TW200809209A - Probe card and glass substrate drilling method - Google Patents

Abstract

To form a guide hole so as to contain more probe pins than in the conventional method in the same region support plate of the probe card and improve the probe pin position accuracy and the guide hole position accuracy and dimension accuracy. [MEANS FOR The support plate guide hole has a horizontal cross section of a rectangular shape. A plurality of grooves are arranged at the opposing side surfaces in the guide hole.The grooves are arranged to oppose each other and the region between the opposing grooves in the guide hole forms an insert section. A probe pin is inserted in each insert section. Since one guide hole has a plurality of insert sections for inserting the probe pin, it is possible to arrange more probe pins than in the conventional guide hole.

Description

200809209 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a probe card and a glass substrate opening method. [Prior Art] For example, the inspection of the characteristics of an electronic circuit such as an IC or an LSI formed on a semiconductor wafer is performed by using a probe card mounted on the probe device to execute a probe capable of a probe type + A mesh + jinming Gray or A2 connector with a majority of needle-like probes

- '", the board's support board, and the circuit board that is electrically connected to the board. . The support plate is configured such that the front end of the probe protrudes below the surface: day. The rounded surfaces are opposed to each other, and the circuit board is placed on top of the support plate. The electrical characteristics of the element of the crystal 2 are checked at the front end of the complex probe.

The lightning contact with the component; the electrode of the A-electronic circuit is applied to the circuit substrate through the circuit substrate, and the inspection is performed by using the electric snow. The probe slides in the up and down direction, and is housed in a guide hole formed in the support plate. However, the shape of the horizontal cross section of the hole is circular (Patent Document 丨). [Problem to be Solved] However, the horizontal cross-sectional shape of the guide hole is a rounded shape, which cannot meet the needs of the conventional integrated components in recent years. That is, the shape of the guide hole (four) material, to narrow the gap of the hole of the hole f, in the case of the micro hole, regardless of the diameter of the hole is large and small, ', the minimum hole required for the hole processing and The gap between the partitions of the round holes is constant, so the diameter of the holes must be extremely narrowed. However, the miniaturization of the aperture processing and the wave probe has its limits, and it is also desirable to conform to the high integration. 120334.doc 200809209 Reduces the distance between adjacent probes, and also has (4). And 'Although it is suitable for use as a guide hole in the round shape, the extension of the ♦ 太 之 之 疋 疋 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容Ideal and not conducive to fine determination. On the other hand, in the valley easy to infect the surrounding noise η lost. In order to prevent such problems, the lack of recognition on the structure and the structure will increase the size of the wave probe and meet the needs of high integration.

The invention is developed according to the series of the invention, and the purpose of the invention is to: in the support plate of the same area of the probe card, the positional accuracy of the needle can be reduced by a positional accuracy which is narrower than the previous distance. Fine inspection of high integrated components is performed. Means for Solving the Problems In order to achieve the above object, a probe card includes a circuit board and a support plate disposed under the circuit board and supporting the probe, and a probe for inspecting electrical characteristics of the object to be inspected And a probe is inserted into the guide hole formed in the support plate, and the front end of the probe protrudes from the guide hole below the support plate, and the insertion portion of the plurality of probes is arranged side by side. Thus, since a plurality of insertion portions for inserting a plurality of probes are provided in one guide hole, the probe card of the present invention can be disposed with a narrower distance than a probe card having a circular guide hole. Further, since the probe is inserted and arranged in parallel with the plurality of insertion portions of one of the guide holes, the probe can be placed with high positional accuracy. Further, the guide hole of the probe card has a horizontal cross-sectional shape of a quadrangular shape, and each of the guide holes has a plurality of groove portions on opposite sides thereof, and the groove portions are opposite to each other, and the insertion portion is the guide portion The probe in the hole may be inserted into the hole of the groove between the grooves of the 120334.doc 200809209. Since the via hole has the aforementioned shape, the probe can use a cage such as a wave shape to make it thicker than the coil spring and shorten the overall length to reduce the inductance. Further, the probe 2 can also be configured to have a locking portion that is locked to the upper edge portion of the guide hole. The quadrangular shape of the horizontal cross-sectional shape of the above-mentioned guide holes can be arranged with a narrower pitch probe in the same-area, especially when forming a rectangular shape. For example, in a rectangular guide hole having a width of 3 inches, 6 〇 ^ is formed on the opposite side.

