TW200413980A - Overlay offset management system and method of pilot production - Google Patents

Overlay offset management system and method of pilot production Download PDF

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Publication number
TW200413980A
TW200413980A TW92100982A TW92100982A TW200413980A TW 200413980 A TW200413980 A TW 200413980A TW 92100982 A TW92100982 A TW 92100982A TW 92100982 A TW92100982 A TW 92100982A TW 200413980 A TW200413980 A TW 200413980A
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batch
trial production
offset
scope
trial
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TW92100982A
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Chinese (zh)
Inventor
You-Nain Lin
Kuan-Luan Cheng
Kun-Pi Cheng
Hsin-Yuan Chen
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Taiwan Semiconductor Mfg
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Priority to TW92100982A priority Critical patent/TW200413980A/en
Publication of TW200413980A publication Critical patent/TW200413980A/en

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Abstract

A kind of overlay offset management method of pilot lot for use in semiconductor lithographic process contains the following steps: defining the manufacturing information of the pilot lot and the continuous lots on a user interface; performing the lithographic process of the pilot lot; measuring and evaluating the overlay offset value of the pilot lot; and automatically conducting the manufacture of the continuous lots according to the overlay offset of the pilot lot when the overlay offset value of the pilot lot fulfills the determined specifications.

Description

200413980 五、發明說明(1) 發明所屬之技術領域 本發明係有關於製造控制(process control),特別 有關於半導體微影曝光對準機台之試產批次的(p i丨〇 t 1〇土)登對偏移值(〇 v e r 1 a y 〇 f f s e t:)之管理系統與方法。 先前技術 在半導體產業 是在矽基底,也就 義並形成數百萬的 件與外部線路。而 必須藉由微影設備 A1 igner),例如掃 Stepper),準確的 以步進式對準 感測器(a 1 i g n m e n t 特定曝光區或標記 測數值以電腦運算 (overlay offset) 層之曝光圖案可精 反覆執行圖案曝光 方某層的定位 整而造成偏移,使 短路’對於積體電 片。因此目前曝光 中,超大型積體電路(VLSI)的製造主要 是晶圓上,反覆的以半導體製程技術定 半導體元件,並以數層導體連線連結元 在如此高度積集化的積體電路製程中, 中的曝光對準機台(prc)jectiQn 瞄式或步進式對準機台(Scanner或 控制層與層間的疊對(〇Verlay)。 機台(Stepper)為例,通常設置有對準 =⑼S 〇 Γ)在曝光前先偵測晶圓上某些 處(m a r k e r )進行料淮^心 拖^ &胃、/對準動作,之後根據偵 ,^革機台的疊對補償 石t斟、、隹乂思回 σ的機械定位,確保本 確對準珂層圖幸 十 的動作。 〃接者對整片晶圓逐區 偏移時,則後鯖 得元件或層間内連‘可能隨之逐層調 路產品的良率影的電性無法連結或 對準機台的層間‘ # 士、:更可能造成廢 #誤差均需控制在微200413980 V. Description of the invention (1) Technical field to which the invention belongs The present invention relates to manufacturing control (process control), and in particular to trial production batches of semiconductor lithography exposure alignment machines (pi 丨 〇t 10) ) Management system and method for offset value (〇ver 1 ay 〇ffset :). Previous technology in the semiconductor industry was on a silicon substrate, meaning millions of components and external circuits. It is necessary to accurately align the sensor (a 1 ignment specific exposure area or mark measurement value) by the lithographic equipment A1 igner), such as Stepper), with the exposure pattern of the overlay offset layer. The positioning of a certain layer of the pattern exposure side is finely repeated to cause a shift, which causes a short circuit. For integrated chips, so in the current exposure, the manufacturing of very large integrated circuits (VLSI) is mainly on wafers, and semiconductors are repeatedly used. The process technology determines the semiconductor components and uses several layers of conductor connection elements in such a highly integrated integrated circuit manufacturing process. The exposure alignment machine (prc) jectiQn sighting or stepping alignment machine ( Scanner or control layer and layer overlap (〇Verlay). As an example, a stepper is usually set with alignment = ⑼S 〇Γ). Before exposure, some parts of the wafer are marked for marking. ^ Heart drag ^ Stomach, / alignment action, and then according to the detection, the mechanical positioning of the pair of compensating stones t 、, 斟 thinking back σ to ensure that the correct alignment Action: The adapter takes the entire wafer one by one. When shifting, the back-to-back components or inter-layer interconnections 'may follow the layer-by-layer adjustment of the product's yield rate, and the electrical properties cannot be connected or aligned with the inter-layer layers of the machine'. Need to be controlled in micro

200413980 五、發明說明(2) 米以下。 缺 言,必 評估其 管理數 為實際 制,因 被排入 產,使 需要再 另 單時間 批,而 無法有 效,則 廢片, 產效能 而對於接受客 須為各種不同 疊對偏移。在 批不同產品之 投產的參考或 此線上人員在 產品B的試產, 得原先計算之 重作調整,以 外,某些產品 相隔甚久,前 需要重新試產 效確認各批次 容易因為採用 或者在尚無須 下單生產不同產品的晶圓代工廠而 卜產品各自進行試產(pil〇t 1〇ts)以 種h况下,線上人員通常必須同時 /產’以得到對應的疊對偏移,以作 。然而,其缺點在於缺乏管理機 的試產完成後,微影機台可能 導。致無法即時進行產品A的正式投 ^品A的疊對偏移,在產品b完成後則 广正因產品B所產生的偏移。 二Γ、抵方式下單,批次與批次間的下 式產的疊對偏移可能無法適用於下 盥大型製造廠而言,線上人員若 〃其式產批次的疊對偏移值狀態與時 崔的登對偏移值投產而導致晶圓 新試產的情況下再度試產而降低生 發明内容 為了解決上述問題,本發 有效管理試產批次之疊對偏移 供線上人員快速設定並檢閱各 訊0 明的一個目的在於提供一種 資訊的系統與方法,可以提 減產批次(pilot lot)之資 本發明的再一個目的在於提供一種管理試產之疊對偏200413980 V. Description of invention (2) Below meters. Without a word, the management number must be evaluated as the actual system. Because it is put into production, it needs to be approved at another time, but it is not effective. The waste film and production efficiency must be offset by various different pairs for the receiving customer. The reference to the production of different products or the trial production of this online staff in product B may be adjusted according to the original calculation. In addition, some products are separated for a long time, and the trial production needs to be re-tested before to confirm that each batch is easy to adopt due to adoption or In a wafer foundry that does not have to place an order to produce different products, and the products are trial-produced separately (pil0t 10ts), the online personnel usually must simultaneously / produce 'to get the corresponding stack offset To make. However, its shortcoming is that after the trial production without a management machine is completed, the lithography machine may be turned on. As a result, it is impossible to carry out the formal offset of product A's stacking offset in real time. After product b is completed, the offset caused by product B is caused by Guangzheng. Two Γ, ordering method, the stack offset of batch-to-lot batch production may not be applicable to large-scale manufacturing plants. If the online staff is not familiar with the stack offset of batch production, Status and time Cui's boarding of the offset value results in the new trial production of wafers and reduced production. In order to solve the above problems, the present invention effectively manages the stack offset of trial production batches for online personnel. Quickly set and review the information. One purpose is to provide an information system and method that can reduce the capital of the pilot lot. Another purpose of the invention is to provide management of trial and error stacking.

200413980 五、發明說明(3) 移的系統與方法,可 續依批次(f ο 1 1 〇 w i n g 為達上述目的, (over 1 ay 〇f fset)管 ‘造系統(C〇m p u t e r s亥糸統包含:^一使用 續依批次的製造資訊 S對偏移資訊;以及 介面’並根據使用介 定試產批次於該微影 對偏移值排定續依批 根據上述系統, 移管理方法,係用於 一使用者介面上定義 行該試產批次之微影 偏移值;以及,當該 時’自動根據試產批 造。 以有效管理試產批次(p i 1 0 t 1 0 t )與 1 〇 t)間的疊對偏移設定。 根據本發明提供一種試產之疊對偏移 理系統,連結於微影機台或電腦整合200413980 V. Description of the invention (3) The system and method of transfer can be continued in batches (f ο 1 1 〇wing to achieve the above purpose, (over 1 ay 〇f fset) control system (Comperters) Including: ^ using offset manufacturing information S to offset information in batches; and an interface 'and scheduling offset values for the lithography pair in the lithography pair based on the use of the pilot batch in batches according to the above-mentioned system, shift management method , Which is used to define the lithographic offset value of a trial production batch on a user interface; and, at that time, 'automatic production is based on the trial production batch. To effectively manage the trial production batch (pi 1 0 t 1 0 t) and stacking offset setting between 10 and 10). According to the present invention, a trial production stacking offset management system is provided, which is connected to a lithography machine or a computer for integration

Integrated Manufacturing, CIM) 9 者介面’用以設定試產批次與對應之 ,並用以查詢及/或管理試產批次的 ,一管理伺服器,用以提供該使用者 面設定之試產批次與續依批次,先排 機台進行製造,並根據試產批次的疊 次之製造。 本發明更提供一種試產批次之疊對偏 半導體微影製程,包含下列步驟:; 2批:與續依批次之製造資訊;進 衣私,I測並評估該試產 試產批次之疊對低梦姑人 人心且對 ^夕晶斜伯 偏移值合乎既定規格 -人之$對偏移值進行續依批次之製 而本發明更提供一種試產批次之是 ^ 適用於需先進行微影試產的新產品,节方私官理方法, 驟:提供一批次,並將該批次分為母=a ^包含下列步 母批次為試產批次;於一使用者介面上子批次,其中 次之製造資訊,並設定子批次為續依批^義母抵次與子批 製造;量測並評估母批次之疊對偏 —人’進行母批次之 ?夕值;以及,當母批次Integrated Manufacturing, CIM) 9 user interface 'for setting trial production batches and corresponding, and for querying and / or managing trial production batches, a management server is used to provide trial user batch settings The batches are ordered and renewed according to the batches, and the machines are manufactured first, and are manufactured according to the repeated batches of the trial batches. The present invention further provides a trial production batch stacked semiconductor lithography process, which includes the following steps: 2 batches: and manufacturing information based on the batches; enter the clothing industry, and test and evaluate the trial production batches The stack of low dreams is popular and the offset value of XI Xijing is in line with the established specifications-the offset value of the person's $ is continued according to the batch system, and the present invention further provides a trial production batch of ^ Applicable For new products that require trial production of lithography first, the private party's management method is as follows: Provide a batch and divide the batch into mothers = a ^ contains the following steps: the mother batch is a trial production batch; A user interface on the sub-batch, the second batch of manufacturing information, and set the sub-batch to continue to be manufactured according to the batch ^ meaning the mother arrives at the sub-batch and the sub-batch; measure and evaluate the stack of the batch to the partial-person The next highest value; and, when the parent batch

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之疊對偏移值合乎既定規格時,自動根據母批次之疊對偏 移值進行子批次之製造。 為了讓本發明之上述目的、特徵、及優點能更明顯易 懂,以下配合所附圖式,作詳細說明如下: 實施方式 以下根據第1圖詳細說明根據本發明之一實施例中的 種U式產(pilot lot)之量對偏移(0Veriay 〇ffset)管理 系統。 參見第1圖,在一半導體製造廠中,一般均藉由製造 執行系統(Manufacturing Execution System,仉幻2〇管 理廠内各批次的分派與製造要求。當製造執行系統2〇送出 各批次的製造資訊與製造要求時,則廠内自動化搬運系统 (未顯示)會根據分派的製造資訊將適當的批次送至晶圓儲 存j(Stocker)22等待進一步處理。而微影機台控制器託 則藉由製造廠之電腦整合製造系統(c〇mputerWhen the stack-pair offset value meets the predetermined specifications, the sub-batch manufacturing is automatically performed according to the stack-pair offset value of the parent batch. In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, the following is described in detail with reference to the accompanying drawings: Embodiments The following describes in detail a variety of embodiments according to an embodiment of the present invention with reference to FIG. 1. Pilot-lot-to-offset (0Veriay 0ffset) management system. Referring to Figure 1, in a semiconductor manufacturing plant, the manufacturing execution system (Manufacturing Execution System, Magic 20) is generally used to manage the batch allocation and manufacturing requirements in the factory. When the manufacturing execution system 20 sends each batch When the manufacturing information and manufacturing requirements are met, the in-plant automated handling system (not shown) will send the appropriate batch to the wafer storage j (Stocker) 22 for further processing based on the assigned manufacturing information. And the lithography machine controller Trust uses integrated computer manufacturing system (c〇mputer)

Manufacturing,以下簡稱CIM)28分配待處理之批次及豆 製造相關資訊’並由晶圓儲存站22中送貨至微影機台“進 行製程◦而製造完成的晶圓,則曰 口 疊對偏移(—y。⑴etVK Ξ 台26進行 乂 w里,則,篁測之钿作|钍 估,可藉由量測機台控制器2 7進行。 一…禾汁 而根據本發明的-種試產之疊對偏移管理系統工, 包含-使用者介面12與一管理伺服器14。管理服 微影機台控制器25連結,以控制微影機台24的微景Manufacturing, hereinafter referred to as CIM) 28 Allocates batches to be processed and relevant information on bean manufacturing 'and delivers them from the wafer storage station 22 to the lithography machine “to perform the process. Offset (—y. ⑴etVK Ξ 26 乂 乂 乂 里 篁, then, the guesswork | estimate can be performed by the measuring machine controller 27.…… The trial production stack offset management system includes a user interface 12 and a management server 14. The management server lithography machine controller 25 is connected to control the microview of the lithography machine 24

