KR970008530A - Surface-mount leadframes, semiconductor packages using the same, and manufacturing methods thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount lead frame, a semiconductor package using the same, and a method of manufacturing the same, wherein external leads protrude upward in the thickness direction of the semiconductor package, so that the subsidiary parts of the semiconductor package of the prior art The mounting density is higher than that protruding in the longitudinal direction, and since the sub-leads exposed by the molding resin are integrally formed without cutting, the deformation of the external leads can be prevented, and the completed semiconductor package is overturned. Since the heat generated from the semiconductor chip can be easily discharged out of the molding resin through the die pad, it can protect the reliability of the semiconductor package from the residual thermal stress in the molding resin. The semiconductor package by inserting the lead frame And the process is characterized in that to increase the simplicity and productivity.

Description

Surface-mount leadframes, semiconductor packages using the same, and manufacturing methods thereof

Since this is an open matter, no full text was included.

FIG. 1A is a schematic plan view of a surface mount leadframe according to the present invention, FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A, and FIG. Figure 5 is a bottom perspective view of a semiconductor package using a lead frame according to the present invention.

Claims (13)

A die pad on which a semiconductor chip is mounted; Internal leads electrically connected to a plurality of bonding pads formed on a semiconductor chip mounted on the die pad; Outer leads which are three-dimensional with the inner leads and protrude partly in the thickness direction of the inner leads to increase the surface mounting density; And a dam bar for supporting the external leads. The method of claim 1, wherein the protruding shape of the outer leads is " Lead frame for surface mounting. The method of claim 2, wherein the protruding shape of the outer leads is " "Wow, " "Wow, " "Wow, " "Wow, " "Lead frame for surface mounting, characterized in that any one of the shape. The surface mounting leadframe according to claim 2, wherein the protruding outer lead protrudes to protrude to the upper surface of the molding resin of the package in which the molding process is completed. The surface mount leadframe of claim 1, wherein the inner leads have the same thickness as the outer leads integrally corresponding to the inner leads. The surface mount leadframe of claim 1, wherein the dam bar is thinner than the thickness of the inner leads and the thickness of the outer leads. The surface mount leadframe of claim 1, wherein the dam bar has the same thickness as the inner leads and the outer leads. A semiconductor chip having a plurality of bonding pads formed on an upper surface thereof; Internal leads corresponding to the bonding pads and electrically connected to the bonding pads; Outer leads formed integrally with the inner leads; And a molding resin in which the die pad, the semiconductor chip, the inner leads and the outer leads are embedded, and a portion of the outer leads is exposed to the molding resin in order to be mounted on a iron circuit board. Semiconductor package using leadframe. The method of claim 8, wherein the protruding shape of the outer leads is " "Is a semiconductor package using a lead-mount for surface mounting. The method of claim 9, wherein the protruding shape of the outer leads is " "Wow, " "Wow, " "Wow, " "Wow, " "Semiconductor package using the lead-frame for surface mounting which is any one of shape. 10. The semiconductor package according to claim 9, wherein the protruding outer lead is bent to protrude to the upper surface of the molding resin of the package in which the molding process is completed. In the method of manufacturing a surface-mount semiconductor package, by inserting a lead frame prefabricated so that the outer leads of the lead frame is bent upward in the thickness direction of the lead frame and a plated film is formed on the ends of the outer leads, A die bonding step in which the die pad of the lead frame and the semiconductor chip are bonded by the bonding means; A method of manufacturing a semiconductor package using a surface mount lead frame, comprising the steps of: fabricating individual semiconductor packages by cutting the dam bars protruding from the packages. The method of claim 12, wherein the outer leads of the prefabricated lead frame in the die bonding step are bent to protrude to the upper surface of the molding resin. . ※ Note: The disclosure is based on the initial application.