TW200708587A - Anisotropic conductive film and method for producing the same - Google Patents

Anisotropic conductive film and method for producing the same

Info

Publication number
TW200708587A
TW200708587A TW095127355A TW95127355A TW200708587A TW 200708587 A TW200708587 A TW 200708587A TW 095127355 A TW095127355 A TW 095127355A TW 95127355 A TW95127355 A TW 95127355A TW 200708587 A TW200708587 A TW 200708587A
Authority
TW
Taiwan
Prior art keywords
anisotropic conductive
conductive film
producing
same
adhesive layer
Prior art date
Application number
TW095127355A
Other languages
Chinese (zh)
Inventor
Takashi Tatsuzawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200708587A publication Critical patent/TW200708587A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

Disclosed is an anisotropic conductive film (10) wherein a supporting body (13) and an anisotropic conductive adhesive layer (14) are arranged in layers. The supporting body (13) has a region (14'), where no anisotropic conductive adhesive layer (14) is formed, in both edge portions in the width direction.
TW095127355A 2005-08-04 2006-07-26 Anisotropic conductive film and method for producing the same TW200708587A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005226218 2005-08-04

Publications (1)

Publication Number Publication Date
TW200708587A true TW200708587A (en) 2007-03-01

Family

ID=37708651

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127355A TW200708587A (en) 2005-08-04 2006-07-26 Anisotropic conductive film and method for producing the same

Country Status (5)

Country Link
JP (2) JP4650490B2 (en)
KR (2) KR20100117680A (en)
CN (1) CN101233655B (en)
TW (1) TW200708587A (en)
WO (1) WO2007015372A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102324272A (en) * 2007-05-23 2012-01-18 日立化成工业株式会社 Film and reel for anisotropic electroconductive connection
TWI740934B (en) * 2016-05-05 2021-10-01 日商迪睿合股份有限公司 Anisotropic conductive film

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5695881B2 (en) * 2010-10-28 2015-04-08 デクセリアルズ株式会社 Electronic component connection method and connection structure
JP2011029207A (en) * 2010-11-02 2011-02-10 Sony Chemical & Information Device Corp Film laminate, pasting method of film laminate, connection method and connection structure using film laminate
JP5759168B2 (en) * 2010-12-24 2015-08-05 デクセリアルズ株式会社 Reel body and method for manufacturing reel body
JP2011199308A (en) * 2011-06-06 2011-10-06 Sony Chemical & Information Device Corp Method of sticking adhesive film, connection method, connection structure, and method of manufacturing the same
WO2013024544A1 (en) 2011-08-18 2013-02-21 日立化成工業株式会社 Adhesive material reel
JP2012077305A (en) * 2011-11-07 2012-04-19 Hitachi Chemical Co Ltd Film for anisotropically conductive connection and reel body
JP5982158B2 (en) 2012-04-06 2016-08-31 デクセリアルズ株式会社 Reel member
JP5982159B2 (en) 2012-04-06 2016-08-31 デクセリアルズ株式会社 Reel member, adhesive film winding method, adhesive film unwinding method
JP6297381B2 (en) * 2014-03-26 2018-03-20 デクセリアルズ株式会社 Method for manufacturing adhesive film, film winding body, and connection body
CN104449433A (en) * 2014-11-14 2015-03-25 李家海 Double faced adhesive tape easy to uncover membrane
JP6661997B2 (en) * 2015-11-26 2020-03-11 デクセリアルズ株式会社 Anisotropic conductive film
JP7095227B2 (en) * 2016-05-05 2022-07-05 デクセリアルズ株式会社 Anisotropic conductive film
WO2017191772A1 (en) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 Filler alignment film
JP6905320B2 (en) * 2016-09-27 2021-07-21 デクセリアルズ株式会社 Adhesive film winding body, manufacturing method of adhesive film winding body
JP6524283B2 (en) * 2018-02-21 2019-06-05 デクセリアルズ株式会社 Adhesive film, film wound body, method of manufacturing connected body
KR102675134B1 (en) * 2020-03-31 2024-06-12 동우 화인켐 주식회사 Conductive film stack structure and method of fabricating the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56107847U (en) * 1980-01-21 1981-08-21
JPH0610253A (en) * 1992-04-17 1994-01-18 Japan Vilene Co Ltd Production of tape having processed and unprocessed regions
JP3366020B2 (en) * 1992-07-24 2003-01-14 矢崎総業株式会社 Manufacturing method of adhesive tape
JPH08316690A (en) * 1995-05-18 1996-11-29 Fuji Mach Mfg Co Ltd Electronic component removing apparatus
JPH09259945A (en) * 1996-03-22 1997-10-03 Sony Corp Anisotropic conductive film tape
JPH10195399A (en) * 1997-01-07 1998-07-28 Kanegafuchi Chem Ind Co Ltd Production of heat-resistant bonding film
JPH11339575A (en) * 1998-05-22 1999-12-10 Sony Corp Manufacture of anisotropic conductive tape and its manufacturing device
JP3614684B2 (en) * 1998-11-05 2005-01-26 日立化成工業株式会社 Anisotropic conductive adhesive film production equipment
JP4465788B2 (en) * 2000-03-28 2010-05-19 日立化成工業株式会社 Anisotropic conductive tape and reel
JP2003142176A (en) * 2001-10-31 2003-05-16 Optrex Corp Anisotropic conductive film structure
JP4403360B2 (en) * 2003-02-28 2010-01-27 Ｄｉｃ株式会社 Conductive adhesive sheet
JP3921452B2 (en) * 2003-03-04 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 Method for producing laminated tape of anisotropic conductive film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102324272A (en) * 2007-05-23 2012-01-18 日立化成工业株式会社 Film and reel for anisotropic electroconductive connection
CN102352194A (en) * 2007-05-23 2012-02-15 日立化成工业株式会社 Film for anisotropic conductive connection, and reel body
CN102352194B (en) * 2007-05-23 2015-11-25 日立化成株式会社 Film for anisotropic electroconductive connection and spool body
TWI740934B (en) * 2016-05-05 2021-10-01 日商迪睿合股份有限公司 Anisotropic conductive film
TWI764821B (en) * 2016-05-05 2022-05-11 日商迪睿合股份有限公司 Anisotropic conductive film

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JP2010257983A (en) 2010-11-11
JPWO2007015372A1 (en) 2009-02-19
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KR20100117680A (en) 2010-11-03
JP4650490B2 (en) 2011-03-16

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