SG11201406054TA - Silver-based cylindrical target and process for manufacturing same - Google Patents

Silver-based cylindrical target and process for manufacturing same

Info

Publication number
SG11201406054TA
SG11201406054TA SG11201406054TA SG11201406054TA SG11201406054TA SG 11201406054T A SG11201406054T A SG 11201406054TA SG 11201406054T A SG11201406054T A SG 11201406054TA SG 11201406054T A SG11201406054T A SG 11201406054TA SG 11201406054T A SG11201406054T A SG 11201406054TA
Authority
SG
Singapore
Prior art keywords
silver
manufacturing same
cylindrical target
based cylindrical
target
Prior art date
Application number
SG11201406054TA
Inventor
Shozo Komiyama
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of SG11201406054TA publication Critical patent/SG11201406054TA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C23/00Extruding metal; Impact extrusion
    • B21C23/002Extruding materials of special alloys so far as the composition of the alloy requires or permits special extruding methods of sequences
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3423Shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3426Material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3426Material
    • H01J37/3429Plural materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/33Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332Coating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/824Cathodes combined with auxiliary electrodes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Metal Extraction Processes (AREA)
  • Extrusion Of Metal (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
SG11201406054TA 2012-03-27 2012-11-14 Silver-based cylindrical target and process for manufacturing same SG11201406054TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012071328A JP5472353B2 (en) 2012-03-27 2012-03-27 Silver-based cylindrical target and manufacturing method thereof
PCT/JP2012/079485 WO2013145424A1 (en) 2012-03-27 2012-11-14 Silver-based cylindrical target and process for manufacturing same

Publications (1)

Publication Number Publication Date
SG11201406054TA true SG11201406054TA (en) 2014-11-27

Family

ID=49258759

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201406054TA SG11201406054TA (en) 2012-03-27 2012-11-14 Silver-based cylindrical target and process for manufacturing same

Country Status (8)

Country Link
US (1) US20150041313A1 (en)
EP (1) EP2832895B1 (en)
JP (1) JP5472353B2 (en)
KR (3) KR20140130434A (en)
CN (1) CN104246002B (en)
SG (1) SG11201406054TA (en)
TW (1) TWI457450B (en)
WO (1) WO2013145424A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5159962B1 (en) * 2012-01-10 2013-03-13 三菱マテリアル株式会社 Silver alloy sputtering target for forming conductive film and method for producing the same
DE102012006718B3 (en) 2012-04-04 2013-07-18 Heraeus Materials Technology Gmbh & Co. Kg Planar or tubular sputtering target and method of making the same
JP6198177B2 (en) * 2013-07-19 2017-09-20 三菱マテリアル株式会社 Ag alloy sputtering target
DE102014214683A1 (en) * 2014-07-25 2016-01-28 Heraeus Deutschland GmbH & Co. KG Sputtering target based on a silver alloy
JP6350223B2 (en) * 2014-11-04 2018-07-04 三菱マテリアル株式会社 Ag alloy sputtering target
JP5975186B1 (en) * 2015-02-27 2016-08-23 三菱マテリアル株式会社 Ag alloy sputtering target and method for producing Ag alloy film
JP6259847B2 (en) * 2016-02-05 2018-01-10 住友化学株式会社 Manufacturing method of cylindrical target
KR101945145B1 (en) * 2016-03-14 2019-02-01 제이엑스금속주식회사 Oxide sintered compact
EP3467141B1 (en) 2016-06-02 2023-10-11 Tanaka Kikinzoku Kogyo K.K. Gold sputtering target
JP6877179B2 (en) * 2017-02-23 2021-05-26 Njt銅管株式会社 Cylindrical sputtering target material and its manufacturing method
KR102418935B1 (en) 2017-12-06 2022-07-07 다나카 기킨조쿠 고교 가부시키가이샤 A method for manufacturing a gold sputtering target and a method for manufacturing a gold film
JP7274816B2 (en) 2017-12-06 2023-05-17 田中貴金属工業株式会社 Gold sputtering target and its manufacturing method
JP2019131850A (en) * 2018-01-30 2019-08-08 三菱マテリアル株式会社 Laminated film and Ag alloy sputtering target
CN112771199B (en) * 2018-09-26 2024-01-16 Jx金属株式会社 Sputtering target and method for producing same
CN111215839A (en) * 2018-11-23 2020-06-02 宁波江丰电子材料股份有限公司 Forming method of coating material
CN109440073A (en) * 2018-11-29 2019-03-08 信利光电股份有限公司 A kind of silver alloy target, silver alloy layers and electrochromic rearview
JP2020125533A (en) * 2019-02-06 2020-08-20 三菱マテリアル株式会社 Ag ALLOY SPUTTERING TARGET, AND Ag ALLOY FILM
JP6853458B2 (en) * 2019-02-06 2021-03-31 三菱マテリアル株式会社 Ag alloy sputtering target and Ag alloy film
JP2021075762A (en) * 2019-11-08 2021-05-20 三菱マテリアル株式会社 Ag alloy sputtering target and Ag alloy film
JP7225170B2 (en) 2020-08-05 2023-02-20 松田産業株式会社 Ag alloy cylindrical sputtering target, sputtering apparatus, and method for manufacturing electronic device
CN113088749A (en) * 2021-03-11 2021-07-09 先导薄膜材料(广东)有限公司 Silver alloy and preparation method thereof
CN116752104A (en) * 2023-06-16 2023-09-15 基迈克材料科技(苏州)有限公司 Manufacturing method of high-purity low-oxygen fine-grain Ag rotary tube target for semiconductor

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US6294738B1 (en) * 1997-03-31 2001-09-25 American Superconductor Corporation Silver and silver alloy articles
US20030052000A1 (en) * 1997-07-11 2003-03-20 Vladimir Segal Fine grain size material, sputtering target, methods of forming, and micro-arc reduction method
JP4247863B2 (en) * 1999-07-12 2009-04-02 ソニー株式会社 Metal materials for electronic components, wiring materials for electronic components, electrode materials for electronic components, electronic components, electronic equipment, processing methods for metal materials, and electro-optical components
KR20030024854A (en) * 2000-09-08 2003-03-26 아사히 가라스 가부시키가이샤 Cylindrical target and method of manufacturing the cylindrical target
KR100568392B1 (en) * 2002-06-24 2006-04-05 가부시키가이샤 코베루코 카겐 Silver alloy sputtering target and process for producing the same
JP4264302B2 (en) * 2002-06-24 2009-05-13 株式会社コベルコ科研 Silver alloy sputtering target and manufacturing method thereof
JP3993530B2 (en) * 2003-05-16 2007-10-17 株式会社神戸製鋼所 Ag-Bi alloy sputtering target and method for producing the same
JP4384453B2 (en) * 2003-07-16 2009-12-16 株式会社神戸製鋼所 Ag-based sputtering target and manufacturing method thereof
US20050279630A1 (en) * 2004-06-16 2005-12-22 Dynamic Machine Works, Inc. Tubular sputtering targets and methods of flowforming the same
DE102005050424B4 (en) * 2005-10-19 2009-10-22 W.C. Heraeus Gmbh Sputtering target made of multi-component alloys
US20070251819A1 (en) * 2006-05-01 2007-11-01 Kardokus Janine K Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets
EP2878692B1 (en) * 2006-12-13 2016-07-20 UACJ Corporation High-strength aluminum-base alloy products and process for production thereof
JP4793502B2 (en) * 2009-10-06 2011-10-12 三菱マテリアル株式会社 Silver alloy target for forming reflective electrode film of organic EL element and method for producing the same
JP5533545B2 (en) 2010-01-12 2014-06-25 三菱マテリアル株式会社 Silver alloy target for forming reflective electrode film of organic EL element and method for producing the same
JP5159963B1 (en) * 2012-01-13 2013-03-13 三菱マテリアル株式会社 Silver alloy sputtering target for forming conductive film and method for producing the same
DE102012006718B3 (en) * 2012-04-04 2013-07-18 Heraeus Materials Technology Gmbh & Co. Kg Planar or tubular sputtering target and method of making the same

Also Published As

Publication number Publication date
KR101467152B1 (en) 2014-11-28
CN104246002B (en) 2015-11-25
KR20160022934A (en) 2016-03-02
JP2013204052A (en) 2013-10-07
JP5472353B2 (en) 2014-04-16
TW201339327A (en) 2013-10-01
EP2832895A4 (en) 2016-04-13
US20150041313A1 (en) 2015-02-12
WO2013145424A1 (en) 2013-10-03
KR20140130434A (en) 2014-11-10
EP2832895A1 (en) 2015-02-04
EP2832895B1 (en) 2019-08-21
KR20140029549A (en) 2014-03-10
TWI457450B (en) 2014-10-21
CN104246002A (en) 2014-12-24

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