctions are provided on the bottom surface of the trench. The light emitting element package is arranged in the groove, the protruding portion of the second substrate is located in the recess of the first substrate of the light emitting element package, and the conductive pads of the light emitting element package are electrically connected to the conductive junctions.

In some embodiments, the light emitting elements include red light emitting elements, green light emitting elements and blue light emitting elements, wherein the red light emitting elements, green light emitting elements and blue light emitting elements each have a positive electrode and a negative electrode.

In some embodiments, the conductive pads include a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad, the first conductive pad is electrically connected to the positive electrode of the red light emitting element, and the second conductive pad is electrically connected to the positive electrode of the red light emitting element. The third conductive pad is electrically connected to the positive electrode of the blue light emitting element, the fourth conductive pad is electrically connected to the negative electrodes of the red light emitting element, the green light emitting element and the blue light emitting element, these The number of the conductive pads is four, and the conductive pads are electrically connected to the first conductive pad, the second conductive pad, the third conductive pad and the fourth conductive pad, respectively.

In some embodiments, the protrusions and recesses substantially match the shape.

In some embodiments, the profile of the groove in plan view is polygonal.

The present disclosure provides a method of manufacturing a display device, comprising the following operations: (a) providing a first substrate and a plurality of conductive junctions, wherein the first substrate has a groove and a protrusion extending from sidewalls of the groove , these conductive junctions are provided on the bottom surface of the trenches. (b) flowing a liquid suspension containing a light-emitting element package over the upper surface of the first substrate, wherein the light-emitting element package includes a second substrate, at least one light-emitting element, an encapsulation layer, a pillar and a plurality of conductive pads. The second substrate has opposite upper and lower surfaces, and the edge of the lower surface has a notch. At least one light-emitting element is disposed on the upper surface of the second substrate, wherein the light-emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The pillars are disposed on the encapsulation layer. A plurality of conductive pads are disposed on the lower surface of the second substrate, and are respectively electrically connected to the positive electrode and the negative electrode of the light-emitting element. (c) disposing the light-emitting element package in the groove, wherein the protruding portion of the first substrate is located in the recess of the second substrate.

In some embodiments, the method of manufacturing the display device further includes: after disposing the light emitting element package in the trench, removing the pillar from the encapsulation layer.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are intended to provide further explanation of the present disclosure as claimed.

Several embodiments of the present disclosure will be disclosed in the drawings below, and for the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the present disclosure. That is, in some embodiments of the present disclosure, these practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some well-known structures and elements will be shown in a simple and schematic manner in the drawings. The same numbers in the drawings represent the same or similar elements.

Although a series of operations or steps are used below to describe the methods disclosed herein, the order in which these operations or steps are shown should not be construed as limiting the present disclosure. For example, certain operations or steps may be performed in a different order and/or concurrently with other steps. Furthermore, not all illustrated operations, steps and/or features must be performed in order to implement embodiments of the present disclosure. Furthermore, each operation or step described herein may contain several sub-steps or actions.

The present disclosure provides a light emitting element package. Please refer to Figures 1A and 1B. FIG. 1A is a schematic cross-sectional view of a light emitting element package according to various embodiments of the present disclosure. FIG. 1B is a schematic structural diagram of a light-emitting element in a light-emitting element package according to various embodiments of the present disclosure from a top view.

As shown in FIG. 1A , the light emitting element package 100 includes a substrate 110 , at least one light emitting element L, an encapsulation layer 120 , conductive pads 140 and 150 and a pillar 130 . The substrate 110 has an upper surface S1 and a lower surface S2 opposite to each other, and the edge E of the lower surface S2 has a notch N. The light-emitting element L is disposed on the upper surface S1 of the substrate 110 . The encapsulation layer 120 covers the light emitting element L. The pillars 130 are disposed on the encapsulation layer 120 . A plurality of conductive pads 140 and 150 are disposed on the lower surface S2 of the substrate 110 . As shown in FIG. 1B , the light-emitting element L has a positive electrode L1 and a negative electrode L2 . The conductive pads 140 and 150 shown in FIG. 1A are respectively electrically connected to the positive electrode L1 and the negative electrode L2 of the light-emitting element L shown in FIG. 1B . For example, the conductive pads 140 and 150 can pass through the traces in the substrate 110 . (not shown) are electrically connected to the positive electrode L1 and the negative electrode L2, respectively. In other words, a circuit layout is provided in the substrate 110 for interconnecting the light-emitting element L with the target substrate.

