TW201249523A - Separating device - Google Patents

Separating device Download PDF

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Publication number
TW201249523A
TW201249523A TW100133372A TW100133372A TW201249523A TW 201249523 A TW201249523 A TW 201249523A TW 100133372 A TW100133372 A TW 100133372A TW 100133372 A TW100133372 A TW 100133372A TW 201249523 A TW201249523 A TW 201249523A
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Taiwan
Prior art keywords
plate
liquid
separating
waste liquid
adsorption
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TW100133372A
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Chinese (zh)
Inventor
Hirotaka Ishiguro
Miki Yoshida
Takeshi Furonaka
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Disco Corp
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Publication of TW201249523A publication Critical patent/TW201249523A/en

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  • Water Treatment By Sorption (AREA)
  • Electrostatic Separation (AREA)

Abstract

The present invention provides a separating device which can efficiently separates waste liquid which comprises silicon chips into silicon chips and water through a state that can be easily reused. The separating device comprises the following components: a liquid tank (21) which stores the waste liquid that comprises the silicon chips; and a silicon separating mechanism (22) which is configured in the liquid tank (21). The silicon separating mechanism (22) comprises the following components: an absorption plate (25) which is configured in the liquid tank (21) and absorbs silicon chips in the waste liquid; a silicon passing restriction component (26) which only allows passing of water in the waste liquid and restrains passing of the silicon chip; an absorption plate moving component (30); and a separating part (40).

Description

201249523 六、發明說明: c發明戶斤屬之技術領域】 發明領域 本發明係有關於一種將包含矽屑之廢液分離成矽屑與 液體的分離裝置。 c先前技術3 發明背景 在石夕7L件的製造中,有譬如以下步驟:切斷石夕键而形 成石夕晶圓的步驟、研磨石夕晶圓的步驟,或在表面排 列成格子狀之多數的區域形成IC、LSI等電路沿著預定之 切割道(切斷線)切斷各區域而形成各㈣晶片的步驟等。在 該等步驟中,例如為了冷卻切削刀或加工點、研磨部分等, 或疋為了冲走石夕屑,會使用到水。 近年來,由於水或石夕的重複利用觀點因此要求一種 可使包3⑪屑之廢液分離切屬與不切的水的技術。石夕 屬為細微的粒子,會呈懸浮混濁的Μ包含在廢液中。今 種習知技術已知有進行城或離心分離法的物理方法^ 使用藥品的化學方法(例如參照專利文獻υ。 先行技術文獻 專利文獻 專利文獻1.日本專利公開公報㈣平8_1⑷卿 【發明内容】 化Α % 發明揭示 發明欲解決之課題 201249523 ’’’、而’使用上述之物理方法,會有過濾時塞住遽網、 或疋石夕粒子根本齡直接通H網關題。特別是使用離 〜刀離法時’砂粒子相對於水分的濃度過稀而可能會有離 〜刀離效率較差的情形。又,使用上述化學方法時,則由 於使用藥品’因此會有難以再利用液體(水)的問題。 本發明係有鑑於上述問題而成者,目的在於提供一種 可將包含抑的廢液有效率且以容易制狀狀態分離成 石夕屑與水的分離裝置。 用以欲解決課題之手段 為了解决上述課題並達成目的,本發明係一種將包含 石夕屑之廢液分離成矽屑與不含矽屑之液體的分離裝置,其 特徵在於具有:液槽’係貯集該廢液者;及矽分離機構, 係配置於該液槽中者,且該矽分離機構具有:吸附板,係 帶有正電而吸附在該廢液中帶負電之該矽屑者;及石夕通過 限制元件,係包含有矽通過限制板者,且前述矽通過限制 板係對向於該吸附板而配設,僅容許該廢液之液體通過, 限制帶負電之該矽屑通過者’另外,該矽通過限制元件具 有:筐體,係區劃出已通過該矽通過限制板之液體所存在 的區域者;及搬出部,係配置於該筐體内,將通過該矽通 過限制板之該廢液往該液槽外搬出者,且前述分離裝置具 有電場形成元件,該電場形成元件係以該吸附板為陽極、 以该石夕通過限制板為陰極,在該吸附板與該石夕通過限制板 之間形成電場者,並具有回收機構,該回收機構係回收吸 附於該吸附板之矽者,又,該回收機構具有:吸附板移動 4 201249523 元件,係使該吸附板從該廢液移動者;及分離部,係從該 吸附板使矽分離者。 發明效果 根據本發明,可實現一種可將包含矽屑的廢液有效率 且以容易再利用之狀態分離成矽屑與水的分離裝置。 圖式簡單說明 第1圖係本發明實施形態1之分離裝置的立體圖。 第2圖係顯示本發明實施形態1之分離裝置中收納於液 槽内之矽分離機構的分解立體圖。 第3圖係顯示本發明實施形態1之分離裝置中收納於液 槽内之矽分離機構的立體圖。 第4圖係第3圖之IV—IV截面圖。 第5圖係說明本發明實施形態1之分離裝置中升降臂與 吸附板之卡合元件的重要部分立體圖。 第6圖係顯示本發明實施形態1之分離裝置中,使吸附 板配置於各刮板間之步驟的側面圖。 第7圖係顯示實施形態1之分離裝置中,以刮板夾住吸 附板而刮下矽屑之步驟的側面圖。 第8圖係顯示本發明實施形態2之分離裝置的立體圖。 第9圖係顯示實施形態2之分離裝置中,使圓柱狀刷子 相離開而使吸附板配置於圓柱狀刷子之間之步驟的側面 圖。 第10圖係顯示實施形態2之分離裝置中,在以圓柱狀刷 子夾住吸附板的狀態下,使吸附板上升而刮下矽屑之步驟 201249523 的側面圖。 第11圖係,示本發明實施形態3之分離裝置的立體圖° 第12圖係_示實施形態3之分離裝置的分解立體圖。 第13圖係第U圖之XIII一X111截面圖。 【實施冷式】 用以實施發明之最佳形態 以下,參照圖示說明用以實施本發明之形態的分離裝 置。但是,應注意圖示係示意圖,粒子大小或構件大小等 與現實不同。叉,在各圖示間,含有彼此之尺寸關係或比 例互異的部份。 (實施形態1) 第1〜7圖顯示本發明實施形態1之分離裝釁10。如第1 圖所示,該分離裝置10包含有:分離裝置本體20、吸附板 移動機構30、及分離部40。另外,吸附板移動機構30及分 離部40構成回收機構。 (分離裝置本體) 首先’說明分離裝置本體20。如第1〜4圖所示,分離 裝置本體20包含有:液槽21、及配置於該液槽21中的石夕分 離機構22。如第4圖所示,液槽21係供給有在水中包含有矽 屑5之廢液4者。 液槽21係上部開放的直方體形狀容器。在該液槽21之 一方的壁部21A,貫通設置有廢液供給管23 ,該廢液供給管 23之前端的供給喷嘴23A係配置於液槽21的内部,從該供給 喷嘴23A將廢液4供給至液槽21内。又,在與液槽21之壁部 6 201249523 21A中之廢液供給管23所配置之位置不同的位置,設有防止 廢液4溢出液槽21外的排液管24。 如第1〜4圖所示,矽分離機構22交互地配置有吸附板 25與矽通過限制元件26,而前述吸附板25係配置於液槽21 内吸附廢液4中之矽屑5者,前述矽通過限制元件26係配置 成與吸附板25相對向地隔開,僅容許廢液4中之水4A通過, 並限制碎屑5的通過者。 吸附板25宜以電化學上之貴重材料來形成,可列舉如 銅(Cu)、銀(Ag)、鉑(Pt)、金(Au)等,在本實施形態中使用 不鏽鋼(SUS316、SUS304等)。 如第1〜5圖所示,在吸附板25之上緣部中央,於吸附 板25之寬度方向隔著預定間隔向上方突出設有一對被卡合 片25A。如第5圖所示,該等被卡合片25八係矩形之板狀體, 配置成彼此相對向。在各被卡合片25A之中央,形成有貫通 於吸附板25之寬度方向的被卡合孔25h。在該等被卡合片 25A之間,插入有後述之吸附板移動元件3〇中之卡合部 37A,可伸出沒人地設置於卡合部3M之卡合用突起%可被 插入被卡合孔25h。 如第2圖及第4圖所石夕通過限制元件26包含有:矩 形狀之框體26A、及可塞住該框體26A之兩側開口面且彼此 呈平行而設置的網眼狀之-對料過限制板湖。又,在框 體26A之上部中央’如第4圖所示,設有下端開口部位於一 對石夕通過限制板26Β間的筒狀之搬出部26(:。在該搬出部 20C的上端’連接有搬出軟管27,透過該搬出軟管可將水 7 201249523 4 A搬出至外部。 由於矽屑5在水中帶負電,因此,吸附板25帶正電,以 吸附帶負電的矽屑5 ’而網眼狀之矽通過限制板26B則為了 產生斥力而帶負電,以使矽屑5不會靠近。如第2圖所示, 在該分離裝置本體20中,設有作為電場形成元件的電壓施 加電路28 ’以吸附板25為陽極、矽通過限制板26B為陰極, 使之形成電場。 如第1〜4圖所示,吸附板25係配置成與矽通過限制元 件2 6交互地彼此對向於矽通過限制板2 6 B。本實施形態中之 矽通過限制板26B係配置成與吸附板25距離4mm左右而略 平行於吸附板25。如上所述,使吸附板25與矽通過限制板 26B的距離為4mm左右的理由係由於距離越遠則電場會越 弱,故為了端保吸附板8之矽吸附力,則以儘量靠近者較 佳。另外’一對矽通過限制板26B及框體26A構成區劃出已 通過前述矽通過限制板26B之水4A的筐體。亦即,由框體 26A及一對矽通過限制板26B所構成的筐體和搬出部26C構 成了矽通過限制元件26。 矽通過限制板2 6 B與上述之吸附板2 5同樣,宜以電化學 上之貴重材料如鋼(Cu)、銀(Ag)、鉑(Pt)、金(Au)等形成, 在本實施形態中使用不鏽鋼(SUS316、SUS304等)。前述石夕 通過限制板26B為網眼狀的構造,不具以網眼勾住石夕屬$之 機能亦可’藉由使之帶負電,對於帶負電之矽屑可產生斥 力的網眼粗細程度即可《附帶一提,在本實施形態中,將 矽通過限制板26B設定為500個/吋的網孔。 8 201249523 在分離裝置本體2〇中,液槽21内之吸附板25與矽通過 限制兀件26係設定成短於液槽21之寬度尺寸,廢液4可通過 該等吸附板2 5及矽通過限制元件2 6與液槽2丨之内壁的間隙 而流通於液槽21全體。因此,廢液4存在於在液槽21内之各 處的吸附板25與矽通過限制元件26之間的空間。 (吸附板移動元件) 如第1圖所示,吸附板移動元件30在液槽21之Y方向之 兩側,分別沿著X方向延伸存在有一對導軌31。該等導執3^ 也存在於後述之分離部4〇兩側地設定為較液槽21之乂方向 之長度還長。另外,在本實施形態中,一對導執31係使用 例如截面tr字狀的長條槽形鋼材。 在一對導轨31之間’設有與導軌31同等長度之滾珠螺 桿32。滚珠螺桿32之一端可自由旋轉地軸支撐於設在導辑 31之一端側的軸承構件33。滾珠螺桿32之另一端與脈衝馬 達34之旋轉驅動軸相連結。 在配置於液槽21兩側之一對的各導轨31,如立起般地 設有下部可沿著導轨31、31往X方向自由滑動地被支持的搬 送支柱35。