KR930007910Y1 - Scribe wafer pack using ring - Google Patents

Scribe wafer pack using ring Download PDF

Info

Publication number
KR930007910Y1
KR930007910Y1 KR2019900010255U KR900010255U KR930007910Y1 KR 930007910 Y1 KR930007910 Y1 KR 930007910Y1 KR 2019900010255 U KR2019900010255 U KR 2019900010255U KR 900010255 U KR900010255 U KR 900010255U KR 930007910 Y1 KR930007910 Y1 KR 930007910Y1
Authority
KR
South Korea
Prior art keywords
ring
foil
wafer
frame
scribe
Prior art date
Application number
KR2019900010255U
Other languages
Korean (ko)
Other versions
KR920003416U (en
Inventor
노용수
Original Assignee
금성일렉트론 주식회사
문정환
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사, 문정환 filed Critical 금성일렉트론 주식회사
Priority to KR2019900010255U priority Critical patent/KR930007910Y1/en
Publication of KR920003416U publication Critical patent/KR920003416U/en
Application granted granted Critical
Publication of KR930007910Y1 publication Critical patent/KR930007910Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

내용 없음.No content.

Description

링을 사용한 스크라이브 웨이퍼 포장구조Scribe Wafer Packaging Structure Using Ring

제 1 도는 종래의 웨이퍼 포장 상태도인 것으로, (a)는 소잉(sawing)이 끝난 후 프레임을 메거진에 꽂은채로 층에 포장하는 상태도, (b)는 소잉(sawing)후 프레임을 떼어내고 호일을 접고 통에 포장하는 상태도.1 is a conventional state of wafer packaging, (a) is a state in which the frame is wrapped in a layer after sawing is finished in the magazine, (b) is a saw after the frame is removed and the foil is removed Even when folded and packed in a barrel.

제 2 도는 본 고안에 의한 웨이퍼 포장 순서도.2 is a wafer packaging flow chart according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 웨이퍼 2 : 호일1: wafer 2: foil

2a : 접착면 3 : 프레임2a: adhesive side 3: frame

6 : 링6: ring

본 고안은 스크라이브(Scribe)된 반도체 칩 웨이퍼의 링을 사용한 포장에 관한 것으로, 특히 포장비용을 절감할 수 있도록 한 링을 사용한 스크라이브 웨이퍼 포장구조에 관한 것이다.The present invention relates to a packaging using a ring of scribed semiconductor chip wafer, and more particularly to a scribe wafer packaging structure using a ring to reduce the packaging cost.

종래의 웨이퍼를 포장함에 있어서는 제 1a, b 도와같이 스크라이브에 사용한 프레임을 사용하여 포장하는 방법과, 프레임을 떼고 호일을 접어서 포장하는 방법등이 있는데 (a)는 프레임(3)에 호일(2)을 접착시키고 웨이퍼(1)을 호일(2)위에 얹어 부착하고 (이 공정을 호일 마운트라고 함), 소잉(sawing)이 끝난 후 그대로 메거진(4)에 꽂아서 이 메거진을 골판지 박스로 포장하였던 것이고, (b)는 소잉(sawing)후 프레임(3)을 떼어내고 칩이 호일(2)에 붙어 있는 상태에서 칩표면에 무진지(無塵紙)를 대고 호일(2)을 접어서 통(5)에 넣어 포장하였다.Conventional wafers are packaged using a frame used for scribing, as shown in FIGS. 1a and b, and a method of removing a frame and folding and wrapping the foil includes (a) a foil (2) on a frame (3). The wafer 1 was placed on the foil 2 and attached (this process is called a foil mount), and after the sawing was completed, the magazine was placed in the magazine 4 and packed in a cardboard box. (b) remove the frame (3) after sawing, place the dust (2) on the surface of the chip with the chip attached to the foil (2), fold the foil (2) and place it in the barrel (5). Packed.

이러한 종래의 포장구조에서는 프레임과 메거진이 사용되므로 판매 후 회전하는데 노력이 들고 박스등으로 겉을 포장해야 하므로 박스로인한 코스트가 더 들어간다.In such a conventional packaging structure, the frame and the magazine are used, so it takes a lot of effort to rotate after sale, and thus the cost of the box is further increased because the outer surface of the packaging is wrapped in a box or the like.

또한 소잉(sawing)으로 웨이퍼가 개개의 칩으로 나누어진 상태인 것으로 제 1b 도와 같은 상태로 포장하게 되면 호일이 고정된 것이 아니고 플렉시블(Flexible)하므로 이때에는 칩깨짐이 발생할 소지가 있어 칩보호면에서 상당히 불량한 문제점이 있었다.In addition, the wafer is divided into individual chips by sawing. If the wafer is packaged in the same state as 1b, the foil is not fixed but flexible, and chip breakage may occur at this time. There was a fairly bad problem.

본 고안은 상기와 같은 종래의칩 포장구조에서의 문제점을 감안하여 안출된 것으로, 제 3 도는 링을 사용하여 포장비용을 절감하면서 칩을 확실히 보호할 수 있도록 한 것이다.The present invention has been made in view of the problems in the conventional chip packaging structure as described above, Figure 3 is to ensure the protection of the chip while reducing the packaging cost using the ring.

제 2 도는 본 고안의 웨이퍼 포장 순서도로서, 이에 도시한 바와같이, 프레임(3)에 호일(2)을 접착시킨 후 호일(2)위에 웨이퍼(1)를 얹어 부착하는 것에 있어서, 프레임(3)과 웨이퍼(1)사이의 호일(2)의 접착면(2a)에 링(6)을 부착하여서 된 것이다.2 is a wafer packaging flow chart of the present invention, in which the foil 3 is attached to the frame 3 and the wafer 1 is placed on the foil 2, as shown therein. The ring 6 is attached to the bonding surface 2a of the foil 2 between the wafer and the wafer 1.

상기에 사용되는 링(6)의 형상은 보관용 박스의 형상에 따라 달라질 수 있으며 보관용 박스안에서 흔들리지 않도록 크기를 결정한다.The shape of the ring 6 used above may vary depending on the shape of the storage box and determine the size so as not to shake in the storage box.

링의 재질은 PVC 또는 종이등으로 할 수 있으나 가급적 변형량이 적어야 하며 빳빳한 상태를 유지할 수 있는 두께를 가진 것이 적당하다.The material of the ring may be PVC or paper, but the amount of deformation should be small and it is appropriate to have a thickness to keep it in good condition.

이러한 구성으로 이루어진 본 고안은 프레임(3)과 웨이퍼(1) 사이의 호일접착면(2a)에 링(6)을 접착시킨후 프레임(3)을 호일(2)로부터 떼어낸다.According to the present invention having such a configuration, the ring 6 is adhered to the foil bonding surface 2a between the frame 3 and the wafer 1, and then the frame 3 is detached from the foil 2.

그리고 링(6)밖의 프레임(3)에 접착되었던 호일(2)의 가장자리를 링(6)위로접어올려 링(6) 상면에 접착시킴으로써 호일(2)이 링(6)을 감싸는 식으로 포장하는 것이다.And by wrapping the edge of the foil (2) that was bonded to the frame (3) outside the ring (6) over the ring (6) and glued to the upper surface of the ring (6) by wrapping the foil (2) wrapped around the ring (6) will be.

이와 같이 링(6)으로 포장된 웨이퍼(1)를 여러장 중첩시킬 경우에는 각 링(6)으로 포장된 웨이퍼(1)사이에 무진지가 끼워지도록 하여 웨이퍼(1)가 손상되지 않도록 한다.When the wafers 1 wrapped with the rings 6 are overlapped in this way, the dust-free paper is sandwiched between the wafers 1 packed with the rings 6 so that the wafers 1 are not damaged.

웨이퍼(1) 장수가 많으면 상기한 방법으로 포장된 웨이퍼를 통(5)속에 차곡차곡 쌓아 넣고 뚜껑을 닿는다.If the number of wafers 1 is large, the wafers packaged in the above-described manner are stacked in the barrel 5 and touched with a lid.

이상에서와 같이 소잉(sawing)이 끝난 칩을 깨지지 않도록 보호하면서도 재료 코스트가 거의 들어가지 않으면서 완벽한 포장상태를 제공할 수 있는 것이다.As described above, the sawing chip can be protected from being broken while providing a perfect package with little material cost.

Claims (4)

호일(2)이 부착된 웨이퍼프레임(3)에 웨이퍼(1)가 실장된 것에 있어서, 상기 웨이퍼(1)와 프레임(3)사이의 호일(2a)에 변형이 잘안되는 재질의 링(6)을 접착시키고, 호일(2)에서 프레임(3)을 떼어내고 프레임(3)에 접착되었던 호일(2)의 가장자리를 접어올려 링(6)을 감싸도록 구성한 것을 특징으로 하는 링을 사용한 스크라이브 웨이퍼 포장구조.In the case where the wafer 1 is mounted on the wafer frame 3 to which the foil 2 is attached, the ring 6 made of a material that is hardly deformed in the foil 2a between the wafer 1 and the frame 3. And wrap the ring 6 by peeling off the frame 3 from the foil 2 and folding the edge of the foil 2 bonded to the frame 3 to wrap the ring 6. rescue. 제 1 항에 있어서, 상기 링(6)이 금속재인 것을 특징으로 하는 링을 사용한 스크라이브 웨이퍼 포장구조.The scribe wafer packaging structure according to claim 1, wherein the ring (6) is made of metal. 제 1 항에 있어서, 상기 링(6)이 플라스틱재인 것을 특징으로 하는 링을 사용한 스크라이브 웨이퍼 포장구조.The scribe wafer packaging structure using a ring according to claim 1, wherein the ring (6) is made of plastic. 제 1 항에 있어서, 상기 링(6)이 종이재인 것을 특징으로 하는 링을 사용한 스크라이브 포장구조.The scribe packaging structure according to claim 1, wherein the ring (6) is made of paper.
KR2019900010255U 1990-07-13 1990-07-13 Scribe wafer pack using ring KR930007910Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900010255U KR930007910Y1 (en) 1990-07-13 1990-07-13 Scribe wafer pack using ring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900010255U KR930007910Y1 (en) 1990-07-13 1990-07-13 Scribe wafer pack using ring

Publications (2)

Publication Number Publication Date
KR920003416U KR920003416U (en) 1992-02-25
KR930007910Y1 true KR930007910Y1 (en) 1993-11-24

Family

ID=19300980

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900010255U KR930007910Y1 (en) 1990-07-13 1990-07-13 Scribe wafer pack using ring

Country Status (1)

Country Link
KR (1) KR930007910Y1 (en)

Also Published As

Publication number Publication date
KR920003416U (en) 1992-02-25

Similar Documents

Publication Publication Date Title
US4171742A (en) Corrugated fibreboard box
US4203127A (en) Package and method of packaging semiconductor wafers
CA2138192C (en) Method for daylight loading a photographic light-sensitive material
KR930007910Y1 (en) Scribe wafer pack using ring
JPS5938278B2 (en) How to attach items
US3918581A (en) Shipping package for semiconductor chips
JPH11198987A (en) Method and apparatus for packing semiconductor chip
CN220010711U (en) Kiwi fruit packing carton with protect function
JP2006282278A (en) Packaging element for wafer
JPH08328202A (en) Light-shielding packaging method of stack of photosensitive sheets
JP2004231230A (en) Packing sheet and packing method
GB2013607A (en) Reinforcing inserts for packages
US20050077201A1 (en) Packaging assembly and removal method thereof
JPH0298510A (en) Method of packaging book
JP2001055274A (en) Packing container, semiconductor device, and manufacture of semiconductor device
JPS60167414A (en) Semiconductor packing body
JPH02235349A (en) Manufacture of semiconductor device
JPH0199976A (en) Package
JP3196407B2 (en) Electronic equipment protection bag
JP3645538B2 (en) Bulk packaging method and separate sheet for bulk packaging
JPS5917816Y2 (en) Opening plastic film packaging
JPH08310560A (en) Packaging structure of ceramic sheet
JP3804708B2 (en) Pachinko machine packing method
KR100506850B1 (en) A Buffing pack and method of Buffing pack
JPS6130986B2 (en)

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
J2X1 Appeal (before the patent court)

Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL

E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20041116

Year of fee payment: 12

EXPY Expiration of term