TW200506346A - Pattern inspection apparatus - Google Patents

Pattern inspection apparatus

Info

Publication number
TW200506346A
TW200506346A TW093104625A TW93104625A TW200506346A TW 200506346 A TW200506346 A TW 200506346A TW 093104625 A TW093104625 A TW 093104625A TW 93104625 A TW93104625 A TW 93104625A TW 200506346 A TW200506346 A TW 200506346A
Authority
TW
Taiwan
Prior art keywords
pattern
image
illumination
light
tape
Prior art date
Application number
TW093104625A
Other languages
Chinese (zh)
Other versions
TWI276793B (en
Inventor
Hiroki Hayashi
Shinichi Nagamori
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW200506346A publication Critical patent/TW200506346A/en
Application granted granted Critical
Publication of TWI276793B publication Critical patent/TWI276793B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G01N2021/8893—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques providing a video image and a processed signal for helping visual decision
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Signal Processing (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The present invention is provided to implement an automatic pattern inspection using a transmission light without any error even if an adhesive layer is formed on a substrate and has minute unevenness. The pattern 5a on a TAB (Tape Automated Bonding) tape 5 is fed to an inspection part 1 by a tape feeding mechanism 10 and irradiated with illumination light from a transmissive illumination means 1a. An image of the pattern 5a is picked up by a CCD line sensor 1b. The transmissive illumination means 1a comprises two illumination methods obliquely disposed and obliquely irradiates the pattern with the illumination light. The picked-up image is transmitted to a control part 4 and compared with an inspecting master pattern image. The quality of the pattern 5a is determined. The illumination light preferably irradiates from the outside of a viewing field of the CCD line sensor 1b, and a light shielding plate preferably covers the inside of the viewing field of the CCD line sensor 1b instead of the transmissive illumination method 1a obliquely disposed. Since the transmissive illumination method is constituted as above, the TAB tape 5 can be irradiated with a moderately diffused light and the image can be obtained without spots and irregularity.
TW093104625A 2003-05-21 2004-02-24 Pattern inspection apparatus TWI276793B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003143606A JP4228778B2 (en) 2003-05-21 2003-05-21 Pattern inspection device

Publications (2)

Publication Number Publication Date
TW200506346A true TW200506346A (en) 2005-02-16
TWI276793B TWI276793B (en) 2007-03-21

Family

ID=33531343

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093104625A TWI276793B (en) 2003-05-21 2004-02-24 Pattern inspection apparatus

Country Status (4)

Country Link
JP (1) JP4228778B2 (en)
KR (1) KR100671770B1 (en)
CN (1) CN100395519C (en)
TW (1) TWI276793B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070048034A (en) * 2005-11-03 2007-05-08 엘지전자 주식회사 Inspecting apparatus for tape substrate
KR100785420B1 (en) * 2006-06-13 2007-12-13 주식회사 에스에프에이 Denting inspecting apparatus
JP5332238B2 (en) * 2007-03-29 2013-11-06 三星ダイヤモンド工業株式会社 Laser processing equipment
TWI563850B (en) * 2012-09-07 2016-12-21 Hon Hai Prec Ind Co Ltd Spot detection system and method
US9810641B2 (en) * 2013-09-03 2017-11-07 Kulicke & Soffa Industries, Inc. Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
CN104330418B (en) * 2014-11-04 2017-06-16 北京凌云光技术有限责任公司 The detection means and method of etched pattern in soft printing opacity object
CN104330419A (en) * 2014-11-20 2015-02-04 北京凌云光技术有限责任公司 Method and device for detecting film
JP6630527B2 (en) * 2015-09-30 2020-01-15 日東電工株式会社 Inspection method of adhesive film having through hole
CN107389691A (en) * 2017-09-22 2017-11-24 铜陵市三盛电子有限公司 A kind of metallized film precision detection system of capacitor
CN107607535A (en) * 2017-09-22 2018-01-19 铜陵市三盛电子有限公司 A kind of metallized film accuracy checking method of capacitor
JP7051445B2 (en) * 2018-01-10 2022-04-11 日東電工株式会社 Continuous inspection method and continuous inspection device for optical display panel, and continuous manufacturing method and continuous manufacturing system for optical display panel.
CN108802050A (en) * 2018-06-22 2018-11-13 宁波江丰电子材料股份有限公司 Target vision inspection apparatus and method
CN112345555A (en) * 2020-10-30 2021-02-09 凌云光技术股份有限公司 High bright imaging light source system of visual inspection machine

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0658731A (en) * 1992-06-11 1994-03-04 Fujitsu Ltd Pattern inspecting apparatus
SG76564A1 (en) * 1998-11-30 2000-11-21 Rahmonic Resources Pte Ltd An apparatus and method to transport inspect and measure objects and surface details at high speeds
CN1137387C (en) * 2000-03-14 2004-02-04 武原庆 Method for testing abnormality of electronic element and device on printed circuit board and its testing instrument

Also Published As

Publication number Publication date
KR100671770B1 (en) 2007-01-19
CN100395519C (en) 2008-06-18
JP2004347417A (en) 2004-12-09
TWI276793B (en) 2007-03-21
JP4228778B2 (en) 2009-02-25
KR20040100874A (en) 2004-12-02
CN1573280A (en) 2005-02-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees