SG114566A1 - Liquid composition for removing a photoresist - Google Patents

Liquid composition for removing a photoresist

Info

Publication number
SG114566A1
SG114566A1 SG200205478A SG200205478A SG114566A1 SG 114566 A1 SG114566 A1 SG 114566A1 SG 200205478 A SG200205478 A SG 200205478A SG 200205478 A SG200205478 A SG 200205478A SG 114566 A1 SG114566 A1 SG 114566A1
Authority
SG
Singapore
Prior art keywords
photoresist
liquid composition
composition
liquid
Prior art date
Application number
SG200205478A
Inventor
Ikemoto Kazuto
Maruyama Taketo
Yoshida Hiroshi
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of SG114566A1 publication Critical patent/SG114566A1/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/34Imagewise removal by selective transfer, e.g. peeling away
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/426Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG200205478A 2001-09-28 2002-09-12 Liquid composition for removing a photoresist SG114566A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001304664A JP4639567B2 (en) 2001-09-28 2001-09-28 Photoresist stripping composition

Publications (1)

Publication Number Publication Date
SG114566A1 true SG114566A1 (en) 2005-09-28

Family

ID=19124553

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200205478A SG114566A1 (en) 2001-09-28 2002-09-12 Liquid composition for removing a photoresist

Country Status (4)

Country Link
JP (1) JP4639567B2 (en)
KR (1) KR20030051188A (en)
SG (1) SG114566A1 (en)
TW (1) TW593224B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2591477A1 (en) 2004-12-10 2006-06-22 Mallinckrodt Baker, Inc. Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors
US7879782B2 (en) * 2005-10-13 2011-02-01 Air Products And Chemicals, Inc. Aqueous cleaning composition and method for using same
KR100718527B1 (en) * 2006-04-12 2007-05-16 테크노세미켐 주식회사 Stripper composition for negative photoresist
KR20220056194A (en) * 2019-08-30 2022-05-04 다우 글로벌 테크놀로지스 엘엘씨 photoresist stripping composition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6249355A (en) * 1985-08-10 1987-03-04 Nagase Sangyo Kk Stripping agent composition
EP0828197A1 (en) * 1996-09-06 1998-03-11 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
JPH1184686A (en) * 1997-09-01 1999-03-26 Mitsubishi Gas Chem Co Inc Resist removing agent composition

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08334905A (en) * 1995-06-08 1996-12-17 Tokyo Ohka Kogyo Co Ltd Removing solution composition for resist
JP3236220B2 (en) * 1995-11-13 2001-12-10 東京応化工業株式会社 Stripper composition for resist
JP3891768B2 (en) * 1999-12-28 2007-03-14 株式会社トクヤマ Residual cleaning solution
US6268115B1 (en) * 2000-01-06 2001-07-31 Air Products And Chemicals, Inc. Use of alkylated polyamines in photoresist developers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6249355A (en) * 1985-08-10 1987-03-04 Nagase Sangyo Kk Stripping agent composition
EP0828197A1 (en) * 1996-09-06 1998-03-11 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
JPH1184686A (en) * 1997-09-01 1999-03-26 Mitsubishi Gas Chem Co Inc Resist removing agent composition

Also Published As

Publication number Publication date
JP4639567B2 (en) 2011-02-23
KR20030051188A (en) 2003-06-25
JP2003107754A (en) 2003-04-09
TW593224B (en) 2004-06-21

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