The opposite of the ditch. The insertion of the probes between the opposing grooves can be arranged in parallel at intervals of 100 μm. Further, the via hole may be formed in a resin layer provided to penetrate the support plate. As described above, since the resin is formed on the outer periphery of the guide, it is easy to form fine guide holes even when a material for the support plate is used, for example, a glass substrate having poor machinability. Further, another guide hole into which two probes are inserted may be further formed on the support plate. Further, in order to form the guide holes of the aforementioned shape, it is necessary to open the fine holes in the support plate of the probe. However, it is difficult to form a fine guide hole of the above-described shape with high positional accuracy and dimensional accuracy when drilling or laser machining such as ultrasonic machining or sand blasting is generally used. Therefore, in the present invention, a substrate such as a oleophthalic acid glass represented by a Phillips glass (registered trademark of the company) is used in the support sheet, and the above-described shape guide is formed on the glass substrate via the following steps. hole. That is, first, a mold in which a plurality of holes having inserted into the insertion portion of the probe are arranged side by side is placed in a hole provided in the vertical mold substrate. The glass substrate is placed in a container opened on the upper surface of the 120334.doc 200809209, and the vertical mold substrate is disposed to face the glass substrate so that the mold of the vertical mold substrate faces the glass substrate side in the container. Next, the glass substrate in the container is heated to smear the substrate, and the vertical mold substrate is brought close to the refining glass substrate, and the mold of the above-described vertical mold substrate is inserted into the glass substrate. On the other hand, in the state in which the mold is inserted into the glass substrate, the glass substrate in the container is cooled to cure the glass substrate. After the 苴尨 & means, the glass substrate was taken out from the container and the mold for inserting the glass substrate was removed. The guide holes are formed by grinding and removing the underside of the glass substrate of the mold. Further, the vertical mold substrate is a substrate for erecting a mold. Further, in the mold, the horizontal cross-sectional shape of the die is a quadrangular shape, and a plurality of convex portions may be opposed to one side of the mold in the mold. In the square shape of the horizontal cross-sectional shape of the modulo 4, especially when a rectangle is formed, a probe having a narrower pitch can be disposed in the same region. The aforementioned holes may also be suitable for the aforementioned mold shape. Thereby, the mold can be erected more reliably on the vertical mold substrate. Further, the holes may be formed on the vertical mold substrate by etching. Thereby, a hole can be formed in the vertical mold substrate with higher precision. The step of inserting the mold into the glass substrate may be performed by holding the vertical mold substrate by a lifting member capable of lifting and lowering the vertical mold substrate at a specific speed by the holding member. When the glass substrate of the container is heated, the foregoing The mold substrate can also be heated. The above-mentioned vertical mold substrate can be constituted, for example, by a tantalum substrate. Further, the container may be formed of carbon. The carbon is excellent in thermal conductivity and has a thermal expansion coefficient of carbon equivalent to or lower than that of Shishi 120334.doc 200809209 acid glass. Therefore, the heat of the container can be efficiently transmitted to the glass substrate during heating, and carbon has a gap between the particles of the material, and the bubbles in the glass substrate are easily discharged. Further, since the carbon is not attached to the glass substrate, the glass substrate can be easily taken out by the company. Preferably, the mold is formed of a material having heat resistance to a heating temperature of the glass substrate. When the mold is removed, for example, the mold may be melted by a liquid to be removed by the glass plate. In this case, for example, the mold may be formed of a metal, and the liquid may also be aqua regia using <+> Among the materials of the mold, for example, tungsten, stainless steel, molybdenum, nickel or a nickel alloy can be used. Further, when the mold is removed, for example, the mold may be burned and removed from the glass substrate. In this case, for example, carbon can be used in the material of the mold. Also in action! When the glass substrate of the support plate of the wood needle card is formed side by side with a plurality of guide holes into which the insertion portion of the probe is inserted, a glass substrate opening method including the following steps may be used: the conductive substrate is formed on the glass substrate. a step of forming a temporary hole in the horizontal section; a step of filling the melted resin in the temporary hole 'after the resin is cured; and a step of forming the two conductive holes in the cured resin> 依据 ^ according to this method Since the cutting process of the resin I is better than that of the glass substrate, for example, fine guide holes can be easily formed even by mechanical reinforcement. Therefore, a specific size of the via hole can be formed at a specific position of the glass substrate with a positional accuracy of =1 and dimensional accuracy. Further, the V-hole type of the guide hole has a square shape, and the plurality of groove portions have a plurality of groove portions, and the groove portions are opposite to each other, and the insertion portion is also It is a hole between the opposite grooves in the guide hole. When the glass substrate which is the support plate of the eucalyptus needle card is formed side by side with the hole of the insertion portion of the insertion probe, the glass substrate opening method including the following steps can also be used: Forming a step of inserting a mold having a shape suitable for the temporary hole into the lower portion of the temporary hole in a glass-filled substrate having a JC level σ_ larger than the above-mentioned via hole; and refining the resin Filling: a step of preparing a temporary hole above the upper portion, and thereafter curing the resin; a step of removing the aforementioned molding from the temporary hole; and a step of forming the aforementioned via hole in the cured resin. According to the method, only Processing the upper part of the temporary hole