The light-emitting element package 100 of the present disclosure can be installed in a groove of a substrate by means of fluid self-assembly, thereby forming a display device. It is worth noting that during the fluid self-assembly process, the encapsulation layer 120 isolates the light-emitting element L from the liquid, which can protect the light-emitting element L and prevent the light-emitting element package 100 from being damaged when the liquid flows. After mounting, the pillars 130 are removed from the encapsulation layer 120 . In other embodiments, the light emitting element package 100 further includes an adhesive layer (not shown) disposed between the pillar 130 and the packaging layer 120 . The following will describe in detail the flow of the installation by means of fluid self-assembly.

FIG. 1A takes one light-emitting element L as an example. However, the number of light-emitting elements is not limited to this. The number of light-emitting elements can be adjusted according to design requirements, such as two, three, four, etc., but not limited thereto. In some embodiments, the light emitting element L is a red light emitting element, a green light emitting element, a blue light emitting element, and a white light emitting element, but is not limited thereto. FIG. 1A takes two conductive pads 140 and 150 as an example. However, the number of conductive pads is not limited to this. The number of conductive pads can be adjusted according to design requirements or the number of light-emitting elements, such as two, three, or four. etc., but not limited to this.

In some embodiments, as shown in FIG. 1A , the lower surfaces of the conductive pads 140 and 150 are substantially flush, but not limited thereto. In other embodiments, the thickness of the conductive pad 140 is greater than the thickness of the conductive pad 150 . In still other embodiments, the thickness of the conductive pad 140 is less than the thickness of the conductive pad 150 .

In some embodiments, the lower surfaces of the conductive pads 140 and 150 are polygonal shapes, such as triangles, quadrilaterals, pentagons or hexagons, but are not limited thereto. In other embodiments, the lower surfaces of the conductive pads 140 and 150 are each in a circle, an ellipse or any other shape.

In some embodiments, the outline of the light emitting element package 100 in a plan view is a polygon, such as a triangle, a quadrangle, a pentagon or a hexagon, but is not limited thereto. In other embodiments, the outline of the light-emitting element package 100 in a plan view is a circle, an ellipse, or any other shape.

In some embodiments, the light emitting element package 100 does not include the pillar 130 . As shown in FIG. 1C , FIG. 1C is a schematic cross-sectional view of a light emitting element package 100A according to various embodiments of the present disclosure. The difference between the light emitting element package 100A and the light emitting element package 100 is that no pillar is provided on the encapsulation layer 120 of the light emitting element package 100A.

The present disclosure provides another light emitting element package. Please refer to Figures 2A and 2B. 2A is a schematic cross-sectional view of a light emitting element package according to various embodiments of the present disclosure. FIG. 2B is a schematic view of the structure of a light-emitting element in a light-emitting element package according to various embodiments of the present disclosure from a top view.

As shown in FIG. 2A , the light emitting element package 200 includes a substrate 110 , a red light emitting element R, a green light emitting element G, a blue light emitting element B, an encapsulation layer 220 , conductive pads 420 , 430 and pillars 130 . The substrate 110 has an upper surface S1 and a lower surface S2 opposite to each other, and the edge E of the lower surface S2 has a notch N. The red light emitting element R, the green light emitting element G and the blue light emitting element B are disposed on the upper surface S1 of the substrate 110 . The encapsulation layer 220 covers the red light emitting element R, the green light emitting element G, and the blue light emitting element B. The pillars 130 are disposed on the encapsulation layer 220 . The conductive pads 420 and 430 are disposed on the lower surface S2 of the substrate 110 . As shown in FIG. 2B, the red light emitting element R has a positive electrode R1 and a negative electrode R2, the green light emitting element G has a positive electrode G1 and a negative electrode G2, and the blue light emitting element B has a positive electrode B1 and a negative electrode B2. The conductive pads 420 and 430 shown in FIG. 2A are respectively electrically connected to the positive electrodes R1, G1, B1 and the negative electrodes R2, G2, B2. For example, the conductive pads 420 and 430 can be respectively electrically connected to the positive electrodes R1 , G1 , B1 and the negative electrodes R2 , G2 , B2 through the traces (not shown) in the substrate 110 . In other words, the substrate 110 is provided with a circuit layout for interconnecting the red light emitting element R, the green light emitting element G, and the blue light emitting element B with the target substrate.

Please refer to Figure 2B, Figure 3 and Figure 4. FIGS. 3 and 4 are schematic diagrams of wiring diagrams of the substrate 110 of the light emitting element package 200 according to various embodiments of the present disclosure. The positive electrode R1 of the red light emitting element R is connected to the line 310 below it, the line 310 is connected to the via hole 312 below it, and the via hole 312 is connected to the conductive pad 410 below it. The positive electrode G1 of the green light emitting element G is connected to the line 320 below it, the line 320 is connected to the via hole 322 below it, and the via hole 322 is connected to the conductive pad 420 below it. The anode B1 of the blue light emitting element B is connected to the line 330 below it, the line 330 is connected to the via hole 332 below it, and the via hole 332 is connected to the conductive pad 430 below it. In addition, the negative electrodes R2, G2, B2 of the red light emitting element R, the green light emitting element G, and the blue light emitting element B are connected to the lines 340 under these negative electrodes R2, G2, B2, and the lines 340 are connected to the via holes below them 342, the via hole 342 is connected to the conductive pad 440 below it.

Through the above-mentioned structure design of the wiring, the conductive pad 410 is electrically connected to the positive electrode R1 of the red light emitting element R, the conductive pad 420 is electrically connected to the positive electrode G1 of the green light emitting element G, and the conductive pad 430 is electrically connected to the blue light emitting element. The positive electrode B1 of the element B and the conductive pad 440 are electrically connected to the negative electrodes R2 , G2 and B2 of the red light emitting element R, the green light emitting element G and the blue light emitting element B. Figure 4 takes four conductive pads 410, 420, 430, and 440 as an example. However, the number of conductive pads is not limited to this. The number of conductive pads can be adjusted according to design requirements or the number of light-emitting elements, such as two, three One, four, five, six, etc., but not limited thereto.

The light-emitting element package 200 of the present disclosure can be installed in the groove of the substrate by means of fluid self-assembly, thereby forming a display device. It is worth noting that during the process of fluid self-assembly, the encapsulation layer 220 isolates the red light emitting element R, the green light emitting element G, and the blue light emitting element B from the liquid, which can protect the above light emitting elements and prevent the light emitting elements from encapsulating when the liquid flows. The collision of the body 200 damages the above-mentioned light-emitting element. After mounting, the pillars 130 are removed from the encapsulation layer 220 . In other words, in some embodiments, the light emitting element package 200 does not include the pillar 130 . The process of installing the light-emitting element package 200 by means of fluid self-assembly will be described in detail later.

For the embodiment of the light emitting element package 200 in FIG. 2A, reference may be made to the embodiment of the light emitting element package 100 in FIG. 1A. In some embodiments, the lower surfaces of the conductive pads 410, 420, 430, 440 are substantially flush, but not limited thereto. In other embodiments, the thicknesses of the conductive pads 410, 420, 430, and 440 are different. For example, the thickness of the conductive pad 440 is greater than that of the conductive pads 410 , 420 and 430 , or the thickness of the conductive pad 440 is smaller than that of the conductive pads 410 , 420 and 430 , but not limited thereto.

In some embodiments, the lower surfaces of the conductive pads 410 , 420 , 430 , and 440 are each a polygon, such as a triangle, a quadrangle, a pentagon, or a hexagon, but not limited thereto. In other embodiments, the lower surfaces of the conductive pads 410 , 420 , 430 , and 440 are each in a circle, an ellipse, or any other shape.

In some embodiments, the outline of the light emitting element package 200 in a plan view is a polygon, such as a triangle, a quadrilateral, a pentagon or a hexagon, but is not limited thereto. In other embodiments, the outline of the light emitting element package 200 in a plan view is circular, oval or any other shape.

FIG. 5 is a schematic cross-sectional view of a light emitting element package 500 according to various embodiments of the present disclosure. The difference between the light emitting element package 500 of FIG. 5 and the light emitting element package 200 of FIG. 2A is that the light emitting element package 500 further includes an adhesive layer 510 disposed between the pillar 130 and the encapsulation layer 220 . Subsequent layer 510 enables easy attachment of posts 130 to encapsulation layer 220 . The subsequent layer 510 is, for example, silicon dioxide, but not limited thereto. In some embodiments, the adhesive layer 510 may be wet etched to remove the pillars 130 .

FIG. 6 is a schematic cross-sectional view of a display device 600 according to various embodiments of the present disclosure. The display device 600 includes the light-emitting element package 200 , a substrate 610 , and conductive junctions 612 and 614 as shown in FIG. 2 . The substrate 610 has a trench T and a protruding portion TP, and the protruding portion TP extends from the sidewall SW of the trench T. As shown in FIG. The conductive junctions 612, 614 are provided on the bottom surface BS of the trench T. The light emitting element package 200 is disposed in the groove T, and the protruding portion TP of the substrate 610 is located in the recess N of the substrate 110 of the light emitting element package 200 .

