TW201312041A - Light-emitting circuit and luminaire - Google Patents

Abstract

A light emitting apparatus and an illuminating apparatus having the same are provided. In the light emitting apparatus, the mutual connection of light emitting devices is simplified, and the mixture of colors is good, and the uniformity is improved. The light emitting apparatus includes a substrate (21), and light emitting devices (22) in which each lighting color has the same number. The light emitting devices are disposed on the substrate (21), and have a plurality of lighting colors. Each lighting color of the light emitting devices is arranged in a plurality of rows on the circumference of almost concentric circles with different radius or polygons with different sizes but having almost the same center. The light emitting devices are disposed at shifted positions of the light emitting devices in the circumferential direction in mutual rows.

Description

Illuminating device and lighting device

An embodiment of the present invention relates to a light-emitting device that uses a light-emitting element such as an LED (hereinafter referred to as an LED (Light Emitting Diode)) as a light source, and an illumination device including the same.

Recently, with the increase in output and efficiency of LEDs, lighting devices that use LEDs as light sources for indoor or outdoor use and that can be expected to have a long life have been developed. The lighting device mounts a plurality of LEDs on a substrate to obtain a prescribed brightness, for example, as a base illumination mounted on a ceiling surface or the like.

On the other hand, with the diversification of lifestyles, as a function required for these lighting devices, it is desirable to not only simply illuminate the surroundings, but also to consider the influence of the surrounding environment or light on the living body, etc. The light space of the scene to satisfy the user's comfort and the like.

Therefore, for example, it is attempted to sequentially arrange a plurality of LEDs of a plurality of luminescent colors on the substrate on the substrate, and to mix the colors to improve the decorativeness.

Prior technical literature Non-patent literature

Non-Patent Document 1: Release of LED Ceiling Light "EVERLEDS" Series|Press Release|News|Panasonic Corporate Information|Panasonic [September 5, 2011 Internet Search] (https://panasonic.co.jp/corp/news/ Official.data/data.dir/jn110126-2/jn110126-2.html)

However, in the case as described above, it is possible to complicate a wiring pattern for connecting LEDs of a plurality of luminescent colors to each other on a substrate.

The present invention has been made in view of the above problems, and an object thereof is to provide a light-emitting device capable of simplifying connection between light-emitting elements and improving color uniformity, and improving uniformity.

A light-emitting device according to an embodiment of the present invention includes: a substrate; and the same number of light-emitting elements of the respective illuminating colors, which are mounted on the substrate and have a plurality of luminescent colors, and each of the illuminating colors is arranged in a plurality of rows substantially concentrically with different radii The circumferences of the polygons having different circles or sizes but having substantially the same center are arranged, and the positions of the columns in the circumferential direction are shifted.

According to the embodiment of the present invention, it is possible to provide a light-emitting device capable of simplifying the connection between the light-emitting elements and an improved illumination, and an illumination device including the same, which can improve the uniformity.

Hereinafter, an embodiment of the present invention will be described with reference to Figs. 1 to 9 . 1 to 6 show an illumination device, and Figs. 7 and 8 show a part of a light source unit. Further, Fig. 9 shows the wiring state of the light source unit. In each of the drawings, the wiring connection relationship by a wire or the like is omitted. In addition, the same portions are denoted by the same reference numerals and the description thereof will not be repeated.

The lighting device of the embodiment is mounted on the main body of the ceiling lamp holder The illuminating device for an ordinary house is used to illuminate a room by a light emitted from a light source unit provided on a device mounting surface as a wiring device, and the light source unit has a plurality of mounted on the substrate Light-emitting element.

The illuminating device includes a device body 1, a light source unit 2, a lighting device 3, a center member 4, and a mounting portion 5. Further, the illumination device includes a photo sensor 6, a cover 7, a cover member 8, an indirect light source unit 9, and an auxiliary unit 10. Further, the illuminating device includes an adapter A (see FIG. 6) electrically and mechanically connected to the ceiling holder main body Cb, and an infrared remote control transmitter Rc, and the ceiling holder main body Cb is provided as a device. On the ceiling surface C of the mounting surface. Such an illuminating device is formed into a spherical circular outer appearance, and the front surface side is used as a light irradiation surface, and the rear surface side is used as a mounting surface to the ceiling surface C. These constituent elements are described below in order.

As shown in FIG. 2 to FIG. 6 , the apparatus main body 1 is a chassis having thermal conductivity, and is formed into a circular shape by a flat plate of a metal material such as a cold-rolled steel sheet, and is formed in a substantially central portion. The circular opening 11 of the mounting portion 5. A part of the circular shape of the opening 11 protrudes outward and is formed in a shape substantially equal to the outer shape of the mounting portion 5.

A protruding portion 12 is formed on the outer peripheral side of the opening 11, and the protruding portion 12 has a quadrangular shape and the corner portion has an R shape and protrudes toward the back side. Further, on the outer peripheral side of the apparatus main body 1, a circular annular protruding portion 13 is formed, which protrudes toward the back side, in other words, the protruding portion 13 forms a concave portion on the front surface side.

In the recess formed by the protruding portion 13, a cover receiving metal member 75 to which the cover 7 is detachably attached is disposed. These protruding portions 12 and 13 mainly function as attachment portions of members attached to the chassis, and have a function of reinforcing the strength of the chassis or a function of increasing the heat dissipation area.

Further, the apparatus body 1 corresponds to the chassis in the present embodiment, but may be a member called a case, a reflector, or a bottom plate. In general, it means a member or a portion in which the light source unit 2 is directly or indirectly disposed, and is not particularly limited.

As shown in FIGS. 2, 4, and 6, the light source unit 2 includes a substrate 21 and a plurality of light-emitting elements 22 mounted on the substrate 21 to constitute a light-emitting device. In addition, in FIG. 2, illustration of the light emitting element 22 is abbreviate|omitted. The substrate 21 has a substantially arc-shaped substantially fan shape having a predetermined width dimension, and is formed by arranging a plurality of the same shape, specifically, four substrates 21, and is formed in a substantially circular shape as a whole. In other words, the substrate 21 formed in a substantially annular shape as a whole includes four divided substrates 21 .

By using the substrate 21 thus divided, it is possible to absorb heat shrinkage by the divided portion of the substrate 21 to suppress deformation of the substrate 21. Moreover, the material selection of the substrate member can be efficiently performed, which is advantageous in terms of cost, and since the member is miniaturized, the handling becomes easy. Further, the divided substrate 21 can be shared as a component.

Further, it is preferable to use the substrate 21 divided into a plurality of sheets, but a single substrate which is integrally formed into a substantially annular shape may be used.

The substrate 21 includes a flat plate of a glass epoxy resin (FR-4) as an insulating material, and a wiring is formed on the surface side by a copper foil. Pattern layer. The light emitting element 22 is electrically connected to the wiring pattern layer. Further, on the wiring pattern layer, that is, on the surface of the substrate 21, a white resist layer functioning as a reflective layer is formed.

Further, when the material of the substrate 21 is an insulating material, a ceramics material or a synthetic resin material can be applied. Furthermore, when it is made of a metal, the base substrate made of metal is excellent in thermal conductivity of aluminum or the like and has an insulating layer in one area of the base plate excellent in heat dissipation.

The light-emitting element 22 is an LED and is a surface mount type LED package. The LED package is mounted over a plurality of rows along the circumferential direction of the plurality of annular substrates 21, and in the present embodiment, it is mounted over three rows on substantially concentric circles having different radii. In other words, it is attached to the column on the inner circumference side, the column on the outer circumferential side, and the row on the inner circumferential side and the column on the outer circumferential side.

The LED package generally includes an LED chip disposed in a cavity formed of ceramic or synthetic resin, and a mold for an epoxy resin or a silicone resin. A photo-resin seals the LED wafer.

For the LED package mounted on the inner circumference side column and the outer circumference side column, an LED package in which the illuminating colors are the bulb color (L) and the daylight color (D) is used, that is, using a so-called white LED package, these LED packages are The circumferences of the substantially concentric circles are alternately arranged at substantially equal intervals. The LED chip is an LED chip that emits blue light. A phosphor is mixed in the translucent resin, and the bulb color (L) and the daylight color (D) can be emitted. The white light mainly uses a yellow phosphor or a red phosphor for replenishing a red component, and the yellow phosphor emits yellow light having a complementary color relationship with the blue light. In addition, the so-called white color includes daylight color (D), white color (N), white color (W), or light bulb color (L).

For the LED package mounted on the middle column, an LED package that emits a plurality of illuminating colors is used, specifically, an LED package that emits red (R), green (G), and blue (B) light. Therefore, the LED chips are LED chips that emit red light, green light, and blue light, respectively, and these LED chips are sealed by a light transmissive resin for molding.

The red (R) light, green (G) light, and blue (B) light LED packages mounted on the middle column are in red (R), green (G), and blue on the approximate circumference. The order of B) is continuously arranged at substantially equal intervals. For these LED packages that emit red (R) light, green (G) light, and blue (B) light, the same number is used for each of the light-emitting colors, and each of the divided substrates 21 is mounted with 11 LED packages of respective light-emitting colors. . Therefore, each of the 44 LED packages of the respective illuminating colors is used as a whole.

Specifically, as shown in the reference of FIG. 7 and FIG. 8 , for each of the LED packages of red (R) light, green (G) light, and blue (B) light having different illuminating colors, each The luminescent color is arranged in a plurality of rows (three columns) on the circumference of a substantially concentric circle having different radii, and the positions of the columns in the circumferential direction are shifted from each other.

FIG. 7 shows one of the divided substrates 21, and FIG. 8 shows a part of the wiring pattern layer 12a of the substrate 21. Further, in FIG. 8, in order to show the positional relationship between the wiring pattern layer 12a and the light-emitting element 22, The broken line indicates a part of the light-emitting element 22.

As shown in FIG. 7 , for an LED package that emits red (R) light, green (G) light, and blue (B) light, each of the illuminating colors is on a circumference of a substantially concentric circle having a different radius, that is, The red (R) light LED is packaged at a radius r1, the green (G) light is encapsulated in a radius r2, and the blue (B) light is encapsulated in a substantially concentric circle of radius r3. Configured at intervals. Further, the columns of the LED packages that emit red (R) light, the columns of the LED packages that emit green (G) light, and the rows of the LED packages that emit blue (B) light are in the circumferential direction. The positions are staggered (indicated by d) and are configured.

Further, the LED package has a substantially rectangular parallelepiped shape in the outer shape, and an electrode Ae on the anode side is provided on one short side, and an electrode Ce on the cathode side is provided on the other short side. In addition, in the description, the short side of the electrode side side on the cathode side is indicated by a thick line.

As shown in FIG. 8, the substrate 21 is formed by laminating a wiring pattern layer 21a on an insulating surface and further having a reflective layer 21b laminated thereon. Further, on the substrate 21, a plurality of light-emitting elements 22, that is, surface mount type LED packages are mounted.

The wiring pattern layer 21a is formed by patterning a copper foil by etching, and is formed so as to cover the surface of the substrate 21 over substantially the entire surface. The wiring pattern layer 21a is divided into a plurality of blocks by the linear insulating region i corresponding to the number of mounting of the light-emitting elements 22, and the electrode Ae on the anode side and the electrode Ce crossing the cathode side of the light-emitting element 22 The relatively narrow linear insulating regions i between the blocks are connected.

The wiring pattern layer 21a is an electrical conduction path for supplying electric power to the light-emitting element 22, and has a function as a heat spreader that diffuses heat generated from the light-emitting element 22. Therefore, heat dissipation can be improved by securing the wiring pattern layer 21a having a large area.

The reflective layer 21b is formed over substantially the entire surface except for the portion where the light-emitting elements 22 are mounted and the electrodes Ae and Ce are connected, and the portion to which the connector Cn is connected. In other words, the portion where the light-emitting elements 22 are mounted and the electrodes Ae and Ce are connected and the portion where the connector is connected is in a state where the wiring pattern layer 21a is exposed on the surface to connect the light-emitting element 22 and the connector.

Specifically, the reflective layer 21b is formed using a white photo solder type resist ink material, and is a white resist layer having a good light reflectance.

Each of the light-emitting elements 22 is an electrode Ae on the anode side and an electrode on the cathode side of the light-emitting element 22 across a relatively narrow linear insulating region i between a plurality of blocks divided by the linear insulating region i. Ce is soldered to the wiring pattern layer 21a and connected.

More specifically, the area of the area Sc on the side of the wiring pattern layer 21a to which the electrode side Ce on the cathode side is connected is formed larger than the area Sa on the side of the wiring pattern layer 21a to which the electrode Ae on the anode side of the light-emitting element 22 is connected. . In other words, it is formed so as to have a relationship of Sa<Sc.

Such a light-emitting element 22 generates heat mainly on the cathode side at the time of light emission, and the temperature of the electrode Ce on the cathode side becomes high. Therefore, by increasing the area Sc on the side of the wiring pattern layer 21a to which the electrode Side on the cathode side is connected, it is possible to efficiently diffuse and dissipate the generated heat by a large area, thereby suppressing the light emission. The temperature of the element 22 rises.

