TW200633809A - Method and device for separating products with a controlled cut edge, and separated product - Google Patents

Method and device for separating products with a controlled cut edge, and separated product

Info

Publication number
TW200633809A
TW200633809A TW095109431A TW95109431A TW200633809A TW 200633809 A TW200633809 A TW 200633809A TW 095109431 A TW095109431 A TW 095109431A TW 95109431 A TW95109431 A TW 95109431A TW 200633809 A TW200633809 A TW 200633809A
Authority
TW
Taiwan
Prior art keywords
cut edge
separated product
separating products
controlled cut
relates
Prior art date
Application number
TW095109431A
Other languages
Chinese (zh)
Other versions
TWI465310B (en
Inventor
Egmond Henri Joseph Van
Joannes Leonardus Jurrian Zijl
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Publication of TW200633809A publication Critical patent/TW200633809A/en
Application granted granted Critical
Publication of TWI465310B publication Critical patent/TWI465310B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/08—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for flash removal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention relates to a method for separating products, in particular semiconductor circuits, from a shared carrier by means of laser cutting. The invention also relates to a device for applying this method. The invention further also relates to a product, in particular a semiconductor mounted on a carrier, separated by means of a laser beam using such a method.
TW095109431A 2005-03-22 2006-03-20 Method and device for separating products with a controlled cut edge, and separated product TWI465310B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1028588A NL1028588C2 (en) 2005-03-22 2005-03-22 Method and device for separating products with a controlled cut edge and separated product.

Publications (2)

Publication Number Publication Date
TW200633809A true TW200633809A (en) 2006-10-01
TWI465310B TWI465310B (en) 2014-12-21

Family

ID=35453332

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109431A TWI465310B (en) 2005-03-22 2006-03-20 Method and device for separating products with a controlled cut edge, and separated product

Country Status (7)

Country Link
EP (1) EP1905067A1 (en)
JP (1) JP2008537511A (en)
KR (1) KR20070121793A (en)
CN (1) CN101147241B (en)
NL (1) NL1028588C2 (en)
TW (1) TWI465310B (en)
WO (1) WO2006118454A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102473651B (en) 2009-07-06 2014-12-17 瑞萨电子株式会社 Method for manufacturing semiconductor device
CN114603249A (en) * 2014-08-28 2022-06-10 Ipg光子公司 Multi-laser system and method for cutting and post-cutting machining of hard dielectric materials
CN106346143B (en) * 2016-11-24 2018-05-25 武汉华星光电技术有限公司 A kind of laser cutting machine and its cutting method
SI25748A (en) * 2018-12-07 2020-06-30 Intech-Les, Razvojni Center D.O.O. Area roughness improvement with laser
EP3685954B1 (en) * 2019-01-22 2024-01-24 Synova S.A. Method for cutting a workpiece with a complex fluid-jet-guided laser beam
PL3914418T3 (en) * 2019-02-25 2022-06-13 Wsoptics Technologies Gmbh Process for beam processing of a plate or tubular workpiece
JP7387870B2 (en) * 2019-07-29 2023-11-28 ダブリュ・エス・オプティクス テクノロジーズ ゲー・エム・ベー・ハー Method for beam machining plate or tubular workpieces
CN113199149B (en) * 2020-01-15 2023-08-11 大族激光科技产业集团股份有限公司 Processing technology for removing coating by laser
CN112404745A (en) * 2020-11-02 2021-02-26 中国航空工业集团公司北京长城航空测控技术研究所 Ultrafast laser leveling method for cut surface of thin crystal device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3626143A (en) * 1969-04-02 1971-12-07 American Can Co Scoring of materials with laser energy
US5368900A (en) * 1991-11-04 1994-11-29 Motorola, Inc. Multistep laser ablation method for making optical waveguide reflector
JPH11503880A (en) * 1996-02-09 1999-03-30 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ Laser splitting method for semiconductor device formed on semiconductor material wafer
JP4396953B2 (en) * 1998-08-26 2010-01-13 三星電子株式会社 Laser cutting apparatus and cutting method
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
JP2003506216A (en) * 1999-08-03 2003-02-18 イクシィル・テクノロジー・リミテッド Circuit singulation system and method
KR100634750B1 (en) * 1999-12-07 2006-10-16 삼성전자주식회사 Laser cutting equipment
WO2001076808A2 (en) * 2000-04-11 2001-10-18 Gsi Lumonics Inc. A method and system for laser drilling
EP1341638B1 (en) * 2000-12-15 2006-02-01 Xsil Technology Limited Laser machining of semiconductor materials
US6677552B1 (en) * 2001-11-30 2004-01-13 Positive Light, Inc. System and method for laser micro-machining

Also Published As

Publication number Publication date
JP2008537511A (en) 2008-09-18
EP1905067A1 (en) 2008-04-02
CN101147241A (en) 2008-03-19
KR20070121793A (en) 2007-12-27
WO2006118454A1 (en) 2006-11-09
TWI465310B (en) 2014-12-21
CN101147241B (en) 2011-01-12
NL1028588C2 (en) 2006-09-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees