KR20100008509A - A surface mount device type light emmitting diode and backlight unit uusing the same - Google Patents

A surface mount device type light emmitting diode and backlight unit uusing the same Download PDF

Info

Publication number
KR20100008509A
KR20100008509A KR1020080069029A KR20080069029A KR20100008509A KR 20100008509 A KR20100008509 A KR 20100008509A KR 1020080069029 A KR1020080069029 A KR 1020080069029A KR 20080069029 A KR20080069029 A KR 20080069029A KR 20100008509 A KR20100008509 A KR 20100008509A
Authority
KR
South Korea
Prior art keywords
electrode terminal
package
heat dissipation
led package
heat
Prior art date
Application number
KR1020080069029A
Other languages
Korean (ko)
Other versions
KR101122059B1 (en
Inventor
정천기
최용석
서창식
박정운
김재인
김돈수
유순재
Original Assignee
주식회사 이츠웰
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이츠웰 filed Critical 주식회사 이츠웰
Priority to KR1020080069029A priority Critical patent/KR101122059B1/en
Publication of KR20100008509A publication Critical patent/KR20100008509A/en
Application granted granted Critical
Publication of KR101122059B1 publication Critical patent/KR101122059B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE: A surface mount device type light emitting diode and backlight unit using the same is provided to improve the emission effect of the heat. CONSTITUTION: The package body(10) is formed with the metal plate. Using the division of the metal plate, the first electrode terminal(11) and the second electrode terminal(12) are formed. The LED chip(15) is mounted in the electrode terminal of one side. The LED chip, and the first electrode terminal and the second electrode terminal are respectively connected with the access line. The resin is molded in the upper of the second electrode terminal and the first electrode terminal. Using the resin molding, the lens(17) is formed. The heat emitting unit(13) is formed in the package body. The heat emitting unit directly releases the heat of the LED chip.

Description

표면 실장형 엘이디 패키지와 이를 이용한 백 라이트 유닛{A Surface Mount Device Type Light Emmitting Diode and Backlight Unit Uusing The Same}A Surface Mount Device Type Light Emmitting Diode and Backlight Unit Uusing The Same}

본 발명은 반도체를 이용하여 빛을 발생시키는 엘이디 패키지 중에서 표면실장형 엘이디 패키지와 이를 이용한 백 라이트 유닛에 관한 것이다.The present invention relates to a surface-mount type LED package and a backlight unit using the same among the LED package for generating light using a semiconductor.

이를 좀 더 상세히 설명하면, 단자가 형성되는 패키지(Package)본체를 메탈플레이트(Metal Plate)로 형성하고, 메탈플레이트를 분할하여 제1전극단자와 제2전극단자를 형성하며, 어느 일측의 전극단자에 발광다이오드칩을 실장하고 발광다이오드칩과 제1전극단자와 제2전극단자를 접속선으로 각각 연결하며, 제1전극단자와 제2전극단자의 상측에 수지를 몰딩한 것에 있어서, In more detail, the package body in which the terminal is formed is formed of a metal plate, the metal plate is divided to form a first electrode terminal and a second electrode terminal, and an electrode terminal on either side. In the case where the light emitting diode chip is mounted on the light emitting diode chip, the light emitting diode chip, the first electrode terminal, and the second electrode terminal are respectively connected by connecting lines, and the resin is molded on the first electrode terminal and the second electrode terminal.

상기 제1전극단자와 제2전극단자가 형성되는 패키지본체에는 발광다이오칩에서 발생하는 열(과 빛)을 직접 방출하는 열방출수단을 나란하게 구비하여 열의 방출특성을 향상시킬 수 있도록 된 표면 실장형 엘이디 패키지와 상기 표면 실장형 엘이디 패키지를 모듈용 PCB에 식설하여 형성하여서 된 백 라이트 유닛을 제공하려는 것이다.The package body in which the first electrode terminal and the second electrode terminal are formed is provided with side by side heat dissipation means for directly dissipating heat (and light) generated from the light emitting diode chip to improve the heat dissipation characteristics. It is to provide a backlight unit formed by implanting a type LED package and the surface-mount type LED package on a module PCB.