Therefore, in the LED package in which the illuminating colors mounted on the inner peripheral side are the bulb color (L) and the daylight color (D), the orientation of the electrodes is alternately changed to ensure the wiring pattern to which the cathode side cathode Ce is connected. The area Sc on the side of the layer 21a is large.

On the other hand, in the LED package in which the illuminating color of the column mounted on the outer peripheral side is the bulb color (L) and the daylight color (D), the cathode side electrode Ce is disposed toward the outside. Since the heat dissipation effect on the outer side tends to be higher than the inner side, it is possible to expect an improvement in heat dissipation performance by causing the electrode side Ce on the cathode side to face outward.

Next, the LED packages of red (R) light, green (G) light, and blue (B) light mounted on the middle column are arranged on the circumference of substantially concentric circles having different radii as described above, and these are made. The columns in the circumferential direction are arranged to be shifted from each other. Therefore, when the LED packages of the same color are connected in series as in the present embodiment, the connection can be simplified, and specifically, the wiring pattern layer 21a between the electrodes can be simplified.

Assuming that LED packages emitting red (R) light, green (G) light, and blue (B) light are disposed on the same circumference, wiring must be bent to avoid adjacent LED packages, and the formation of the wiring pattern layer will change. It is complicated.

However, by arranging the LED packages of the respective luminescent colors in the circumferential direction as in the present embodiment, they are arranged on the circumference of a substantially concentric circle having different radii, and thus substantially arc-shaped along the circumference (substantially Since the LED packages of the same color are connected in a straight line, the connection can be simplified, and a predetermined space can be provided in a region where space is restricted. It is possible to connect while ensuring that the area of the wiring pattern layer 21a functioning as a heat sink is large.

In addition, as a whole, the LED packages of the respective luminescent colors are arranged in a predetermined width in the radial direction and are arranged in a continuous manner in the circumferential direction. Therefore, the color mixture is good and the uniformity can be improved. In addition, in the radial direction, the LED package that is attached to the column on the inner circumference side and the column on the outer circumference side is placed close to each other. Therefore, it is expected that the light mixing with them is good.

Further, between the LED packages of the respective illuminating colors and the LED packages mounted on the inner circumferential side and the LED packages on the outer peripheral side, a region for securing a space is formed in the radial direction, and the connector Cn can be disposed in the region. Parts such as to effectively use space.

In addition, the region Sa on the side of the wiring pattern layer 21a to which the electrode Ae on the anode side of the light-emitting element 22 is connected and the region Sc on the side of the wiring pattern layer 21a to which the electrode on the cathode side are connected can be formed so that the region Sc can be increased. Further, the shape and the like are not particularly limited.

FIG. 9 shows the wiring state of each of the light-emitting elements 22 on one of the substrates 21. Specifically, the light-emitting elements 22 mounted on the inner peripheral side column and the outer peripheral side column include two lines which are formed by connecting four series circuits, the four series circuits The six light-emitting elements 22 are connected in series. Therefore, a total of 24 light-emitting elements 22 are connected to one line. Further, these series circuits are connected to a light-emitting element group in which the light-emitting color is the bulb color (L) and the light-emitting element group of the daylight color (D). That is, in a series circuit, the illuminant of the bulb color (L) and the daylight color (D) Pieces 22 will not be mixed.

On the other hand, the light-emitting elements 22 of red (R) light, green (G) light, and blue (B) light which are mounted on the middle column are connected in series of eleven. Further, similarly, in these series circuits, the light-emitting elements 22 of red (R), green (G), and blue (B) are not mixed.

The end of such a connection circuit is connected to the connector Cn so as to be connectable to the connector of the adjacent substrate 21 or the connector on the power supply side.

As described above, in the light source unit 2, a plurality of light-emitting elements 22 having different luminescent colors are disposed, that is, light-emitting (L) light, daylight (D) light, red (R) light, and green (G) are disposed. Since the light-emitting elements 22 of light and blue (B) light are mixed, the range of light colors that can be expressed is wide, and by adjusting the light output of the light-emitting elements 22, the light colors can be toned.

Further, the LED can mount the LED chip directly on the substrate 21, and a bullet-type LED can also be mounted. The mounting method or form is not particularly limited.

