TW202043127A - Conveying machine can save space and may not deform ring-shaped frame through support of sliding rails - Google Patents
Conveying machine can save space and may not deform ring-shaped frame through support of sliding rails Download PDFInfo
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- TW202043127A TW202043127A TW109117570A TW109117570A TW202043127A TW 202043127 A TW202043127 A TW 202043127A TW 109117570 A TW109117570 A TW 109117570A TW 109117570 A TW109117570 A TW 109117570A TW 202043127 A TW202043127 A TW 202043127A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0019—End effectors other than grippers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/025—Arms extensible telescopic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- Manufacturing & Machinery (AREA)
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Abstract
Description
本發明是關於一種機器,搬送板狀工件及具有開口之環狀框架。The invention relates to a machine for conveying plate-shaped workpieces and a ring frame with openings.
以往的搬送機器具備:工件保持部,吸引保持板狀工件並搬送;及握持部,握持環狀框架並搬送(例如,參照專利文獻1)。 [習知技術文獻] [專利文獻]A conventional conveying machine is provided with a workpiece holding part which sucks and holds a plate-shaped workpiece and conveys it, and a grip part which holds and conveys the ring frame (for example, refer to Patent Document 1). [Literature Technical Literature] [Patent Literature]
[專利文獻1] 日本特開2017-130515號公報[Patent Document 1] JP 2017-130515 A
[發明所欲解決的課題] 因為上述握持部握持環狀框架的一部分並搬送,所以會有環狀框架因為重量而彎曲,且環狀框架會以握持部握持住的地方為支點而變形的問題。此外,在將板狀工件搬送至研削板狀工件的裝置、將膠膜黏貼至板狀工件的膠膜貼片裝置及分割板狀工件的裝置(例如,切割裝置或雷射加工裝置)時,會有需要多個搬送機器,而導致佔用空間的問題。[The problem to be solved by the invention] Because the above-mentioned gripping portion grips a part of the ring frame and transports it, there is a problem that the ring frame is bent due to weight, and the ring frame is deformed with the place gripped by the gripping portion as a fulcrum. In addition, when conveying a plate-shaped workpiece to a device for grinding plate-shaped workpieces, a film sticking device for attaching an adhesive film to a plate-shaped workpiece, and a device for dividing the plate-shaped workpiece (for example, a cutting device or a laser processing device), There may be a problem of taking up space by requiring multiple conveying machines.
因此,在搬送機器中具有以下的課題:藉由將保持板狀工件的工件保持部及握持環狀框架的握持部一體化,而能謀求節省空間,且能搬送板狀工件及環狀框架,並不會使環狀框架變形而搬送。Therefore, the conveying machine has the following problem: by integrating the workpiece holding part holding the plate-shaped workpiece and the holding part holding the ring frame, it is possible to save space and to convey the plate-shaped workpiece and the ring The frame is transported without deforming the ring frame.
[解決課題的技術手段] 用於解決上述課題的本發明為一種搬送機器,係搬送板狀工件及具有開口的環狀框架之機器,該搬送機器具備:吸附墊,具有吸引保持板狀工件的吸附面;第一移動手段,使該吸附墊在水平方向且在X軸方向上前進或後退;滑軌,夾著該環狀框架的開口而平行地配置兩條且支撐該環狀框架的兩側面;第二移動手段,使該滑軌在該X軸方向上前進或後退;握持部,握持該環狀框架的外周緣;第三移動手段,使該握持部在該X軸方向上前進或後退且使該環狀框架在該滑軌之上並於該X軸方向上移動;第四移動手段,使該吸附墊、該滑軌及該握持部在水平方向上迴旋移動,或是在水平方向上與該X軸方向正交的Y軸方向上直線移動;及升降手段,使該吸附墊、該滑軌及該握持部在與X軸方向及Y軸方向正交的Z軸方向上升降。[Technical means to solve the problem] The present invention for solving the above-mentioned problems is a conveying machine that conveys a plate-shaped workpiece and a ring frame with an opening. The conveying machine includes: a suction pad having a suction surface for sucking and holding the plate-shaped workpiece; and a first moving means , Make the adsorption pad advance or retreat in the horizontal direction and in the X-axis direction; slide rail, sandwich the opening of the ring frame and arrange two parallel to support the two sides of the ring frame; the second moving means, Make the slide rail advance or retreat in the X-axis direction; the grip portion grip the outer periphery of the ring frame; the third moving means make the grip portion advance or retreat in the X-axis direction and make the The ring frame is above the slide rail and moves in the X-axis direction; the fourth moving means makes the suction pad, the slide rail and the grip part move in a horizontal direction or in a horizontal direction. The X-axis direction is linearly moved in the Y-axis direction orthogonal to the X-axis direction; and the lifting means moves the suction pad, the slide rail, and the grip part up and down in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction.
本發明的搬送機器較佳為具備盒體,該盒體容納該吸附墊、該握持部、該滑軌、該第一移動手段、該第二移動手段及該第三移動手段,且具有可取出放入該吸附墊並可取出放入該握持部及該滑軌的出入口。The conveying machine of the present invention preferably has a box body that contains the suction pad, the gripping portion, the slide rail, the first moving means, the second moving means, and the third moving means, and has a The suction pad can be taken out and put into the holding part and the entrance and exit of the sliding rail.
本發明的搬送機器較佳為具備黏著滾輪,該黏著滾輪配設於該吸附墊的下方且以在與該X軸方向交叉之方向上延伸的旋轉軸為軸而旋轉自如,並在外側面具有黏著劑;以該升降手段將該吸附墊定位在該吸附面與該黏著滾輪的外側面接觸的高度,且以該第一移動手段使該吸附墊在該X軸方向上前進或後退而使該吸附面與該黏著滾輪的外側面接觸,並使該黏著滾輪轉動而將該吸附面進行乾式清洗。The conveying machine of the present invention is preferably provided with an adhesive roller, the adhesive roller is arranged below the suction pad and is rotatable with a rotating shaft extending in a direction crossing the X-axis direction as an axis, and has an adhesive on the outer surface The lifting means is used to position the adsorption pad at a height where the adsorption surface is in contact with the outer surface of the adhesive roller, and the first movement means is used to advance or retreat the adsorption pad in the X axis direction to make the adsorption The surface is in contact with the outer surface of the adhesive roller, and the adhesive roller is rotated to perform dry cleaning on the adsorption surface.
