SG11201503318PA - Method for microcontact embossing - Google Patents
Method for microcontact embossingInfo
- Publication number
- SG11201503318PA SG11201503318PA SG11201503318PA SG11201503318PA SG11201503318PA SG 11201503318P A SG11201503318P A SG 11201503318PA SG 11201503318P A SG11201503318P A SG 11201503318PA SG 11201503318P A SG11201503318P A SG 11201503318PA SG 11201503318P A SG11201503318P A SG 11201503318PA
- Authority
- SG
- Singapore
- Prior art keywords
- microcontact
- embossing
- microcontact embossing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0015—Production of aperture devices, microporous systems or stamps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012112030.7A DE102012112030A1 (en) | 2012-12-10 | 2012-12-10 | Method for microcontact embossing |
PCT/EP2013/075562 WO2014090661A1 (en) | 2012-12-10 | 2013-12-04 | Method for microcontact printing |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201503318PA true SG11201503318PA (en) | 2015-06-29 |
Family
ID=49709685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201503318PA SG11201503318PA (en) | 2012-12-10 | 2013-12-04 | Method for microcontact embossing |
Country Status (8)
Country | Link |
---|---|
US (1) | US9323144B2 (en) |
EP (1) | EP2888629B1 (en) |
JP (1) | JP2016511931A (en) |
KR (1) | KR101759810B1 (en) |
CN (2) | CN104823107A (en) |
DE (1) | DE102012112030A1 (en) |
SG (1) | SG11201503318PA (en) |
WO (1) | WO2014090661A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160020131A1 (en) * | 2014-07-20 | 2016-01-21 | X-Celeprint Limited | Apparatus and methods for micro-transfer-printing |
WO2016070869A2 (en) * | 2014-11-03 | 2016-05-12 | Universität Osnabrück | Device for carrying out a capillary nanoprinting method, a method for carrying out capillary nanoprinting using the device, products obtained according to the method and use of the device |
CN104356740B (en) * | 2014-11-05 | 2017-05-17 | 广西师范学院 | Method for performing microcontact printing by using water-soluble porphyrin iron complex |
US11086217B2 (en) | 2014-12-22 | 2021-08-10 | Koninklijke Philips N.V. | Patterned stamp manufacturing method, patterned stamp and imprinting method |
US20180169907A1 (en) * | 2015-06-25 | 2018-06-21 | Ev Group E. Thallner Gmbh | Method for producing of structures on a substrate surface |
CN106486209A (en) * | 2015-08-31 | 2017-03-08 | 中国科学院宁波材料技术与工程研究所 | A kind of patterning 3D graphene conductive film and its environment-friendly preparation method thereof and application |
CN105319840A (en) * | 2015-11-23 | 2016-02-10 | 南通天鸿镭射科技有限公司 | Apparatus and method for manufacturing ultraviolet-light-cured seamless-moulded roller wheel through replication technology |
KR102331438B1 (en) * | 2016-04-06 | 2021-11-26 | 코닌클리케 필립스 엔.브이. | Imprint lithography stamps, methods of making and methods of using the same |
CN106542494B (en) * | 2016-09-26 | 2017-12-26 | 西北工业大学 | A kind of method for preparing the not contour micro-nano structure of multilayer |
JP6854733B2 (en) * | 2017-08-17 | 2021-04-07 | 株式会社ジェイエスピー | Resin sheet |
CN111747372B (en) * | 2019-03-26 | 2024-06-14 | 深圳清力技术有限公司 | Metal cover graphite island without edge bulge and preparation method thereof |
US12055737B2 (en) * | 2022-05-18 | 2024-08-06 | GE Precision Healthcare LLC | Aligned and stacked high-aspect ratio metallized structures |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE601401A (en) * | 1960-03-16 | 1900-01-01 | ||
US3678848A (en) * | 1969-08-25 | 1972-07-25 | Weber Marking Systems Inc | Inking pad and use thereof |
US3709647A (en) * | 1970-10-21 | 1973-01-09 | Clear Pack Co | Apparatus for forming an embossed thermoplastic sheet |
JPS5436617B2 (en) * | 1973-02-07 | 1979-11-10 | ||
US3971315A (en) * | 1974-08-12 | 1976-07-27 | Porelon, Inc. | Macroporous microporous marking structure |