FIG. 6 only shows one trench T, however, the number of trenches T is not limited to this, and the number of trenches can be adjusted according to design requirements, and the substrate 610 may include a plurality of trenches.

For a clearer understanding of the structure of the display device 600 , please refer to FIG. 4 , FIG. 6 , FIG. 7 , and FIG. 8 at the same time. 7 is a schematic cross-sectional view of a substrate 610 and conductive junctions 612, 614 in accordance with various embodiments of the present disclosure. 8 is a schematic top view of a substrate 610 and conductive junctions 612, 614, 616, 618 in accordance with various embodiments of the present disclosure. The light emitting element package 200 is disposed in the trench T, and the conductive pads 410 , 420 , 430 , and 440 of the light emitting element package 200 are respectively electrically connected to the conductive contact surfaces 618 , 612 , 614 , and 616 . Figure 8 takes four conductive junctions 612, 614, 616, and 618 as an example. However, the number of conductive junctions is not limited to this. The number of conductive junctions can be adjusted according to the design and number of conductive pads, for example, two , three, four, five, six, etc., but not limited thereto. In some embodiments, the conductive junctions 612 , 614 , 616 , and 618 are connected with traces (not shown) in the substrate 610 to regulate the light emission of the light emitting device package 200 .

As shown in FIG. 8 , in some embodiments, the outline of the trench T in a plan view is a polygon, such as a triangle, a quadrilateral, a pentagon or a hexagon, but not limited thereto. In other embodiments, the outline of the trench T in plan view is a circle, an ellipse, or any other shape. In some embodiments, the trench T substantially matches the shape of the light emitting element package 200 .

Referring to FIGS. 4 and 8 simultaneously, in some embodiments, the shape of the protrusion TP and the notch N are substantially matched. In some embodiments, the volume of the protrusion TP is substantially equal to the volume of the notch N. In other embodiments, the volume of the protrusion TP is smaller than the volume of the recess N. When the light emitting element package 200 is to be disposed in the groove T of the substrate 610, the light emitting element package 200 will be disposed in the groove T only when the protruding portion TP of the substrate 610 is aligned with the notch N of the substrate 110. Make sure that the conductive pads 410 , 420 , 430 , 440 of the light emitting element package 200 are butted with the conductive junctions 612 , 614 , 616 , 618 in the correct direction and polarity.

The present disclosure provides a method of manufacturing a display device. Please refer to Figure 2A, Figure 2B and Figures 6 to 9. FIG. 9 is a schematic diagram in a process of fabricating a display device 600 according to various embodiments of the present disclosure. The method includes the following operations: (a) as shown in FIGS. 7 to 8 , providing a substrate 610 and a plurality of conductive junctions 612 , 614 , 616 , 618 , wherein the substrate 610 has a trench T and a protruding portion TP, and the protruding portion TP is formed from The sidewall SW of the trench T extends out, and the conductive junctions 612 , 614 , 616 , 618 are disposed on the bottom surface BS of the trench T. (b) As shown in FIG. 9 , the liquid suspension containing the light-emitting element package 200 is made to flow over the upper surface S3 of the substrate 610 . Since the light emitting element package 200 has the pillars 130 , when the pillars 130 contact the upper surface S3 of the substrate 610 , the pillars 130 are turned over on the substrate 610 due to liquid flow until they fall into the grooves T. As shown in FIGS. 2A and 4 , the light emitting element package 200 includes a substrate 110 , a red light emitting element R, a green light emitting element G, a blue light emitting element B, an encapsulation layer 220 , and conductive pads 410 , 420 , 430 , and 440 , and column 130 . The substrate 110 has an upper surface S1 and a lower surface S2 opposite to each other, and the edge E of the lower surface S2 has a notch N. The red light emitting element R, the green light emitting element G and the blue light emitting element B are disposed on the upper surface S1 of the substrate 110 . The encapsulation layer 220 covers the red light emitting element R, the green light emitting element G, and the blue light emitting element B. The pillars 130 are disposed on the encapsulation layer 220 . The conductive pads 410 , 420 , 430 and 440 are disposed on the lower surface S2 of the substrate 110 . As shown in FIG. 2B, the red light emitting element R has a positive electrode R1 and a negative electrode R2, the green light emitting element G has a positive electrode G1 and a negative electrode G2, and the blue light emitting element B has a positive electrode B1 and a negative electrode B2. The conductive pads 410 , 420 , 430 , and 440 are electrically connected to the positive electrodes R1 , G1 , B1 and the negative electrodes R2 , G2 , B2 of the red light emitting element R, the green light emitting element G, and the blue light emitting element B, respectively. (c) As shown in FIG. 6 , the light-emitting element package 200 is disposed in the trench T, wherein the protruding portion TP of the substrate 610 is located in the notch N of the substrate 110 . In detail, when the light emitting element package 200 rolls to the groove T of the substrate 610, it falls into the groove T, and only when the protrusion TP of the substrate 610 is aligned with the notch N of the substrate 110, emits light The device package 200 is disposed in the trench T, so as to ensure that the conductive pads 410 , 420 , 430 , 440 of the light emitting device package 200 are connected to the conductive pads 612 , 614 , 616 , 618 in the correct direction and polarity.

In some embodiments, after disposing the light emitting device package 200 in the trench T, the pillar 130 is removed from the encapsulation layer 220 .

FIG. 10 is a schematic diagram in the process of fabricating a display device 600 according to various embodiments of the present disclosure. As shown in FIG. 10 , when the light emitting element package 200 falls into the trench T, the conductive pads 410 , 420 , 430 , and 440 of the light emitting element package 200 do not fall into the trench T downward, so the light emitting element package 200 cannot It is arranged in the groove T, and will be driven by the liquid suspension, leave the groove T, continue to roll on the substrate 610, and may fall into another groove. Similarly, if the conductive pads 410 , 420 , 430 , 440 of the light emitting element package 200 fall into the groove T downward, however, when the protrusion TP of the substrate 610 is not aligned with the notch N of the substrate 110 , the light emitting element package 200 It also cannot be disposed in the groove T, and will be driven by the liquid suspension to leave the groove T. The design of the protruding portion TP and the notch N of the present disclosure can prevent the light emitting device package 200 from being incorrectly connected to the conductive junction. , thereby improving the manufacturing yield.

When manufacturing a display device, the above-mentioned fluid self-assembly method can be used to install light-emitting element packages with different emission colors in a substrate with a plurality of grooves. The component package is first installed in a part of the groove of the substrate, the green light emitting element package is first installed in another part of the groove of the substrate, and then the blue light emitting element package is first installed in the remaining groove of the substrate , forming a display device. Therefore, three transfers are required to manufacture the display device according to the above process. It is worth noting that, when manufacturing the display device, the light-emitting element package 200 containing three light-emitting elements of different colors can be installed in the groove of the substrate at one time by the above-mentioned fluid self-assembly method as a transfer unit. Therefore, only one transfer is required to manufacture the display device according to the above process. The light-emitting element package 200 is a light-emitting unit capable of emitting white light. Therefore, compared with the method of multi-installation, the time required for the installation of the light-emitting element package 200 of the present disclosure is only 1/ of the time required for the sub-installation. 3. Therefore, the structural design of the light-emitting element package 200 of the present disclosure can greatly reduce the manufacturing cost, greatly save the manufacturing time, and improve the assembly speed. For example, the assembly speed can exceed 50 million transfer units per hour. The fabrication methods of the present disclosure can be used to produce LED displays with small pitch or high pixels per inch (PPI) values.

To sum up, the structural design of the protrusions and recesses in the light-emitting element package of the present disclosure can ensure that the conductive pads and the conductive junctions of the light-emitting element package are in contact with the conductive junctions in the correct direction and polarity, thereby improving the manufacturing process. yield rate. In addition, in the method for manufacturing a display device of the present disclosure, a large amount of packages can be transferred to the substrate by means of fluid self-assembly, thereby greatly reducing the manufacturing cost and greatly saving the manufacturing time, which is beneficial to the production of the display device. Great help.

Although the present disclosure has been described in considerable detail with reference to certain implementations, other implementations are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

It will be apparent to those skilled in the art that various modifications and changes can be made in the structure of the present disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, this disclosure is intended to cover modifications and variations of this disclosure that fall within the scope of the appended claims.

100, 100A, 200, 500: Light-emitting element package 110,610: Substrate 120,220: encapsulation layer 130: Column 140,150: Conductive pad 310, 320, 330, 340: Lines 312, 322, 332, 342: Pilot holes 410, 420, 430, 440: Conductive pads 510: Next layer 600: Display device 612, 614, 616, 618: Conductive Junctions B: blue light emitting element B1: positive electrode B2: negative pole BS: Bottom surface E: edge G: Green light-emitting element G1: positive electrode G2: Negative L: light-emitting element L1: positive electrode L2: negative pole N: Notch R: red light emitting element R1: positive electrode R2: negative pole S1: upper surface S2: lower surface S3: Upper surface SW: Sidewall T: groove TP: Protrusion

The foregoing and other aspects, features, and other advantages of the present disclosure will be more clearly understood with reference to the description in conjunction with the accompanying drawings, wherein: FIGS. 1A , 1C, and 2A are schematic cross-sectional views of light-emitting element packages according to various embodiments of the present disclosure. FIGS. 1B and 2B are schematic structural diagrams of a light-emitting element in a light-emitting element package according to various embodiments of the present disclosure from a top view. FIGS. 3 and 4 are schematic diagrams of wiring diagrams of substrates of light emitting element packages according to various embodiments of the present disclosure. 5 is a schematic cross-sectional view of a light emitting element package according to various embodiments of the present disclosure. FIG. 6 is a schematic cross-sectional view of a display device according to various embodiments of the present disclosure. 7 is a schematic cross-sectional view of a substrate and conductive junctions according to various embodiments of the present disclosure. 8 is a schematic top view of a substrate and conductive junctions according to various embodiments of the present disclosure. FIGS. 9 and 10 are schematic diagrams in a process of fabricating a display device according to various embodiments of the present disclosure.

100: Light-emitting element package

110: Substrate

120: encapsulation layer

130: Column

140,150: Conductive pad

E: edge

L: light-emitting element

N: Notch

L1: positive electrode

S1: upper surface

S2: lower surface

Claims (7)

A display device, comprising: A light-emitting element package, including: a first substrate having an opposite upper surface and a lower surface, and an edge of the lower surface has a notch; at least one light-emitting element disposed on the upper surface of the first substrate, wherein the light-emitting element has a positive electrode and a negative electrode; an encapsulation layer covering the light-emitting element; and a plurality of conductive pads, disposed on the lower surface of the first substrate, and electrically connected to the positive electrode and the negative electrode of the light-emitting element respectively; a second substrate having a groove and a protrusion extending from a sidewall of the groove; and a plurality of conductive junctions disposed on a bottom surface of the trench, The light emitting element package is disposed in the groove, the protrusion of the second substrate is located in the recess of the first substrate of the light emitting element package, and the conductive pads of the light emitting element package are electrically connect the conductive junctions. The display device according to claim 1, wherein the light-emitting elements include a red light-emitting element, a green light-emitting element and a blue light-emitting element, wherein the red light-emitting element, the green light-emitting element and the blue light-emitting element Each has a positive electrode and a negative electrode. The display device of claim 2, wherein the conductive pads comprise a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad, the first conductive pad is electrically connected to the The positive electrode of the red light emitting element, the second conductive pad is electrically connected to the positive electrode of the green light emitting element, the third conductive pad is electrically connected to the positive electrode of the blue light emitting element, the fourth conductive pad is electrically connected Connected to the negative electrodes of the red light emitting element, the green light emitting element and the blue light emitting element, the number of the conductive junctions is four, and the conductive junctions are respectively electrically connected to the first conductive pad, the The second conductive pad, the third conductive pad and the fourth conductive pad. The display device of claim 1, wherein the protrusion substantially matches the shape of the recess. The display device according to claim 1, wherein the outline of the groove is polygonal in plan view. A method of manufacturing a display device, comprising: (a) providing a first substrate and a plurality of conductive junctions, wherein the first substrate has a groove and a protrusion, the protrusion extends from a sidewall of the groove, and the conductive junctions are disposed on the on a bottom surface of the groove; (b) flowing a liquid suspension containing a light-emitting element package over an upper surface of the first substrate, wherein the light-emitting element package includes: a second substrate having an opposite upper surface and a lower surface, and an edge of the lower surface has a notch; at least one light-emitting element is disposed on the upper surface of the second substrate, wherein the light-emitting element has a positive electrode and a negative electrode; an encapsulation layer covering the light-emitting element; a post disposed on the encapsulation layer; and a plurality of conductive pads disposed on the lower surface of the second substrate and electrically connected to the positive electrode and the negative electrode of the light-emitting element respectively; and (c) disposing the light-emitting element package in the groove, wherein the protruding portion of the first substrate is located in the recess of the second substrate. The method of claim 6, further comprising: after disposing the light-emitting element package in the groove, removing the post from the packaging layer.

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