발광다이오드(LED: Light Emmitting Diode)는, 반도체의 pn접합에 전류를 흘려 보내면 빛이 방출되도록 한 다이오드의 일종으로서, 비소화갈륨(GaAs)은 적외선용으로 이용되는 발광다이오드, 비소화갈륨알루미늄(GaAlAs)은 적외선 또는 빨간색용으로 이용되는 발광다이오드, 인화갈륨비소(GaAsP)는 빨간색ㆍ주황색ㆍ 또는 노란색 용으로 이용되는 발광다이오드, 인화갈륨(GaP)은 빨간색ㆍ녹색 또는 노란색 용으로 이용되는 발광다이오드, 갈륨나이트(GaN)는 희토류 물질인 CrㆍTmㆍTb를 활성이온으로 하는 형광체를 혼합하여 백색을 발광하도록 하는 백색 발광다이오드 등이 알려져 있다.Light emitting diodes (LEDs) are a type of diode that emits light when a current flows through a pn junction of a semiconductor, and gallium arsenide (GaAs) is a light emitting diode and gallium arsenide aluminum (A) used for infrared rays. GaAlAs) is a light emitting diode used for infrared or red light, gallium arsenide phosphide (GaAsP) is used for red, orange, or yellow light emitting diode, and gallium phosphide (GaP) is used for red, green or yellow light Gallium nitrite (GaN) is known as a white light emitting diode which emits white light by mixing phosphors containing Cr · Tm · Tb as rare earth materials as active ions.

발광다이오드(LED: Light Emmitting Diode)는 램프형(Lamp Type) 발광다이오드와 표면실장형(SMD:Surface Mount Device Type) 발광다이오드가 알려져 있다.Light emitting diodes (LEDs) are known as lamp type light emitting diodes and surface mount device type (SMD) light emitting diodes.

램프형(Lamp Type) 발광다이오드는, 기판의 상측에 2개의 리드 프레임(금속 전극)을 형성하여 엘이디칩을 실장하고 그 외측에 수지(플라스틱 수지)를 몰딩하여 렌즈(17)로 형성한 것이나, 열 저항이 크고 열 방출이 어려워 고출력용으로 활용하기가 용이치 못한 문제가 있다.Lamp type light emitting diodes are formed by forming two lead frames (metal electrodes) on an upper side of a substrate, mounting an LED chip, and molding a resin (plastic resin) on the outside thereof to form a lens 17. There is a problem that the heat resistance is large and difficult to dissipate heat is not easy to use for high power.

반면에 표면실장형(SMD:Surface Mount Device Type) 발광다이오드는, 세라믹 등으로 형성된 기판(PCB)의 상측에 다이(Die)를 본딩하고 그 상측에 수지를 몰딩하여 렌즈(17)로 형성한 것으로서, 열을 램프형(Lamp Type) 발광다이오드보다 다소 용이하게 방출할 수 있는 특징이 있다.On the other hand, a surface mount device (SMD) light emitting diode is formed by bonding a die to an upper side of a substrate (PCB) formed of ceramic or the like and molding a resin on the upper side to form a lens 17. In addition, the heat dissipation characteristics of the lamp type light emitting diodes are somewhat easier.

발전을 거듭하는 표면실장형(SMD:Surface Mount Device Type) 발광다이오드는, 휘도가 비약적으로 향상되면서 컬러형 전광판과 조명장치 등 여러 분야에서 널 리 활용되고 있다.Surface Mount Device Type (SMD) light emitting diodes, which are continuously developing, are widely used in various fields such as color display boards and lighting devices due to the dramatic increase in brightness.

도 1a와 도 1b는 PCB형 엘이디 패키지(1-1)와 리드프레임형 엘이디 패키지(1-2)로 각각 형성된 종래의 표면실장형 발광다이오드 패키지(1)를 보인 예시도(단면도)이다.1A and 1B are exemplary views (sectional views) showing a conventional surface mount type light emitting diode package 1 formed of a PCB type LED package 1-1 and a lead frame type LED package 1-2, respectively.