[發明功效] 搬送板狀工件及具有開口的環狀框架之本發明的搬送機器具備:吸附墊,具有吸引保持板狀工件的吸附面;第一移動手段,使吸附墊在水平方向且在X軸方向上前進或後退;滑軌,夾著環狀框架的開口而平行地配置兩條且支撐環狀框架的兩側面;第二移動手段,使滑軌在X軸方向上前進或後退;握持部,握持環狀框架的外周緣;第三移動手段,使握持部在X軸方向上前進或後退且使環狀框架在滑軌之上並於該X軸方向上移動;第四移動手段,使吸附墊、滑軌及握持部在水平方向上迴旋移動,或是在水平方向上與X軸方向正交的Y軸方向上直線移動;及升降手段,使吸附墊、滑軌及握持部在與X軸方向及Y軸方向正交的Z軸方向上升降;藉此,因為可謀求節省空間,並且以滑軌支撐並取出放入環狀框架,所以可不使環狀框架變形並搬送。然後,可有效率地將板狀工件或環狀框架搬送至例如研削板狀工件的研削裝置、膠膜貼片機,或是切割裝置、雷射加工裝置等分割裝置,該膠膜貼片機是以分割板狀工件後而單體化的晶片不會分散之方式形成透過膠膜以環狀框架支撐板狀工件而一體化的工件單元。[Invention Effect] The conveying machine of the present invention for conveying a plate-shaped workpiece and an open ring frame is provided with: an adsorption pad having a suction surface for sucking and holding the plate-shaped workpiece; and a first moving means to move the adsorption pad in the horizontal direction and in the X-axis direction Or retreat; two slide rails are arranged in parallel with the opening of the ring frame and support the two sides of the ring frame; the second moving means makes the slide rail move forward or backward in the X-axis direction; grip part, grip Holding the outer periphery of the ring frame; the third moving means makes the grip part move forward or backward in the X-axis direction and makes the ring frame move on the slide rail and in the X-axis direction; the fourth moving means makes The suction pad, the sliding rail and the gripper move in a horizontal direction or move linearly in the Y-axis direction orthogonal to the X-axis direction; and lifting means make the suction pad, slide rail and gripper It is lifted and lowered in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction; this saves space, and is supported by slide rails and taken out into the ring frame, so the ring frame can be transported without deforming the ring frame. Then, the plate-shaped workpiece or ring frame can be efficiently transported to, for example, a grinding device that grinds the plate-shaped workpiece, an adhesive film placement machine, or a cutting device, a laser processing device, and other dividing devices. The adhesive film placement machine After dividing the plate-shaped work piece, the singularized wafer is not scattered, forming an integrated work unit that supports the plate-shaped work piece through the glue film and supports the plate-shaped work piece through the ring frame.
本發明的搬送機器具備盒體,該盒體容納吸附墊、握持部、滑軌、第一移動手段、第二移動手段及第三移動手段,且具有可取出放入吸附墊並可取出放入握持部及滑軌的出入口;藉此,可謀求節省空間,並且可相對於板狀工件適當地定位吸附墊,此外,可相對於環狀框架適當地定位握持部或滑軌。The conveying machine of the present invention is provided with a box body that contains an adsorption pad, a holding part, a slide rail, a first moving means, a second moving means, and a third moving means, and has a suction pad that can be taken out and put in and can be taken out and put in. The entrance and exit of the holding part and the slide rail; thereby, space can be saved, and the suction pad can be appropriately positioned relative to the plate-shaped workpiece, and the holding part or the slide rail can be appropriately positioned relative to the ring frame.
本發明的搬送機器具備黏著滾輪,該黏著滾輪配設於吸附墊的下方且以在與X軸方向交叉之方向上延伸的旋轉軸為軸而旋轉自如,並在外側面具有黏著劑;藉此,可以升降手段將吸附墊定位在吸附面與黏著滾輪的外側面接觸的高度,且以第一移動手段使吸附墊在X軸方向上前進或後退而使吸附面與黏著滾輪的外側面接觸,並使黏著滾輪轉動而將吸附面進行乾式清洗。The conveying machine of the present invention is provided with an adhesive roller, the adhesive roller is arranged under the suction pad and is rotatable with a rotating shaft extending in a direction crossing the X-axis direction as an axis, and has an adhesive on the outer surface; thereby, The suction pad can be positioned at the height where the suction surface is in contact with the outer surface of the adhesive roller by lifting means, and the suction pad is advanced or retreated in the X-axis direction by the first moving means to make the suction surface contact the outer surface of the adhesive roller, and Rotate the adhesive roller to dry clean the suction surface.
在圖1~圖3表示其整體之本發明的搬送機器1,係可移動地配設在例如未圖示之研削裝置、膠膜貼片機及分割裝置(切割裝置、雷射加工裝置或是擴片裝置)等之間,或在各裝置的前方等,所述各裝置是隔開預定間隔而排列,或是連結且設置在無塵室等。亦即,例如在各個上述各裝置之間或是其前方配設導軌等,各裝置間或各裝置的前方成為沿著導軌移動之搬送機器1可通行的移動通路。然後,藉由線性馬達式的移動機構等而在導軌上移動的搬送機器1可僅以搬送機器1在各裝置間順利地進行板狀工件W或是環狀框架F,又或是由板狀工件W、未圖示的圓形膠膜及環狀框架F所組成的工件單元的搬入搬出或處理。Figures 1 to 3 show the overall conveying machine 1 of the present invention, which is movably arranged in, for example, a grinding device, a film placement machine, and a dividing device (cutting device, laser processing device, or Expansion device), etc., or in front of each device, etc., each device is arranged at a predetermined interval, or connected and installed in a clean room, etc. That is, for example, a guide rail or the like is arranged between or in front of each of the above-mentioned devices, and the space between or in front of each device becomes a moving path through which the conveying machine 1 moving along the guide rail can pass. Then, the conveying machine 1 that moves on the guide rails by a linear motor type moving mechanism or the like can smoothly move the plate-shaped workpiece W or the ring frame F between the devices with only the conveying machine 1 or the plate-shaped Loading and unloading or processing of the work unit composed of the work W, the circular film and the ring frame F not shown.
圖1所示之板狀工件W例如是由矽材料等所組成之圓形的半導體晶圓,但板狀工件W的種類及形狀並無特別限制,也可以砷化鎵、藍寶石、氮化鎵、陶瓷、樹脂或是碳化矽等所構成,也可為矩形的封裝基板等。 圖1所示的大致呈環狀之環狀框架F是例如以SUS(不鏽鋼)等形成為大致圓環板狀,在中央形成有從正面貫通至背面之圓形的開口。在環狀框架F的外周,將其外周的一部分切口成平面,藉此形成定位用的平坦面Fc。The plate-shaped workpiece W shown in FIG. 1 is, for example, a circular semiconductor wafer composed of silicon material, etc., but the type and shape of the plate-shaped workpiece W are not particularly limited, and gallium arsenide, sapphire, and gallium nitride can also be used. , Ceramic, resin or silicon carbide, etc. It can also be a rectangular package substrate. The substantially ring-shaped ring frame F shown in FIG. 1 is, for example, formed of SUS (stainless steel) in a substantially circular plate shape, and a circular opening penetrating from the front to the back is formed in the center. A part of the outer periphery of the ring frame F is cut into a plane to form a flat surface Fc for positioning.
本發明的搬送機器1,其搬送板狀工件W、具有開口的環狀框架F,或是由板狀工件W、未圖示的圓形膠膜及環狀框架F所組成之工件單元,如圖1~3所示,搬送機器1至少具備:吸附墊12,具有吸引保持板狀工件W的吸附面;第一移動手段3(參照圖4),使吸附墊12在水平方向且在X軸方向上前進或後退;滑軌16a、16b(參照圖2),夾著環狀框架F的開口而平行地配置兩條且支撐環狀框架F的兩側面;第二移動手段4(參照圖5、6),使滑軌16a及滑軌16b在X軸方向上前進或後退;握持部50,握持環狀框架F的外周緣;第三移動手段6,使握持部50在X軸方向上前進或後退且使環狀框架F在滑軌16a及滑軌16b上並於X軸方向上移動;第四移動手段7(參照圖3),使吸附墊12、滑軌16a、16b及握持部50在水平方向上迴旋移動,或是在水平方向上與X軸方向正交的Y軸方向上直線移動;及升降手段8,使吸附墊12、滑軌16a、16b及握持部50在與X軸方向及Y軸方向正交的Z軸方向上升降。The conveying machine 1 of the present invention conveys a plate-shaped workpiece W, a ring frame F having an opening, or a workpiece unit composed of a plate-shaped workpiece W, a circular film not shown, and a ring frame F, such as As shown in Figs. 1 to 3, the conveying machine 1 has at least: a
圖2、3所示的吸附墊12,例如其外型為圓形,且具備由多孔構件等所組成並吸附板狀工件W的吸附部120,及包圍並支撐吸附部120的框體121。吸附部120透過接頭129(參照圖2、圖4)及具備可撓性之未圖示的樹脂管等連通至未圖示之噴射器機構或真空產生裝置的吸引源。然後,藉由未圖示的吸引源運作而將所產生的吸引力傳遞至吸附部120的露出面(下表面)之平坦的吸附面120a。
另外,吸附墊12的構成並不限定於上述例子,也可成為在吸附面形成多個吸引槽的構成。The
如圖4所示,吸附墊12是框體121的上表面透過連結工具125且藉由螺栓125a而與搬送臂13的下表面連結。
搬送臂13是在後述的圖4所示之第一移動手段3的第一基板30的下方且在X軸方向上延伸成長尺板狀,並且其+X方向側的根部130與第一移動手段3的臂連結部341連結。As shown in FIG. 4, the
圖4所示的第一移動手段3具備:第一基板30,X軸方向為其長度方向;第一滾珠螺桿31,在第一基板30上表面的中央區域中往X軸方向延伸;一對第一導軌32,夾著第一滾珠螺桿31且與第一滾珠螺桿31平行地配置;第一旋轉驅動機構33,與第一滾珠螺桿31的後端側(+X方向側)連結且使第一滾珠螺桿31轉動;及第一可動構件34,底面在第一導軌32上滑動接觸。The first moving means 3 shown in FIG. 4 includes: a
第一旋轉驅動機構33例如是皮帶輪機構。第一旋轉驅動機構33具備在Z軸方向上延伸的圖4、5所示之板狀的馬達托架330。馬達托架330在上下形成有兩個安裝孔,在上側的該安裝孔插通有作為旋轉驅動源之第一馬達331的軸及安裝於該軸之主動皮帶輪332,在下側的該安裝孔插通有第一滾珠螺桿31(參照圖4)的後端側及安裝於第一滾珠螺桿31之後端的從動皮帶輪333。在主動皮帶輪332及從動皮帶輪333捲繞有環狀皮帶334。第一馬達331旋轉驅動主動皮帶輪332,藉此環狀皮帶334伴隨主動皮帶輪332的旋轉而轉動,且藉由環狀皮帶334的轉動而旋轉從動皮帶輪333及第一滾珠螺桿31。The first
圖4所示之第一可動構件34例如具備在Y軸方向上延伸的大致呈矩形的長尺板,在該長尺板的下表面的兩外側安裝有與第一導軌32滑動接觸的滑動構件340,並且第一滾珠螺桿31與已配設於該下表面中央之未圖示的螺帽螺合。The first
在第一基板30的中央區域作為各個第一導軌32之外側的位置形成有在X軸方向上延伸之切口成矩形狀而形成的兩條長尺孔300。例如,在第一可動構件34的長尺板之Y軸方向的兩端側下表面形成有與支撐吸附墊12之搬送臂13的根部130連結的臂連結部341。亦即,臂連結部341往-Z方向垂下且通過第一基板30的長尺孔300後,藉由固定螺栓等而與位於長尺孔300之下方的搬送臂13之根部130連結。In the central area of the
因此,若第一旋轉驅動機構33使第一滾珠螺桿31轉動,則伴隨於此,第一可動構件34被導引於第一導軌32且與位於第一基板30之下方的搬送臂13同時於X軸方向上往返移動,且伴隨於此,被配設於搬送臂13之前端側的吸附墊12也在X軸方向上往返移動。Therefore, when the first
上述圖4所示的第一滾珠螺桿31、第一導軌32及長尺孔300的上方成為如圖2、5所示之以板金蓋39覆蓋的狀態,例如,如圖5所示,第一旋轉驅動機構33的第一馬達331成為安裝於板金蓋39之上表面的狀態。
然後,在圖2、5所示之第一基板30的上表面之Y軸方向兩側未以板金蓋39覆蓋的區域上載置有第二移動手段4之後述的各構成要素。The upper part of the
使圖5及圖6所示的一對滑軌16a、16b在X軸方向上前進或後退的第二移動手段4,例如具備:第二滾珠螺桿41(僅圖示於圖5),在第一基板30的上表面之Y軸方向外側區域(未以板金39覆蓋的區域)且於X軸方向上延伸;第二導軌42a、第二導軌42b,與跟第二滾珠螺桿41平行地配設;第二旋轉驅動機構43,與該第二滾珠螺桿41的後端連結且使第二滾珠螺桿41轉動;及第二可動構件44a、44b,其底面在第二導軌42a、42b上滑動接觸。The second moving means 4 that advances or retreats the pair of
在第一基板30的上表面中位於-Y方向側的第二滾珠螺桿41及第二導軌42a構成滑塊式的電動缸(ROBO Cylinder),且被滾珠螺桿蓋45保護。在滾珠螺桿蓋45的側面,例如,安裝載置有被綁束之電源線等的電線載體45a。配設於第二導軌42a上的第二可動構件44a透過第三移動手段6的第三基板60於其下表面側配設有滑塊45d,且伴隨著第二滾珠螺桿41的轉動而藉由滑塊45d成為可與第三基板60同時於第二導軌42a上滑動移動。第二可動構件44a於其前端側安裝有滑軌16a。The
例如,在第二導軌42a上配設有透過第三基板60而與第二可動構件44a的下表面連結的上述滑塊45d。For example, the above-mentioned
如圖5、6所示,位於第一基板30的上表面之+Y方向側的區域之平板狀的第二可動構件44b具備以X軸作為對稱軸而與第二可動構件44a對稱的形狀,且於其前端側安裝有滑軌16b,並透過第三移動手段6之第三基板60而在其下表面安裝有未圖示的滑塊,該未圖示的滑塊可滑動地與第二導軌42b鬆嵌合。As shown in FIGS. 5 and 6, the flat plate-shaped second
如圖5、6所示,第二旋轉驅動機構43例如為皮帶輪機構,具備在Z軸方向上延伸之板狀的馬達托架430,在馬達托架430的下部側插通有作為旋轉驅動源之第二馬達431的軸及安裝於該軸之主動皮帶輪432。在馬達托架430的上部側,插通有第二滾珠螺桿41的後端側,及安裝於第二滾珠螺桿41之後端的從動皮帶輪433。在主動皮帶輪432及從動皮帶輪433捲繞有環狀皮帶434。第二馬達431旋轉驅動主動皮帶輪432,藉此環狀皮帶434伴隨主動皮帶輪432的旋轉而轉動,且藉由環狀皮帶434的轉動而旋轉從動皮帶輪433及第二滾珠螺桿41,第二導軌42a上的第二可動構件44a會在X軸方向上移動。As shown in FIGS. 5 and 6, the second
第二可動構件44a的後端側與第二可動構件44b的後端側,藉由在Y軸方向上延伸之後述的汽缸機構169而連結,第二可動構件44b為與第二可動構件44a在X軸方向上往返移動連動而在X軸方向上往返移動。The rear end side of the second
如圖5、6所示,兩條滑軌16a、16b其剖面分別形成L字狀,且在X軸方向上平行地延伸。兩條滑軌16a、16b以階梯狀的導引面(內側面)對向的方式分別連結於第二可動構件44a、第二可動構件44b的前端側。然後,將後述之握持部50已握持的環狀框架F載置於兩條滑軌16a、16b,且該導引面從±Y方向抵接環狀框架F之定位用的平坦面Fc(參照圖1)。
例如,也可在兩條滑軌16a、16b的前端配設檢測環狀框架F之光感測器等的檢測感測器163。As shown in Figs. 5 and 6, the two
在本實施方式中,如圖5、6所示,在安裝有滑軌16a的第二可動構件44a及安裝有滑軌16b的第二可動構件44b配設有汽缸機構169,其可擴大滑軌16a與滑軌16b的間隔,從可支撐例如200mm的環狀框架F之間隔起至可支撐例如300mm的環狀框架F之間隔為止。藉由汽缸機構169,使第二可動構件44a由配設於後述之第三基板60上的導引部169a導引並往-Y方向移動,使第二可動構件44b由配設於第三基板60上的導引部169b導引並往+Y方向移動,而可改變成以滑軌16a、16b支撐300nm的環狀框架F的狀態。In this embodiment, as shown in FIGS. 5 and 6, the second
圖6、7所示的第三移動手段6,其使已握持環狀框架F的握持部50在X軸方向上移動,例如具備:俯視為矩形狀的第三基板60,如圖6所示在第一移動手段3的板金蓋39之上方連結有第二可動構件44a、44b且可在X軸方向上移動;第三滾珠螺桿61,具有X軸方向的軸心;一對第三導軌62,與第三滾珠螺桿61平行地配設於第三基板60上;第三旋轉驅動機構63,與第三滾珠螺桿61的後端連結且使第三滾珠螺桿61轉動;及第三可動構件64,其底面與第三導軌62滑動接觸。The third moving means 6 shown in FIGS. 6 and 7 moves the gripping
第三基板60是其左右外側的區域被切口成例如在X軸方向上延伸的矩形狀而形成兩個切口部600,例如,在圖6、7中+Y方向側的切口部600內容納有第三滾珠螺桿61。In the
第三旋轉驅動機構63例如是具備第三馬達630及未圖示之環狀皮帶的皮帶輪機構,第三馬達630透過馬達托架633而被配設在第三基板60之+Y方向側的旁邊,藉由第三馬達630的旋轉驅動而能使第三滾珠螺桿61旋轉。The third
第三可動構件64例如為在Y軸方向上延伸的長尺板,配設於設置在+Y方向側之端部的連結部640之內部的螺帽與第三滾珠螺桿61螺合,此外,配設於其兩端側之下表面的各滑塊641與第三導軌62可滑動地鬆嵌合。然後,配設有握持部50的握持部固定板51被鎖緊在第三可動構件64的下表面之大致為中央的位置。若第三旋轉驅動機構63使第三滾珠螺桿61轉動,則伴隨於此,第三可動構件64被導引於第三導軌62且與握持部50同時於第三基板60上且在X軸方向上往返移動。The third
從上下方向握持環狀框架F之外周緣的握持部50被安裝於從第三可動構件64往-X方向側延伸之握持部固定板51的前端。
握持部50例如為具備從側面觀看大致為ㄈ字狀之外型的機械夾具,在Z軸方向上對向的一對夾持爪500藉由電動汽缸等的握持部驅動源501而在互相接近的方向上移動,藉此可握持環狀框架F的外周緣。The gripping
例如,在第三基板60上,於圖6所示之第三導軌62及握持部50之間,使用未圖示的固定工具或纜線盒66來使電源線匍匐,因此,如圖2所示,以排除第三基板60上之握持部50的移動通路之方式進行,成為第三基板60上被板金蓋67覆蓋一部分的狀態。For example, on the
在本實施方式中,第三移動手段6成為可以第三移動手段6整體在第一移動手段3之板金蓋39的上方於X軸方向移動。亦即,伴隨著讓用於移動圖5所示之第二可動構件44a的滑塊45d及用於移動第二可動構件44b之未圖示的滑塊分別在第二導軌42a、42b上移動,安裝於滑塊45d及未圖示之滑塊上的第三移動手段6也成為可在X軸方向上移動。In this embodiment, the third moving means 6 can move the entire third moving means 6 in the X-axis direction above the
本實施方式中的搬送機器1如圖1、3所示,具備盒體20,該盒體20容納吸附墊12、握持部50、滑軌16a、16b、第一移動手段3、第二移動手段4及第三移動手段6,且具有可取出放入吸附墊12的第一開口201,並且具有可取出放入握持部50及滑軌16a、16b的第二開口202。在本實施方式中,以尚未一體化的第一開口201及第二開口202,形成可取出放入吸附墊12,並且可取出放入握持部50及導軌16a、16b的出入口。
另外,也可使第一開口201及第二開口202一體化,而將一體化之大開口作為可取出放入吸附墊12,並且可取出放入握持部50及導軌16a、16b的出入口。As shown in Figs. 1 and 3, the conveying machine 1 in this embodiment includes a
如圖1、3所示的盒體20例如具備比第一基板30還大且與第一基板30俯視為相似多角形之外型,並具備盒體頂壁200、從盒體頂壁200的下表面往-Z方向垂下的盒體側壁203、盒體前壁204及盒體後壁205。
例如,如圖2、3所示,從第一基板30之Y軸方向兩側的下表面起,第一連結板307往-Z方向垂下,盒體安裝板302從第一連結板307的側面朝向Y軸方向的外側且水平地延伸。然後,如圖3所示,在盒體20已被載置於盒體安裝板302上的狀態,藉由彈簧鎖扣或螺栓等的固定工具而將其盒體側壁203固定於盒體安裝板302。另外,未圖示的電線等也以被綁束的狀態載置並固定在盒體安裝板302上。The