The guide holes can be formed, and the guide holes can be formed more easily. Further, the resin can be filled only in the upper portion of the boring hole, and the amount of resin required can be reduced. Further, the guide hole has a horizontal cross-sectional shape of the guide hole having a square shape, and the side surface of the guide hole has a plurality of groove portions, and the groove portions are opposite to each other, and the insertion portion may be the guide hole. The hole between the grooves facing the inside. In addition, when the glass (four) plate as the support plate of the probe card is formed side by side and has a plurality of guide holes into which the insertion portion of the probe is inserted, a glass substrate opening method including the following steps may be used: the glass substrate is formed with a step of inserting a temporary hole larger than a horizontal cross section of the V hole; inserting a surface of the mold T which is suitable for the shape of the via hole into the temporary hole; filling the refining resin into the gap between the temporary hole and the mold, and thereafter a step of curing the resin; removing the mold inserted into the resin; and grinding the other side of the glass substrate to form the via hole at a position where the glass substrate is removed from the mold. According to this method, since the viscosity of the resin is lower than that of the glass substrate, the molten resin can be filled in the temporary hole and the mold/door, and the gate can be easily formed into a fine guide hole without any gap. Further, the guide hole has a horizontal cross-sectional shape of the guide hole having a square shape, and the side surface of the guide hole is opposite to each other 120334.doc 200809209 has a plurality of groove portions, and the groove portions are opposite to each other, and the insertion portion may be the same The hole in the guide hole that faces the groove. At the time of insertion of the aforementioned mold, the jig of the standing mold can be inserted, and the jig is removed after the resin is cured. In the insertion of the mold in this case, the jig for erecting the mold may be disposed on the lower side of the glass substrate, and thereafter, the mold is erected on the jig of the standing mold, and the mold is inserted into the temporary hole, and The mold can be set up in advance on the fixture of the vertical mold, and the lower side of the glass substrate is close to the fixture of the vertical mold, and at the same time, each mold is inserted into the δπχ 守孔令, and the mold can be arranged in a temporary manner. The specific position in the hole allows the guide hole to be formed at a specific position on the glass substrate. Advantageous Effects of Invention According to the present invention, since a plurality of insertion portions for mounting a probe are provided in parallel in one guide hole, a plurality of probes can be mounted at a narrower pitch than a conventional support plate in the same region, which can be high. Position accuracy configuration probe. Moreover, the positional accuracy and dimensional accuracy of the formed via holes can be improved. Thereby, the inspection of the highly integrated component can be performed finely. Moreover, since the pitch is narrow, the thickness of the probe can be increased, so that the design freedom of the probe can be increased, and a highly reliable probe card can be produced. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described. Fig. i is a view showing the side of the probe card 1 of the present embodiment. The probe card i has a circuit base = 2, and a support plate 3 disposed under the circuit board 2. Further, the entire probe card 1 is supported in parallel with the probe device (not shown) so as to face the wafer % of the object to be inspected placed on the mounting table 4. 120334.doc 200809209 The support plate 3 is formed of a glass plate. As shown in Fig. 2, the whole plate is slightly rounded, and a plurality of guide holes are formed in the central portion opposite to the wafer % on the mounting table 4. 5. As shown in Fig. 3, the guide hole 5' has a horizontal cross-sectional shape of a quadrangular shape, and has a plurality of groove portions 5a on the opposite side faces of the holes, and the groove portions 5a are opposed to each other. The insertion portion % is formed in the region between the opposing groove portions 5a in the guide hole 5, and the probe is inserted into the insertion portion 5b! ! , the width of the guide hole $ in this embodiment is

Then, μιη, the groove portion 5a is arranged with an interval of 8 〇, _6 〇 _ and a distance (10) between μ μm. As shown in Fig. 4, the probe 11 has an elastic portion 12 integrally formed with a stopper portion 13 located at an upper end portion of the elastic portion 12. The elastic portion 12 has a strip shape and a wave shape. The lower end portion of the elastic portion 12 is formed in a slightly c-shaped shape, and the front end of the elastic portion is provided with a contact portion 12a which is in contact with the wafer 1. The locking portion 13 is longer than the width D of the groove portion of the guide hole 5, and the locking portion 13 functions as a blocking portion when the probe is inserted into the guide hole 5. The locking portion is provided with a contact portion 13a that is in contact with the circuit board 2 on the locking portion. In the present embodiment, the length ε of the sensation is 1500 μm, and the thickness of the elastic portion 12 is 5 〇 μηι. The contact portion 12a protrudes toward the lower surface side of the support plate 3, and as shown in Fig. $, the specific portion on the contact & crystal W is locked, for example, by contact with the electrode of the formed element. (The contact portion 13a of the U3 protrudes toward the upper surface side of the support plate 3 to contact the specific receiving μ of the circuit substrate 2. The contact electrode 2a is electrically connected to the electrode portion on the wafer W and the contact portion 2a on the circuit substrate 2. Such a via hole 5 is formed, for example, in the following manner as an opening for forming a via hole 5 in a substrate. Fig. 6 is a schematic view showing a configuration in which a glass I is placed 21, which is provided with a structure of 120334.doc 200809209 A container for accommodating the glass substrate 22 serving as the support plate 3 is provided. The upper opening of the container 23 is formed in a concave shape in a longitudinal section. The side of the inner side of the container 23 forms a container 23 as the bottom surface of the container 23 approaches the opening surface. The inner diameter of the container is increased in a conical shape. The container 23 has a linear expansion coefficient slightly smaller than that of the glass substrate 22, and has good thermal conductivity and is not formed by adhering to the material of the glass substrate 22, such as carbon. When cooling