도 1a에 예시된 PCB형 엘이디 패키지(1-1)는, 플라스틱으로 형성된 기판(2)의 외면 양측에 금속기판을 각각 씌워 제1전극단자(3-1)와 제2전극단자(3-2)를 형성하고, 제1전극단자(3-1)의 상면에 엘이디칩(5)을 실장하며, 엘이디칩(5)을 금전선으로 된 접속선(6)에 의해 제1전극단자(3-1)와 제2전극단자(3-2)에 연결하고 그 외측에 수지를 몰딩하여 렌즈(7)를 형성한 것이다.In the PCB type LED package 1-1 illustrated in FIG. 1A, the first electrode terminal 3-1 and the second electrode terminal 3-2 are covered with metal substrates on both sides of the outer surface of the substrate 2 formed of plastic. ), The LED chip 5 is mounted on the upper surface of the first electrode terminal 3-1, and the first electrode terminal 3- is connected to the LED chip 5 by a connection line 6 made of a cash wire. The lens 7 is formed by connecting to 1) and the second electrode terminal 3-2 and molding a resin on the outside thereof.

도 1b에 예시된 리드프레임형 엘이디 패키지(1-2)는, 기판(2)의 외면 양측에 메탈플레이트을 절곡하여 제1전극단자(4-1)와 제2전극단자(4-2)를 형성하고, 제1전극단자(4-1)의 상면에 엘이디칩(5)을 실장하며, 엘이디칩(5)을 금전선으로 된 접속선(6)에 의해 제1전극단자(4-1)와 제2전극단자(4-2)에 연결하며, 제1전극단자(4-1)와 제2전극단자(4-2)의 상면에 형성된 반사구조물(8)의 내부에 수지를 몰딩하여 렌즈(7)를 형성한 것이다.In the lead frame type LED package 1-2 illustrated in FIG. 1B, metal plates are bent on both sides of the outer surface of the substrate 2 to form the first electrode terminal 4-1 and the second electrode terminal 4-2. The LED chip 5 is mounted on the upper surface of the first electrode terminal 4-1, and the LED chip 5 is connected to the first electrode terminal 4-1 by a connection line 6 made of a cash wire. The resin is connected to the second electrode terminal 4-2 and molded into the reflective structure 8 formed on the upper surface of the first electrode terminal 4-1 and the second electrode terminal 4-2. 7) is formed.

상기와 같이 형성된 종래의 PCB형 엘이디 패키지(1-1)와 리드프레임형 엘이디 패키지(1-2)는, 엘이디칩(5)에서 발생하는 열을 제1전극단자(3-1)(4-1)의 측면(Side) 또는 밑면(Bottom)에 의해 방출시키므로 엘이디칩(5)에서 발생하는 열과 빛을 효율적으로 방출(반사)시킬 수 없는 문제가 있다.In the conventional PCB type LED package 1-1 and the lead frame type LED package 1-2 formed as described above, the heat generated from the LED chip 5 is transferred to the first electrode terminal 3-1 (4-). Since it is emitted by the side or bottom of 1), there is a problem that the heat and light generated from the LED chip 5 cannot be emitted (reflected) efficiently.

발광다이오드(LED) 즉, 표면실장형 발광다이오드 패키지(1)가 고휘도를 필요 로 하는 분야에서 활용되어 소모전력이 증가함에 따라 발광다이오드(LED)에서는 다량의 열이 발생하게 되고, 이와 같이 발생하는 고열을 외부에 효율적으로 방출시키지 못하게 되면 발광다이오드(LED)의 특성이 변화되거나 수명이 단축되는 문제 등이 발생하게 된다.As the light emitting diode (LED), that is, the surface mounted light emitting diode package 1 is utilized in a field requiring high brightness, a large amount of heat is generated in the light emitting diode (LED) as power consumption increases. Failure to efficiently dissipate high heat to the outside causes problems such as changes in the characteristics of the light emitting diodes (LEDs) or shortened lifetimes.

상기와 같은 열 방출문제를 해소하기 위하여, CuㆍAlㆍAg 등과 같이 열전도성이 우수한 금속물질을 이용하여 열방출수단을 별도로 형성하여 기판에 부착하기도 하였으나, 열방출수단을 별도로 제작하고 기판에 부착하여야 하므로 용이하게 제조할 수 없을 뿐만 아니라 발광다이오드 패키지의 제조비용이 추가되어 제조원가를 상승시키게 되는 문제가 있다.In order to solve the heat dissipation problem as described above, heat dissipation means may be separately formed and attached to a substrate using a metal material having excellent thermal conductivity such as Cu, Al, Ag, etc., but heat dissipation means may be separately manufactured and attached to the substrate. Since it should not be easy to manufacture, there is a problem that the manufacturing cost of the light emitting diode package is added to increase the manufacturing cost.

이러한 문제를 다소나마 해소할 수 있도록 제안된 것으로는 국내의 특허등록 제10-616692호 "금속기판을 이용한 LED 패키지 및 그 제조방법"이 알려져 있다.Proposed to solve this problem somewhat, domestic patent registration No. 10-616692 "LED package using a metal substrate and its manufacturing method" is known.

이는 금속기판을 3개로 분할하여 서로 접속되는 면에 절연물질을 개입시키고 외면에 절연물질을 씌워 제2영역을 일체로 형성하고, 3개의 분할금속기판 중에서 어느 하나에는 LED칩을 실장하여 LED칩과 다른 2개의 분할금속기판은 접속선으로 연결하며, 제2영역을 형성하는 절연물질의 외측에는 다른 금속기판으로 된 별도의 제1영역을 일체형으로 접착 형성한 것이다.It divides the metal substrate into three parts, intersects the insulating material on the surfaces connected to each other, and covers the outer surface with the insulating material to form the second area integrally, and one of the three divided metal substrates mounts the LED chip to the LED chip and The other two divided metal substrates are connected by a connecting line, and a separate first region made of another metal substrate is integrally bonded to the outside of the insulating material forming the second region.

그러나, 이와 같이 형성된 종래의 LED 패키지는 다음과 같은 문제가 단점으로 지적된다.However, in the conventional LED package formed as described above, the following problems are pointed out as disadvantages.

LED칩이 실장된 하나의 분할금속판이 다른 2개의 분할금속기판과는 절연물질에 의해 원천적으로 차단되어 있으므로 LED칩에서 발생하는 열이 LED칩이 실장된 그 분할금속기판에만 전열되고 다른 2개의 분할금속판에는 전열되지 못하는 문제가 있다.Since one divided metal plate on which the LED chip is mounted is inherently blocked from the other two divided metal substrates by an insulating material, heat generated from the LED chip is transferred only to the divided metal substrate on which the LED chip is mounted, and the other two divided metal plates are separated. There is a problem in that the metal plate can not be transferred.

또 제2영역을 형성하는 분할금속판들과 제1영역을 형성하는 금속기판도 절연물질에 의해 원천적으로 차단되어 있으므로 LED칩이 실장된 분할금속기판의 열이 제2영역의 금속기판에 전열(전달)되지 못하게 되는 문제가 있다.In addition, since the divided metal plates forming the second region and the metal substrate forming the first region are also blocked by an insulating material, the heat of the divided metal substrate on which the LED chip is mounted is transferred to the metal substrate of the second region. There is a problem that can not be.

따라서, LED칩이 실장된 그 분할금속기판의 열이 제2영역의 다른 분할금속기판 및 제1영역의 금속기판을 통해 방출되지 못하고 LED칩이 실장된 그 분할금속기판에만 가둬 지게 되므로, LED칩이 실장된 그 분할금속기판은 열에 의해 급속하게 상승하게 되어 열 방출(냉각)효과를 전혀 기대할 수 없는 문제가 있다.Therefore, the heat of the divided metal substrate on which the LED chip is mounted is not discharged through the other divided metal substrate of the second region and the metal substrate of the first region, and is confined only to the divided metal substrate on which the LED chip is mounted. The mounted divided metal substrate is rapidly risen by heat, and there is a problem in that no heat dissipation (cooling) effect can be expected.

