MY120575A - Semiconductor device and method of manufacturing same - Google Patents

Semiconductor device and method of manufacturing same

Info

Publication number
MY120575A
MY120575A MYPI99002246A MYPI9902246A MY120575A MY 120575 A MY120575 A MY 120575A MY PI99002246 A MYPI99002246 A MY PI99002246A MY PI9902246 A MYPI9902246 A MY PI9902246A MY 120575 A MY120575 A MY 120575A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
manufacturing same
circuit substrate
semiconductor component
base material
Prior art date
Application number
MYPI99002246A
Inventor
Yoshihiro Bessho
Minehiro Itagaki
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of MY120575A publication Critical patent/MY120575A/en

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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

A SEMICONDUCTOR DEVICE HAS (A) A SEMICONDUCTOR COMPONENT (6); (B) A CIRCUIT SUBSTRATE (8; 14); (C) A BASE MATERIAL (1; 12) WHICH IS PLACED BETWEEN THE SEMICONDUCTOR COMPONENT AND THE CIRCUIT SUBSTRATE; AND (D) A CONDUCTIVE PASTE (5), WHICH IS FILLED INTO A HOLE (4) FORMED IN THE BASE MATERIAL, FOR ELECTRICALLY CONNECTING BETWEEN A TERMINAL ELECTRODE (7) OF THE SEMICONDUCTOR COMPONENT AND AN INTERNAL CONNECTION ELECTRODE (9) OF THE CIRCUIT SUBSTRATE.
MYPI99002246A 1998-06-04 1999-06-03 Semiconductor device and method of manufacturing same MY120575A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15555398 1998-06-04

Publications (1)

Publication Number Publication Date
MY120575A true MY120575A (en) 2005-11-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI99002246A MY120575A (en) 1998-06-04 1999-06-03 Semiconductor device and method of manufacturing same

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Country Link
US (2) US6372548B2 (en)
EP (2) EP1202348A3 (en)
KR (1) KR100557049B1 (en)
MY (1) MY120575A (en)
SG (1) SG87034A1 (en)
TW (1) TW423083B (en)

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US6529022B2 (en) * 2000-12-15 2003-03-04 Eaglestone Pareners I, Llc Wafer testing interposer for a conventional package
US6673653B2 (en) * 2001-02-23 2004-01-06 Eaglestone Partners I, Llc Wafer-interposer using a ceramic substrate
US6923882B2 (en) * 2001-03-26 2005-08-02 Honeywell International Inc. Compliant pre-form interconnect
US6930256B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laser-embedded conductive patterns and method therefor
US20030094666A1 (en) * 2001-11-16 2003-05-22 R-Tec Corporation Interposer
US7399661B2 (en) * 2002-05-01 2008-07-15 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded back-side access conductors and vias
US20080043447A1 (en) * 2002-05-01 2008-02-21 Amkor Technology, Inc. Semiconductor package having laser-embedded terminals
US7548430B1 (en) 2002-05-01 2009-06-16 Amkor Technology, Inc. Buildup dielectric and metallization process and semiconductor package
US7633765B1 (en) 2004-03-23 2009-12-15 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US7670962B2 (en) 2002-05-01 2010-03-02 Amkor Technology, Inc. Substrate having stiffener fabrication method
US9691635B1 (en) 2002-05-01 2017-06-27 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
SG143932A1 (en) * 2003-05-30 2008-07-29 Micron Technology Inc Packaged microelectronic devices and methods of packaging microelectronic devices
JP2005026363A (en) * 2003-06-30 2005-01-27 Toshiba Corp Semiconductor device and its manufacturing method
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US20010002733A1 (en) 2001-06-07

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