The shrinkage causes the glass substrate 22 in the container H23 to be broken, or the glass substrate 2 2 cannot be taken out by the holder 2 3 after cooling. The container 2 3 is supported by the support member 30 and housed in the heating container 3]. The heating container 3 is formed in a slightly cylindrical shape in which the upper surface is open and the bottom surface is closed. The heating container 3 1 is formed, for example, by quartz: a shape, a central waste, and the upper opening of the heating container 31 is covered by the cover 32. The lid body 32 is, for example, made of ceramic. For example, a heater 33 is disposed around the heating container 31, and the heater 33 is disposed on the side of the heating chamber (10). The heating container 31 is formed of a heat insulating material and covered with a cover 34. The upper main heater 33 is interposed between the outer cover 34 and the heating container 31. In the central portion of the cover 32, a through-up is formed Through-hole in the direction - In the Beton-hole 32a, the shaft 40 extending in the up-and-down direction is inserted from the upper side of the cover 32 to the heating container η. The shaft 4 is formed, for example, by a ceramics. Below the Hi, for example, a shape having a square plate shape having a thickness = a structure (4) is attached. The lower side of the holding member 41 is formed into a horizontal holding structure (4), and the lower surface is formed to form a suction port 41. "Attraction port is called I20334.doc 200809209 Through the axis 4〇, the true $i road 42 is connected to the The vacuum pump is shown. The lower surface 41a of the holding member 41 can also be held as shown in Fig. 7 by starting and stopping the tearing from the suction port. The _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The lift drive unit_ is supported on the cover body 32 support body 61. When the lift drive unit 6g is controlled, for example, when the lift/lower drive unit 60 moves the shaft 40 up and down, the holding member 41 can be moved to hold the holding member 41 in the container 23; ; 31 advance and retreat. The control unit 62 controls the raising and lowering speed and the lifting position of the stone substrate 50. I + like: As the shaft 40 between the cover 32 and the lifting drive 60, the flange 7 is rounded, for example. A film -1 which is stretchable and contractible is interposed between the flange 70 and the lid body 32. The boat case 71 is provided with a cooling mechanism (not shown), and the heat of the side is transmitted to the elevation drive unit 6_. Further, the above true (four) (four) is a negative pressure generating device which is connected to the outside by the flange 70. The opening device 21 is provided with a body supply pipe 75 for supplying a predetermined gas to the heating capacity H31. The gas supply pipe 75 is connected, for example, to the side of the heating vessel n. The gas supply pipe 75 is connected to a gas supply source not shown. In the present embodiment, nitrogen gas is sealed in a gas supply source, and nitrogen gas is supplied into the heating vessel 31 through a gas supply pipe. Next, a step of forming a guide hole using the above-described opening device 21 will be described. In the present embodiment, the case of the glass substrate of the borax acid glass of the lyocell glass (registered trademark of Corning Co., Ltd.), etc., is formed as a guide 120334.doc 200809209 hole 5 shown in FIG. Explain. First, as shown in Fig. 7, in the square opening, a certain number of holes 5〇a are formed at a specific position of the square substrate 5〇. The hole 50a has a square cross-sectional shape in a square shape, and a plurality of groove portions 50b are formed on the opposite side faces of the holes 5〇a, and the groove portions are opposed to each other. A peripheral surface 2 opening puller 80 having a shape suitable for the hole 5〇a is inserted into each of the holes 5〇a. The horizontal cross-sectional shape of the opening die 8Q is identical to the water=face shape of the guide hole 5, and the height of the opening in this embodiment is difficult to be 10000 μm. The hole 5Ga of the Shixi substrate 50 is formed, for example, by a dry residual of the lithography technique. The hole 5〇a has positional accuracy and dimensional accuracy within 2 μπι. The hole 5〇a is formed to be slightly larger than the size of the inserted die 8〇. The arrangement and number of holes 50a of the ruthenium substrate 50 are suitably set at the position of WL5 which is finally formed on the glass substrate. Further, the method of forming the holes is not limited to the dry etching process. Further, the hole 5〇a may not be a through hole. The aperture die 80 is, for example, and right-handed; ^, medium > 1 & J Ge / has a temperature at the time of heating as described later, for example, the heat resistance of 〇 C is formed, for example, by five genera such as tungsten, stainless steel, molybdenum, nickel or nickel alloy. The open hole mold is formed by the processing of (4). Further, the opening die 8G can be formed, for example, by machining or electroforming. When the hole die 4 is used, the adhesive L is applied to the stone earth plate 50, for example, as shown by the circle 8, and