As shown schematically in FIGS. 4 and 6, the light source unit 2 configured in this manner is located on the front surface side of the apparatus main body 1 and around the opening 11, and the mounting surface of the light-emitting element 22 faces the front surface side, that is, faces downward. Arranged in the direction of irradiation. Moreover, the back surface side of the substrate 21 is attached to the inner surface side of the apparatus main body 1 by a fixing device such as a screw. Therefore, the substrate 21 is thermally coupled to the apparatus body 1, and heat from the substrate 21 is conducted from the back side to the apparatus body 1 and is radiated.

As shown in FIG. 2 and FIG. 6, light is disposed on the front surface side of the light source unit 2 Source cover 25. The light source unit cover 25 includes, for example, an insulating transparent synthetic resin such as polycarbonate or acryl resin, and is integrally formed in a substantially annular shape along the arrangement of the light-emitting elements 22, and The light-emitting element 22 is disposed so as to cover the entire surface of the substrate 21.

Therefore, the light emitted from the light-emitting element 22 is transmitted through the light source unit cover 25. Moreover, since the entire surface of the substrate 21 is covered, the charging portion is covered by the light source unit cover 25, and insulation is ensured.

As shown in FIGS. 3 and 6, the lighting device 3 includes a circuit board and circuit components such as a control integrated circuit (IC), a transformer, and a capacitor attached to the circuit board. The circuit board is formed in a plate shape so as to surround the periphery of the center portion, and circuit components are mounted on the surface side thereof.

The circuit board is electrically connected to the adapter A side, and is connected to the commercial AC power supply via the adapter A. Therefore, the lighting device 3 receives the AC power supply to generate a DC output, and supplies the DC output to the light-emitting element 22 via a wire to perform lighting control of the light-emitting element 22.

As described with reference to FIG. 5, the lighting device 3 is attached to the lighting device cover 35 and covered, and is disposed on the back side of the device body 1. At this time, the circuit board is mounted with the circuit component facing the front surface side (upper and lower sides in the drawing).

The lighting device cover 35 is formed in a short rectangular shape having a substantially rectangular shape by a metal material such as a cold-rolled steel plate, and the side wall 35a is inclined so as to expand toward the front surface side, and an opening 35c is formed in a central portion of the rear surface 35b. .

As shown in FIGS. 5 and 6, the lighting device cover 35 is placed on the protruding portion 12 of the chassis on the front surface side, and is screwed and attached.

Further, an elastic member 36 is attached to the back side of the lighting device cover 35. The elastic member 36 is attached to the vicinity of the mounting position of the plurality of indirect light source units 9 in the vicinity thereof. Further, the elastic member 36 is attached so that the distal end side faces the central portion.

The elastic member 36 is a member that is disposed between the ceiling surface C and the ceiling surface C in a state where the illuminating device is attached to the ceiling surface C as the device mounting surface, and functions as a lighting device. It is surely maintained on the ceiling surface C.

As shown in FIGS. 2, 4, and 6, the center member 4 is made of a synthetic resin material such as polybutylene terephthalate (PBT) resin and is formed into a substantially short cylindrical shape. The center portion has an opening 41 facing the ceiling holder main body Cb. Further, an annular space portion 42 is formed around the opening 41, and a photosensor 6 to be described later is disposed in the space portion 42. Further, a light receiving window 43 facing the light receiving portion of the photo sensor 6 is formed on the front surface wall of the center member 4.

The center member 4 configured in this manner is mainly attached as shown in FIG. 6, and the flange on the back side is screwed to the chassis via the light source unit cover 25. In addition, the center member 4 may be directly or indirectly mounted to the chassis, and the specific mounting structure thereof is not limited.

The mounting portion 5 is an adapter guide, which is a member through which the adapter A is inserted and engaged, and is used to mount the lighting fixture to the ceiling. The component of the panel C. As shown in FIGS. 3 and 6, the adapter guide portion is formed in a substantially cylindrical shape, and an engagement opening 51 through which the adapter A is inserted and engaged is provided at the center portion. The adapter guide portion is disposed corresponding to the opening 11 formed in the central portion of the body 1.

Further, the mounting portion 5 is not necessarily a member called an adapter guiding portion or the like. For example, it may be an opening formed in the apparatus body 1 or the like, and mainly refers to a member or a portion that faces the ceiling holder main body Cb as a wiring device and that engages the adapter A.