該等一對搬送支柱35之下部螺合於滚珠螺桿 32 ’該等搬送支柱35係設定成隨著滾珠螺桿32的旋轉,可 沿著X方向同步地進行移動動作。 在一對搬送支枉35彼此對向之面側,設有升降驅動部 36。又,在一對搬送支柱35,架設有進行升降動作的升降 臂37。該升降臂37之兩端部係連結於未圖示之升降驅動用 的汽缸機構,該汽缸機構透過沿著上下方向(Z方向)形成於 201249523 升降驅動部36之狹縫部36A而配設於升降驅動部36内部。升 降臂37係設定成在藉由汽缸機構保持為水平的狀態下進行 升降動作。在升降臂37的寬度方向中央下部,向下方突出 §5:置有插入於吸附板25之被卡合片25A間的卡合部37A。如 第5圖所示,在該卡合部37八的寬度方向兩端,設有藉由利 用例如電磁線圈等之未圖示之驅動機構而可伸出沒入地設 有卡合用突起38。在卡合部37A插入被卡合片25A之間的狀 態下,藉由卡合用突起38突出而插入至被卡合孔25h,升降 臂37與吸附板25可卡合。 (分離部) 如第1圖所示,分離部40包含有:回收容器41 ,係回收 矽屑5者;支持板42,係在該回收容器41之寬度方向(γ方向) 兩側上部,彼此相對向立起地設置者;刮板43,係在一對 相對向之支持板42之間,彼此隔著預定間隔而平行地架設 者,及旋轉調整驅動部45 ,係連結於該刮板43之旋轉軸 43A(參照第6、7圖)者。該旋轉調整驅動部45具有未圖示之 旋轉驅動源,使在刮板43間略呈平行的如第6圖所示之位 置、與如第7圖所示之刮板43之上部側間彼此接近的位置兩 位置之間的變位為可能》 (分離裝置10之動作及作用) 首先,如第2及4圖所示,在分離裝置本體中,當由 電壓施加電路28施加電壓而形成電場,則矽分離機構22可 以吸附板25吸附廢液4中之石夕屑5,以石夕通過限制元件26之 矽通過限制板26B藉由斥力使廢液4中之矽屑5不會靠近而 201249523 產生作用。藉由石夕通過限制板2 6 B,使廢液4令之石夕屬」不會 通過而使水4A通過石夕通過限制元件湖。積存於石夕通祕 制70件26内的水4A可由搬出部26C搬出至外部而可再利 用又在吸附板25呈現進行吸附石夕屬5的狀態。 一面維持上述狀態面使吸附板移動元们〇之升降 臂37向積存㈣屑5之預定之韻板25移動。此時,驅動脈 衝馬達34使搬送支柱35移動於Xf方向。 ▲在升降们7到達财之⑽板μ上方時使搬送支柱 ϋ移動。然後’使未圖示之汽缸機構動作而使升降臂 37下降’如第5_示,使卡合部37緒人_板25之被卡 合月25Α之間。然後,使卡合部37Α兩側之卡合用突起%向 側方突出’使卡合較起38嵌合於被卡合之被卡合孔 25h。如此—來’升降臂37與吸附板25相卡合。 -接著’使设置於搬送支柱35之升降驅動部湖的未圖 不之汽缸機構動作’使升降臂37上升。另外,升降臂37係 設定成可移動至將吸附板25吊起至液槽21上方的位置。 '、通使脈衝馬達3 4逆旋轉地驅動而使搬送支柱3 5移 動於Xr方向,在被吊起之吸附板Μ到達回收容器*丨中之一 對刮板43間的位置時’停止搬送支柱^的移動。另外,此 時’使刮板43如第6圖所示,呈現板面被設定於沿著垂直方 向的位置’呈彼此平行的狀態。 接著’使升降臂37如第6圖所示,使未圖示之汽缸機構 動作而插人刮板43之間,使吸附板25之上端下降至刮板43 ,的位置然後’如第7圖所示’使旋轉調整驅動部45動作 201249523 而使刮板43的上部間互相接近。之後,如第7圖所示,藉由 使升降臂17上升’可以刮板43將附著於吸附板25表 面之矽 屑5到落至回收容器41。 如上所述而除去矽屑5之吸附板25,在驅動脈衝馬達34 而使搬送支柱35移動於Xf方向,當吸附板25到達液槽21内 之原本的位置上方時,使搬送支柱35停止移動。然後,使 未圖示之汽缸機構動作而使升降臂37下降,使吸附板25往 液槽21内的原本位置配置。而且,使未圖示之驅動機構動 作’將卡合用突起38從被卡合片25A之被卡合孔25h拔出, 藉此’升降臂37與吸附板25解除卡合。 而且,對於下個欲除去、分離石夕屑5之吸附板25,只要 進行與上述同樣的操作即可。如此一來,可從液槽21内所 有的吸附板25回收石夕屑5。也可進行控制依分離裝置1〇之預 定動作時間自動地進行如上所述之一連串操作。 如此一來,回收於回收容器41之矽屑$施行例如乾燥處 理,可以再利用。在本實施形態中,係藉由複數矽通過限 制元件26與吸附板25之組合’可有效率並且以容易再利用 的狀態將包含矽屑5之廢液4分離成矽屑5與水4A。. (實施形態1之變形例) 第8〜1 〇圖顯示本發明實施形態1之變形例的分離裝置 10 A。本變形例係將上述實施形態1之分離裝置丨〇中之一對 刮板43置換成—對圓枉狀刷子46者,其他構造皆與實施形 態1之分離裝置1〇大致相同。 如第9及1〇圖所示’圓柱狀刷子46在旋轉軸46A周圍起 12 201249523 毛,並旋轉而接觸於吸附板25,藉此,將附著於吸附板25 之矽屑5刮落。另外’在本變形例中,圓柱狀刷子46之旋轉 軸46A係設置成藉由未圖示之驅動機構,可變位於如第9圖 所示之彼此分離的位置、與如第1〇圖所示之彼此接近的位 置。 在本變形例中’—對圓柱狀刷子46之旋轉軸46A如第10 圖所示,係設定成對於進行上升動作之吸附板25,彼此旋 轉於相反方向,且與吸附板25接觸之刷子外周面係旋轉於 與作為吸附板25移動方向之上升方向相反的方向。 另外’在本變形例中,係構成為使圓柱狀刷子46之旋 轉轴46A可彼此分開、彼此接近地移動,但亦可為增長圓柱 狀刷子46的毛長並固定旋轉軸46A位置的構造。 (實施形態2) 第11〜13圖顯示本發明實施形態2之分離裝置i〇b。該 分離裝置10B具有:石夕分離機構6()'作為吸附板移動元件之 旋轉驅動部7G、分離部72、及配置於料離機構6()之側方 的回收容器7卜在本實施形態中,回收機構由旋轉驅動部 70與分離部72所構成。另外,本實施形態中切通過限制 元件62之構造與上述實施形態1之矽通過限制元件26相 同,故省略其說明。 矽分離機構60具有:液槽51、圓板狀之複數吸附板61、 及與吸附板61交互配置的矽通過限制元件62。如第u圖所 示,在該等吸附板61與矽通過限制元件62之間形成電場之 電壓施加電路81的電性連接關係與上述實施形態丨之分離 13 201249523 裝置10—樣,係吸附板61連接於正側、石夕通過限制元件62 連接於負側。 如第11及12圖所示,複數之吸附板61係隔著預定間隔 平行配置,一體地固定成以旋轉軸63貫通中心部之狀態。 5亥方疋轉軸63係軸支樓於形成在一對軸承部52之u字狀的軸 承孔52A,且該等一對軸承部52係設置於液槽51上緣部彼此 相對的2處。另外,在本實施形態中,塞住軸承孔52A上部 之開放部地架設有未圖示之防止鬆脫構件,以使旋轉軸63 不會脫離軸承部52。 該吸附板61之構成材料與上述實施形態丨同樣,可列舉 如銅(Cu)、銀(Ag)、鉑(pt)、金(Au)等,在本實施形態中使 用不鏽鋼(SUS316、SUS304等)。又,旋轉軸63之構成材料 具有可支撐複數吸附板61的強度,並且係以可電性導通於 吸附板61之金屬材料所形成。 吸附板61之直徑尺寸係設定為大致下半部分左右浸於 供給至液槽51之廢液4中。如第11圖所示,吸附板61於旋轉 軸63連結有作為吸附板移動元件的旋轉驅動部7〇。在本實 施形態中’藉由以旋轉驅動部70進行旋轉驅動,使吸附板 61旋轉移動而使吸附板61中浸於廢液4的部分往不會接觸 到廢液4的位置移動。 如第11及12圖所示,在旋轉軸63之一方的端部63A附 近,同軸地固定設置有配置在液槽51外側的被傳導齒輪 64。又’在液槽51外側之被傳導齒輪64附近,以與旋轉軸 63平行的狀態可自由旋轉地軸支撐有旋轉傳導軸65。在該 14 201249523 專導轴65,同轴地固定設置有與被傳導齒輪料咬合的 、導齒輪66。又,旋轉傳導軸65連結於馬達67。如上述之 被傳導齒輪64、旋轉傳導軸65、傳導齒輪的及馬達67構成 旋轉驅動部70。 又’在旋轉軸63之-方的端部63A,與圓柱形狀之非旋 轉接觸構件68接觸,該非旋轉接觸構件68可沿著旋轉軸63 之軸方向移動,且由螺旋彈簧69向壓接於端部63 A之端面的 方向E賦予勢能。如第u圖所示,該非旋轉接觸構件68往電 壓鈿加電路81之正極側連接,並透過旋轉軸63使吸附板61 帶正電。 分離部72一體地具有接觸於吸附板61之兩面側的一對 刮板7 2 A。該等一對刮板7 2 a的形狀係如從回收容器71側張 開般地夾住吸附板61,分離部72全體則形成為溝狀。又, 分離部72設定有傾斜度,以從液槽51側向回收容器71側變 低。因此’隨著吸附板61的旋轉,由刮板72A所刮取的矽屑 5可搬送至回收容器71。另外,如第13圖所示,吸附板25之 旋轉方向C係依如以刮板72A刮取下之矽屑5載置於刮板 72A上般的旋轉方向旋轉驅動,即,接近分離部72的吸附板 61之周緣部相對於刮板72A由上往下地旋轉驅動。如第11 圖所示,在使吸附板61旋轉於旋轉方向C時,亦可使傳導軸 65及傳導齒輪66呈如箭號D所示之旋轉方向地使馬達67旋 轉。 接著,說明分離裝置10B的作用及動作。在本實施形態 之分離裝置10B中,也與上述實施形態1具有同樣作用’可 15 201249523 於吸附板61吸附矽屑5。當驅動旋轉驅動部70而使吸附板61 旋轉,則分離部72之刮板72A會刮取附著於吸附板61兩表面 的矽屑5。被刮落至分離部72上的矽屑5會因應分離部72的 傾斜而往回收容器71落下而被回收。 以上,說明了實施形態2,根據本實施形態,具有如下 之效果:不須從液槽51取出吸附板61,也不用停止吸附板 61的吸附動作,亦可進行矽屑5的回收。另外,本實施形態 中之其他效果與上述實施形態1之分離裝置10的效果相同。 以上,說明了具有複數吸附板之各實施形態,在具備 單一吸附板之分離機構的情況下,本發明當然也可適用。 又,吸附板或矽通過限制機構的形狀構造也不限定於上述 各實施形態。 產業上之可利用性 如以上所述,本發明之分離裝置可用於切斷、分離矽 時所產生之廢液再利用,特別可適用於半導體加工領域。 I;圖式簡單說明3 第1圖係本發明實施形態1之分離裝置的立體圖。 第2圖係顯示本發明實施形態1之分離裝置中收納於液 槽内之矽分離機構的分解立體圖。 第3圖係顯示本發明實施形態1之分離裝置中收納於液 槽内之矽分離機構的立體圖。 第4圖係第3圖之IV—IV截面圖。 第5圖係說明本發明實施形態1之分離裝置中升降臂與 吸附板之卡合元件的重要部分立體圖。 16 201249523 第6圖係顯示本發明實施形態1之分離裝置中,使吸附 板配置於各刮板間之步驟的側面圖。 第7圖係顯示實施形態1之分離裝置中,以刮板夾住吸 附板而刮下矽屑之步驟的側面圖。 第8圖係顯示本發明實施形態2之分離裝置的立體圖。 第9圖係顯示實施形態2之分離裝置中,使圓柱狀刷子 相離開而使吸附板配置於圓柱狀刷子之間之步驟的側面 圖。 第10圖係顯示實施形態2之分離裝置中,在以圓柱狀刷 子夾住吸附板的狀態下,使吸附板上升而刮下矽屑之步驟 的側面圖。 第11圖係顯示本發明實施形態3之分離裝置的立體圖 第12圖係顯示實施形態3之分離裝置的分解立體圖。 第13圖係第11圖之XIII —XIII截面圖。 【主要元件符號說明 4.. .廢液 4A".水 5_._石夕層 10、10A、10B...分離裝置 20.. .分離裝置本體 21、 51…液槽 21A...壁部 22、 60...矽分離機構 23…廢液供給管 23 A...供給喷嘴 24...排液管 25、 61...吸附板 25A...被卡合片 25h...被卡合孔 26、 62...矽通過限制元件 26A...框體 26B...石夕通過限制板 26C···搬出部(搬出口) 17 201249523 27.. .搬出軟管 28、81...電壓施加電路 30.. .吸附板移動元件 31.. .導軌 32.. .滾珠螺桿 33.. .軸承構件 34.. .脈衝馬達 35.. .搬送支柱 36.. .升降驅動部 36A...狹縫部 37.. .升降臂 37A...卡合部 38.. .卡合用突起 40、 72...分離部 41、 71...回收容器 42.. .支持板 43、72A...刮板 43A、46A、63...旋轉軸 45.. .旋轉調整驅動部 46.. .圓柱狀刷子 52.. .轴承部 52A...軸承孔 63A...端部 64.. .被傳導齒輪 65.. .旋轉傳導輪 66.. .傳導齒輪 67.. .馬達 68.. .非旋轉接觸構件 69.. .螺旋彈簣 70.. .旋轉驅動部 C、D...