the hole die 8 is fixed to the stone substrate. Further, the fixing of the opening die 80 can be carried out, for example, by fitting by friction. . The crucible substrate 5 of the fixed perforating die 80 is held as shown in Fig. 6 in the state of the perforated die ribs, which is held by the holding member 41 in the opening device 21, J20334.doc -16 - 200809209 below 41a. The adsorption of the crucible substrate 50 is performed by suction from the suction port 41b. On the other hand, the glass substrate 22 having a square shape and a flat shape is accommodated in the container 23 of the perforating device 21. When the glass substrate 22 is housed in the container 23, nitrogen gas is supplied from the gas supply pipe 75 to the heating container 31, and the inside of the heating container 3j is maintained in a nitrogen-containing atmosphere. At this time, the inside of the heating container 3 i maintains a positive pressure to the outside to prevent the outside air from entering the heating container 31. As shown in Fig. 9(a), in the state where the crucible substrate 5A and the glass substrate 22 are close to each other, the inside of the heating container 31 is heated by the heat generated by the heater 33. Thereby, the glass substrate 22 in the container 23 is heated to about 1 〇〇〇 c > c above the softening point. At this %, the crucible substrate 50 and the perforated mold 8 are also heated to the same temperature as the glass substrate u. When the temperature of the glass substrate 22 exceeds the softening point, the glass substrate "be begins to melt (Fig. 9 (b)). When the glass substrate 22 starts to melt, the elevation drive unit 6 performs an operation by the control unit 62 to cause the holding member 41 to rotate at a weft speed. Drop to a specific position (Fig. 9(C)). Thereby, the opening die 80 of the ruthenium substrate 50 is inserted into a specific depth in the glass substrate 22. Thereafter, the heat of the heater 33 is stopped, and the hole mold is opened. In the state in which the molten glass substrate 22 is melted, the glass substrate (10) is kneaded and solidified. At this time, the cooling is performed by the temperature fluctuation during heating. This cooling is performed while the holding member is held by the substrate. After the glass substrate 22 is cooled and solidified, the suction of the suction port 41b of the holding member 41 is stopped. The holding member μ is raised by the lifting/lowering driving unit 6 (), and the holding member 41 is retracted by the crucible substrate 50 (Fig. 9(d)). Next, as shown in Fig. 4, the glass substrate 22 is taken out by the heating container 3 in a state where the opening die 8 〇 120334.doc -17- 200809209 and the 矽 substrate 50 are mounted. Then, for example, it is immersed in the king. Water and other chemicals, melt the hole mold 80 (Figure 10 ( b)), the opening die 8 〇 and the 矽 substrate 5 除去 are removed from the glass substrate 22, and a hole 1 形成 is formed on the upper surface of the glass substrate 22. After that, for example, the underside of the glass substrate 22 is polished, and the glass substrate 22 is penetrated. The hole 100. Thus, the via hole 5 shown in Fig. 3 is formed on the glass substrate 22. (Fig. 1 (c)). Thereafter, the upper surface of the glass substrate 22 is polished as needed. According to the above steps, the photolithography technique is used. The substrate 50 is formed with a plurality of holes 50a having high positional accuracy and dimensional accuracy, and a hole is formed in the glass substrate 22 by the opening die 80 which is erected in the hole 50a, so that the glass substrate 22 as the support plate 3 can be easily formed. The guide hole 5 having high positional accuracy and dimensional accuracy is formed. Further, carbon may be used in the hole-opening mold 80. The hole-opening mold 80 may be processed into a shape of the guide hole 5, for example, according to an embodiment of the present invention, In the case where the hole mold 80 is made of a metal such as tungsten, stainless steel, molybdenum, nickel or a nickel alloy, when the perforated mold 8 is removed from the solidified glass substrate 22, for example, a chemical such as aqua regia is melted and melted. Mold 8 〇. On the other hand, in the opening In the case of using 8 碳 carbon, the open hole fork 80 can be removed from the glass substrate by burning carbon. The burning temperature of 妷 is about 4 〇〇, which is lower than the strain point of the glass substrate. The hole mold 80 does not deform the glass substrate 22. In the case where the hole mold 80 uses carbon, as the hole opening device of the glass substrate, the hole opening device 11 () shown in Fig. 11 can also be used. The opening device 21 of the present embodiment is additionally provided with an oxygen supply pipe 76 for burning the open hole mold 120334.doc 200809209. The oxygen supply pipe 76 is connected to the side of the heating container 31. Oxygen supply source, not shown, supplies oxygen to the heating vessel 31 via oxygen helium H 76. The step of inserting the opening core 8 into the glass substrate 22 and curing the glass substrate (Fig.) to remove the carbon opening die 8 by the opening device 例如 0 is performed, for example, in the following manner.