200413980 五、發明說明(5) 1 ^ 而管理伺服系統1 4亦可連接量測機台控制器2 7,以擷取曰 曰曰 圓微影製程後在疊對量測機台2 6的疊對偏移量測值 (overlay 〇ffset)。此外,較佳情況中,管理伺服器14可 連接C I Μ系統28,以控制批次的製造順序。 為了提供線上人員簡便並有效的管理試產批次(p i 1 01 1 ot)的疊對偏移值,以正確的運用在後續批次的疊對偏移 值校正,因此,藉由管理伺服器丨4提供使用者介面丨2,可 提供線上人員於該介面上設定試產批次(pU〇t 1〇t)與續 依批次(f ο 1 1 〇w i ng丨〇 t)的製造資訊。在較佳情況中,使 用者介面1 2如第2圖所示,提供線上人員設定試產批次與 績依批次編號。例如以新產品而言,通常需要分批(s p丨士 t 1 ot) ’先進行試產批次的製造,當製造品質符合規格後, 才進t後續批次的製造。在這種情況下,同一批次的產品 則被分為母子批次,則在使用者介面丨2上將試產批次 (pi lot lot)欄位a填入母批次編號,而續依批次 (following l〇t)欄位b則填入子批次編號。 仍參見第2圖,更可在該使用者介面12上設定試產批 次,片數以及疊對偏移值有效時限(Expiry day)f。為了 f:蔓:ϋ精確性’因此,若試產超過-定時間後,則機 :狀,漸偏移/此時必須進行再度試產,因此必須放 莱:5式產批次育料。而有效時限的設定則可以使線上 ^ Ξ古:理減產批— 人日寸速得知試產批次資訊目前是否 仍屬有效。 仍茶見第2圖’在較佳情況中,管理祠服器丄4更提供200413980 V. Description of the invention (5) 1 ^ And the management servo system 14 can also be connected to the measuring machine controller 2 7 to capture the stack of the measuring machine 2 6 after the circle lithography process. Measured offset (overlay 0ffset). In addition, preferably, the management server 14 may be connected to the CI system 28 to control the manufacturing sequence of the batches. In order to provide online personnel with a simple and effective way to manage the stack offset value of the trial batch (pi 1 01 1 ot) and correct the stack offset value correction in subsequent batches, the management server丨 4 provides user interface 丨 2, can provide online personnel to set up trial production batch (pU〇t 1〇t) and follow-up batch (f ο 1 1 〇wi ng 丨 〇t) manufacturing information on this interface . In the preferred case, the user interface 12 is shown in Figure 2 and provides online personnel to set trial production batches and performance by batch number. For example, in the case of new products, it is usually necessary to manufacture a batch of trial production batches (s p 丨 t 1 ot) ′, and only after the manufacturing quality meets the specifications, then the subsequent batches of manufacturing. In this case, the same batch of products are divided into mother and child batches, then the pilot batch (pi lot lot) field a is filled into the parent batch number on the user interface, and continued The batch (following 10) field b is filled with the sub-batch number. Still referring to FIG. 2, it is further possible to set trial production batches, the number of pieces, and the stacking offset valid period (Expiry day) f on the user interface 12. For f: man: ϋaccuracy ’, therefore, if the trial production exceeds-a fixed time, then the machine: shape, gradually shifting / at this time, the trial production must be carried out again, so it must be released: Type 5 batch breeding. The setting of the effective time limit can make the online ^ Ξ ancient: reduce production batches-people can quickly know whether the trial batch information is still valid. Still tea see Figure 2 ’In a better case, the management temple server 4 is provided

