SE7601058L - HIGH TEMPERATURE FORUM FOR HARD SOLDERING AND USING THE SAME IN A DIFFUSION HARD SOLDERING PROCEDURE - Google Patents

HIGH TEMPERATURE FORUM FOR HARD SOLDERING AND USING THE SAME IN A DIFFUSION HARD SOLDERING PROCEDURE

Info

Publication number
SE7601058L
SE7601058L SE7601058A SE7601058A SE7601058L SE 7601058 L SE7601058 L SE 7601058L SE 7601058 A SE7601058 A SE 7601058A SE 7601058 A SE7601058 A SE 7601058A SE 7601058 L SE7601058 L SE 7601058L
Authority
SE
Sweden
Prior art keywords
hard soldering
forum
high temperature
same
diffusion
Prior art date
Application number
SE7601058A
Other languages
Unknown language ( )
Swedish (sv)
Inventor
F S Galasso
E U Kuntz
E J Delgrosso
Original Assignee
United Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/549,846 external-priority patent/US4034454A/en
Priority claimed from US05/549,848 external-priority patent/US4026677A/en
Application filed by United Technologies Corp filed Critical United Technologies Corp
Publication of SE7601058L publication Critical patent/SE7601058L/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/325—Ti as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
SE7601058A 1975-02-13 1976-02-02 HIGH TEMPERATURE FORUM FOR HARD SOLDERING AND USING THE SAME IN A DIFFUSION HARD SOLDERING PROCEDURE SE7601058L (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/549,846 US4034454A (en) 1975-02-13 1975-02-13 Composite foil preform for high temperature brazing
US05/549,848 US4026677A (en) 1975-02-13 1975-02-13 High temperature titanium braze foil

Publications (1)

Publication Number Publication Date
SE7601058L true SE7601058L (en) 1976-08-14

Family

ID=27069254

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7601058A SE7601058L (en) 1975-02-13 1976-02-02 HIGH TEMPERATURE FORUM FOR HARD SOLDERING AND USING THE SAME IN A DIFFUSION HARD SOLDERING PROCEDURE

Country Status (6)

Country Link
JP (1) JPS51106661A (en)
DE (1) DE2605874A1 (en)
FR (1) FR2300650A1 (en)
GB (1) GB1541231A (en)
IT (1) IT1055228B (en)
SE (1) SE7601058L (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112941514A (en) * 2021-02-05 2021-06-11 南昌航空大学 Preparation method of copper/nickel reactive nano multilayer film

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT383762B (en) * 1985-12-23 1987-08-25 Plansee Metallwerk METHOD FOR PRODUCING MULTI-COMPONENT, CONGRUENTLY MELTING SOLDER MATERIALS
EP0456481A3 (en) * 1990-05-11 1993-06-30 Daido Tokushuko Kabushiki Kaisha Titanium-containing brazing materials
DE4129414A1 (en) * 1990-11-13 1993-03-11 Endress Hauser Gmbh Co Ternary activated solder
JP3763107B2 (en) * 1997-07-23 2006-04-05 大同特殊鋼株式会社 Thermoelectric conversion module and manufacturing method thereof
DE19941815A1 (en) * 1999-09-02 2001-03-08 Abb Patent Gmbh Solder for joining two components in a vacuum comprises a foil coated with a reactive component
CN114571055A (en) * 2022-03-28 2022-06-03 哈尔滨工业大学 Method for realizing low-temperature diffusion bonding of zirconium alloy by using Ti foil intermediate layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112941514A (en) * 2021-02-05 2021-06-11 南昌航空大学 Preparation method of copper/nickel reactive nano multilayer film

Also Published As

Publication number Publication date
GB1541231A (en) 1979-02-28
FR2300650A1 (en) 1976-09-10
JPS51106661A (en) 1976-09-21
IT1055228B (en) 1981-12-21
DE2605874A1 (en) 1976-08-26

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