201043905 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種吸波散熱材料。201043905 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a wave absorbing heat dissipating material.
[先前技術J[Prior Art J
[〇〇〇2]隨著電子技術的發展，電子產品的工作頻率愈來愈高， 其在工作的時候會產生高熱和強的電磁輻射，高熱使電 子元件的工作穩定性降低且縮短電子元件的使用壽命， 強的電磁輻射會對人類的健康和周圍的環境產生不利影 響。為了解決電磁輻射問題，習知是利用金屬罩密閉電 〇 子元件阻擋電磁波散射。又，為了解決電子產品的散熱 問題’習知是將熱流引導到由銅或者是鋁做成的散熱器 上將熱流導出，然，散熱器和電子元件之間會有間隙， 在間隙中一般會填充散熱介質來增加熱傳導率。如何提 供一種能解決散熱問題與電磁輻射問題的物質成為業界 急需解決的課題。 -二；；:；；r：is '4.1. ; f 【發明内容】 [0003] 鑒於上述内容，有必要提供一種既可以解決電磁輻射又 可解決散熱問題的吸波散熱材料。 [0004] 一種吸波散熱材料，其主要組成成分及對應的質量百分 比為： [0005] 導熱粒子15%〜25% ; [0006] 吸波顆粒25%〜30%;及 [0007] 導熱黏膠50%〜60%，該導熱黏膠將該導熱粒子與該吸波顆 粒枯合在一起。 0982032455-0 098119126 表單編號A0101 第3頁/共8頁 201043905 [0008] 上述吸波散熱材料内部含有導熱黏膠及導熱粒子，使其 可以粘合於晶片與散熱器之間，以將晶片的熱量傳遞至 散熱器，又，該吸波散熱材料中含有的吸波顆粒可以吸 收該晶片產生的電磁波*減少電磁韓射。 【實施方式】 [0009] 本發明吸波散熱材料的較佳實施方式包括導熱粒子、導 熱黏膠及吸波顆粒，該導熱粒子、導熱黏膠及吸波顆粒 分別占吸波散熱材料的總質量的比例範圍為15°/»〜25%、 50%〜60%、25%〜30%，該導熱黏膠將該導熱粒子及吸波顆 * 〇 粒粘合在一起。 [0010] 該導熱粒子用於吸熱，其成分為石墨顆粒與導熱金屬顆 粒的混合物，該石墨顆粒及導熱金屬顆粒占該吸波散熱 材料的總質量的比例範圍分別為5%~ 15%、10%〜15%。 [0011] 該導熱金屬顆粒一般為銀粉和鋁粉的混合物，在具體的 實施時可根據客戶對吸波散熱材料的導熱需求，調整該 吸波散熱材料中的石墨和導熱金屬顆粒比例。如當客戶[〇〇〇2] With the development of electronic technology, the working frequency of electronic products is getting higher and higher, which generates high heat and strong electromagnetic radiation when working. High heat reduces the working stability of electronic components and shortens electronic components. The service life, strong electromagnetic radiation will have a negative impact on human health and the surrounding environment. In order to solve the problem of electromagnetic radiation, it is conventional to block electromagnetic wave scattering by using a metal cover to seal the electrical components. Moreover, in order to solve the problem of heat dissipation of electronic products, it is conventionally to direct heat flow to a heat sink made of copper or aluminum, and there is a gap between the heat sink and the electronic component, which is generally in the gap. Fill the heat sink to increase thermal conductivity. How to provide a substance that can solve heat dissipation problems and electromagnetic radiation problems has become an urgent problem to be solved in the industry. - 2;;:;;r:is '4.1. ; f [Summary of the Invention] [0003] In view of the above, it is necessary to provide a absorbing heat dissipating material which can solve electromagnetic radiation and solve heat dissipation problems. [0004] A absorbing heat dissipating material whose main components and corresponding mass percentages are: [0005] thermally conductive particles 15% to 25%; [0006] absorbing particles 25% to 30%; and [0007] thermal conductive adhesive 50% to 60%, the thermally conductive adhesive wets the thermally conductive particles together with the absorbing particles. 0982032455-0 098119126 Form No. A0101 Page 3 of 8 201043905 [0008] The above absorbing heat dissipating material contains a thermal conductive adhesive and a heat conductive particle, so that it can be bonded between the wafer and the heat sink to heat the wafer. Passed to the heat sink, and the absorbing particles contained in the absorbing heat dissipating material can absorb the electromagnetic waves generated by the wafer* to reduce the electromagnetic ejaculation. Embodiments [0009] A preferred embodiment of the absorbing heat dissipating material of the present invention comprises a thermally conductive particle, a thermally conductive adhesive, and a absorbing particle, and the thermally conductive particle, the thermally conductive adhesive, and the absorbing particle respectively occupy the total mass of the absorbing heat dissipating material. The ratio ranges from 15° to »25%, 50% to 60%, and 25% to 30%. The thermally conductive adhesive bonds the thermally conductive particles and the absorbing particles*. [0010] The thermally conductive particles are used for endothermic, and the composition thereof is a mixture of graphite particles and thermally conductive metal particles, and the ratio of the graphite particles and the thermally conductive metal particles to the total mass of the absorbing heat dissipating material ranges from 5% to 15%, respectively. %~15%. [0011] The thermally conductive metal particles are generally a mixture of silver powder and aluminum powder. In specific implementation, the proportion of graphite and thermally conductive metal particles in the absorbing heat dissipating material can be adjusted according to the customer's heat conduction requirement for the absorbing heat dissipating material. As a customer
需要較高的導熱需求時，即可適當增加該導熱金屬顆粒 U 的比例，相反則可適當減少該導熱金屬顆粒的比例。 [0012] 該導熱黏膠為聚矽氧烷，其具有較強的導熱性和粘合性 ，是一種通用的導熱介質。該導熱黏膠可使該吸波散熱 材料具有粘合性。 [0013] 該吸波顆粒用於吸收電磁波，其為透過現有的奈米技術 製成的奈米吸波顆粒，主要是由磁損耗性吸波材料或者 是電損耗性吸波材料或者是由電損耗性吸波材料與磁損 098119126 表單編號A0101 第4頁/共8頁 0982032455-0 201043905 乾性吸波材料的混合物透過現在的奈米技術製成。其中 該電損耗性吸波材料為石墨或碳化石夕，磁損耗性吸波材 料為鋅鉻鐵氧體、鎳鋅鐵氧體、鎳銅鐵氧體、鎳鉻鐵氧 體、錳鋅鐵氧體、鈮鋅鐵氧體、鋇鐵氧體、锶鐵氧體、 鋼鐵氧體、鎂錳鐵氧體、鈷鎳鐵氧體或鋰錳鐵氧體。 [0014] 製備該吸波散熱材料時，將各組分材料按符合上述範圍 的—定比例混合後攪拌均勻即可。使用時，將該吸波散 熱材料塗覆在一晶片表面，然後在其上安放一散熱器， 0 該吸波散熱材料把晶片產生的熱量傳遞到散熱器上時又 可°及收晶片產生的電磁波以減少電磁輻射。 [0015] 由於該吸波散熱材料内部含有的導熱黏膠具有很強的粘 合性及導熱性，另，該導熱粒子亦具有很強的導熱性’ 故該吸波散熱材料會很好的粘合在該晶矣和散熱器之間 ’以將該晶片的熱量傳遞至散熱器；又，該吸波散熱材 料中含有的吸波顆粒可以吸收該晶片產生的電磁波，減 少電磁韓射。When a higher heat conduction requirement is required, the proportion of the thermally conductive metal particles U can be appropriately increased, and on the contrary, the proportion of the thermally conductive metal particles can be appropriately reduced. [0012] The heat conductive adhesive is a polysiloxane, which has strong thermal conductivity and adhesion, and is a general heat conductive medium. The thermally conductive adhesive provides adhesion to the absorbing heat dissipating material. [0013] The absorbing particles are used for absorbing electromagnetic waves, which are nano absorbing particles made by the existing nanotechnology, mainly by magnetic loss absorbing materials or electrically loss absorbing materials or by electricity. Loss-absorbing absorbing material and magnetic loss 098119126 Form No. A0101 Page 4 of 8 0982032455-0 201043905 The mixture of dry absorbing materials is made by the current nanotechnology. Wherein the electric loss absorbing material is graphite or carbon stone, and the magnetic loss absorbing material is zinc chrome ferrite, nickel zinc ferrite, nickel copper ferrite, nickel chromite ferrite, manganese zinc ferrite Body, bismuth zinc ferrite, barium ferrite, barium ferrite, steel oxide, magnesium manganese ferrite, cobalt nickel ferrite or lithium manganese ferrite. [0014] When preparing the absorbing heat-dissipating material, the materials of the respective components are mixed in a ratio corresponding to the above-mentioned range, and then uniformly stirred. In use, the absorbing heat dissipating material is coated on a surface of the wafer, and then a heat sink is placed thereon. 0 The absorbing heat dissipating material transfers heat generated by the wafer to the heat sink and can be generated by the wafer. Electromagnetic waves to reduce electromagnetic radiation. [0015] Since the thermal conductive adhesive contained in the absorbing heat dissipating material has strong adhesiveness and thermal conductivity, the thermally conductive particles also have strong thermal conductivity. Therefore, the absorbing heat dissipating material will adhere well. Between the wafer and the heat sink, the heat of the wafer is transferred to the heat sink. Further, the absorbing particles contained in the absorbing heat dissipating material can absorb electromagnetic waves generated by the wafer and reduce electromagnetic radiation.
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[0016] 综上所述，本發明符合發明專科要件，爰依法提出專利 申靖。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之如申請專利範圍内。 【圖式簡單說明】 [0017] 無 【主要元件符號說明】 [0018] 無 098119126 表單煸號A0101 0982032455-0[0016] In summary, the present invention meets the requirements of the invention, and patents Shen Jing according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. [Simple description of the diagram] [0017] None [Main component symbol description] [0018] None 098119126 Form nickname A0101 0982032455-0