圖1、3所示之可取出放入吸附墊12的第一開口201是將位於盒體20之-X方向側的盒體前壁204之下部側的區域切口成大致為矩形而形成。此外,可取出放入握持部50及導軌16a、16b的第二開口202是將盒體前壁204之上部側的區域切口成大致為矩形而形成。The
在第一連結板307的下端固定有連結升降手段8及第四移動手段7之各構成的水平板79。因此,吸附墊12可於X軸方向上進退地被容納在藉由水平板79、Y軸方向兩側之兩片第一連結板307及第一基板30所形成的空間。To the lower end of the first connecting
如圖1~3所示之使吸附墊12、導軌16a、16b及握持部50在Z軸方向上升降的升降手段8,例如具備:角柱狀的塊體80,在Z軸方向上延伸的剖面是大致為凹型;升降滾珠螺桿82(僅圖示於圖3),具有Z軸方向之軸心且配設於塊體80之-X方向側的前表面;一對升降導軌81,與升降滾珠螺桿82平行地配設於塊體80的該前表面且在Z軸方向上延伸;升降旋轉驅動機構83,與升降滾珠螺桿82之下端連結且使升降滾珠螺桿82轉動;及升降構件84,配設於一對升降導軌81之間。As shown in Figures 1 to 3, the lifting means 8 that lifts the
在形成於塊體80的-X方向側之前表面的凹陷部分配設有升降滾珠螺桿82及大致為四角柱狀的升降構件84。
如圖3所示,相對於已固定之狀態的塊體80,可上升的升降構件84至少具備:升降柱部840,固定於水平板79的下表面且在Z軸方向上延伸並可在塊體80的凹部內上下移動;及滑塊841,一體地形成於升降柱部840的下端側且其側面與一對升降導軌81鬆嵌合。
例如,如圖3所示,在塊體80的側邊供給電力至搬送機器1之各馬達等的電源線88是透過電線盒880或未圖示的電線拖鏈(CABLE BEAR)(註冊商標)而配設。A lifting
詳細示於圖3的升降旋轉驅動機構83例如為皮帶輪機構,具備透過馬達托架830而安裝於塊體80之下端面的升降馬達831。在作為使升降滾珠螺桿82旋轉之驅動源的升降馬達831的軸安裝有主動皮帶輪832,在主動皮帶輪832捲繞有環狀皮帶833。在升降滾珠螺桿82之下端側安裝有從動皮帶輪834,環狀皮帶833也捲繞在此從動皮帶輪834。藉由升降馬達831旋轉驅動主動皮帶輪832,環狀皮帶833伴隨著主動皮帶輪832的旋轉而轉動,藉由環狀皮帶833的轉動而旋轉從動皮帶輪834及升降滾珠螺桿82。然後,伴隨著升降滾珠螺桿82的旋轉,升降構件84在Z軸方向上直線移動,且階段地配設在水平板79之上方的吸附墊12、滑軌16a、16b及握持部50也一起在Z軸方向上移動。The elevating and
在升降柱部840的上部側配設有第四移動手段7。在圖3、4所示之本實施方式中的第四移動手段7為使吸附墊12、滑軌16a、16b及握持部50在水平方向,亦即在X軸Y軸平面上迴旋移動者,其具備:台座70,安裝於升降柱部840之-X方向側的前表面;旋轉軸71,從台座70往+Z方向延伸且其上端側與水平板79的下表面連結;第四旋轉驅動機構73,安裝於以從台座70之側面往-Y方向伸出的方式安裝之托架77且使旋轉軸71旋轉;及所述水平板79。
另外,第四移動手段7也可為使吸附墊12、滑軌16a、16b及握持部50在水平方向的Y軸方向上直線移動的滾珠螺桿機構等。The fourth moving means 7 is arranged on the upper side of the
台座70及旋轉軸71的下端側透過未圖示之下部軸承而連結,藉由傳遞第四旋轉驅動機構73產生的旋轉動力,旋轉軸71藉由下部軸承而可在台座70上旋轉。The lower end side of the
如圖3、4所示,第四旋轉驅動機構73例如為皮帶輪機構,具備藉由托架77所支撐的第四馬達731。在作為使旋轉軸71旋轉之驅動源的第四馬達731的軸安裝有主動皮帶輪732,在主動皮帶輪732捲繞有環狀皮帶733。在旋轉軸71之下端側安裝有未圖示的從動皮帶輪,環狀皮帶733也捲繞在此未圖示的從動皮帶輪。藉由第四馬達731旋轉驅動主動皮帶輪732,環狀皮帶733伴隨著主動皮帶輪732的旋轉而轉動,藉由環狀皮帶733的轉動而旋轉未圖示的從動皮帶輪及旋轉軸71。然後,伴隨著旋轉軸71的旋轉,水平板79在水平面上迴旋移動,且階段地配設在水平板79之上方的吸附墊12、滑軌16a、16b及握持部50也一起在水平面上迴旋移動。
例如,如圖1、2所示,第四旋轉驅動機構73成為被由安裝於塊體80之防護蓋75覆蓋的狀態。As shown in FIGS. 3 and 4, the fourth
在本實施方式中,搬送機器1如圖1~4所示,具備黏著滾輪17,該黏著滾輪17配設於該吸附墊12的下方且以在與X軸方向交叉之方向(Y軸方向)上延伸的旋轉軸(以下稱為滾輪旋轉軸17d)為軸而旋轉自如,並在外側面具有黏著劑。In this embodiment, as shown in FIGS. 1 to 4, the conveying machine 1 is provided with an
例如,如圖3所示,在作為水平板79之下方的位置配設有可在與升降柱部840同時上下動之水平板79的下表面於X軸方向移動的黏著滾輪支撐板14。黏著滾輪支撐板14藉由配設於水平板79的下表面之未圖示的導軌而被導引於X軸方向,且藉由氣缸14a而在X軸方向上進退。黏著滾輪支撐板14被安裝於防護蓋75的前表面,該防護蓋75被安裝於升降手段8之塊體80。
在黏著滾輪支撐板14的上表面固定有將滾輪旋轉軸17d之兩端支撐為旋轉自如的支撐部143。For example, as shown in FIG. 3, at a position below the
在本實施方式中,例如,形成吸附墊12之直徑以上的長度之黏著滾輪17是藉由插通其內部的滾輪旋轉軸17d而被水平地支撐。配設於黏著滾輪17之外側面的黏著劑是以具有黏著性及彈性的合成橡膠等所構成。若以升降手段8將吸附墊12定位於吸附面120a與黏著滾輪17之外側面接觸的高度,且以第一移動手段3使吸附墊12在X軸方向上前進或後退並使吸附面120a與黏著滾輪17的外側面接觸,則加工屑等會附著於黏著劑而從吸附墊12的吸附面120a去除(乾式清洗)。另外,在清洗吸附墊12的吸附面120a時,使圖3所示的黏著滾輪支撐板14往-X方向移動,且在清洗完成後使黏著滾輪支撐板14往+X方向移動。藉此,可不使搬送機器1往X軸方向加大而構成。
另外,黏著劑的黏著力藉由去除已附著於黏著滾輪17之外周面的加工屑而回復。In this embodiment, for example, the
以下,使用上述搬送機器1說明在搬送例如圖1、4所示之板狀工件W的情況。Hereinafter, a case where the plate-shaped workpiece W shown in Figs. 1 and 4 is conveyed will be described using the aforementioned conveying machine 1.
例如,在搬送載置於未圖示的研削裝置之保持台的板狀工件W的情況,圖4所示的第一移動手段3使吸附墊12往-X方向側前進,且使吸附墊12從圖1所示之盒體20的第一開口201往盒體20外進出,以吸附墊12之吸附面120a的中心與板狀工件W的中心大致一致的方式將吸附墊12定位於板狀工件W的上方。此外,藉由未圖示的吸引源運作而將所產生的吸引力傳遞至吸附墊12的吸附面120a。For example, in the case of conveying a plate-shaped workpiece W placed on a holding table of a grinding apparatus not shown, the first moving means 3 shown in FIG. 4 advances the
藉由升降手段8,吸附墊12往-Z方向下降至吸附面120a與板狀工件W之上表面接觸的高度位置後,在該高度位置停止下降。然後,藉由傳達至吸附面120a的吸引力,吸附墊12以吸附面120a吸附板狀工件W的上表面。其後,藉由升降手段8,已吸引保持板狀工件W的吸附墊12上升,而使板狀工件W從未圖示的保持台離開。By the elevating
圖4所示的第一移動手段3使吸附墊12往+X方向側後退,而將吸引保持板狀工件W的吸附墊12容納在盒體20內。然後,在藉由吸附墊12而被吸引保持的板狀工件W被容納於藉由圖4所示的水平板79、Y軸方向兩側之兩片第一連結板307及第一基板30而形成的空間之狀態下,搬送機器1整體從未圖示的研削裝置移動至例如未圖示的切割裝置的附近,藉此在裝置間進行經由搬送機器1之板狀工件W的搬送。另外,搬送機器1整體也可在將吸引保持板狀工件W的吸附墊12伸出至盒體20外的狀態下在裝置間移動。The first moving means 3 shown in FIG. 4 retreats the
以下,說明使用搬送機器1搬送例如圖1、圖2及圖6所示的環狀框架F之情況。Hereinafter, a case where, for example, the ring frame F shown in Figs. 1, 2 and 6 is conveyed using the conveying machine 1 will be described.
例如,環狀框架F以滑軌16a、16b可支撐其兩側面之平坦面Fc的方式而被容納在未圖示的框架儲存部等。圖6所示的第二移動手段4使滑軌16a、16b往-X方向側前進,而使滑軌16a、16b從圖1所示的盒體20之第二開口202往盒體20外進出。此外,藉由圖1、2所示的升降手段8,滑軌16a、16b在Z軸方向上上升或下降,並進行滑軌16a、16b與環狀框架F之高度的對位。For example, the ring frame F is accommodated in a frame storage part (not shown) so that the slide rails 16a and 16b can support the flat surfaces Fc of both side surfaces. The second moving means 4 shown in FIG. 6 advances the
圖6所示的第二移動手段4使滑軌16a、16b進一步往-X方向側前進,且使滑軌16a、16b之階梯狀的導引面從±Y方向抵接環狀框架F之兩側面的平坦面Fc,以藉由滑軌16a、16b支撐環狀框架F。第二移動手段4使滑軌16a、16b往+X方向側後退,將支撐環狀框架F的滑軌16a、16b從圖1所示的第二開口202容納至盒體20內。然後,在由滑軌16a、16b所支撐的環狀框架F已容納於盒體20內的狀態下,搬送機器1整體從未圖示的框架儲存部移動至例如未圖示之膠膜貼片機的附近,藉此進行在裝置間的經由搬送機器1之環狀框架F的搬送。另外,搬送機器1整體也可在將支撐環狀框架F的滑軌16a、16b伸出至盒體20外的狀態下在裝置間移動。
此外,也可在以滑軌16a、16b支撐環狀框架F後,成為以圖6所示的握持部50握持住環狀框架F之外周緣的狀態。The second moving means 4 shown in FIG. 6 advances the
以下說明使用搬送機器1搬送例如圖8、9所示之工件單元WU的情況。 圖8所示的板狀工件W藉由未圖示的膠膜貼片機,成為其下表面黏貼有直徑比板狀工件W還大之圓形膠膜T的狀態。此外,圓形膠膜T的外周部分被黏貼於環狀框架F。藉此,被定位在環狀框架F之開口內的板狀工件W透過圓形膠膜T而與環狀框架F一體化,成為可以環狀框架F處理的工件單元WU。Hereinafter, a case where the work unit WU shown in FIGS. 8 and 9 is transported using the transport machine 1 will be described. The plate-shaped workpiece W shown in FIG. 8 is in a state where a circular adhesive film T having a larger diameter than the plate-shaped workpiece W is pasted on its lower surface by an adhesive film placement machine not shown. In addition, the outer peripheral portion of the circular adhesive film T is stuck to the ring frame F. Thereby, the plate-shaped work W positioned in the opening of the ring frame F is integrated with the ring frame F through the circular adhesive film T, and becomes a work unit WU that can be processed by the ring frame F.
例如,如圖8所示,工件單元WU被載置在兩條滑軌16a、16b,且在滑軌16a、16b之階梯狀的導引面從±Y方向抵接於環狀框架F的兩側面之定位用的平坦面Fc之狀態下,成為藉由滑軌16a、16b所支撐的狀態。For example, as shown in FIG. 8, the workpiece unit WU is placed on two
圖8所示的第三移動手段6使已打開一對夾持爪500之狀態的握持部50往-X方向移動,且以成為環狀框架F之外周緣進入一對夾持爪500之間的狀態之方式定位握持部50。之後,一對夾持爪500藉由握持部驅動源501而在互相接近的方向上移動,藉此握持環狀框架F的外周緣。The third moving means 6 shown in FIG. 8 moves the gripping
例如,在搬送工件單元WU至未圖示之研削裝置的保持台時,圖6及圖8所示的第二移動手段4使第二可動構件44a、44b、已支撐工件單元WU之狀態的滑軌16a、16b、第三移動手段6及已握持工件單元WU之狀態的握持部50從圖1所示之盒體20的第二開口202往盒體20外進出。然後,例如在未圖示之保持台的前方的預定位置使由第二移動手段4進行的上述之各構成的前進停止。For example, when transporting the workpiece unit WU to the holding table of a grinding device not shown, the second moving means 4 shown in FIGS. 6 and 8 slides the second
如圖9所示,第三移動手段6使握持部50往-X方向側前進,且在滑軌16a、16b上使環狀框架F在X軸方向上移動。然後,使板狀工件W的中心與保持台之保持面的中心大致一致。As shown in FIG. 9, the third moving means 6 advances the
藉由升降手段8,在到達藉由握持部50所握持之工件單元WU的圓形膠膜T與未圖示之保持台的保持面接觸之高度位置為止,使握持部50往-Z方向下降,之後在該高度位置停止下降。然後,在以保持台吸引保持工件單元WU之後,握持部50解除環狀框架F的握持,並從工件單元WU離開。以此方式進行,搬送機器1可在研削裝置等搬送工件單元WU。By the lifting means 8, until the circular adhesive film T of the workpiece unit WU held by the holding
搬送板狀工件W及具有開口的環狀框架F之本發明的搬送機器1具備:吸附墊12,具有吸引保持板狀工件W的吸附面120a;第一移動手段3,使吸附墊12在水平方向且在X軸方向上前進或後退;滑軌16a、16b,夾著環狀框架F的開口而平行地配置兩條且支撐環狀框架F的兩側面;第二移動手段4,使滑軌16a、16b在X軸方向上前進或後退;握持部50,握持環狀框架F的外周緣;第三移動手段6,使握持部50在X軸方向上前進或後退且使環狀框架F在滑軌16a、16b上並於X軸方向上移動;第四移動手段7,使吸附墊12、滑軌16a、16b及握持部50在水平方向上迴旋移動;及升降手段8,使吸附墊12、滑軌16a、16b及握持部50在與X軸方向及Y軸方向正交的Z軸方向上升降;藉此,因為可謀求節省空間,並且以滑軌16a、16b支撐並取出放入環狀框架F,所以可不使環狀框架F變形並搬送。然後,可有效率地將板狀工件W、環狀框架F或是工件單元WU搬送至例如研削板狀工件W的研削裝置、膠膜貼片機,或是切割裝置、雷射加工裝置等分割裝置,該膠膜貼片機是以分割板狀工件W後而單體化的晶片不會分散之方式形成透過圓形膠膜T以環狀框架F支撐板狀工件W而一體化的工件單元WU。