The photo sensor 6 is mounted on the substrate 61 as shown in FIG. 6, and is disposed so as to face the light receiving portion 43 so as to face the light receiving window 43 and be attached to the space portion 42 of the center member 4. The photo sensor 6 is an illuminance sensor, and includes a sensor element such as a photo diode, and operates to detect the surrounding brightness and output a detection signal. Thereby, when the surroundings are bright, the light source unit 2, that is, the light-emitting element 22, is dimmed (dimmed) and turned on.

The shade 7 is formed into a substantially circular shape by a light-transmissive material having a light-transmissive property such as an acrylic resin and having diffusibility, and a circular opening 71 is formed in the center portion. Further, a shade decorative frame 7a is formed on the outer peripheral portion of the globe 7, and the shade decorative frame 7a is formed of a transparent material containing acrylic resin or the like.

Further, the shade 7 is detachably attached to the outer peripheral edge portion of the main body 1 so as to cover the front surface side of the main body 1 including the light source unit 2. Specifically, by rotating the lamp cover 7, the lampshade mounting metal part 74 provided on the lamp cover 7 is engaged with the lamp cover receiving metal part 75, and the lamp cover is attached. The metal receiving member 75 is provided in a recess formed by the protruding portion 13 of the apparatus body 1.

Further, when the lamp cover 7 is removed, the lamp cover 7 is rotated in a direction opposite to the mounting time to release the engagement between the lamp cover mounting metal member 74 and the lamp cover receiving metal member 75, whereby the lamp cover 7 can be detached.

The cover member 8 is formed in a circular shape by a material such as a transparent acrylic resin. The cover member 8 is attached to the front surface wall of the center member 4 corresponding to the opening 71 of the globe 7, and is disposed to cover and close the opening 41 of the center member 4. Further, a transmissive portion 81 that faces the light receiving window 43 of the photo sensor 6 is formed on the cover member 8.

The indirect light source unit 9 is disposed on the back side of the apparatus body 1, and mainly has a function of illuminating the ceiling surface. As shown in FIGS. 3, 5, and 6, the indirect light source unit 9 is disposed around the mounting portion 5 and is provided with a plurality of substrates 91 and a plurality of light-emitting elements 92 mounted on the substrate 91.

The substrate 91 is formed into a substantially rectangular flat plate, and the light-emitting elements 92 are linearly arranged and mounted along the longitudinal direction of the substrate 91.

The substrate 91 on which the light-emitting element 92 is mounted is attached to four places on the side wall 35a of the lighting device cover 35. At this time, the lighting device cover 35 is formed in a substantially quadrangular shape, and the substrate 91 is attached to the linear flat surface on the side wall 35a, so that the mounting can be stably performed.

Further, since the side wall 35a of the mounting portion constituting the substrate 91 is formed in an inclined shape that is expanded toward the front surface side, the substrate 91 is directed obliquely upward, that is, in the ceiling surface direction, and the light emitted from the light-emitting element 92 is directed toward the ceiling surface direction. Irradiation is performed.

Further, as shown mainly in Fig. 6, each of the indirect light source units 9 is covered with a translucent cover 93, and the cross section of the translucent cover 93 is formed in an inclined shape that is expanded toward the back side. Therefore, when the side surface of the illuminating device is viewed from below in a state where the illuminating device is attached to the ceiling surface C, the elastic member 36 attached to the back side of the lighting device cover 35 can be hardly seen.

In addition, the cover 93 is formed in an inclined shape so as not to cover the portion of the apparatus main body 1 corresponding to the back side of the substrate 21 from the outside. Therefore, it is possible to suppress a phenomenon that hinders the heat radiation from the apparatus body 1.

The light-emitting element 92 is an LED package which is an LED similar to the light source unit 2 and which uses a surface mount type LED package and has a light-emitting color of a bulb color (L). Further, the light-emitting element 92 is a light-emitting element having the same specifications as the light-emitting element 22 of the light-emitting color (L) light of the light source unit 2. The light-emitting element 92 is connected to the lighting device 3 and is controlled by lighting.

As shown in FIGS. 2 to 4 and 6 , the auxiliary component unit 10 includes a unit substrate 101 and a plurality of electric auxiliary components mounted on the substrate 101 . The electric auxiliary component in the present embodiment is an infrared remote control signal receiving unit 102, a light emitting element 103 for a bright light, a channel setting switch 104, and the like. The auxiliary component unit 10 is disposed inside the light source unit 2 on the front surface side of the apparatus body 1.