The glass substrate 22 is cured, and oxygen is supplied from the oxygen supply pipe 76 to the cooling, the, and the like. The heating valley is within 3 1. Thereby, the carbon opening die 80 can be burned and removed, and the glass substrate 22 is at the strain point 5, so that the shape can be maintained as it is without deformation. With the above, the carbon is used in the opening die 8 The opening die 8 can be removed in the heating container 31 of the opening device 110. The guiding hole 5 of the supporting plate 3 formed in the probe card 1 of the above embodiment can also be formed in the through support as shown in FIG. The resin layer 200 formed by the plate 3. The resin layer 2 (H) has a horizontal cross section larger than the guide hole 5, and its horizontal cross section is, for example, a slightly circular shape. The X' resin layer is as shown in Fig. 13, and its horizontal section may also be a rectangle. Further, in the case where the distance between the guide holes 5 is small, as shown in Fig. 4, the plurality of guide holes 5 may be formed in the resin layer 2'. Further, as shown in Fig. 15, The support plate 3 is mixedly formed with the guide hole 5 and another guide hole 2〇1 having a rectangular shape in a horizontal cross section. The other guide hole 2〇1 is formed at a larger interval between the probe turns, and is added to the other guide hole. The old probe is inserted in the middle... The via holes 5, 201 are respectively formed in the resin layer 2 (). The resin layer 2 is formed on the resin layer 2 The guide hole 5 can be formed, for example, by the following method: 0 120334.doc -19·200809209 First, as shown in Fig. 16 (4), at a specific position of the support plate 3, for example, a machining process such as a drilling process is performed to form a through support plate 3 A temporary hole 21 大于 having a horizontal cross section larger than the guide hole 5 is formed in the temporary hole 210. It is solidified, and the second portion will be cooled by about 40 (filled with TC melted resin, as shown in Fig. 16 (b) The filled resin resin layer 200 is formed in

