TW200741037A - Plating apparatus and plating method - Google Patents

Plating apparatus and plating method

Info

Publication number
TW200741037A
TW200741037A TW096102453A TW96102453A TW200741037A TW 200741037 A TW200741037 A TW 200741037A TW 096102453 A TW096102453 A TW 096102453A TW 96102453 A TW96102453 A TW 96102453A TW 200741037 A TW200741037 A TW 200741037A
Authority
TW
Taiwan
Prior art keywords
feed roller
plating
film
auxiliary
current
Prior art date
Application number
TW096102453A
Other languages
Chinese (zh)
Other versions
TWI376432B (en
Inventor
Yasuaki Tachi
Shigeki Sawa
Toshiyuki Kasuga
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of TW200741037A publication Critical patent/TW200741037A/en
Application granted granted Critical
Publication of TWI376432B publication Critical patent/TWI376432B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

To propose a plating apparatus in which the plating metal hardly deposited on the cathode feed roller even if the cathode feed roller is disposed in the plating bath. Current is supplied to the plating forming surface of a film (30A) through a feed roller (52) and an auxiliary feed roller (54) electrically interconnected through a short-circuit wire (84). Even if the insulating tape of the film joint comes into contact with either the feed roller (52) or the auxiliary feed roller (54) and the current supply is stopped, or even if the film (30A) separates from either the feed roller (52) or the auxiliary feed roller (54) because of slack and the current supply is stopped, the other feed roller, I.e., the auxiliary feed roller (54) or the feed roller (52), is always in contact with the plating surface of the film (30A) and current is supplied. Therefore, no electroplating film does not deposit on both surfaces of the feed roller (52) and the auxiliary feed roller (54).
TW096102453A 2006-01-30 2007-01-23 Plating apparatus and plating method TW200741037A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006020922 2006-01-30

Publications (2)

Publication Number Publication Date
TW200741037A true TW200741037A (en) 2007-11-01
TWI376432B TWI376432B (en) 2012-11-11

Family

ID=38309296

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102453A TW200741037A (en) 2006-01-30 2007-01-23 Plating apparatus and plating method

Country Status (5)

Country Link
US (2) US8128790B2 (en)
JP (1) JP4781371B2 (en)
CN (1) CN101331247B (en)
TW (1) TW200741037A (en)
WO (1) WO2007086510A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415976B (en) * 2010-09-27 2013-11-21

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011127172A (en) * 2009-12-17 2011-06-30 Nitto Denko Corp Plating device and method of fabricating wiring circuit board
US20120175248A1 (en) * 2011-01-07 2012-07-12 Solopower, Inc. Roll-to-roll electroplating photovoltaic films
JP5880364B2 (en) * 2012-09-05 2016-03-09 住友電気工業株式会社 Aluminum plating apparatus and aluminum film manufacturing method using the same
CN103849913A (en) * 2012-12-06 2014-06-11 先丰通讯股份有限公司 Electrochemical method and electrochemical device
KR20140094061A (en) * 2013-01-16 2014-07-30 주식회사 잉크테크 Continuous plating apparatus and continuous plating method
KR20140092707A (en) * 2013-01-16 2014-07-24 주식회사 잉크테크 Plating apparatus and plating method
GB2518387B (en) 2013-09-19 2017-07-12 Dst Innovations Ltd Electronic circuit production
US10716544B2 (en) 2015-10-08 2020-07-21 Zmk Medical Technologies Inc. System for 3D multi-parametric ultrasound imaging
KR102409364B1 (en) * 2017-08-18 2022-06-17 한국전자통신연구원 Apparatus for fabricating electrode structure
CN108149295A (en) * 2017-12-26 2018-06-12 北京派尔特医疗科技股份有限公司 Semi-automatic silk material differential arc oxidation system and its oxidation, cleaning equipment and method
CN112663119B (en) 2020-12-04 2022-05-31 重庆金美新材料科技有限公司 Device and method for preventing conductive roller from being plated with copper
CN114717623A (en) * 2022-02-07 2022-07-08 昆山鑫美源电子科技有限公司 Conductive film production equipment and production method

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4073699A (en) * 1976-03-01 1978-02-14 Hutkin Irving J Method for making copper foil
JPS5757896A (en) * 1980-09-26 1982-04-07 Fuji Photo Film Co Ltd Electrolyzing device for strip-like metallic plate
JPS586999A (en) 1981-07-07 1983-01-14 Satoosen:Kk Method and device for automatic continuous electroplating
US4964948A (en) 1985-04-16 1990-10-23 Protocad, Inc. Printed circuit board through hole technique
JPS63270497A (en) * 1987-04-27 1988-11-08 Nippon Sanmou Senshoku Kk Method and apparatus for electroplating electrically conductive material
JPS63297588A (en) 1987-05-29 1988-12-05 Sagami Shokai:Kk Electrolytic plating method for isolated electric conductor
US5229549A (en) 1989-11-13 1993-07-20 Sumitomo Electric Industries, Ltd. Ceramic circuit board and a method of manufacturing the ceramic circuit board
FR2657219B1 (en) 1990-01-11 1994-02-18 Gim Industrie Sa METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUITS, PRINTED CIRCUIT MANUFACTURED BY THIS METHOD, AND DEVICE FOR CARRYING OUT SAID METHOD.
JP3099498B2 (en) * 1992-02-24 2000-10-16 松下電器産業株式会社 Power supply equipment for full plating equipment
JP3057924B2 (en) 1992-09-22 2000-07-04 松下電器産業株式会社 Double-sided printed circuit board and method of manufacturing the same
JPH06146066A (en) 1992-11-05 1994-05-27 Nkk Corp Continuous electrolytic processor
JP3291103B2 (en) 1993-12-22 2002-06-10 住友特殊金属株式会社 Continuous surface treatment equipment
JPH08144086A (en) * 1994-11-25 1996-06-04 Taisho Kogyo Kk Feeder roll device
EP0743812B1 (en) 1994-12-01 2008-06-11 Ibiden Co, Ltd. Multilayer printed wiring board and process for producing the same
JP3101197B2 (en) 1994-12-01 2000-10-23 イビデン株式会社 Multilayer printed wiring board and method of manufacturing the same
US6187166B1 (en) * 1998-04-21 2001-02-13 Texas Instruments Incorporated Integrated solution electroplating system and process
EP1541720A3 (en) * 1998-05-20 2006-05-31 Process Automation International Limited An electroplating machine
US6534116B2 (en) 2000-08-10 2003-03-18 Nutool, Inc. Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
JP2000232078A (en) 1999-02-10 2000-08-22 Toshiba Corp Plating method and apparatus
JP4309503B2 (en) 1999-02-18 2009-08-05 イビデン株式会社 Continuous band electroplating equipment
CN1197150C (en) * 1999-02-18 2005-04-13 精工爱普生株式会社 Semiconductor device, circuit board, method of mfg. circuit board, and electronic device
JP4480236B2 (en) 1999-08-06 2010-06-16 イビデン株式会社 Electrolytic plating solution, method for producing multilayer printed wiring board using the liquid, and multilayer printed wiring board
US6294060B1 (en) 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
US6863209B2 (en) 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
TW584899B (en) 2001-07-20 2004-04-21 Nutool Inc Planar metal electroprocessing
US7238092B2 (en) 2001-09-28 2007-07-03 Novellus Systems, Inc. Low-force electrochemical mechanical processing method and apparatus
JP3916946B2 (en) 2001-12-14 2007-05-23 イビデン株式会社 Method for evaluating electrolytic plating solution and method for producing multilayer printed wiring board
DE10162338A1 (en) 2001-12-18 2003-07-03 Huels Troisdorf Film for laminated safety panes with reduced inherent stickiness
JP4212905B2 (en) 2003-01-23 2009-01-21 株式会社荏原製作所 Plating method and plating apparatus used therefor
US6802761B1 (en) 2003-03-20 2004-10-12 Hitachi Global Storage Technologies Netherlands B.V. Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication
JP3723963B2 (en) * 2003-06-06 2005-12-07 三井金属鉱業株式会社 Plating apparatus and film carrier tape manufacturing method for electronic component mounting
JP2005113173A (en) * 2003-10-03 2005-04-28 Toppan Printing Co Ltd Electroplating device for flexible multilayer circuit board
US8349393B2 (en) 2004-07-29 2013-01-08 Enthone Inc. Silver plating in electronics manufacture
JP4992428B2 (en) 2004-09-24 2012-08-08 イビデン株式会社 Plating method and plating apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415976B (en) * 2010-09-27 2013-11-21

Also Published As

Publication number Publication date
WO2007086510A1 (en) 2007-08-02
CN101331247A (en) 2008-12-24
TWI376432B (en) 2012-11-11
JPWO2007086510A1 (en) 2009-06-25
JP4781371B2 (en) 2011-09-28
US8721863B2 (en) 2014-05-13
US20120073977A1 (en) 2012-03-29
CN101331247B (en) 2011-01-19
US8128790B2 (en) 2012-03-06
US20090032404A1 (en) 2009-02-05

Similar Documents

Publication Publication Date Title
TW200741037A (en) Plating apparatus and plating method
CN101318390B (en) Remelting plating Sn material and electronic component using the same
TW548348B (en) Rotary element for making electric contact, array of at least two rotary elements, and method of placing board-shaped work electrolytically to be processed in electric contact in continuous processing plants
WO2007118875A3 (en) Electroplating device and method
KR20130027484A (en) Surface treatment method for copper foil, surface-treated copper foil, and copper foil for negative electrode collector of lithium ion secondary battery
MY158939A (en) Method to form solder deposits on substrates
TW200728514A (en) Method of coating a surface of a substrate with a metal by electroplating
MY120628A (en) Electronic component having external electrodes and method for the manufacture thereof
TW200710287A (en) Composite metal layer formed using metal nanocrystalline particles in an electroplating bath
PL1949995T3 (en) Electrode wire for electric discharge machining
KR20050024350A (en) Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board
JP2005048277A (en) Electrolytic copper foil with carrier foil, and manufacturing method therefor
CN107146964A (en) A kind of galvanization coating and terminal, electrical interface, electronic equipment for terminal
MY146651A (en) Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as dielectric substrate
US20040108211A1 (en) Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB)
TWI255870B (en) Process and composition for high speed plating of tin and tin alloys
TW200710280A (en) Usage of a coating for electrical contacting
CN206850073U (en) A kind of galvanization coating and terminal, electrical interface, electronic equipment for terminal
JP2010077496A (en) Throughhole filling method
MXPA05004855A (en) Method for the formation of a good contact surface on an aluminium support bar and a support bar.
BR0114600B1 (en) electrolytic copper plating bath and electroplating process of a matte copper layer.
JP2000054188A (en) Method and device for continuously coating polymer film with metal, and product produced thereby
JPWO2003010357A1 (en) Electrically conductive structure and electroplating method using the structure
ATE477353T1 (en) SUBMICRON METALLIZATION USING ELECTROCHEMICAL COATING
KR20080079963A (en) Apparatus for plating continuous

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees