KR20180006262A - Coil component - Google Patents

Abstract

The present invention relates to a coil part capable of improving a quality factor by changing the shape of a coil. The coil part according to an embodiment of the present invention comprises a body including a plurality of insulating layers including a coil pattern. The coil pattern includes a coil part, a lead part disposed on one side of the insulating layer, and a connection part connecting the coil part and the lead part, wherein a pattern line of the coil part has an arc shape, and the connection part is formed at one end of the lead part in a tangential direction of the coil part.

Description

Coil Components {COIL COMPONENT}

The present invention relates to a coil component.

Recently, in the case of a smart phone, a signal of a wide frequency band is used. In coil components, coil components are mainly used as impedance matching circuits in a radio frequency system for transmitting and receiving high frequency signals, and the use of such high frequency coil components is continuously increasing.

The coil parts are required to be usable at a high frequency of 100 MHz or more due to the self resonance frequency (SRF) of a high frequency band and the low resistivity based on the miniaturization. In addition, a high Q (quality factor) characteristic is required to reduce the loss in the device frequency.

In the case of coil parts, the material quality is absolutely high since the material is low in resistivity using a photolitho method and high Q (quality factor) is being realized. However, when the same material is used, optimization of the shape and structure of the coil part of the coil part is required to realize a high Q (quality factor) characteristic.

Korean Patent Registration No. 10-1396649 Korean Patent Registration No. 10-1532148

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coil component capable of improving the Q characteristic by changing the shape of a coil.

An embodiment of the present invention includes a body including a plurality of insulating layers including a coil pattern, wherein the coil pattern includes a coil portion, a lead portion disposed on one side of the insulating layer, and a connecting portion connecting the coil portion and the lead portion The pattern line of the coil part has an arc shape, and the connection part provides a coil part formed in a tangential direction of the coil part at one end of the lead part.

According to an embodiment of the present invention, the resistance of the inductor can be lowered to improve the Q characteristic.

1 is a perspective view schematically showing a coil part according to an embodiment of the present invention.
2 is a cross-sectional view showing the shape of a coil pattern of a coil component according to various embodiments of the present invention.
3 is a plan view schematically showing the shape of a coil pattern formed on an insulating layer according to an embodiment of the present invention.
4 is a view showing a via forming position of the coil component of Fig.
5A and 5B are perspective views schematically showing a coil part according to a comparative example of the present invention.
6 is a process diagram showing a method of manufacturing a coil component according to an embodiment of the present invention.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. The shape and size of elements in the drawings may be exaggerated for clarity.

The Q characteristic of the coil part is improved as the inductance is higher and the resistance is lower.

Accordingly, in the present invention, the Q characteristic is improved by reducing the resistance of the coil component, and an optimal coil shape for this purpose is proposed.

Hereinafter, a coil component according to the present invention will be described.

FIG. 1 is a perspective view schematically showing a coil part according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the shape of a coil pattern of a coil part according to various embodiments of the present invention, 1 is a plan view schematically showing the shape of a coil pattern formed on an insulating layer according to an embodiment.

1 to 3, a coil component 100 according to an embodiment of the present invention includes a body 110 including a plurality of insulating layers 111 including a coil pattern, and includes a coil pattern 122 And 122 each include a coil portion 121a and 122a, lead portions 121c and 122c disposed on one side of the insulating layer, and connecting portions 121b and 122b connecting the coil portion and the lead portion, And the connection portion is formed in the tangential direction of the coil portion at one end of the lead portion.

The body 110 is formed by stacking a plurality of insulating layers. The plurality of insulating layers forming the body 110 are sintered, and the boundaries between adjacent insulating layers can be integrated so as to be difficult to confirm without using a scanning electron microscope (SEM).

The body 110 may be in the shape of a hexahedron, and includes a top surface and a bottom surface, a side surface connecting the top surface and the bottom surface, and a cross-section connecting the top surface and the side surface. In order to clearly explain the embodiment of the present invention, when the directions of the hexahedron are defined, L, W and T shown in Fig. 1 indicate the longitudinal direction, the width direction and the thickness direction, respectively.

The body 110 may be made of ferrite, and may be made of a metal such as Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite, But is not limited thereto.

The coil patterns 121 and 122 may be formed by printing a conductive paste containing a conductive metal to a predetermined thickness on a plurality of insulating layers 111 forming the body 110.

The conductive metal forming the coil pattern is not particularly limited as long as it is a metal having excellent electrical conductivity. For example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium Au), copper (Cu), platinum (Pt), or the like.

The coil patterns 121 and 122 include coil portions 121a and 122a, lead portions 121c and 122c disposed on one side of the insulating layer, and connecting portions 121b and 122b connecting the coil portion and the lead portion .

The coil pattern is composed of a first coil pattern 121 exposed on one side in the longitudinal direction of the body 110 and a second coil pattern 122 exposed on the other side in the longitudinal direction and having a polarity different from that of the first coil pattern .

The first coil pattern 121 includes a first coil part, a first coil part 121c exposed through a surface perpendicular to the lamination surface of the body 110, and a second coil part 121c connecting the first coil part and the first coil part The second coil pattern 122 includes a second coil part, a second coil part 122c exposed through a surface perpendicular to the lamination surface of the body 110, And a first connection part for connecting the first lead-out part.

For example, the first and second lead portions 121c and 122c may be exposed to one side surface and the other side in the longitudinal direction L of the body 110, which is perpendicular to the laminated surface of the insulating layers to be laminated.

Also, the first and second lead portions 121c and 122c are also exposed to the bottom surface of the body 110 of the body 110. That is, the first and second lead portions are formed on one side lower portion and the other side lower portion of the insulating layer, respectively, and the first and second lead portions may have an L shape in a length-thickness direction cross section of the body 110 .

The connection portion may be formed in a tangential direction of the coil portion at one end of the lead portion, and may be in contact with an upper portion of the coil portion.

That is, the first connection portion is formed in the tangential direction of the first coil portion at one end of the first lead portion formed at one side of the insulating layer, and the second connection portion is formed in the tether of the second lead portion formed at the other side of the insulation layer And is formed in the tangential direction of the second coil portion.

The connection portion is formed in a tangential direction of the coil portion at one end of the lead portion, that is, at a shortest distance between the lead portion and the coil portion.

When the connecting portion is formed in the tangential direction of the coil portion, since the corner portion formed by the connecting portion with the lead portion is formed at an obtuse angle, the resistance of the entire coil pattern can be reduced and the Q characteristic can be improved.

A via 145 is formed at a predetermined position in each insulating layer including the coil pattern. The first and second coil patterns formed on the insulating layers through the vias are electrically connected to each other to form one coil .

The vias 145 may be formed in a pattern line of the coil portion.

In the case of the vias 145, a via pad (not shown) may be disposed for stable via connection and alignment between the patterns, and the via pad may be larger than the width of the coil pattern.

In the case of the via pad, it may be formed around the pattern line of the coil part, or may be formed inside or outside the coil part, but the present invention is not limited thereto.

The via 145 may be formed by forming a through hole using a mechanical drill or a laser drill, and then filling the through hole with a conductive material by plating.

The via 145 may be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd) .

At this time, the plurality of insulating layers 111 including the coil pattern are laminated in the width direction W or the length direction L of the body 110, so that the first and second coil patterns 121 and 122 And may be disposed in a direction perpendicular to the substrate mounting surface of the body 110. That is, the coil pattern may be arranged perpendicularly to the upper and lower surfaces of the body.

5A and 5B are perspective views schematically showing a coil part according to a comparative example of the present invention.

5A and 5B, the coil patterns 212 and 222 of the coil component 200 according to the comparative example have a rectangular shape. However, when the coil pattern has a polygonal shape with an edge, the edge of the coil pattern has a higher current density than other portions. Therefore, in the case of the comparative example, the resistance of the coil part itself increases due to the existence of the corner, and the Q characteristic is deteriorated.

Referring to FIG. 2, in the coil component 100 according to the present invention, the pattern lines of the coil parts 121a and 122a of the coil pattern have an arc shape having no corner, so that the resistance of the coil component can be lowered, Can be improved.

The pattern lines of the coil parts 121a and 122a may have any one of circular, elliptical, and track shapes.

4 is a view showing a via forming position of the coil component of Fig. In Fig. 3, the dotted line indicates the via formation position.

Referring to FIGS. 4A and 4B, when the pattern lines of the coil part have a circular or oval shape, the vias 145 may be positioned at equal intervals of 45 ° (A).

As the distance between the coil pattern and the external electrode increases, the influence of parasitic capacitance or current flowing between the coil pattern and the external electrode can be prevented, so that the via is not adjacent to the external electrode.

The via pad for connecting the via may be formed on the inner side of the coil part when the via is formed in the area contacting the diagonal line connecting the corners of the body in the pattern line of the coil part, May be formed around the pattern line of the coil part or may be formed outside the coil part.

Referring to FIG. 4C, if the pattern line of the coil part has a track shape, the vias 145 may be located at a 90 ° equidistant point and a point where a straight line and a curve meet (A, B ).

In particular, when the pattern line of the coil part has a track shape, the vias 145 may be arranged in a straight line section in the coil part. (A) when the via is formed in the straight section of the coil part, more vias may be formed in the allowance space than when the via is formed in the curved section (B) of the coil part, Defects can be reduced.

The larger the allowable space for arranging the vias in a certain region of the coil pattern, the more turns the coil pattern of one layer can have. Therefore, when the number of turns of a specific coil is implemented, the capacity can be realized by satisfying the number of turns of the coil even if the number of stacked coil layers is reduced. have. Further, since the number of coil layers is smaller and the number of coil turns is realized, the process can be simplified.

For example, if only two vias can be arranged in one coil pattern, the number of turns of the coil pattern of one layer may be a maximum of 1/2 turn. However, if the number of vias is five or more, the number of turns that the coil pattern can have increases.

Therefore, when the pattern line of the coil part is a track type, the number of vias that can be arranged in the straight line section is larger than the circular or elliptical shape, the number of turns of the coil pattern can be increased more than the circular or elliptical shape, Coil parts can be secured.

When the pattern line of the coil part is a track type, a plurality of vias may be arranged at regular intervals in a straight line section, and the number of vias that can be arranged in a straight line section may be 3 to 5, but the present invention is not limited thereto.

Table 1 below shows the product characteristics of the coil part according to the embodiment of FIG. 1 and the coil part according to the comparative example of FIG. 4A. For reference, the design rules except for the line width are the same, and the coil shape is designed to be changed. For the sake of comparison, both are designed with the same inductance capacity.

Inductance (L; nH) Q Rs (Ω) Rs (Ω) The rate of change (0.5, 2.4 Hz) 0.5 2.4 0.5 2.4 0.5 2.4 0.001 % L % Q % Rs % Rdc Comparative Example 0.62 0.61 23.96 51.35 0.08 0.18 0.018 0.0% 0.0% 0.0% 0.0% Example 0.62 0.61 24.96 54.69 0.08 0.17 0.020 -0.1% 6.5% -5.9% 12.9%

Referring to Table 1, it can be seen that the coil component according to an embodiment of the present invention has a Q characteristic improved by about 6.5% in spite of the same inductance capacity as the coil component according to the comparative example.

According to an embodiment of the present invention, the body 110 may further include a dummy lead portion 123 disposed on a plurality of insulating layers and exposed to the outside.

The dummy lead portion 123 may be included in the body 110 by forming a pattern on the plurality of insulating layers in the same shape as the first lead portion 121c and the second lead portion 122c.

The dummy lead portion 123 may be connected to the first and second coil patterns 121 and 122 through first and second dummy vias (not shown), and the first coil pattern and the second coil pattern may be connected in parallel Lt; / RTI >

That is, a plurality of insulating layers on which the first and second coil patterns 121 and 122 are formed and a plurality of insulating layers on which the dummy lead portions 123 are formed are laminated adjacent to each other, Lt; RTI ID = 0.0 > 110 < / RTI >

A plurality of insulating layers on which the dummy lead portions 123 are formed are laminated adjacent to a plurality of insulating layers on which the first and second coil patterns 121 and 122 are formed, A greater number of metal bonds can be formed with the external electrodes 131 and 132 to be disposed so that the adhesive force between the first and second coil patterns and the external electrode and the adhesive force between the electronic component and the printed circuit board can be improved .

The laminated electronic component according to an embodiment of the present invention includes a first external electrode 131 disposed on one side surface and a bottom surface of the body 110 in the longitudinal direction and connected to the first lead portion 121c, And a second external electrode 132 disposed on the lower surface and connected to the second lead portion 122c.

The first outer electrode 131 and the second outer electrode 132 are connected to the first lead portion 121c and the second lead portion 122c of the first and second coil patterns 121 and 122 And may be formed on a surface perpendicular to the lower surface of the body 110 and the laminated surface, particularly, the other surface facing the longitudinal side of the body 110.

The first outer electrode 131 and the second outer electrode 132 are not particularly limited as long as they are platable metals. For example, the first outer electrode 131 and the second outer electrode 132 may be nickel (Ni) or tin (Sn)

Hereinafter, a method of manufacturing a coil component according to the present invention will be described.

6 is a process diagram showing a method of manufacturing a coil component according to an embodiment of the present invention.

Referring to FIG. 6, a method of manufacturing a coil component according to an embodiment of the present invention includes forming an insulating layer including a coil pattern, and laminating an insulating layer including a coil pattern to form a body , The coil pattern includes a coil portion, a lead portion disposed on one side of the insulating layer, and a connecting portion connecting the coil portion and the lead portion, wherein the pattern line of the coil portion has an arcuate shape, As shown in Fig.

First, a coil pattern can be formed on a substrate.

The substrate may be a copper clad laminate (CCL) coated with a copper foil so that a circuit board can be used on a resin or a resin, but is not limited thereto.

The resin may be a phenol resin, an epoxy resin, a polyester, a polyimide, or the like.

A coil pattern can be formed on the substrate by plating a conductive metal using a photosensitive film.

The conductive metal is not particularly limited as long as it is a metal having an excellent electrical conductivity. Examples of the conductive metal include silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti) Cu), platinum (Pt), or the like, alone or in combination, and may be copper (Cu), but is not limited thereto.

The coil pattern includes a coil portion, a lead portion disposed on one side of the insulating layer, and a connecting portion connecting the coil portion and the lead portion.

The pattern line of the coil part has an arc shape, and may have a shape of, for example, a circular shape, an elliptical shape, and a track shape.

The lead portion is formed on one side of the lower side of the insulating layer and may have an L shape.

The connection portion may be formed in a tangential direction of the coil portion at one end of the lead portion, and may be in contact with an upper portion of the coil portion.

Next, an insulating layer including a coil pattern is formed.

And an insulating material is bonded to the coil pattern to form an insulating layer including a coil pattern.

The insulating material may be formed to cover the coil pattern exposed on the substrate.

The insulating material used for the production of the insulating layer is not particularly limited as a magnetic material and examples thereof include Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite, Li Based ferrite powders such as ferrite powders can be used.

A plurality of insulating layers may be provided by applying a slurry formed by mixing the magnetic material and the organic material onto a carrier film and drying the slurry.

Next, a via is formed in the insulating layer including the coil pattern.

A via is formed to connect the coil pattern.

The vias 45 may be formed by forming a through hole using a mechanical drill or a laser drill, and then filling the through hole with a conductive material by plating.

The vias 45 may be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd) .

The coil pattern is formed as a coil in the step of forming a body by laminating as described later.

Thereafter, the insulating layer may be separated from the substrate.

Next, an insulating layer including the coil pattern is stacked in a lump to form a body.

A plurality of insulating layers separated from the substrate may be laminated to form a body including a coil having a bottom surface and a coiled surface exposed to a surface perpendicular to the laminate surface.

Vias are formed between the coil patterns, and the coil patterns formed on the insulating layers through the vias are electrically connected to each other to form one coil.

The lead portion of the coil pattern formed by one coil may be exposed on the lower surface of the body and a surface perpendicular to the laminated surface.

The coil pattern may be formed in a direction perpendicular to the substrate mounting surface of the body.

Next, an external electrode connected to the lead portion of the coil pattern may be formed on the lower surface of the body and the surface perpendicular to the laminated surface.

The external electrode may be formed using a conductive paste containing a metal having excellent electrical conductivity or may be formed by metal plating. The metal may be nickel (Ni), tin (Sn) alone, or an alloy thereof.

In addition, the same parts as those of the above-described multilayer electronic component according to the embodiment of the present invention will be omitted here.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited by the appended claims.

It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

100: Coil parts
110: Body
121, 122: Coil pattern
123:
131, 132: external electrode
145: Via

Claims (14)

And a body including a plurality of insulating layers including a coil pattern,
Wherein the coil pattern includes a coil portion, a lead portion disposed on one side of the insulating layer, and a connecting portion connecting the coil portion and the lead portion,
The pattern line of the coil part has an arc shape,
And the connection portion is formed in a tangential direction of the coil portion at one end of the lead portion.
The method according to claim 1,
Wherein the pattern line of the coil part has a shape of either a circle, an ellipse, and a track.
The method according to claim 1,
Wherein the lead portion is formed at a lower portion of one side of the insulating layer, and has an L-shaped configuration.
The method according to claim 1,
And the connecting portion is in contact with an upper portion of the coil portion.
The method according to claim 1,
The coil pattern is connected via a via.
6. The method of claim 5,
Wherein the pattern line of the coil section has a track-
Wherein the vias are arranged in a linear section in the coil section.
The method according to claim 1,
The body includes a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface,
And the coil pattern is stacked in the vertical direction on the upper surface and the lower surface.
The method according to claim 1,
And an outer electrode electrically connected to the coil pattern, the outer electrode being disposed on a lower surface and a part of a side surface of the body.
9. The method of claim 8,
And the external electrode is L-shaped.
Forming an insulating layer including a coil pattern; And
And forming a body by laminating a plurality of insulating layers including the coil pattern,
Wherein the coil pattern includes a coil portion, a lead portion disposed on one side of the insulating layer, and a connecting portion connecting the coil portion and the lead portion,
The pattern line of the coil part has an arc shape,
Wherein the connecting portion is formed in a tangential direction of the coil portion at one end of the lead portion.
11. The method of claim 10,
Wherein the pattern line of the coil part has a shape of a circle, an ellipse, and a track.
11. The method of claim 10,
Wherein the lead portion is formed at a lower portion of one side of the insulating layer and has an L-shaped shape.
11. The method of claim 10,
Wherein the coil pattern is connected via a via.
14. The method of claim 13,
Wherein the pattern line of the coil section has a track-
Wherein the vias are arranged in a straight line section in the coil section.

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