이와 같이 LED칩이 실장된 분할금속기판은 오히려 열이 축열되는 현상이 발생하고, 열이 축열됨으로서 축열되는 열에 의해 실장된 LED칩의 특성이 변화되거나 접속선의 접속 부분이 단선되어 수명이 단축되는 등의 문제를 유발시키게 된다.As such, the split metal substrate on which the LED chip is mounted has a phenomenon in which heat is accumulated, and as the heat is accumulated, the characteristics of the LED chip mounted by the accumulated heat are changed or the connection part of the connection line is disconnected, thereby shortening the lifespan. Will cause problems.

본 발명은 상기와 같은 문제를 해소할 수 있도록 더욱 개선된 표면실장형 엘이디 패키지를 제공하려는 것이다.The present invention is to provide a surface-mounted LED package further improved to solve the above problems.

본 발명은, 단자가 형성되는 패키지(Package)본체를 메탈플레이트(Metal Plate)로 형성하고, 메탈플레이트를 분할하여 제1전극단자와 제2전극단자를 형성하며, 어느 일측의 전극단자에 발광다이오드칩을 실장하고 발광다이오드칩과 제1전극 단자와 제2전극단자를 접속선으로 각각 연결하며, 제1전극단자와 제2전극단자의 상측에 수지를 몰딩한 하되, 상기 제1전극단자와 제2전극단자가 형성된 패키지에는 발광다이오드칩에서 발생하는 열(과 빛)을 직접 전도 받아 방출하는 열방출수단을 구비하여 형성한 것;을 특징으로 하는 표면실장형 엘이디 패키지를 제공하려는데 그 목적이 있다.According to the present invention, a package body in which a terminal is formed is formed of a metal plate, and the metal plate is divided to form a first electrode terminal and a second electrode terminal, and a light emitting diode is formed on one of the electrode terminals. The chip is mounted, and the light emitting diode chip, the first electrode terminal, and the second electrode terminal are connected by connecting lines, respectively, and a resin is molded on the upper side of the first electrode terminal and the second electrode terminal. The purpose of providing a surface-mount LED package is characterized in that the package formed with a two-electrode terminal is provided with a heat-emitting means for directly conducting and emitting heat (and light) generated from the light emitting diode chip; .

본 발명의 다른 목적은, 발광다이오칩에서 발생하는 열을 직접 전도 받아 방출하는 열방출수단은, 제1전극단자와 제2전극단자가 형성되는 패키지본체에 일체로 형성하거나, 또는 별도로 형성하여 상기 패키지본체에 일체형으로 연결 형성한 것;을 특징으로 하는 표면실장형 엘이디 패키지를 제공하려는데 있다.Another object of the present invention, the heat dissipation means for directly conducting and dissipating heat generated from the light emitting diode chip is formed integrally with the package body in which the first electrode terminal and the second electrode terminal is formed, or separately formed It is to provide a surface-mount LED package, characterized in that formed integrally connected to the package body.

본 발명의 또 다른 목적은, 발광다이오드칩이 식설된 메탈플레이트는 전극단자용 분할 메탈플레이트의 사이에 설치하거나, 전극단자용 분할 메탈플레이트를 나란하게 형성하고 나란하게 형성되는 분할 메탈플레이트 중에서 어느 일측 분할 메탈플레이트의 외측에 일체형으로 형성한 것;을 특징으로 하는 표면실장형 엘이디 패키지를 제공하려는데 있다.Another object of the present invention, the metal plate implanted with a light emitting diode chip is provided between the split metal plate for the electrode terminal, or any one side of the split metal plate formed side by side to form a split metal plate for the electrode terminal. It is to provide a surface-mount LED package, characterized in that formed integrally on the outside of the divided metal plate.

본 발명의 또 다른 목적은, 발광다이오칩에서 발생하는 열을 직접 전도 받아 방출하는 열방출수단은 메탈 플레이트를 3분할하여, 2개의 분할 메탈플레이트는 전극단자로 활용하고 다른 분할 메탈플레이트에는 엘이디칩을 직접 실장하여, 엘이디칩에서 발생하는 열이 전극단자용 분할 메탈플레이트에 전열되지 않고 발광다이오드칩이 실장된 메탈플레이트를 통해 전열되어 방출되도록 하여 열의 방출효과를 향상시킬 수 있도록 한 것;을 특징으로 하는 표면실장형 엘이디 패키지를 제공하려는 데 있다.It is still another object of the present invention that the heat dissipation means for directly conducting and dissipating heat generated from a light emitting diode chip divides a metal plate into three parts, and utilizes two divided metal plates as electrode terminals and an LED chip in another divided metal plate. Direct mounting so that the heat generated from the LED chip is not transferred to the split metal plate for the electrode terminal, but is heat-transmitted through the metal plate mounted with the light emitting diode chip to improve the heat emission effect; The purpose is to provide a surface-mount LED package.

본 발명의 또 다른 목적은, 발광다이오드칩이 실장된 메탈플레이트에는 별도의 전열플레이트를 전열선으로 연결하여 방열효과를 배가시킬 수 있도록 한 것;을 특징으로 하는 표면실장형 엘이디 패키지를 제공하려는데 있다.Another object of the present invention is to provide a surface-mount LED package, characterized in that the metal plate mounted with a light emitting diode chip is connected to a separate heat transfer plate by a heating wire to double the heat dissipation effect.

본 발명의 또 다른 목적은, 발광다이오드칩이 실장된 메탈플레이트에서 열을 직접 방출시키고, 동시에 발광다이오드칩이 실장된 메탈플레이트에 별도의 전열플레이트를 전열선으로 연결하여 열을 방출시켜 줌으로써, 열이 축적되지 않고 즉시 방출되도록 하여 방열효과를 향상시킬 수 있고 실장된 LED칩의 특성이 변화되거나 접속선의 접속 부분이 단선되어 수명이 단축되는 현상을 원천적으로 배제시킬 수 있도록 된 것;을 특징으로 하는 표면실장형 엘이디 패키지를 제공하려는데 있다.Another object of the present invention, by directly emitting heat from the metal plate on which the light emitting diode chip is mounted, and at the same time by connecting a separate heat transfer plate to the metal plate on which the light emitting diode chip is mounted to emit heat, It can be discharged immediately without accumulating to improve the heat dissipation effect, and it is possible to fundamentally exclude the phenomenon that the characteristics of the mounted LED chip are changed or the connection part of the connection line is shortened to shorten the lifespan. We want to offer a package of LED packages.

본 발명의 또 다른 목적은, 상기와 같이 열이 즉시 배출되어 방열효과가 향상된 표면실장형 엘이디 패키지를 모듈용 PCB에 식설하여 형성함으로써, 장시간 사용하더라도 발광다이오드칩에서 발생하는 열을 효율적으로 방출하여 열이 발생하지 않도록 하고, 식설된 발광다이오드칩의 특성이 변화되거나 수명이 단축되지 않아 장기간 사용할 수 있도록 된 백 라이트 유닛을 제공하려는데 있다.Still another object of the present invention is to form a surface-mounted LED package with improved heat dissipation effect on the module PCB by immediately dissipating heat as described above, thereby efficiently dissipating heat generated from the light emitting diode chip even when used for a long time. The purpose of the present invention is to provide a backlight unit that prevents heat from being generated and has a long lifetime because the characteristics of the light emitting diode chip are not changed or the life is shortened.

본 발명의 상기 및 기타 목적은, The above and other objects of the present invention,

단자가 형성되는 패키지(Package)본체를 메탈플레이트(Metal Plate)로 형성하고, 메탈패키지를 분할하여 제1전극단자와 제2전극단자를 형성하며, 어느 일측의 전극단자에 발광다이오드칩을 실장하고 발광다이오드칩과 제1전극단자와 제2전극단자를 접속선으로 각각 연결하며, 제1전극단자와 제2전극단자의 상측에 수지를 몰딩한 것에 있어서, The package body in which the terminals are formed is formed of a metal plate, the metal package is divided to form a first electrode terminal and a second electrode terminal, and a light emitting diode chip is mounted on one of the electrode terminals. In connecting the light emitting diode chip, the first electrode terminal and the second electrode terminal with a connecting line, respectively, in molding the resin on the upper side of the first electrode terminal and the second electrode terminal,