The conveying machine 1 of the present invention that conveys a plate-shaped workpiece W and an open ring frame F includes: a suction pad 12 having a suction surface 120a for sucking and holding the plate-shaped workpiece W; and a first moving means 3 to make the suction pad 12 horizontal Direction and advance or retreat in the X-axis direction; the slide rails 16a, 16b are arranged in parallel with the opening of the ring frame F and support the two sides of the ring frame F; the second moving means 4 makes the slide rails 16a, 16b advance or retreat in the X-axis direction; the grip part 50 holds the outer periphery of the ring frame F; the third moving means 6 makes the grip part 50 advance or retreat in the X-axis direction and make the ring The frame F moves on the sliding rails 16a, 16b and in the X-axis direction; the fourth moving means 7, which makes the suction pad 12, the sliding rails 16a, 16b, and the grip 50 move in a horizontal direction; and the lifting means 8, The suction pad 12, the slide rails 16a, 16b, and the grip 50 are raised and lowered in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction; thereby, space can be saved and the slide rails 16a, 16b are supported And take it out and put it in the ring frame F, so the ring frame F can be transported without deforming the ring frame F. Then, the plate-shaped workpiece W, the ring frame F, or the workpiece unit WU can be efficiently transferred to, for example, a grinding device for grinding the plate-shaped workpiece W, a film mounter, or a cutting device, a laser processing device, etc. Device, the film mounter is to divide the plate-shaped workpiece W and the singulated wafer will not be dispersed to form a work unit integrated with the plate-shaped workpiece W supported by the ring frame F through the circular adhesive film T WU.
本發明的搬送機器1具備盒體20,該盒體20容納吸附墊12、握持部50、滑軌16a、16b、第一移動手段3、第二移動手段4及第三移動手段6,且具有例如可取出放入吸附墊12的第一開口201以及例如可取出放入握持部50及滑軌16a、16b的第二開口202;藉此,可謀求節省空間,並且相對於板狀工件W適當地定位吸附墊12,此外,可相對於環狀框架F適當地定位握持部50或滑軌16a、16b。The conveying machine 1 of the present invention is provided with a
本發明的搬送機器1具備黏著滾輪17,該黏著滾輪17配設於該吸附墊12的下方且以在與X軸方向交叉之方向上延伸的旋轉軸17d為軸而旋轉自如,並在外側面具有黏著劑;藉此,可以升降手段8將吸附墊12定位在吸附面120a與黏著滾輪17的外側面接觸的高度,且以第一移動手段3使吸附墊12在X軸方向上前進或後退而使吸附面120a與黏著滾輪17的外側面接觸,並使黏著滾輪17轉動而將吸附面120a進行乾式清洗。The conveying machine 1 of the present invention is provided with an
本發明的搬送機器1不限於上述實施方式,可在其技術思想的範圍內以各種不同方式實施也是自不待言。此外,關於在隨附圖式所圖示之搬送機器1的各構成的形狀等,也不限定於此,可在能發揮本發明之效果的範圍內適當變更而實施。The conveying machine 1 of the present invention is not limited to the above-mentioned embodiment, and it goes without saying that it can be implemented in various ways within the scope of its technical idea. In addition, the shapes and the like of the respective components of the conveying machine 1 illustrated in the accompanying drawings are not limited to this, and can be appropriately changed and implemented within the range where the effects of the present invention can be exhibited.
W:板狀工件 F:環狀框架: Fc:平坦面 T:圓形膠膜 WU:工件單元 1:搬送機器 12:吸附墊 120:吸附部 120a:吸附面 121:框體 129:接頭 125:連結構件 13:搬送臂 130:搬送臂的根部 17:黏著滾輪 17d:滾輪旋轉軸 14:黏著滾輪支撐板 14a:氣缸 20:盒體 200:盒體頂壁 201:第一開口 202:第二開口 203:盒體側壁 204:盒體前壁 205:盒體後壁 3:第一移動手段 30:第一基板 300:長尺孔 302:盒體安裝板 307:第一連結板 31:第一滾珠螺桿 32:第一導軌 33:第一旋轉驅動機構 330:馬達托架 331:第一馬達 332:主動皮帶輪 333:從動皮帶輪 334:環狀皮帶 34:第一可動構件 340:滑塊構件 341:臂連結部 39:板金蓋 16a、16b:滑軌 4:第二移動手段 41:第二滾珠螺桿 42a、42b:一對第二導軌 43:第二旋轉驅動機構 44a:第二可動構件 44b:第二可動構件 50:握持部 500:一對夾持爪 501:握持部驅動源 6:第三移動手段 60:第三基板 61:第三滾珠螺桿 62:第三導軌 63第三旋轉驅動機構 64:第三可動構件 7:第四移動手段 70:台座 71:旋轉軸 73:旋轉驅動機構 79:水平板 8:升降手段 80:塊體 81:一對升降導軌 82:滾珠螺桿 83:升降旋轉驅動機構 84:升降構件W: plate-shaped workpiece F: Ring frame: Fc: flat surface T: round film WU: Workpiece unit 1: transfer machine 12: Adsorption pad 120: Adsorption part 120a: Adsorption surface 121: Frame 129: Connector 125: connecting member 13: Transport arm 130: The root of the transport arm 17: Adhesive roller 17d: Roller rotation axis 14: Adhesive roller support plate 14a: cylinder 20: Box body 200: box top wall 201: first opening 202: second opening 203: Box side wall 204: box front wall 205: back wall of box 3: The first means of movement 30: First substrate 300: Long hole 302: Box mounting plate 307: first link plate 31: The first ball screw 32: The first rail 33: The first rotary drive mechanism 330: Motor bracket 331: First Motor 332: active pulley 333: driven pulley 334: Loop belt 34: The first movable member 340: Slider member 341: Arm link 39: sheet metal cover 16a, 16b: slide rail 4: The second means of movement 41: The second ball screw 42a, 42b: a pair of second rails 43: second rotary drive mechanism 44a: second movable member 44b: second movable member 50: grip 500: A pair of clamping jaws 501: Grip drive source 6: The third means of movement 60: third substrate 61: The third ball screw 62: Third rail 63 third rotary drive mechanism 64: third movable member 7: The fourth means of movement 70: Pedestal 71: Rotation axis 73: Rotary drive mechanism 79: horizontal board 8: Lifting means 80: block 81: A pair of lifting rails 82: Ball screw 83: Lifting and rotating drive mechanism 84: Lifting member