Further, the unit substrate 101 of the auxiliary part unit 10 is another substrate for the substrate 61 on which the photo sensor 6 is mounted, and the infrared remote control signal is not mounted on the substrate 61 on which the photo sensor 6 is mounted. The receiving unit 102, the light-emitting element 103 for the long light, and the like. The reason is that the photo sensor 6 has the function of detecting the brightness of the surroundings and automatically controlling the emission of the light-emitting element 22. The function of the light state makes it easy to provide two types of lighting devices, such as a lighting device having the function and a lighting device not having the function.

In other words, when the illumination device that does not have the function of automatically controlling the light-emitting state is developed, the photo sensor 6 and the center member 4 can be easily omitted.

As shown in Fig. 6, the adapter A is electrically and mechanically connected to a portion of the ceiling holder main body Cb provided on the ceiling surface C by a hook provided on the upper surface side, and has a substantially cylindrical shape and a peripheral wall. A pair of locking portions A1 are provided on both sides so as to always protrude toward the outer peripheral side by a built-in spring. The locking portion A1 is immersed by operating the lever provided on the lower surface side. Further, a cord (not shown) connected to the lighting device 3 is led out from the adapter A, and is connected to the lighting device 3 via a connector.

The infrared remote control transmitter Rc transmits, for example, a pulse-shaped specific encoded infrared remote control signal having a frequency of 38 kHz, for example, a mode switch button, a full light button, a dimming button, a long lamp. Button and light-off button, etc. By operating the remote control transmitter Rc toward the auxiliary component unit 10, that is, the infrared remote control signal receiving unit 102, the illumination states of the light source unit 2 and the indirect light source unit 9 can be controlled.

Next, an installation state in which the lighting fixture is attached to the ceiling surface C will be described with reference to Fig. 6 . First, the adapter A is electrically and mechanically connected to the ceiling holder main body Cb previously provided on the ceiling surface C. In the state in which the cover member 8 of the lighting fixture is removed, on the one hand, the engaging opening 51 of the adapter guiding portion is aligned with the adapter A, and on the other hand, against the elastic force of the elastic member 36, the device body 1 is pushed up by hand from below until the adapter A The locking part A1 is indeed The mounting operation is performed by engaging the engagement opening 51 of the adapter guide portion in the field.

Next, the cover member 8 is attached to cover and close the opening 41 of the central portion of the center member 4 facing the ceiling holder main body Cb.

Further, when the lighting fixture is removed, the cover member 8 is removed, and the operating lever provided in the adapter A is operated by the opening 41 of the center member 4 to release the engagement of the locking portion A1 of the adapter A, thereby being detachable.

When electric power is supplied to the lighting device 3 in a mounted state in which the lighting fixture is attached to the ceiling surface C, the light-emitting element 22 is energized via the substrate 21 in the light source unit 2, and each of the light-emitting elements 22 is turned on. The light emitted from the light-emitting element 22 toward the front surface side passes through the light source unit cover 25, is diffused through the globe 7, and is transmitted to the outside. Therefore, the lower side can be illuminated within a prescribed light distribution range.

At the same time, when the indirect light source unit 9 is energized, the light-emitting elements 92 are turned on, and the light emitted from the light-emitting element 92 obliquely upward passes through the translucent cover 93 and is radiated from the periphery of the adapter guiding unit 5. Mainly illuminated to the ceiling. Therefore, the ceiling surface becomes bright, and the brightness of the space can be improved.

Since the back side of the substrate 21 is thermally coupled to the apparatus body 1, heat generated from the light-emitting element 22 is efficiently conducted to the apparatus body 1 and is radiated by a large area.

As described above, according to the present embodiment, LED packages of a plurality of luminescent colors that emit red (R) light, green (G) light, and blue (B) light are disposed on the circumference of substantially concentric circles having different radii, and These rows are arranged in such a manner that the positions in the circumferential direction are shifted from each other. Therefore, a lighting device can be provided, which can It is possible to simplify the connection of the light-emitting elements 22 to each other, and the color mixture is good and the uniformity can be improved.

Further, in the above-described embodiment, a plurality of light-emitting elements that emit red (R) light, green (G) light, and blue (B) light are arranged in a plurality of rows on substantially concentric circles having different radii. Although the case of 22 is described, it may be arranged in a plurality of rows on a circumference of a polygon having a different size, for example, a hexagon, and the positions in the circumferential direction of the columns may be shifted.

Further, in the outer side and the inner side of the column of the plurality of light-emitting color light-emitting elements 22, light emitting white light may be arranged in a row on a circumference of a polygon having substantially the same center as the polygon. Element 22. In the case of such a form, the same effects as described above can be obtained. The present invention is not limited to the configuration of the above-described embodiment, and various modifications can be made without departing from the spirit and scope of the invention. Further, the above-described embodiments are presented as examples only, and are not intended to limit the scope of the invention.

1‧‧‧ device body (underframe)

2‧‧‧Light source department

3‧‧‧Lighting device

4‧‧‧ central components

5‧‧‧Installation Department (Adapter Guide)

6‧‧‧Light sensor

7‧‧‧shade

7a‧‧‧shade decorative frame

8‧‧‧ Cover member

9‧‧‧Indirect light source department

10‧‧‧Auxiliary parts unit

11, 35c, 41, 71‧‧‧ openings

12, 13‧‧‧ protruding parts

21, 91‧‧‧ substrate

21a‧‧‧Wiring pattern layer

21b‧‧‧reflective layer

22, 92‧‧‧Lighting elements (LED)

25‧‧‧Light source cover

35‧‧‧Lighting device cover

35a‧‧‧ side wall

35b‧‧‧back wall

36‧‧‧Flexible components

42‧‧‧ Space Department

43‧‧‧light window

51‧‧‧Kate

74‧‧‧shade mounting metal parts

75‧‧‧shade accepts metal parts

81‧‧‧Transmission Department

93‧‧‧ Cover

101‧‧‧unit substrate

102‧‧‧Infrared remote control signal receiving unit

103‧‧‧Lighting elements for Changming lamps

104‧‧‧Channel setting switch

A‧‧‧ Adapter

Ae, Ce‧‧‧ electrodes

B‧‧‧Blue

C‧‧‧Installation surface (ceiling surface)

Cb‧‧‧Wiring device (main body of ceiling lamp holder)

Cn‧‧‧ connector

D‧‧‧ daylight

G‧‧‧Green

i‧‧‧Insulated area

L‧‧‧ bulb color

R‧‧‧Red

Rc‧‧‧Infrared remote control transmitter

Radius of r1, r2, r3‧‧

Sa, Sc‧‧‧ area

Fig. 1 is a perspective view showing an illumination device according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view showing the front surface side of the lighting device of the present invention.

Fig. 3 is an exploded perspective view showing the back side of the lighting device of the present invention.

Fig. 4 is a plan view showing a light shield and a light source cover removed in the lighting device of the present invention.

Fig. 5 is a perspective view showing a back side of the lighting device of the present invention.

Figure 6 is a view showing the state in which the lighting device of the present invention is mounted on a ceiling surface; A cross-sectional view of the state.

Fig. 7 is a plan view showing one of the substrates in the light source unit.

Fig. 8 is a plan view showing a part of a wiring pattern layer of a substrate of the present invention.

Fig. 9 is a wiring diagram showing a connection state of a light-emitting element.

1‧‧‧ device body (underframe)

2‧‧‧Light source department

4‧‧‧ central components

5‧‧‧Installation Department (Adapter Guide)

10‧‧‧Auxiliary parts unit

11‧‧‧ openings

21‧‧‧Substrate

75‧‧‧shade accepts metal parts

101‧‧‧unit substrate

102‧‧‧Infrared remote control signal receiving unit

103‧‧‧Lighting elements for Changming lamps

104‧‧‧Channel setting switch

B‧‧‧Blue

D‧‧‧ daylight

G‧‧‧Green

L‧‧‧ bulb color

R‧‧‧Red

Claims (3)

A light-emitting device, comprising: a substrate; and the same number of light-emitting elements of each illuminating color, mounted on the substrate, having a plurality of illuminating colors, and each of the illuminating colors arranged in a plurality of rows substantially concentric with different radii The circumference of the polygon having a circle or a different size but having substantially the same center is arranged such that the positions of the columns in the circumferential direction are shifted from each other. The light-emitting device according to claim 1, comprising: a light-emitting element that emits white light, on an outer side and an inner side of the column of the plurality of light-emitting color light-emitting elements, and is substantially centered with the circle or The circles or polygons having the same polygon are arranged in a row on the circumference of the circle. A lighting device comprising: the light-emitting device according to claim 1 or 2; and a lighting device for lighting control of the light-emitting element in the light-emitting device.