旋轉方向 Xr、Xf、Ε··_方向 18201249523 VI. INSTRUCTIONS: C TECHNICAL FIELD OF THE INVENTION The present invention relates to a separation device for separating waste liquid containing swarf into swarf and liquid. c Prior Art 3 Background of the Invention In the manufacture of Shi Xi 7L, there are the following steps: the step of cutting the Shi Xi key to form the Shi Xi wafer, the step of grinding the Shi Xi wafer, or arranging the surface in a lattice shape. In many areas, a circuit such as an IC or an LSI is formed by cutting each area along a predetermined scribe line (cut line) to form each (four) wafer. In these steps, for example, in order to cool the cutting knives or machining points, the grinding portion, etc., or in order to wash away the stone chips, water is used. In recent years, there has been a demand for a technique for separating the waste liquid of the package 311 from the uncut water due to the reuse viewpoint of water or Shixia. Shi Xi is a subtle particle that is suspended and turbid in the waste liquid. A physical method for performing a city or a centrifugal separation method is known in the prior art. (For example, refer to the patent document υ. Prior art document Patent document Patent document 1. Japanese Patent Publication (four) Ping 8_1 (4) Qing [Invention content Α Α 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 When the knife is separated from the method, the concentration of the sand particles relative to the moisture is too thin, and there may be a case where the efficiency of the knife is too poor. Moreover, when the above chemical method is used, it is difficult to reuse the liquid due to the use of the drug. The present invention has been made in view of the above problems, and an object of the present invention is to provide a separation device capable of efficiently separating a waste liquid containing a waste liquid into a stone and water in an easily-formed state. Means for solving the above problems and achieving the object, the present invention is a separation device for separating a waste liquid containing a swarf chip into a liquid of a swarf and a swarf-free liquid. The method is characterized in that: a liquid tank is used to store the waste liquid; and a helium separation mechanism is disposed in the liquid tank, and the helium separation mechanism has: an adsorption plate, which is positively charged and adsorbed The waste liquid is negatively charged to the scrap; and the Shi Xi passing through the restricting member includes a crucible passing through the restricting plate, and the crucible is disposed opposite to the adsorbing plate by the restricting plate, and only the waste liquid is allowed The passage of the liquid restricts the negatively passing the chipper. In addition, the damper has a casing through which the zone is defined by the zone through which the liquid passing through the restriction plate passes; and the removal section is configured In the casing, the waste liquid passing through the restricting plate is carried out to the outside of the liquid tank, and the separating device has an electric field forming element, wherein the electric field forming element uses the adsorption plate as an anode, and the stone eve The restriction plate is a cathode, and an electric field is formed between the adsorption plate and the stone plate through the restriction plate, and has a recovery mechanism for recovering the adsorber on the adsorption plate, and the recovery mechanism has: adsorption board Moving 4 201249523, the moving plate is moved from the waste liquid; and the separating portion is separated from the adsorption plate. Effect of the Invention According to the present invention, it is possible to realize an efficient use of waste liquid containing chips And the apparatus for separating the chips and the water in a state of being easily reused. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a separating apparatus according to a first embodiment of the present invention. Fig. 2 is a view showing a separating apparatus according to a first embodiment of the present invention. 3 is a perspective view showing a weir separation mechanism housed in a liquid tank in the separation device according to Embodiment 1 of the present invention. Fig. 4 is a view showing FIG. Fig. 5 is a perspective view showing an essential part of the engaging element of the lifting arm and the suction plate in the separating apparatus according to the first embodiment of the present invention. Fig. 6 is a view showing the arrangement of the adsorption plate in the separating apparatus according to the first embodiment of the present invention. Side view of the steps between the squeegees. Fig. 7 is a side view showing a step of scraping off the swarf by sandwiching the absorbing plate with the squeegee in the separating apparatus of the first embodiment. Fig. 8 is a perspective view showing a separating apparatus according to a second embodiment of the present invention. Fig. 9 is a side view showing the step of disposing the cylindrical brush in the separation device of the second embodiment and arranging the adsorption plate between the cylindrical brushes. Fig. 10 is a side elevational view showing a step of a process of the separator of the second embodiment, in which the suction plate is raised by a cylindrical brush and the squeegee is scraped off to scrape the swarf. Fig. 11 is a perspective view showing a separating apparatus according to a third embodiment of the present invention. Fig. 12 is an exploded perspective view showing the separating apparatus of the third embodiment. Figure 13 is a cross-sectional view of XIII-X111 of Figure U. [Implementation of the cold type] The best mode for carrying out the invention Hereinafter, a separating apparatus for carrying out the embodiment of the present invention will be described with reference to the drawings. However, it should be noted that the diagram is schematic, and the particle size or component size is different from reality. The fork, between the illustrations, contains portions that differ from each other in size or proportion. (Embodiment 1) Figs. 1 to 7 show a separation device 10 according to Embodiment 1 of the present invention. As shown in Fig. 1, the separating apparatus 10 includes a separating apparatus main body 20, a suction plate moving mechanism 30, and a separating unit 40. Further, the adsorption plate moving mechanism 30 and the separation portion 40 constitute a recovery mechanism. (Separating device body) First, the separating device body 20 will be described. As shown in Figs. 1 to 4, the separator main body 20 includes a liquid tank 21 and a stone separation mechanism 22 disposed in the liquid tank 21. As shown in Fig. 4, the liquid tank 21 is supplied with the waste liquid 4 containing the swarf 5 in the water. The liquid tank 21 is a rectangular parallelepiped container in which the upper portion is open. The waste liquid supply pipe 23 is penetrated in the wall portion 21A of one of the liquid tanks 21, and the supply nozzle 23A at the front end of the waste liquid supply pipe 23 is disposed inside the liquid tank 21, and the waste liquid 4 is supplied from the supply nozzle 23A. It is supplied into the liquid tank 21. Further, a drain pipe 24 for preventing the waste liquid 4 from overflowing the liquid tank 21 is provided at a position different from the position where the waste liquid supply pipe 23 is disposed in the wall portion 6 201249523 21A of the liquid tank 21. As shown in FIGS. 1 to 4, the crucible separation mechanism 22 alternately arranges the adsorption plate 25 and the crucible passage restriction member 26, and the adsorption plate 25 is disposed in the liquid tank 21 to adsorb the crumbs 5 in the waste liquid 4. The aforementioned weir is arranged to be spaced apart from the suction plate 25 by the restriction member 26, and only the water 4A in the waste liquid 4 is allowed to pass, and the passer of the debris 5 is restricted. The adsorption plate 25 is preferably formed of an electrochemically valuable material, and examples thereof include copper (Cu), silver (Ag), platinum (Pt), and gold (Au). In the present embodiment, stainless steel (SUS316, SUS304, etc.) is used. ). As shown in Figs. 1 to 5, a pair of engaged sheets 25A are protruded upward at a predetermined interval in the width direction of the suction plate 25 at the center of the upper edge portion of the suction plate 25. As shown in Fig. 5, the plate-like bodies of the eight-height rectangular shape of the engaged sheets 25 are arranged to face each other. In the center of each of the engaged portions 25A, an engaged hole 25h penetrating in the width direction of the suction plate 25 is formed. Between the engaged pieces 25A, the engaging portion 37A of the suction-plate moving member 3A, which will be described later, is inserted, and the engaging projections % which can be extended to the engaging portion 3M can be inserted and engaged. Hole 25h. As shown in FIGS. 2 and 4, the restriction element 26 includes a rectangular frame 26A and a mesh-like shape that can be inserted in parallel with the open faces on both sides of the frame 26A. For the limit plate lake. Further, as shown in FIG. 4, the center of the upper portion of the frame body 26A is provided with a tubular outlet portion 26 in which the lower end opening portion is located between the pair of stone passages through the restriction plate 26 (: at the upper end of the removal portion 20C) The carry-out hose 27 is connected, and the water 7 201249523 4 A can be carried out to the outside through the carry-out hose. Since the chip 5 is negatively charged in the water, the suction plate 25 is positively charged to adsorb the negatively charged chips 5 ' The mesh-like flaw is negatively charged by the restricting plate 26B in order to generate a repulsive force so that the chip 5 does not come close. As shown in Fig. 2, in the separating device body 20, a voltage as an electric field forming element is provided. The application circuit 28' has an adsorption plate 25 as an anode and a cathode through the restriction plate 26B as an anode to form an electric field. As shown in Figs. 1 to 4, the adsorption plate 25 is disposed to interact with the crucible through the restriction member 26, respectively. The crucible passes through the restricting plate 2 6 B. The crucible in the present embodiment is disposed so as to be slightly parallel to the adsorption plate 25 by the restriction plate 26B by about 4 mm from the adsorption plate 25. As described above, the adsorption plate 25 and the crucible are restricted. The reason why the distance of the plate 26B is about 4 mm is due to the distance. In the far end, the electric field will be weaker, so in order to end the adsorption force of the adsorption plate 8, it is better to be as close as possible. In addition, the 'a pair of 矽 矽 限制 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 The casing of the water 4A of 26B, that is, the casing 26A and the pair of casings and the unloading portion 26C formed by the restricting plate 26B constitute the weir passing restriction member 26. The weir passes through the restricting plate 2 6 B and the above Similarly, the adsorption plate 25 is preferably made of an electrochemically valuable material such as steel (Cu), silver (Ag), platinum (Pt), gold (Au) or the like. In the present embodiment, stainless steel (SUS316, SUS304, etc.) is used. The above-mentioned stone eve through the restriction plate 26B has a mesh-like