第9頁 200413980 五、發明說明(6) 在使用者介面12上查詢及/或管理各*式 的製造資訊。例如,提供設定試產^批#—比次與續依批次 值’包含各種微影定位設定值d,以及^對種微影設定 其中疊對偏移預設值e可根據製造廠之二料:移預設值e。 結果而設定。例如製造廠可利用—回饋"控移回饋控制 control )系統評估微影機台的疊對偏移4勢feedback田 ;此預先w產批次的疊對 株ί it m:有先前批次的歷史紀錄,可儲存於 :儲?…以供查詢,例如儲存於CIM系統28子於 庫。線上^員藉由使用者介面12查詢各筆試產批次之資 亂’例如疋否尚在有效期限,或去並 、 定值與試產後的疊對偏移值等的各項微影設 在,用者’I面1 2凡成設定後,則管理伺服 設定’控制微影機台控制器25,先在微影機台24進^產 批,的微影製帛。當微影製程完成後,則將試產批次送疊 對里測機:2 6進‘行璺對偏移的量測。其量測結果經由量測 機台控制器2 7評估是否合乎既定規格,若試產通過,管理 祠服器14由量測機台控制器27操取試產批次的疊對偏移 值,亚進而根據該試產批次的疊對偏移值,校正設定該微 影機台以f續製造該續依批次(followmg lot)。在較佳 情況中,管理伺服器1 4會管制其餘批次,在完成母批次 (试產)+子批次(續依)的整體微影製程前,將其他欲進行 微影製程之批次列入等待中,直到子批次在母批次之後完 成衣反為止,以確保子批次可緊接於母批次之後,根據母Page 9 200413980 V. Description of the invention (6) Query and / or manage various types of manufacturing information on the user interface 12. For example, providing a set of trial production ^ batch # —batch times and continuation by batch values' includes various lithographic positioning setting values d, and ^ sets of lithographic settings where the stack offset preset value e can be based on the second of the manufacturer Material: shift preset value e. Set as a result. For example, the manufacturer can use the "feedback" control system to evaluate the stack offset offset 4-potential feedback field of the lithography machine; this stack of pre-production batches is m: there is a previous batch of Historical records can be stored in: … For inquiries, for example, stored in the CIM system 28 in the library. The online clerk uses the user interface 12 to inquire about the chaos of each trial production batch. For example, whether it is still within the expiration date, or to delete, set, and overlap offset values after trial production, etc. After the user 'I side 1 2 Fan Cheng is set, the management servo setting' controls the lithography machine controller 25, and the lithography machine 24 enters the production batch at the lithography machine 24 first. When the lithography process is completed, the trial production batch will be sent to the stacker: 2 6 to perform the measurement of the offset. The measurement result is evaluated by the measuring machine controller 27 to determine whether it meets the predetermined specifications. If the trial production passes, the management server 14 is operated by the measuring machine controller 27 to obtain the stack offset value of the trial production batch. Asia further corrects and sets the lithography machine to continue to manufacture the followmg lot according to the stack offset value of the trial production lot. In a better case, the management server 14 will control the remaining batches. Before completing the overall lithography process of the parent batch (trial production) + sub-batch (continued), other batches that want to perform the lithography process will be processed. It is included in the waiting list until the child batch is finished after the parent batch, to ensure that the child batch can be placed immediately after the parent batch.

200413980200413980

200413980 五、發明說明(8) 之®對偏移值,、,# 曰、 試產批次的:;f二::機台控制器27計算並 定規格i :當試產批次之疊對偏移值合乎既 之製造二=根據試產批次之疊對偏移值進 格後,則心;:m試產批次的微影 控制器25或CIM夺統&制為27之結果,並連結微影機台 ^ - 依批”微影製程,於微影機;制接著進行續 猎由上述管理系統與方法,可程。 方便的介面,以設定廿其B 了以如供線上人員快速且 外’藉由上述的管理李產批次的疊對偏移資料。此 母子批次的產品:言=”’對於將同—批次分批為 影製程前,其間不會有L動確保在母子批次均完成微 此可確保試產的母批次^晶寺待微影製程的批次插入。藉 次的疊對偏移。 I對偏移’可直接用於校正子批 雖然本發明以較隹貧 定本發明,任何熟悉此項=揭露如上,然其並非用以限 和範圍内,當可做些許、技蟄者,在不脫離本發明之精神 圍當視後附之申請專利^動與潤飾,因此本發明之保護範 範圍所界定者為準。 第12頁 0503-8766TWF(Nl) ; TSMC2001-1264 ; Peggy.ptd 200413980 圖式簡單說明 第1圖所示為根據本發明之一實施例中的一種試產之 疊對偏移管理系統架構。 第2圖所示為根據本發明之一實施例的使用者介面示 意圖。 第3圖所示為根據本發明的一實施例中的一種試產之 疊對偏移管理方法流程示意圖。 符號說明 12 ·· 使 用 者 介 面 14 管理 祠 服 ^3. · 為 , 20 : 製 造 執 行 系 統 ;22 晶圓 儲 存 站; 24 : 微 影 機 台 j 25 微影 機 台 控制器 25 ^ 26 ·· 疊 對 量 測 機台: 27 : 量 測 機 台 控 制 , 2 8 ·· 電 腦 整 合 製 造(CIM) 系統; a〜f ·· 使 用 者 介 面 欄位: ) S302 S308 ; 流 程 步驟ζ200413980 V. Description of the invention (8) ® Offset value, #, # ,, Trial production batch:; f2 :: Machine controller 27 calculates and sets the specification i: When the trial production batch is stacked The offset value is in line with the former. Two = After the offset value of the trial production batch is checked, then be careful ;: The result of the lithography controller 25 or the CIM control & system of the trial production batch is 27. , And link to the lithography machine ^-"Batch-by-" lithography process, in the lithography machine; the system then continues to hunt by the above management system and method, which can be processed. Convenient interface to set the B's as for online The personnel quickly and externally "use the above-mentioned management of the stack offset data of the batch produced by Li. The product of this mother and child batch:" = "For the same batch to be batched into a filming process, there will be no L in the meantime. This ensures that the micro batches are completed in both the mother and child batches. This ensures that the trial batch of the mother batch ^ Jingsi is to be inserted into the lithography process. Stacked offsets borrowed by. I pair offset 'can be directly used in syndrome batches. Although the present invention is relatively poor in determining the present invention, anyone familiar with this item = disclosed as above, but it is not intended to be used within the scope and scope. Without departing from the spirit of the present invention, the attached patents are subject to the following patent applications and modifications, so the scope of the protection scope of the present invention shall prevail. Page 12 0503-8766TWF (Nl); TSMC2001-1264; Peggy.ptd 200413980 Brief Description of Drawings Figure 1 shows the structure of a stack-to-stack offset management system in a trial production according to an embodiment of the present invention. Figure 2 is a schematic diagram of a user interface according to an embodiment of the present invention. FIG. 3 is a flowchart of a method for managing a stack-to-stack offset in a trial production according to an embodiment of the present invention. Explanation of symbols 12 ·· User interface 14 Management of shrine service ^ 3. · For, 20: Manufacturing execution system; 22 Wafer storage station; 24: Lithography machine j 25 Lithography machine controller 25 ^ 26 ·· Stack For measuring machine: 27: measuring machine control, 2 8 ·· computer integrated manufacturing (CIM) system; a ~ f ·· user interface field:) S302 S308; process steps ζ

0503-8766TWF(Nl) ; TSMC2001-1264 ; Peggy.ptd 第13頁0503-8766TWF (Nl); TSMC2001-1264; Peggy.ptd page 13

Claims (1)

六、申請專利範圍 1.種°式產之®對偏移(〇veriay offset)管理έ 連結一微影機台,該系統包含·· 系統, 7 :用者二左用以設定-試產批次與-續依抵次之 製造資讲’亚用以查詢及/或管理試產批次的疊對 訊,·以及 偏移資 一管理伺服器,用以提供該使用者介面,並根攄 用介面設疋之该试產批次與該續依批次,先排定該^使 次於該微影機台進行製造,並根據該試產批次的叠^ 抵 值進行該續依批次之製造。 、移 2 ·根據申請專利範圍第1項所述之試產之疊對偏移 (〇ν e r 1 a y 0 f f s e t)管理系統,其中該試產批次與該病 次為同/批次之母、子批次。 x、只依抵 3 ·根據申請專利範圍第1項所述之試產之疊對偏移 (overlay 〇f f set)管理系統,其中該試產批次與該續>依& 次之製造資訊包含_·該試產批次與續依批次編號、該^】 批次片數 $對偏移預設值及/或髮對偏移值有效時限。 4.根據申請專利範圍第3項所述之試產之疊對偏移 (overlay of f set)管理系統,其中該試產批次之製造資訊 更包含該試產批次的微影設定值。 5 ·根據申請專利範圍第3項所述之試產之疊對偏移 (overlay of f set)管理系統,其中該疊對偏移預設值係根 據疊對偏移回饋控制結果而設定。 6.根據申請專利範圍第1項所述之試產之疊對偏移 (overlay of f set)管理系統,該管理伺服器更連結一疊對六 、 Application scope of patents 1. Management of offsets (° veriay offset) of ° type production Linked with a lithography machine, the system contains ... System 7: User 2 left for setting-trial production batch And-continuously based on the manufacturing capital talk 'Asia used to query and / or manage the overlay of trial production batches, and offset management management server to provide the user interface and use The trial production batch and the renewal batch set in the interface are first scheduled to be manufactured next to the lithography machine, and the renewal batch is performed according to the offset value of the trial production batch. Manufacture. 、 Move 2 · According to the trial production stack offset (0ν er 1 ay 0 ffset) management system described in item 1 of the scope of patent application, where the trial production batch is the same / batch mother as the illness , Sub-batch. x. Reliance only 3. According to the overlay ○ ff set management system for trial production described in item 1 of the scope of the patent application, where the trial production batch and the continuation > according to & second manufacturing The information includes _ · The trial production batch and the continuation according to the batch number, the ^] batch number $ for the preset offset value and / or the valid time limit for the offset value. 4. The overlay of f set management system for trial production according to item 3 of the scope of patent application, wherein the manufacturing information of the trial production batch further includes the lithographic setting value of the trial production batch. 5 • According to the trial production of the overlay of f set management system described in item 3 of the scope of the patent application, wherein the overlay offset preset value is set according to the overlay offset feedback control result. 6. According to the trial production of the overlay of f set management system described in item 1 of the scope of patent application, the management server is further connected to a stack of f set 0503-8766TWF(Nl) - TSMC2001-1264 ; Peggy.ptd 第14頁 200413980 六、申請專利範圍 偏移量測系統,以擷取兮4 士 _ ^ ^ ^ .r w忒產批次之疊對偏移值。 7 ·根據申凊專利範圊 ^ (〇verlay〇ffset)管理本 局矛夕 批次之ί對偏移值人1 φ 〃中該f理籠器將該試產 制該微影機台以自動進行製造系統,以控 n 德4 —田 订4續依批次之製造。 8 ·〆種減產之豐對低 成πρ & A蔞卿外旦/制 每矛夕(〇ver lay 〇f f set)管理 適用於爭V體被影製程,# 一丄△ 王方法, 你田土人 该方法包含下列步驟: 於〆使用者介面上定 气甚4L A冷格 ^ . 欠我一试產批次與一績依柷a 造資訊, 仳次之製 進行該試產批次之微影製程; 量測並評估該試產妞4 ^ @ 里 、座批次之疊對偏移值;以及 當該試產批次之疊對偏移值合乎一既定規格_ 根據該試產批次之疊對偏移值進行該續依批次之:自動 9 ·根據申請專利範圍第8項所述之試產之疊對% ^。 (overlay offset)管理方法,其中該試產批次與今綠移 次為同一批次之母、子批次。 一 w、,依抵 (over 次之 I 0 ·根據申請專利範圍第8項所述之試產之叠斜 r lay of f set)管理方法,其中該試產批次與气=移 次之製造資訊包含··該試產批次與續依抵次編號、^依抵 批次片數、疊對偏移預設值及/或燊對偏移值有致护^式產 II ·根據申請專利範圍第1 〇項戶斤述之試產之最鮮限。 (over lay of f set)管理方法,其中該試產批次之制、生偏移 更包含該試產批次的微影設定值。 ^資矾 1 2 ·根據申請專利範圍第1 〇項所述之試產之最 定對偏移0503-8766TWF (Nl)-TSMC2001-1264; Peggy.ptd Page 14 200413980 VI. Application for patent range offset measurement system to capture 4 ± _ ^ ^ ^ .rw value. 7 · According to the application of the patent scope of the patent (圊 verlay〇ffset) to manage the pair of offset value people 1 φ 矛 in the Xixi batch of this bureau, the cage device will be trial-produced to make the lithography machine automatically. Manufacturing system to control n German 4-Tianding 4 continued to manufacture by batch. 8 · A variety of yield reductions to low πρ & A 蒌 qing foreign / system of each spear (〇ver lay 〇ff set) management is applicable to the process of the film production, # 一 丄 △ King method, your land The method includes the following steps: Set the gas on the user interface to 4L A cold grid ^. I owe me a trial production batch and a performance based on the information, and then the next batch of the trial production batch Filming process; measure and evaluate the stacking offset value of the trial batch 4 ^ @ 里, block; and when the stacking offset value of the trial batch conforms to a predetermined specification _ according to the trial batch The stacking offset value is carried out in the following batch-by-batch: Automatic 9 · According to the stacking %% of the trial production described in item 8 of the scope of patent application. (overlay offset) management method, in which the trial production batch and the current green shift are the same batch of mother and child batches. I., according to the over (I 0 of the overtime) management method according to the trial production r lay of f set described in item 8 of the scope of patent application, wherein the trial production batch and gas = shifted manufacturing The information includes ... The trial production batch and the continuation batch number, the number of batches in the batch, the preset offset value of the overlap pair and / or the offset value are protected ^ type II. According to the scope of the patent application The freshest limit for trial production described in item 10 of the household. (over lay of f set) management method, wherein the trial production batch production and production offset further include the lithographic setting value of the trial production batch. ^ Alum 1 2 · According to the optimal pair shift of trial production described in item 10 of the scope of patent application 0503-8766TW(Nl) ; TSMC200M264 ; Peggy.ptd 第15頁 2004139800503-8766TW (Nl); TSMC200M264; Peggy.ptd page 15 200413980 六、申請專利範圍 (overlay of f set)管理方法,其中該疊對偏移預設值 據疊對偏移回饋控制結果而設定。 ’、根 1 3 ·根據申请專利範圍第8項所述之試產之疊對偏^ (overlay of f set)管理方法,其中該試產批次之疊對^夕 值係匯入一電腦整合製造(C I Μ )系統,以自動進行續浐# 批次之製造。 μ、’依 14. 一種试產之豐對偏移(〇veriay 〇ffset)管理方 法,適用於半導體微影製程,該方法包含下列步驟: 提供一批次,並將該批次分為一母批次與一子抵3 其中該母批次為試產批次; 人 於一使用者介面上定義該母批次與子批次之製造資 訊,並設定該子批次為續依批次; 貝 進行該母批次之製造; 量測並评估該母批次之疊對偏移值;以及 當該母批次之疊對偏移值合乎一既定規格時,自動根 據該母批次之疊對偏移值進行該子批次之製造。 乂 1 5 ·根據申請專利範圍第丨4項所述之試產之疊對偏移 (overlay of f set)管理方法,其中該母批次與子抵次之製 造資訊包含:該母批次與子批次編號、該母批次片數、疊 對偏移預設值及/或疊對偏移值有效時限。 1 6 ·根據申請專利範圍第丨5項所述之試產之疊對偏移 (〇ve r 1 ay 〇 f f s e t)管理方法,其中该母批次之製造資訊更 包含該母批次的微影設定值。 1 7.根據申请專利範圍第1 $項戶斤述之5式產之里對偏移6. The method of managing an overlay of f set (patent application), wherein the preset value of the stack offset is set according to the feedback control result of the stack offset. ', Root 1 3 · According to the management method of overlay of f set described in item 8 of the scope of patent application, the overlay of the trial production batch is imported into a computer for integration Manufacturing (CI) system to automate the manufacturing of batches. μ, 'According to 14. A trial production method of 对 veriay 〇ffset) management method, suitable for semiconductor lithography process, the method includes the following steps: Provide a batch, and divide the batch into a mother The batch and a child arrive 3 The parent batch is a trial production batch; a user defines the manufacturing information of the parent batch and the child batch on a user interface, and sets the child batch as a continuation batch; Beam manufactures the parent batch; measures and evaluates the stack offset value of the parent batch; and when the stack offset value of the parent batch meets a predetermined specification, automatically The offset value is manufactured for this sub-batch.乂 1 5 · According to the method of management of overlay of f set for trial production described in item 丨 4 of the scope of patent application, the manufacturing information of the parent batch and the child batch includes: the parent batch and the The sub-batch number, the number of pieces of the parent batch, the preset value of the stack offset and / or the valid time limit of the stack offset. 1 6 · According to the trial production method of stack-to-stack offset (〇ve r 1 ay 〇ffset) described in item 5 of the patent application scope, wherein the manufacturing information of the parent batch further includes the lithography of the parent batch Set value. 1 7.According to the scope of the application for the scope of the patent application, the offset of the type 5 property is described in Item 1 200413980 六、申請專利範圍 (〇 v e r 1 a y 〇 f f s e t)管理方法,其中該疊對偏移預設值係根 據疊對偏移回饋控制結果而設定。 1 8.根據申請專利範圍第1 4項所述之試產之疊對偏移 (〇 v e r 1 a y 〇 f f s e t)管理方法,其中該母批次之疊對偏移值 係匯入一電腦整合製造(C I Μ )系統,以自動進行該子批次 之製造。200413980 VI. Application scope of patent management (〇 v er 1 a y f f s et) management method, wherein the preset value of the stack offset is set according to the control result of the stack offset feedback. 1 8. According to the trial production stack offset (0ver 1 ay ffset) management method described in item 14 of the scope of the patent application, the stack offset value of the parent batch is imported into a computer integrated manufacturing (CI M) system to automate the manufacturing of this sub-batch. 0503-8766TWF(Nl) ; TSMC2001-1264 ; Peggy.ptd 第17頁0503-8766TWF (Nl); TSMC2001-1264; Peggy.ptd page 17
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI742485B (en) * 2019-09-17 2021-10-11 台灣積體電路製造股份有限公司 Shift control method in manufacture of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI742485B (en) * 2019-09-17 2021-10-11 台灣積體電路製造股份有限公司 Shift control method in manufacture of semiconductor device
US11183482B2 (en) 2019-09-17 2021-11-23 Taiwan Semiconductor Manufacturing Company, Ltd. Shift control method in manufacture of semiconductor device

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