NO20025457D0 - Lightweight construction bears for bumpers - Google Patents

Lightweight construction bears for bumpers

Info

Publication number
NO20025457D0
NO20025457D0 NO20025457A NO20025457A NO20025457D0 NO 20025457 D0 NO20025457 D0 NO 20025457D0 NO 20025457 A NO20025457 A NO 20025457A NO 20025457 A NO20025457 A NO 20025457A NO 20025457 D0 NO20025457 D0 NO 20025457D0
Authority
NO
Norway
Prior art keywords
bumpers
lightweight construction
construction bears
bears
lightweight
Prior art date
Application number
NO20025457A
Other languages
Norwegian (no)
Other versions
NO20025457L (en
Inventor
Klaus Hausberger
Guntram Ruef
Bruno Goetzinger
Thomas Friesenbichler
Original Assignee
Magna Steyr Fahrzeugtechnik Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magna Steyr Fahrzeugtechnik Ag filed Critical Magna Steyr Fahrzeugtechnik Ag
Publication of NO20025457D0 publication Critical patent/NO20025457D0/en
Publication of NO20025457L publication Critical patent/NO20025457L/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R19/00—Wheel guards; Radiator guards, e.g. grilles; Obstruction removers; Fittings damping bouncing force in collisions
    • B60R19/02—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects
    • B60R19/18—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects characterised by the cross-section; Means within the bumper to absorb impact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R19/00—Wheel guards; Radiator guards, e.g. grilles; Obstruction removers; Fittings damping bouncing force in collisions
    • B60R19/02—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects
    • B60R19/18—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects characterised by the cross-section; Means within the bumper to absorb impact
    • B60R2019/1806—Structural beams therefor, e.g. shock-absorbing
    • B60R2019/1813—Structural beams therefor, e.g. shock-absorbing made of metal
    • B60R2019/182—Structural beams therefor, e.g. shock-absorbing made of metal of light metal, e.g. extruded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Body Structure For Vehicles (AREA)
NO20025457A 2001-11-15 2002-11-14 Lightweight construction for bumpers NO20025457L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0088601U AT5755U1 (en) 2001-11-15 2001-11-15 LIGHTWEIGHT BODY FOR BUMPER

Publications (2)

Publication Number Publication Date
NO20025457D0 true NO20025457D0 (en) 2002-11-14
NO20025457L NO20025457L (en) 2003-05-27

Family

ID=3502069

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20025457A NO20025457L (en) 2001-11-15 2002-11-14 Lightweight construction for bumpers

Country Status (4)

Country Link
AT (1) AT5755U1 (en)
CH (1) CH696197A5 (en)
DE (1) DE10252835B4 (en)
NO (1) NO20025457L (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010054638A1 (en) 2010-12-15 2012-06-21 Benteler Automobiltechnik Gmbh Bumper for a motor vehicle

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO173537C (en) * 1991-09-06 1993-12-29 Norsk Hydro As Reinforcement beam and vehicle beams with beam
US5340178A (en) * 1993-11-12 1994-08-23 Chrysler Corporation Vehicle bumper beam
CH688651A5 (en) * 1994-12-23 1997-12-31 Alusuisse Lonza Services Ag Bumper for road vehicle
NO974375L (en) * 1997-09-22 1999-03-23 Norsk Hydro As Bumper, and manufacture of the same
JP2000052897A (en) * 1998-08-05 2000-02-22 Nippon Light Metal Co Ltd Bumper structure
JP2001132787A (en) * 1999-11-01 2001-05-18 Tokai Rubber Ind Ltd Impact-absorbing member

Also Published As

Publication number Publication date
NO20025457L (en) 2003-05-27
AT5755U1 (en) 2002-11-25
DE10252835B4 (en) 2013-11-28
DE10252835A1 (en) 2004-02-05
CH696197A5 (en) 2007-02-15

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