structure, and does not have the function of hooking the stone to the genus of the genus. It can also be used to negatively charge the mesh thickness of the negatively charged swarf. To the extent that it can be mentioned, in the present embodiment, the crucible is set to a mesh of 500/inch through the limiting plate 26B. 8 201249523 In the separator main body 2, the adsorption plate 25 and the crucible in the liquid tank 21 By restricting the member 26 to be set shorter than the width dimension of the liquid tank 21, the waste liquid 4 can pass The adsorption plates 25 and 矽 are circulated through the gap between the restriction element 26 and the inner wall of the liquid tank 2, and flow through the entire liquid tank 21. Therefore, the waste liquid 4 is present in the adsorption plate 25 and the ruthenium in the liquid tank 21. By the space between the restriction elements 26. (Adsorption plate moving element) As shown in Fig. 1, the adsorption plate moving element 30 has a pair of guide rails 31 extending in the X direction on both sides of the liquid groove 21 in the Y direction. The guides 3^ are also disposed on both sides of the separation portion 4A, which will be described later, to be longer than the length of the liquid tank 21. In the present embodiment, the pair of guides 31 are used, for example, in section tr Long strip-shaped steel in the shape of a letter. A ball screw 32 having the same length as the guide rail 31 is provided between the pair of guide rails 31. One end of the ball screw 32 is rotatably supported by a bearing member 33 provided on one end side of the guide 31. The other end of the ball screw 32 is coupled to a rotary drive shaft of the pulse motor 34. Each of the guide rails 31 disposed on one of the opposite sides of the liquid tank 21 is provided with a transfer post 35 which is supported by the lower portion so as to be slidable in the X direction along the guide rails 31 and 31. The lower portions of the pair of transporting stays 35 are screwed to the ball screw 32'. The transporting stays 35 are set so as to be movable in synchronization with the X direction in accordance with the rotation of the ball screw 32. A lifting drive unit 36 is provided on the side opposite to the pair of conveying supports 35. Further, the pair of transporting stays 35 are provided with a lifting arm 37 for performing the lifting operation. The both ends of the lift arm 37 are coupled to a cylinder mechanism for lifting and lowering (not shown), and the cylinder mechanism is disposed in the vertical direction (Z direction) formed in the slit portion 36A of the 201249523 lift drive unit 36. The inside of the drive unit 36. The lift arm 37 is set to be lifted and lowered while being held horizontal by the cylinder mechanism. The lower portion of the center of the lift arm 37 in the width direction protrudes downward. § 5: The engaging portion 37A inserted between the engaged pieces 25A of the suction plate 25 is placed. As shown in Fig. 5, the engaging projections 38 are provided at both ends in the width direction of the engaging portion 37, by means of a driving mechanism (not shown) such as an electromagnetic coil. When the engaging portion 37A is inserted between the engaged pieces 25A, the engaging projection 38 is protruded and inserted into the engaged hole 25h, and the lifting arm 37 and the suction plate 25 are engageable. (Separation unit) As shown in Fig. 1, the separation unit 40 includes a recovery container 41 for collecting the chips 5, and a support plate 42 which is on the upper sides of the collection container 41 in the width direction (γ direction) and mutually The squeegee 43 is disposed between the pair of opposing support plates 42 and is disposed in parallel with each other at a predetermined interval, and the rotation adjustment drive unit 45 is coupled to the squeegee 43. The rotation axis 43A (see Figs. 6 and 7). The rotation adjustment drive unit 45 has a rotation drive source (not shown), and the position shown in FIG. 6 which is slightly parallel between the squeegees 43 and the upper side of the squeegee 43 as shown in FIG. 7 are mutually The displacement between the two positions in the approach position is possible" (action and action of the separating device 10) First, as shown in Figs. 2 and 4, in the body of the separating device, when a voltage is applied by the voltage applying circuit 28, an electric field is formed. Then, the 矽 separating mechanism 22 can adsorb the swarf 5 in the waste liquid 4 by the adsorption plate 25, so that the swarf 5 in the waste liquid 4 does not approach by the repulsion force through the restriction plate 26B through the restriction plate 26 201249523 has a role. By means of the stone eve through the restriction plate 2 6 B, the waste liquid 4 is made to pass the water and the water 4A passes through the stone eve through the restriction element lake. The water 4A accumulated in the 70 pieces of the stone stalks 26 can be carried out to the outside by the carry-out unit 26C, and can be reused, and the adsorption plate 25 is in a state of adsorbing the stone genus 5. While maintaining the above-mentioned state surface, the elevating arm 37 of the suction plate moving member moves toward the predetermined rhyme plate 25 of the accumulated (four) chips 5. At this time, the drive pulse motor 34 moves the transport post 35 in the Xf direction. ▲ When the lifter 7 reaches the top of the (10) board μ, the transport pillar ϋ moves. Then, the cylinder mechanism (not shown) is operated to lower the lift arm 37. As shown in Fig. 5, the engaging portion 37 is engaged with the board 25 for 25 months. Then, the engagement projections % on both sides of the engaging portion 37 are protruded sideways, and the engagement engagement 38 is fitted to the engaged engagement hole 25h. Thus, the lifting arm 37 is engaged with the suction plate 25. - Next, the operation of the unillustrated cylinder mechanism provided in the lake of the elevation drive unit of the conveyance stay 35 is caused to raise the lift arm 37. Further, the elevating arm 37 is set to be movable to a position where the suction plate 25 is lifted up above the liquid tank 21. ', the pulse motor 34 is driven to rotate in the reverse rotation, and the transport post 35 is moved in the Xr direction, and when the lifted suction plate reaches the position between one of the recovery containers * 对 and the squeegee 43, the transport is stopped. The movement of the pillar ^. Further, at this time, as shown in Fig. 6, the squeegee 43 is in a state in which the plate faces are set to be parallel to each other at a position ' along the vertical direction. Next, as shown in Fig. 6, the lifting arm 37 is operated by inserting a cylinder mechanism (not shown) between the squeegees 43 to lower the upper end of the suction plate 25 to the position of the squeegee 43, and then as shown in Fig. 7 The rotation adjustment drive unit 45 is operated as 201249523 to bring the upper portions of the squeegee 43 closer to each other. Thereafter, as shown in Fig. 7, the squeegee 43 can be used to cause the squeegee 43 to adhere to the surface of the adsorption plate 25 to the recovery container 41 by raising the lift arm 17. When the adsorption plate 25 of the chip 5 is removed as described above, the transporting motor 35 is driven to move the transport post 35 in the Xf direction, and when the suction plate 25 reaches the original position in the liquid tank 21, the transport post 35 is stopped. . Then, the cylinder mechanism (not shown) is operated to lower the lift arm 37, and the suction plate 25 is placed at the original position in the liquid tank 21. Then, the driving mechanism (not shown) is actuated to pull out the engaging projection 38 from the engaged hole 25h of the engaged piece 25A, whereby the lifting arm 37 is disengaged from the suction plate 25. Further, the next adsorption operation of the adsorption plate 25 for removing and separating the stone chips 5 may be performed in the same manner as described above. In this way, the stone chips 5 can be recovered from all the adsorption plates 25 in the liquid tank 21. It is also possible to control the one-line operation as described above automatically according to the predetermined operation time of the separation device 1〇. In this way, the scraps recovered in the recovery container 41 can be reused, for example, by drying. In the present embodiment, the waste liquid 4 containing the chips 5 can be separated into the chips 5 and the water 4A in an efficient and easy-to-reuse state by the combination of the plurality of weirs through the restriction member 26 and the adsorption plate 25. (Modification of Embodiment 1) Figs. 8 to 1 show a separation device 10 A according to a modification of the first embodiment of the present invention. In the present modification, one of the separating devices of the first embodiment is replaced with a pair of squeegee 43 by a pair of squeegee brushes 46, and the other structures are substantially the same as those of the separating device 1 of the first embodiment. As shown in Figs. 9 and 1 'the cylindrical brush 46 is 12 201249523 around the rotating shaft 46A, and is rotated to contact the suction plate 25, whereby the chips 5 adhering to the suction plate 25 are scraped off. Further, in the present modification, the rotation shaft 46A of the cylindrical brush 46 is provided so as to be located at a position separated from each other as shown in Fig. 9 by a drive mechanism (not shown), and as shown in Fig. 1 Show positions close to each other. In the present modification, the rotation axis 46A of the cylindrical brush 46 is set as the outer periphery of the brush which is rotated in the opposite direction to the adsorption plate 25 which is moved in the opposite direction and is in contact with the adsorption plate 25 as shown in Fig. 10 . The surface is rotated in a direction opposite to the rising direction as the moving direction of the adsorption plate 25. Further, in the present modification, the rotation shaft 46A of the cylindrical brush 46 is configured to be movable apart from each other, but it is also possible to increase the length of the cylindrical brush 46 and fix the position of the rotation shaft 46A. (Embodiment 2) Figs. 11 to 13 show a separation device i〇b according to Embodiment 2 of the present invention. The separation device 10B includes a spinning separation mechanism 6 ()' as a rotation driving portion 7G of the adsorption plate moving element, a separation portion 72, and a recovery container 7 disposed on the side of the separation mechanism 6 (). The recovery mechanism is composed of a rotation drive unit 70 and a separation unit 72. Further, in the present embodiment, the structure of the cutting and passing restriction element 62 is the same as that of the above-described first embodiment, and the description thereof is omitted. The weir separation mechanism 60 has a liquid tank 51, a disk-shaped plurality of adsorption plates 61, and a weir passage restriction member 62 that is disposed to alternate with the adsorption plate 61. As shown in Fig. u, the electrical connection relationship between the adsorption plate 61 and the enthalpy passing restriction element 62 forming an electric field is similar to that of the above-described embodiment. 13 201249523 Device 10 is an adsorption plate. 61 is connected to the positive side, and Shishi is connected to the negative side by the restriction member 62. As shown in Figs. 11 and 12, a plurality of suction plates 61 are arranged in parallel at predetermined intervals, and are integrally fixed to a state in which the rotating shaft 63 penetrates the center portion. The five-turn shaft 63 is a shaft-supporting shaft formed in a U-shaped bearing hole 52A of the pair of bearing portions 52, and the pair of bearing portions 52 are provided at two places where the upper edge portions of the liquid tank 51 face each other. Further, in the present embodiment, the anti-release member (not shown) is placed on the open portion of the upper portion of the bearing hole 52A so that the rotating shaft 63 does not come off the bearing portion 52. The constituent material of the adsorption plate 61 is similar to the above-described embodiment, and examples thereof include copper (Cu), silver (Ag), platinum (pt), and gold (Au). In the present embodiment, stainless steel (SUS316, SUS304, etc.) is used. ). Further, the constituent material of the rotary shaft 63 has a strength capable of supporting the plurality of adsorption plates 61, and is formed of a metal material electrically conductive to the adsorption plate 61. The diameter of the adsorption plate 61 is set to be approximately immersed in the waste liquid 4 supplied to the liquid tank 51 in the lower half. As shown in Fig. 11, the suction plate 61 is coupled to the rotary shaft 63 via a rotary drive unit 7 as a suction plate moving element. In the present embodiment, by the rotational driving of the rotary driving unit 70, the suction plate 61 is rotationally moved to move the portion of the adsorption plate 61 immersed in the waste liquid 4 to a position where it does not come into contact with the waste liquid 4. As shown in Figs. 11 and 12, a conductive gear 64 disposed outside the liquid tank 51 is coaxially fixed to the vicinity of one end 63A of one of the rotating shafts 63. Further, in the vicinity of the guided gear 64 outside the liquid tank 51, the rotation conductive shaft 65 is rotatably supported in a state parallel to the rotary shaft 63. In the 14 201249523 special guide shaft 65, a guide gear 66 that is engaged with the conductive gear material is coaxially fixed. Further, the rotation conduction shaft 65 is coupled to the motor 67. The above-described conductive gear 64, rotational conduction shaft 65, conductive gear, and motor 67 constitute a rotational drive unit 70. Further, the end portion 63A of the rotating shaft 63 is in contact with the cylindrical non-rotating contact member 68, and the non-rotating contact member 68 is movable in the axial direction of the rotating shaft 63, and is crimped by the coil spring 69. The direction E of the end face of the end portion 63 A imparts potential energy. As shown in Fig. u, the non-rotating contact member 68 is connected to the positive electrode side of the voltage addition circuit 81, and the adsorption plate 61 is positively charged through the rotary shaft 63. The separating portion 72 integrally has a pair of squeegees 7 2 A that are in contact with both sides of the suction plate 61. The shape of the pair of squeegees 7 2 a is such that the suction plate 61 is sandwiched from the side of the recovery container 71, and the entire separation portion 72 is formed in a groove shape. Further, the separation portion 72 is set to have an inclination to be lowered from the liquid tank 51 side toward the recovery container 71 side. Therefore, the chips 5 scraped off by the squeegee 72A can be carried to the recovery container 71 as the suction plate 61 rotates. Further, as shown in Fig. 13, the rotation direction C of the suction plate 25 is rotationally driven in the rotational direction such that the chip 5 scraped off by the blade 72A is placed on the blade 72A, that is, close to the separation portion 72. The peripheral portion of the suction plate 61 is rotationally driven from the top to the bottom with respect to the blade 72A. As shown in Fig. 11, when the suction plate 61 is rotated in the rotation direction C, the conduction shaft 65 and the transmission gear 66 can be rotated in the direction of rotation indicated by the arrow D to rotate the motor 67. Next, the action and operation of the separation device 10B will be described. In the separation device 10B of the present embodiment, the same action as in the above-described first embodiment is also applied. 15 201249523 The chip 5 is adsorbed on the adsorption plate 61. When the rotation driving unit 70 is driven to rotate the suction plate 61, the squeegee 72A of the separation unit 72 scrapes the chips 5 adhering to both surfaces of the adsorption plate 61. The chip 5 scraped off onto the separation portion 72 is dropped to the recovery container 71 in response to the inclination of the separation portion 72, and is collected. As described above, according to the second embodiment, the suction plate 61 is not taken out from the liquid tank 51, and the adsorption operation of the adsorption plate 61 is not stopped, and the chips 5 can be recovered. Further, the other effects of the present embodiment are the same as those of the separating apparatus 10 of the first embodiment. As described above, each embodiment having a plurality of adsorption plates has been described, and the present invention is of course applicable to a case where a separation mechanism having a single adsorption plate is provided. Further, the shape of the suction plate or the weir passing through the restricting mechanism is not limited to the above embodiments. Industrial Applicability As described above, the separating apparatus of the present invention can be used for recycling waste liquid generated when cutting and separating ruthenium, and is particularly suitable for use in the field of semiconductor processing. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a separating apparatus according to a first embodiment of the present invention. Fig. 2 is an exploded perspective view showing the weir separation mechanism housed in the liquid tank in the separation device according to the first embodiment of the present invention. Fig. 3 is a perspective view showing a weir separation mechanism housed in a liquid tank in the separation device according to the first embodiment of the present invention. Figure 4 is a cross-sectional view taken along line IV-IV of Figure 3. Fig. 5 is a perspective view showing an essential part of the engaging member of the elevating arm and the suction plate in the separating apparatus according to the first embodiment of the present invention. 16 201249523 Fig. 6 is a side view showing a step of arranging an adsorption plate between the respective squeegees in the separation device according to the first embodiment of the present invention. Fig. 7 is a side view showing a step of scraping off the swarf by sandwiching the absorbing plate with the squeegee in the separating apparatus of the first embodiment. Fig. 8 is a perspective view showing a separating apparatus according to a second embodiment of the present invention. Fig. 9 is a side view showing the step of disposing the cylindrical brush in the separation device of the second embodiment and arranging the adsorption plate between the cylindrical brushes. Fig. 10 is a side view showing a step of raising the suction plate and scraping off the swarf in a state where the adsorption plate is sandwiched by the cylindrical brush in the separation device of the second embodiment. Fig. 11 is a perspective view showing a separating apparatus according to a third embodiment of the present invention. Fig. 12 is an exploded perspective view showing the separating apparatus of the third embodiment. Figure 13 is a cross-sectional view taken along line XIII-XIII of Figure 11. [Main component symbol description 4.. Waste liquid 4A". Water 5_._石夕层10, 10A, 10B... Separation device 20.. Separation device body 21, 51... Liquid tank 21A... Wall portion 22, 60... 矽 separating mechanism 23... waste liquid supply pipe 23 A... supply nozzle 24... drain pipes 25, 61... suction plate 25A... engaged piece 25h... The engagement holes 26, 62, ..., the passage of the restriction member 26A, the frame 26B, the passage of the restriction plate 26C, the removal portion (the delivery port), and the delivery unit (2012) are provided. ...voltage application circuit 30.. adsorption plate moving element 31.. guide rail 32.. ball screw 33.. bearing member 34.. pulse motor 35.. transporting post 36.. lifting drive 36A... slit portion 37.. lifting arm 37A... engaging portion 38.. engaging projection 40, 72... separating portion 41, 71... recovery container 42.. support plate 43, 72A... Scraper 43A, 46A, 63... Rotary shaft 45.. Rotary adjustment drive unit 46.. Cylindrical brush 52.. Bearing portion 52A... Bearing hole 63A... End portion 64 .. . Conducted gear 65.. Rotating the conducting wheel 66.. Conducting gear 67.. Motor 68.. Non-rotating contact member 69.. .. spiral magazine 70.. Rotary drive unit C, D... rotation direction Xr, Xf, Ε··_ direction 18

Claims (1)

201249523 七、申請專利範園: 一種分離裝置, 砂屑之液體者, 係將包含矽屑之廢液分離成矽屑與不含 其特徵在於具有: 液槽,係貯集該廢液者;及 矽分離機構,係里狀 你配置於該液槽中者 且該矽分離機構具有: 吸附板,係帶有正電 砂屑者;及 而吸附在該廢液中帶負電之該 液之液體通過 限制帶負電之該矽屑通過者, 另外,該矽通過限制元件具有: 筐體’係區劃出已通過财通過限制板之液體所存 在的區域者;及 搬出部,係配置於該筐體内,將通過該矽通過限制 板之該廢液往該液槽外搬出者, 且前述分離裝置具有電場形成元件,該電場形成元 件係以遠吸附板為陽極、以該石夕通過限制板為陰極,在 該吸附板與該矽通過限制板之間形成電場者, 並具有回收機構,該回收機構係回收吸附於該吸附 板之碎者, 又,該回收機構具有: 吸附板移動元件,係使該吸附板從該廢液移動者; 19 201249523 分離部 係從該吸附板使矽分離者。 20201249523 VII. Application for Patent Park: A separation device, the liquid of sand dust, which separates the waste liquid containing swarf into swarf and does not contain it. It has: a liquid tank, which is used to store the waste liquid; a 矽 separating mechanism, which is disposed in the liquid tank, and the 矽 separating mechanism has: an adsorption plate, which is provided with a positive electric swarf; and a liquid that is negatively charged in the effluent Restricting the negatively-charged swarf-passing person, and the sputum-passing restriction element has: a housing portion that defines a region in which the liquid that has passed through the restriction plate is present; and a removal portion that is disposed in the housing Passing the waste liquid through the restricting plate to the outside of the liquid tank, and the separating device has an electric field forming element, wherein the electric field forming element has a far adsorption plate as an anode, and the stone plate passes through the limiting plate as a cathode. An electric field is formed between the adsorption plate and the crucible through the restriction plate, and has a recovery mechanism for recovering the crusher adsorbed on the adsorption plate, and the recovery mechanism has: suction Moving the plate member, so that the suction plate based waste from the mover; 19201249523 separating portion from the adsorption system so that the silicon plate were separated. 20
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