SG11201608819VA - Bonding wire for semiconductor device - Google Patents
Bonding wire for semiconductor deviceInfo
- Publication number
- SG11201608819VA SG11201608819VA SG11201608819VA SG11201608819VA SG11201608819VA SG 11201608819V A SG11201608819V A SG 11201608819VA SG 11201608819V A SG11201608819V A SG 11201608819VA SG 11201608819V A SG11201608819V A SG 11201608819VA SG 11201608819V A SG11201608819V A SG 11201608819VA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- bonding wire
- bonding
- wire
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
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- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/05624—Aluminium [Al] as principal constituent
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Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014087587 | 2014-04-21 | ||
PCT/JP2015/062040 WO2015163297A1 (en) | 2014-04-21 | 2015-04-21 | Bonding wire for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201608819VA true SG11201608819VA (en) | 2016-12-29 |
Family
ID=54332462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201608819VA SG11201608819VA (en) | 2014-04-21 | 2015-04-21 | Bonding wire for semiconductor device |
Country Status (10)
Country | Link |
---|---|
US (1) | US10950570B2 (en) |
EP (1) | EP3136427B1 (en) |
JP (3) | JP6167227B2 (en) |
KR (2) | KR20180105740A (en) |
CN (2) | CN106233447A (en) |
MY (1) | MY168617A (en) |
PH (1) | PH12016502098B1 (en) |
SG (1) | SG11201608819VA (en) |
TW (1) | TWI605559B (en) |
WO (1) | WO2015163297A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6167227B2 (en) | 2014-04-21 | 2017-07-19 | 新日鉄住金マテリアルズ株式会社 | Bonding wires for semiconductor devices |
MY162048A (en) | 2015-06-15 | 2017-05-31 | Nippon Micrometal Corp | Bonding wire for semiconductor device |
EP3136435B1 (en) | 2015-07-23 | 2022-08-31 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
JP6002300B1 (en) * | 2015-09-02 | 2016-10-05 | 田中電子工業株式会社 | Palladium (Pd) coated copper wire for ball bonding |
TW202143414A (en) * | 2015-12-15 | 2021-11-16 | 日商日鐵化學材料股份有限公司 | Bonding wire for semiconductor device |
SG10201600329SA (en) * | 2016-01-15 | 2017-08-30 | Heraeus Materials Singapore Pte Ltd | Coated wire |
WO2017221434A1 (en) * | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | Bonding wire for semiconductor device |
JP6452661B2 (en) * | 2016-11-11 | 2019-01-16 | 日鉄マイクロメタル株式会社 | Bonding wires for semiconductor devices |
JP7036838B2 (en) | 2017-12-28 | 2022-03-15 | 日鉄マイクロメタル株式会社 | Bonding wire for semiconductor devices |
CN117529802A (en) * | 2021-06-25 | 2024-02-06 | 日铁新材料股份有限公司 | Bonding wire for semiconductor device |
WO2022270049A1 (en) * | 2021-06-25 | 2022-12-29 | 日鉄マイクロメタル株式会社 | Bonding wire for semiconductor device |
EP4174202A4 (en) * | 2021-06-25 | 2024-05-29 | Nippon Micrometal Corporation | Bonding wire for semiconductor devices |
KR20240026928A (en) * | 2021-06-25 | 2024-02-29 | 닛데쓰마이크로메탈가부시키가이샤 | Bonding wire for semiconductor devices |
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2015
- 2015-04-21 JP JP2016514933A patent/JP6167227B2/en active Active
- 2015-04-21 MY MYPI2016703847A patent/MY168617A/en unknown
- 2015-04-21 US US15/305,238 patent/US10950570B2/en active Active
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- 2015-04-21 EP EP15782477.2A patent/EP3136427B1/en active Active
- 2015-04-21 WO PCT/JP2015/062040 patent/WO2015163297A1/en active Application Filing
- 2015-04-21 KR KR1020187026794A patent/KR20180105740A/en active Application Filing
- 2015-04-21 CN CN201580020829.0A patent/CN106233447A/en active Pending
- 2015-04-21 KR KR1020167029247A patent/KR101902091B1/en active IP Right Grant
- 2015-04-21 CN CN202010200779.7A patent/CN111383935A/en active Pending
- 2015-04-21 TW TW104112804A patent/TWI605559B/en active
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KR20160144390A (en) | 2016-12-16 |
PH12016502098A1 (en) | 2017-01-09 |
US10950570B2 (en) | 2021-03-16 |
KR20180105740A (en) | 2018-09-28 |
CN106233447A (en) | 2016-12-14 |
CN111383935A (en) | 2020-07-07 |
TW201603220A (en) | 2016-01-16 |
MY168617A (en) | 2018-11-14 |
TWI605559B (en) | 2017-11-11 |
EP3136427B1 (en) | 2023-12-06 |
EP3136427A4 (en) | 2018-03-14 |
US20170040281A1 (en) | 2017-02-09 |
JPWO2015163297A1 (en) | 2017-04-20 |
WO2015163297A1 (en) | 2015-10-29 |
PH12016502098B1 (en) | 2017-01-09 |
JP2017163169A (en) | 2017-09-14 |
KR101902091B1 (en) | 2018-09-27 |
JP2020031238A (en) | 2020-02-27 |
JP6167227B2 (en) | 2017-07-19 |
EP3136427A1 (en) | 2017-03-01 |
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