Further, as shown in Fig. 16 (c), for example, a specific position of the resin layer 200 which is cured by mechanically passing through the via hole $ is obtained. Through the above steps, first, a temporary hole 21 is formed in the support plate 3, and a via hole 5 is formed in the resin layer provided in the temporary hole 21''. Since the resin layer 2 is more excellent in cutting work than the glass substrate on which the support plate 3 is formed, the minute guide holes 5 can be easily formed, for example, by machining or the like. Therefore, the guide hole 5 of a specific size can be formed at a specific position of the support plate 3 with high positional accuracy and dimensional accuracy. Further, although the coefficient of thermal expansion of the resin layer 200 is larger than that of the glass substrate, as in the present embodiment, the resin layer 2 is formed on the branch.

Holding the board 3 orders, almost no impact. Further, another via hole 20 1 formed in the resin layer 200 can also be formed by the above steps. Further, the via hole 5 formed in the resin layer 200 can be formed as follows. First, as shown in Fig. 17 (a), the temporary hole 210 is formed in the same manner as the temporary hole 2 1 0 of the above-described embodiment. Next, as shown in Fig. 17 (b), a dummy 22 〇 which is suitable for the cross-sectional shape of the temporary hole 21 且 and has a length shorter than the thickness of the support plate 3 is inserted into the temporary hole 2 1 〇. The material of the mold 220 is, for example, copper. After inserting the mold 220 into the lower portion of the temporary hole 21, it will be about 4 (10). c The resin of 120334.doc -20- 200809209 is melted to fill the temporary hole 21〇 above the mold 220. Thereafter, as shown in (c), the filled resin is cooled and solidified to form a resin layer 200. When the resin layer 200 is formed, it is removed by the temporary etching hole 21 by the chemical etching mold 22. Further, as shown in Fig. 17 (4), a specific position of the cured resin layer 2 (10) is formed by, for example, machining through the via hole 5. According to the above method, first, a temporary hole 21 is formed in the support plate 3, and after the mold is inserted into the lower portion of the temporary hole 210, the melted resin is filled in the temporary hole 1〇 above the mold 220, and then the mold is removed. 22, since the via hole 5 is formed in the cured resin layer 200, it is only necessary to process the upper portion of the temporary (4) to form the via hole $, and the via hole 5 can be formed more easily. Further, the resin layer may be filled in the upper portion of the temporary hole 10 to reduce the amount of resin. This method is effective for guiding the probe even if the guide holes 5 are not formed entirely in the thickness of the support plate 3. Further, the other via hole 2〇 formed in the resin layer 2 can be formed by the above steps. Further, the via hole 5 formed in the resin layer 20A can also be formed as follows. First, as shown in Fig. 18 (a), a temporary hole 2 is formed in the same manner as the temporary hole 210 of the above-described embodiment. Next, as shown in Fig. 18 (b), the vertical jig 23 is placed in contact with the lower surface of the support plate 3. On the upper surface of the vertical mold fixture 23, a groove having the same size as that of the guide hole 5 is formed at a specific position opposed to the guide hole 5 formed in the support plate 3. The groove 23〇a is a shallow groove that does not penetrate the support plate 3, and can be formed, for example, by a surname. And the vertical model is +, and the ΙΟ ΙΟ A. The α supply/mouth 23 0 groove 230a is intended to insert the mold 231 suitable for the guide hole 5 into the temporary hole 21〇, and the front end of the mold 231 is repeatedly plunged into the groove 120334.doc • 21 - 200809209 23〇a . A material having a coefficient of thermal expansion which is the same as that of the support plate 3 is used in the vertical jig 230, for example, a chopped substrate is used. In the material of the mold 23, a material which is not deformed by using 400, which is a melting temperature of a resin to be described later, is used, for example, a metal such as a nickel alloy, a copper alloy, a steel alloy, a chain or an alloy. After the mold 231 was inserted into the temporary hole 210, the resin melted at 400 ° C was filled in the gap between the temporary hole 21 〇 and the mold 231. Thereafter, as shown in FIG. 18(c), the filled resin is cooled and solidified to form the resin layer 200. After the resin layer 200 is formed, the vertical mold jig 230 is removed as shown in Fig. i8(d). On the other hand, the support plate 3 inserted into the mold 23 is dipped in a drug such as aqua regia, as shown in Fig. 18(e), and the mold 231 is melted. After the mold 213 is removed, the upper surface of the support plate 3 is polished to be flattened. As shown in Fig. 18 (f), the via hole 5 penetrating the resin layer 200 is formed. According to the above method, the temporary hole 2 1 0 is first formed in the support plate 3, and the mold 231 is inserted into the temporary hole 210 by the vertical mold jig 230, so that the position of the mold 231 of the support plate 3 can be accurately determined. Thereafter, the resin is filled in the gap between the hole 210 and the mold 231 in the S product, and the mold 231 is removed to polish the upper surface of the support plate 3. The guide hole 5 can be formed at a position after the mold 231 is removed. Further, the other via hole 2 formed in the resin layer 200 can also be formed by the above steps. Further, when the mold 231 is inserted into the temporary hole 210 by the vertical mold fixture 230, the mold 23 1 ' may be vertically set in the groove 23 〇 a of the vertical mold fixture 23 ' from the lower side of the support plate 3 Close to the vertical mold fixture 230 while inserting all of the molds 23 1 into the temporary holes 210. Further, the length of the mold 231 may be longer than the temporary hole 21, so that the mold 231 120334.doc -22-200809209 can penetrate the temporary hole 2 1 〇. The above embodiments are described with reference to the accompanying drawings, but the present invention is not limited by this example. It can be understood that as long as they are peers, it is obvious that they can all think of various changes in the scope of the application for patents - (4) Amendments, which are also the scope of the technology of the present invention. Industrial Applicability This specification can be effectively utilized as a probe card for inspecting the electrical characteristics of electronic components having a high degree of integration. ^ [Simple description of the drawing] Fig. 1 is a side view of the probe card of the embodiment. Figure 2 is a plan view of a support plate used in the probe card of Figure 1. Fig. 3 is a plan view showing a guide hole in a case where a probe is inserted into a guide hole. ' is a longitudinal sectional view showing a guide hole in the case where the probe is inserted into the guide hole. πFig. 5 is an explanatory view showing a case where the contact portion of the probe is in contact with the object to be measured on the wafer, and the contact portion of the ten-card stop is in contact with the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 6 is a schematic longitudinal sectional view showing the configuration of a non-opening device. Figure 7 is a perspective view of a substrate. Figure 8 is a longitudinal cross-sectional view of the ruthenium substrate of the tamping aperture pin. Fig. 9 is an explanatory view showing a step of forming a via hole in a glass substrate, wherein (a) is a case where the second substrate is not mounted on the holding member, (b) is a glass substrate, and a crucible is formed, and (C) is a The fact that the pin enters the molten glass substrate means that the adsorption of the holding member to the glass substrate is released. Fig. 1 is a view showing a step of forming a via hole on a glass substrate subsequent to Fig. 9 (wherein η) indicates that the glass substrate is taken out by the valley, and (b) indicates that the substrate is removed by Shixia I20334.doc -23 - 200809209, In the case of a pin, (C) represents a case where the underside of the glass substrate is ground to complete the via hole. Fig. 11 is a schematic longitudinal cross-sectional view showing the configuration of a perforating device of another embodiment. Figure 12 is a plan view showing a support plate of another embodiment. Figure 3 is a plan view of a support plate of another embodiment. The figure shows a plan view of a support plate of other embodiments. Figure 15 is a plan view showing a support plate of another embodiment. Fig. 16 is an explanatory view showing a step of forming a guide hole of a support plate, wherein (4) indicates that a temporary hole is formed in the shape of 彡>^, and (b) indicates a case where a resin layer is formed, which indicates a case where the guide hole is completed. . Fig. 17 is a view showing the support; the explanation of the step of forming the pupil of the eve 7; () shows the case where the temporary hole is formed, and the total master-> 1 Μ series table (b) is not inserted into the temporary hole. The mold shape, (C) indicates that the merging of the resin layer is formed on the upper side of the mold, and (d) indicates the case where the guide hole is completed. Fig. 1 is a diagram showing the steps of forming the v-hole of the support plate. The illustration shows the case of forming the temporary hole, (b) #) 糸 table ((8) the table is not inserted into the temporary hole, and (C) is expressed in The temporary hole 、 , , , , , , , , , , , , , , , , , , , , , , , ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( f) indicates the completion of the guide hole. / /, f month [main symbol description] 2 3 probe card circuit board support plate 120334.doc -24. 200809209 5 guide hole 11 probe 13 lock portion 50 矽Substrate 80 Perforated mold 200 Resin layer 201 Other guide holes 210 Temporary holes

