TW200711817A - Resin molding machine and resin molding method - Google Patents

Resin molding machine and resin molding method

Info

Publication number
TW200711817A
TW200711817A TW094131460A TW94131460A TW200711817A TW 200711817 A TW200711817 A TW 200711817A TW 094131460 A TW094131460 A TW 094131460A TW 94131460 A TW94131460 A TW 94131460A TW 200711817 A TW200711817 A TW 200711817A
Authority
TW
Taiwan
Prior art keywords
resin molding
molding machine
decomposition
resin
high temperature
Prior art date
Application number
TW094131460A
Other languages
Chinese (zh)
Inventor
Tadahiro Ohmi
Original Assignee
Tadahiro Ohmi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tadahiro Ohmi filed Critical Tadahiro Ohmi
Publication of TW200711817A publication Critical patent/TW200711817A/en

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Heretofore, in order to produce a plastic product which does not release harmful organic molecules, an injection pressure or an extrusion pressure must be increased because a resin can not be heated to a high temperature. Therefore, a resin molding machine is inevitably increased in size, weight, and power consumption. By adopting means for suppressing decomposition by oxidization and decomposition by a catalytic effect, molten plastic is prevented from decomposition and dissociation up to a high temperature and the molten plastic has an extremely low viscosity. Therefore, it is possible to perform molding at a very low injection or extrusion pressure so that resin molding machine can be reduced in size and weight.
TW094131460A 2004-03-29 2005-09-13 Resin molding machine and resin molding method TW200711817A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004096516A JP5020459B2 (en) 2004-03-29 2004-03-29 Resin molding machine and resin molding method

Publications (1)

Publication Number Publication Date
TW200711817A true TW200711817A (en) 2007-04-01

Family

ID=35178961

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131460A TW200711817A (en) 2004-03-29 2005-09-13 Resin molding machine and resin molding method

Country Status (2)

Country Link
JP (1) JP5020459B2 (en)
TW (1) TW200711817A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI787375B (en) * 2017-10-31 2022-12-21 日商Ａｇｃ股份有限公司 Molded body, metal-clad laminate, printed wiring board, and manufacturing method thereof

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5161467B2 (en) * 2007-02-19 2013-03-13 三菱重工プラスチックテクノロジー株式会社 Water supply system for injection mold
JP5137635B2 (en) * 2007-03-16 2013-02-06 キヤノン株式会社 Imprint method, chip manufacturing method, and imprint apparatus
JP4915663B2 (en) * 2007-03-27 2012-04-11 パナソニック株式会社 Injection molding apparatus and injection molding method
WO2017002202A1 (en) * 2015-06-30 2017-01-05 アドバンスド・コンポジット株式会社 Molding-machine work extraction device having neutralization function and injection molding machine
EP3640378B1 (en) * 2017-06-13 2021-12-08 Kuraray Co., Ltd. Low leachable fibers and fiber structure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4276314B2 (en) * 1998-11-04 2009-06-10 浜松ホトニクス株式会社 Resin molded product manufacturing method and apparatus
JP3898858B2 (en) * 1999-09-24 2007-03-28 三菱エンジニアリングプラスチックス株式会社 Molding apparatus and forced scavenging method in molding apparatus
JP2003019733A (en) * 2001-07-06 2003-01-21 Sony Corp Method for data recording disk
JP3876657B2 (en) * 2001-07-19 2007-02-07 市光工業株式会社 VEHICLE LIGHT LENS BODY, MOLDING MOLD THEREOF, AND METHOD FOR MANUFACTURING THE SAME
JP2003114436A (en) * 2001-10-04 2003-04-18 Seiko Epson Corp Manufacturing device for liquid crystal display device and its manufacturing method
JP2004009303A (en) * 2002-06-03 2004-01-15 Fuji Photo Film Co Ltd Process of manufacturing optical element made from plastic
JP2004058470A (en) * 2002-07-29 2004-02-26 Canon Inc Mold for molding optical element and method for molding optical element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI787375B (en) * 2017-10-31 2022-12-21 日商Ａｇｃ股份有限公司 Molded body, metal-clad laminate, printed wiring board, and manufacturing method thereof

Also Published As

Publication number Publication date
JP5020459B2 (en) 2012-09-05
JP2005280064A (en) 2005-10-13

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