JPH10278217A (en) * | 1997-04-09 | 1998-10-20 | Asahi Optical Co Ltd | Printing plate, its manufacture, and printer using the plate |
US6276272B1 (en) * | 1996-10-01 | 2001-08-21 | Brother Kogyo Kabushiki Kaisha | Stamp plate producing apparatus for producing stamp plate used in a stamp device |
US6048623A (en) * | 1996-12-18 | 2000-04-11 | Kimberly-Clark Worldwide, Inc. | Method of contact printing on gold coated films |
DE19949993C1 (en) * | 1999-10-15 | 2001-05-03 | Peter Barth | Microcontact printing process, for structuring oxidized surfaces using stamp in microelectronics, comprises wetting surface of stamp with silane or thiol molecules before contacting the stamp with oxidized surfaces |
DE60118843T2 (en) * | 2000-02-07 | 2006-11-30 | Koninklijke Philips Electronics N.V. | STAMP FOR A LITHOGRAPHIC PROCESS, METHOD FOR STAMP MAKING, AND METHOD FOR PRODUCING A PATTERNED LAYER ON A SUBSTRATE |
JP4278977B2 (en) * | 2000-11-22 | 2009-06-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Stamp, method and apparatus |
US6817293B2 (en) * | 2001-03-28 | 2004-11-16 | Dainippon Printing Co., Ltd. | Patterning method with micro-contact printing and its printed product |
JP5055672B2 (en) * | 2001-07-31 | 2012-10-24 | 大日本印刷株式会社 | Thin film pattern forming stamp |
US20030127002A1 (en) * | 2002-01-04 | 2003-07-10 | Hougham Gareth Geoffrey | Multilayer architechture for microcontact printing stamps |
GB0326904D0 (en) * | 2003-11-19 | 2003-12-24 | Koninkl Philips Electronics Nv | Formation of self-assembled monolayers |
KR20070072877A (en) * | 2004-10-22 | 2007-07-06 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | Roller micro-contact printer with pressure control |
EP2087403B1 (en) * | 2006-11-01 | 2012-02-01 | Koninklijke Philips Electronics N.V. | Imprint method for forming a relief layer and use of it as an etch mask |
US20080230773A1 (en) | 2007-03-20 | 2008-09-25 | Nano Terra Inc. | Polymer Composition for Preparing Electronic Devices by Microcontact Printing Processes and Products Prepared by the Processes |
US7959975B2 (en) | 2007-04-18 | 2011-06-14 | Micron Technology, Inc. | Methods of patterning a substrate |
WO2010002788A1 (en) | 2008-06-30 | 2010-01-07 | 3M Innovative Properties Company | Solvent assisted method of microcontact printing |
JP2010171281A (en) * | 2009-01-23 | 2010-08-05 | Jsr Corp | Imprinting method |
WO2010115027A1 (en) * | 2009-04-01 | 2010-10-07 | Nano Terra Inc. | Methods of patterning substrates using microcontact printed polymer resists and articles prepared therefrom |
WO2011079032A1 (en) * | 2009-12-22 | 2011-06-30 | 3M Innovative Properties Company | Apparatus and method for microcontact printing using a pressurized roller |
-
2012
- 2012-12-10 DE DE102012112030.7A patent/DE102012112030A1/en not_active Ceased
-
2013
- 2013-12-04 SG SG11201503318PA patent/SG11201503318PA/en unknown
- 2013-12-04 CN CN201380064460.4A patent/CN104823107A/en active Pending
- 2013-12-04 JP JP2015546946A patent/JP2016511931A/en active Pending
- 2013-12-04 CN CN201910665524.5A patent/CN110376844A/en active Pending
- 2013-12-04 KR KR1020157014532A patent/KR101759810B1/en active IP Right Grant
- 2013-12-04 WO PCT/EP2013/075562 patent/WO2014090661A1/en active Application Filing
- 2013-12-04 US US14/439,860 patent/US9323144B2/en active Active
- 2013-12-04 EP EP13799316.8A patent/EP2888629B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN110376844A (en) | 2019-10-25 |
JP2016511931A (en) | 2016-04-21 |
KR20150092139A (en) | 2015-08-12 |
EP2888629B1 (en) | 2016-03-02 |
DE102012112030A1 (en) | 2014-06-12 |
KR101759810B1 (en) | 2017-07-19 |
EP2888629A1 (en) | 2015-07-01 |
CN104823107A (en) | 2015-08-05 |
WO2014090661A1 (en) | 2014-06-19 |
US9323144B2 (en) | 2016-04-26 |
US20150293442A1 (en) | 2015-10-15 |
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