220 Die Model 230 Vertical Form Fixture 231 Mold 120334.doc -25-

Claims (1)

200809209 X. Patent application scope: And for checking the electrical characteristics of the object to be inspected, a probe card, and supporting the support plate of the probe; and having a probe inserted into the guide hole formed in the support plate Projecting under the support plate; the aforementioned via holes are arranged side by side with a plurality of insertion portions of the aforementioned probes. 2. The probe card according to claim 1, wherein the guide hole has a horizontal cross-sectional shape of a quadrangular shape, and the hole has a plurality of groove portions on the side of the phase, and the groove portion is provided for the foregoing The insertion portion is a hole between the opposing groove portions in the guide hole, and the probe is inserted into the insertion portion. 3. The probe card of claim 2, wherein the rain guide hole is formed in a resin layer provided through the support plate. 4. The probe card of claim 2, wherein the quadrangular shape is rectangular. 5. The probe card of claim 1, wherein the support plate is formed of a glass substrate. 6. The probe card of claim 1, wherein the needle has a locking portion that is locked to an upper end of the guide hole. 7. The probe card of claim 1, wherein the 'Y; hole is formed in a resin layer provided through the support plate. 8. The probe card of claim 1, wherein the support plate is further described to form another guide hole into which one probe is inserted. 120334.doc 200809209 9. A method for opening a glass substrate, characterized in that: the glass substrate is a support plate of a probe card, and the opening method thereof comprises: a mold having a plurality of holes inserted into the insertion portion of the probe side by side a step of standing on a hole provided in the vertical mold substrate; a step of accommodating the glass substrate on the open container; and the vertical mold in such a manner that the mold of the vertical mold substrate faces the glass substrate side in the container a step of arranging the substrate opposite to the glass substrate; heating the glass substrate in the container to melt the glass substrate; bringing the vertical mold substrate close to the molten glass substrate, and inserting the mold of the vertical mold substrate into the glass a step in the substrate; a step of cooling the glass substrate in the container in a state in which the uranium mold is inserted into the glass substrate, and curing the glass substrate; removing the glass substrate from the container; removing the glass substrate as described a step of the mold and a lower surface of the glass substrate after the removal of the mold The step of forming the holes of the glass substrate. The method of opening a glass substrate according to claim 9, wherein the mold has a horizontal cross-sectional shape of a quadrangular shape in which a plurality of opposite convex portions are formed in a side of the mold. The method of opening a glass substrate according to claim 10, wherein the square shape is rectangular. 12. The method of opening a glass substrate according to claim 9, wherein: 120334.doc 200809209 The hole is suitable for the shape of the mold shape. The method for opening a glass substrate according to claim 9, wherein the hole is formed by etching in the vertical mold plate 14 by the method of opening a glass substrate according to claim 9, wherein the step is to use a lifting member for lifting and lowering The stepping member that inserts the mold into the glass substrate at a specific speed holds the vertical mold substrate, and the vertical mold substrate is lowered before being applied. The method of opening a glass substrate according to claim 9, wherein the vertical mold substrate is also heated while heating the glass substrate of the container. The method of opening a glass substrate according to claim 9, wherein the vertical mold substrate is a substrate. The method of opening a glass substrate according to claim 9, wherein the container is formed of carbon. The method of opening a glass substrate according to claim 9, wherein the mold is formed of a material having heat resistance to a heating temperature of the glass substrate. 19. The method of opening a glass substrate according to claim 9, wherein the mold is removed from the glass substrate by melting the liquid. The method of opening a glass substrate according to claim 19, wherein the rain plate is formed of a metal, and the liquid system is aqua regia. 21. The glass substrate opening method of claim 20, wherein the mold is formed of cast, stainless steel, tantalum, nickel or a nickel alloy. 22. The method of opening a glass substrate according to claim 9, wherein the mold is burned and removed from the glass substrate. 23. The method of opening a glass substrate according to claim 22, wherein the mold is formed of charcoal. The invention relates to a method for opening a glass substrate, wherein the glass substrate is a support plate of a probe card; and the opening method is formed on the glass substrate and has a plurality of guide holes inserted into the insertion portion of the probe, and comprises: a step of forming a temporary hole having a horizontal cross section larger than the aforementioned via hole in the glass substrate; a step of filling the temporary hole with the molten resin, followed by curing the resin; and a step of forming the via hole by the cured resin. 25. The glass substrate opening method of claim 24, wherein the guide hole has a horizontal cross-sectional shape of a quadrangular shape, and the opposite side of the guide has a plurality of groove portions, and the groove portions are oppositely disposed. The hole in the guide hole that faces the groove is opposite. 26. A glass substrate opening method, wherein the glass substrate is a probe card holder 4 2 'opening method is formed on the glass substrate and has a plurality of insertion holes in the insertion portion of the needle, and includes: a hole ::: the substrate forms a step having a larger than the horizontal cross section of the via hole; the step of having a portion suitable for the lower portion of the temporary hole; and the insertion of the small shape into the aforementioned temporary refining resin The step of curing the temporary hole 5 above the Μ 模 5 亥 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 The method of opening a glass substrate according to claim 26, wherein the horizontal hole shape of the guide hole is a quadrangular shape, and the opposite side faces of the guide hole respectively have a plurality of n grooves, and the groove portions are opposite to each other. The miscellaneous material feeds the hole between the opposite groove portions. 28. A method for opening a glass substrate, wherein the glass substrate is a support plate for a probe card; the opening method is for forming a via hole having a plurality of insertion portions into which the probe is inserted, and comprising: Forming, by the substrate, a temporary hole having a horizontal section larger than the guiding hole; inserting the surface into the mold hole suitable for the shape of the guiding hole; and filling the refining resin into the temporary hole and a step of: curing the resin; removing the mold inserted into the resin; and grinding the other side of the glass substrate to form the via hole at the position where the glass substrate is removed from the mold The steps. The method of opening a glass substrate according to claim 28, wherein the guide hole has a horizontal cross-sectional shape of a quadrangular shape, and the opposite side of the guide hole has a plurality of groove portions, and the groove portions are opposite to each other 3 Further, the insertion portion of the fourth embodiment is a hole between the opposing grooves in the guide hole. The method of opening a glass substrate according to claim 28, wherein, in the insertion of the mold, the jig of the vertical mold is inserted, and the jig is removed after the resin is cured. 120334.doc