NL7008596A - - Google Patents
Info
- Publication number
- NL7008596A NL7008596A NL7008596A NL7008596A NL7008596A NL 7008596 A NL7008596 A NL 7008596A NL 7008596 A NL7008596 A NL 7008596A NL 7008596 A NL7008596 A NL 7008596A NL 7008596 A NL7008596 A NL 7008596A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
- Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3001469 | 1969-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7008596A true NL7008596A (xx) | 1970-12-15 |
Family
ID=10300881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7008596A NL7008596A (xx) | 1969-06-13 | 1970-06-12 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3691632A (xx) |
| DE (1) | DE2029071A1 (xx) |
| FR (1) | FR2051133A5 (xx) |
| GB (1) | GB1310880A (xx) |
| NL (1) | NL7008596A (xx) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3934985A (en) * | 1973-10-01 | 1976-01-27 | Georgy Avenirovich Kitaev | Multilayer structure |
| US3895435A (en) * | 1974-01-23 | 1975-07-22 | Raytheon Co | Method for electrically interconnecting multilevel stripline circuitry |
| US3932932A (en) * | 1974-09-16 | 1976-01-20 | International Telephone And Telegraph Corporation | Method of making multilayer printed circuit board |
| GB1535813A (en) * | 1975-07-03 | 1978-12-13 | Ncr Co | Multi-layer circuit board |
| DE2541280A1 (de) * | 1975-09-16 | 1977-03-17 | Siemens Ag | Verfahren zur herstellung einer gedruckten verdrahtung mit lotabweisenden teilbereichen |
| JPS54158661A (en) * | 1978-06-01 | 1979-12-14 | Tokyo Purinto Kougiyou Kk | Printed circuit board |
| DE2838982B2 (de) * | 1978-09-07 | 1980-09-18 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Verfahren zum Herstellen von Mehrebenen-Leiterplatten |
| US4285780A (en) * | 1978-11-02 | 1981-08-25 | Schachter Herbert I | Method of making a multi-level circuit board |
| US4446188A (en) * | 1979-12-20 | 1984-05-01 | The Mica Corporation | Multi-layered circuit board |
| US4464704A (en) * | 1980-09-26 | 1984-08-07 | Sperry Corporation | Polyimide/glass-epoxy/glass hybrid printed circuit board |
| US4479991A (en) * | 1982-04-07 | 1984-10-30 | At&T Technologies, Inc. | Plastic coated laminate |
| US4804575A (en) * | 1987-01-14 | 1989-02-14 | Kollmorgen Corporation | Multilayer printed wiring boards |
| JPH04363093A (ja) * | 1990-11-27 | 1992-12-15 | Mitsubishi Electric Corp | プリント基板の製造方法 |
| JP2636537B2 (ja) * | 1991-04-08 | 1997-07-30 | 日本電気株式会社 | プリント配線板の製造方法 |
| JP3175195B2 (ja) * | 1991-06-24 | 2001-06-11 | ソニー株式会社 | 多層配線の形成方法 |
| US5584956A (en) * | 1992-12-09 | 1996-12-17 | University Of Iowa Research Foundation | Method for producing conductive or insulating feedthroughs in a substrate |
| US5840402A (en) * | 1994-06-24 | 1998-11-24 | Sheldahl, Inc. | Metallized laminate material having ordered distribution of conductive through holes |
| JPH09507969A (ja) * | 1994-11-09 | 1997-08-12 | ブラウプンクト−ヴェルケ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 導体板上の貫通接続部の製法 |
| US5863447A (en) * | 1997-04-08 | 1999-01-26 | International Business Machines Corporation | Method for providing a selective reference layer isolation technique for the production of printed circuit boards |
| US6085415A (en) * | 1998-07-27 | 2000-07-11 | Ormet Corporation | Methods to produce insulated conductive through-features in core materials for electric packaging |
| JP4201436B2 (ja) * | 1999-07-14 | 2008-12-24 | 日東電工株式会社 | 多層配線基板の製造方法 |
| US6723927B1 (en) * | 2000-08-24 | 2004-04-20 | High Connection Density, Inc. | High-reliability interposer for low cost and high reliability applications |
| US6629367B2 (en) * | 2000-12-06 | 2003-10-07 | Motorola, Inc. | Electrically isolated via in a multilayer ceramic package |
| KR100516123B1 (ko) * | 2005-08-30 | 2005-09-21 | 주식회사 누리플랜 | 라인형 엘이디 조명등 |
| JP2009026875A (ja) * | 2007-07-18 | 2009-02-05 | Nitto Denko Corp | 配線回路基板 |
| TWI578416B (zh) * | 2015-09-18 | 2017-04-11 | Subtron Technology Co Ltd | 封裝載板及其製作方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3102213A (en) * | 1960-05-13 | 1963-08-27 | Hazeltine Research Inc | Multiplanar printed circuits and methods for their manufacture |
| US3274328A (en) * | 1963-06-06 | 1966-09-20 | Polymer Corp | Dielectric for circuit board and strip lines |
| US3571923A (en) * | 1968-12-30 | 1971-03-23 | North American Rockwell | Method of making redundant circuit board interconnections |
-
1969
- 1969-06-13 GB GB3001469A patent/GB1310880A/en not_active Expired
-
1970
- 1970-06-10 US US45073A patent/US3691632A/en not_active Expired - Lifetime
- 1970-06-12 DE DE19702029071 patent/DE2029071A1/de active Pending
- 1970-06-12 NL NL7008596A patent/NL7008596A/xx unknown
- 1970-06-12 FR FR7021588A patent/FR2051133A5/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2029071A1 (de) | 1970-12-17 |
| US3691632A (en) | 1972-09-19 |
| FR2051133A5 (xx) | 1971-04-02 |
| GB1310880A (en) | 1973-03-21 |