圖1為從上方表示搬送機器整體之一例的立體圖。 圖2為從上方表示盒體被拆卸後的狀態之搬送機器整體之一例的立體圖。 圖3為從下方表示搬送機器整體之一例的立體圖。 圖4為從上方表示搬送機器的吸附墊、第一移動手段、第四移動手段及升降手段的立體圖。 圖5為從搬送機器的背後之上方表示搬送機器的第一移動手段、第二移動手段、第三移動手段、握持部及滑軌的構造之一例的立體圖。 圖6為從搬送機器的前側之上方表示搬送機器的第二移動手段、第三移動手段、握持部及滑軌的構造之一例的立體圖。 圖7為說明搬送機器的握持部及第三移動手段之一例的立體圖。 圖8為說明搬送機器將工件單元以滑軌支撐並搬送之狀態的立體圖。 圖9為說明環狀框架被握持部握持住的工件單元藉由第三移動手段而在滑軌上移動之狀態的立體圖。Fig. 1 is a perspective view showing an example of the entire conveying machine from above. Fig. 2 is a perspective view showing an example of the entire conveying machine in a state where the cassette body is removed from above. Fig. 3 is a perspective view showing an example of the entire conveying machine from below. Fig. 4 is a perspective view showing the suction pad, the first moving means, the fourth moving means, and the elevating means of the conveying machine from above. Fig. 5 is a perspective view showing an example of the structure of the first moving means, the second moving means, the third moving means, the grip and the slide rail of the conveying machine from above the back of the conveying machine. Fig. 6 is a perspective view showing an example of the structure of the second moving means, the third moving means, the grip and the slide rail of the conveying machine from above the front side of the conveying machine. Fig. 7 is a perspective view illustrating an example of a grip portion and a third moving means of the conveying machine. Fig. 8 is a perspective view illustrating a state in which the conveying machine supports and conveys the workpiece unit with slide rails. Fig. 9 is a perspective view illustrating a state in which the workpiece unit held by the ring frame is moved on the slide rail by the third moving means.
4:第二移動手段 4: The second means of movement
6:第三移動手段 6: The third means of movement
8:升降手段 8: Lifting means
12:吸附墊 12: Adsorption pad
14:黏著滾輪支撐板 14: Adhesive roller support plate
16a,16b:滑軌 16a, 16b: slide rail
17:黏著滾輪 17: Adhesive roller
17d:滾輪旋轉軸 17d: Roller rotation axis
30:第一基板 30: First substrate
33:第一旋轉驅動機構 33: The first rotary drive mechanism
39:板金蓋 39: sheet metal cover
42a,42b:一對第二導軌 42a, 42b: a pair of second rails
44a:第二可動構件 44a: second movable member
44b:第二可動構件 44b: second movable member
45a:電線載體 45a: Wire carrier
50:握持部 50: grip
51:握持部固定板 51: Grip fixing plate
60:第三基板 60: third substrate
61:第三滾珠螺桿 61: The third ball screw
63:第三旋轉驅動機構 63: Third rotary drive mechanism
64:第三可動構件 64: third movable member
66:電線盒 66: Wire box
67:板金蓋 67: Sheet metal cover
75:防護蓋 75: protective cover
79:水平板 79: horizontal board
80:塊體 80: block
81:一對升降導軌 81: A pair of lifting rails
83:升降旋轉驅動機構 83: Lifting and rotating drive mechanism
84:升降構件 84: Lifting member
120a:吸附面 120a: Adsorption surface
121:框體 121: Frame
129:接頭 129: Connector
143:支撐部 143: Support
163:檢測感測器 163: Detection Sensor
169:汽缸機構 169: cylinder mechanism
302:盒體安裝板 302: Box mounting plate
307:第一連結板 307: first link plate
330:馬達托架 330: Motor bracket
331:第一馬達 331: First Motor
500:一對夾持爪 500: A pair of clamping jaws
501:握持部驅動源 501: Grip drive source
840:升降柱部 840: Lifting column
841:滑塊 841: Slider
W:板狀工件 W: plate-shaped workpiece
F:環狀框架 F: ring frame
Fc:平坦面 Fc: flat surface
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2019100121A JP7343306B2 (en) | 2019-05-29 | 2019-05-29 | Transfer robot |
JP2019-100121 | 2019-05-29 |
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TW202043127A true TW202043127A (en) | 2020-12-01 |
TWI831975B TWI831975B (en) | 2024-02-11 |
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TW109117570A TWI831975B (en) | 2019-05-29 | 2020-05-26 | Transporting machines |
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JP (1) | JP7343306B2 (en) |
KR (1) | KR20200137970A (en) |
CN (1) | CN112008702B (en) |
TW (1) | TWI831975B (en) |
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CN114496871B (en) * | 2021-12-31 | 2023-07-14 | 深圳新益昌科技股份有限公司 | Die bonder |
CN118251467A (en) | 2022-01-14 | 2024-06-25 | 富士高分子工业株式会社 | Thermally conductive composition, thermally conductive sheet using same, and method for producing thermally conductive sheet |
JP2024018207A (en) | 2022-07-29 | 2024-02-08 | 株式会社ディスコ | Transportation device |
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JP2000049210A (en) * | 1998-07-30 | 2000-02-18 | Matsushita Electric Ind Co Ltd | One-piece substrate transfer pallet and manufacture of electronic component |
JP5129002B2 (en) * | 2008-04-10 | 2013-01-23 | 株式会社ディスコ | Processing equipment |
JP5543813B2 (en) * | 2010-03-23 | 2014-07-09 | 日東電工株式会社 | Work transfer method and work transfer device |
JP6084115B2 (en) * | 2013-05-10 | 2017-02-22 | 株式会社ディスコ | Processing equipment |
JP5835276B2 (en) * | 2013-06-24 | 2015-12-24 | 株式会社安川電機 | Robot, robot manufacturing method and bag |
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JP6710050B2 (en) * | 2016-01-19 | 2020-06-17 | 株式会社ディスコ | Transport device |
JP6829590B2 (en) * | 2016-11-28 | 2021-02-10 | 株式会社ディスコ | Grinding device |
WO2019013022A1 (en) * | 2017-07-12 | 2019-01-17 | 東京エレクトロン株式会社 | Conveyance device, substrate processing system, conveyance method, and substrate processing method |
-
2019
- 2019-05-29 JP JP2019100121A patent/JP7343306B2/en active Active
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2020
- 2020-04-14 KR KR1020200044933A patent/KR20200137970A/en not_active Application Discontinuation
- 2020-05-21 CN CN202010434447.5A patent/CN112008702B/en active Active
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KR20200137970A (en) | 2020-12-09 |
CN112008702B (en) | 2024-06-04 |
TWI831975B (en) | 2024-02-11 |
JP2020194901A (en) | 2020-12-03 |
CN112008702A (en) | 2020-12-01 |
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