상기 제1전극단자와 제2전극단자가 형성되는 패키지본체에는 발광다이오칩에서 발생하는 열을 전도 받아 직접 방출하는 열방출수단을 구비하여 형성한 것;을 특징으로 하는 직접 열방출형 엘이디 패키지(1-3)에 의해 달성된다.The package body formed with the first electrode terminal and the second electrode terminal is formed with a heat dissipation means for conducting the heat generated from the light emitting diode chip directly to direct discharge; LED package characterized in that 1-3).

본 발명의 다른 상기 및 기타 다른 목적은, Other above and other objects of the present invention,

열이 즉시 배출되어 방열효과가 향상된 직접 열방출형 엘이디 패키지(1-3)를 모듈용 PCB에 식설하여 형성한 것:을 특징으로 하는 표면 실장형 엘이디 패키지를 이용한 백 라이트 유닛(100)에 의해 달성된다.The heat-dissipating LED package (1-3) having the heat dissipation effect is immediately discharged by implanting on the module PCB: by the backlight unit 100 using the surface-mount LED package, characterized in that Is achieved.

본 발명에 따른 표면실장형 엘이디 패키지는, Surface-mount LED package according to the present invention,

단자가 형성되는 패키지(Package)본체를 메탈플레이트(Metal Plate)로 형성하고, 메탈플레이트를 분할하여 제1전극단자와 제2전극단자를 형성하며, 어느 일측의 전극단자에 발광다이오드칩을 실장하고 발광다이오드칩과 제1전극단자와 제2전극단자를 접속선으로 각각 연결하며, 제1전극단자와 제2전극단자의 상측에 수지를 몰딩한 것에 있어서, 상기 제1전극단자와 제2전극단자가 형성되는 패키지본체에는 발광다이오칩에서 발생하는 열(과 빛)을 직접 전도 받아 방출하는 열방출수단을 구 비하여 형성한 것이다.The package body in which the terminals are formed is formed of a metal plate, the metal plate is divided to form a first electrode terminal and a second electrode terminal, and a light emitting diode chip is mounted on one of the electrode terminals. The light emitting diode chip, the first electrode terminal and the second electrode terminal are respectively connected by connecting lines, and the resin is molded on the upper side of the first electrode terminal and the second electrode terminal, wherein the first electrode terminal and the second electrode terminal The package body is formed by having a heat-emitting means for directly conducting and emitting heat (and light) generated from the light emitting diode chip.

또 본 발명은, 메탈 플레이트를 3분할하여, 2개의 분할 메탈플레이트는 전극단자로 활용하고 다른 분할 메탈플레이트에는 엘이디칩을 직접 실장하여, 엘이디칩에서 발생하는 열이 전극단자용 분할 메탈플레이트에 전열되지 않고 발광다이오드칩이 실장된 메탈플레이트를 통해 직접 전열되어 방출되도록 함으로써, 열의 방출효과를 향상시킬 수 있는 것이다.In the present invention, the metal plate is divided into three parts, and the two divided metal plates are used as electrode terminals, and the LED chip is directly mounted on the other divided metal plates, and heat generated from the LED chips is transferred to the divided metal plates for electrode terminals. Instead, the light emitting diode chip is directly heat-transmitted through the mounted metal plate, thereby improving heat emission effect.

또 본 발명은, 발광다이오드칩이 실장된 메탈플레이트에는 별도의 전열플레이트를 전열선으로 연결하여 방열효과를 크게 향상시킬 수 있고, 발광다이오드칩이 실장된 메탈플레이트에서 열을 직접 방출시키고 동시에 발광다이오드칩이 실장된 메탈플레이트에 별도의 전열플레이트를 전열선으로 연결하여 열을 방출시켜 줌으로써 열이 축적되지 않고 즉시 방출되도록 하여 방열효과를 향상시키며, 실장된 LED칩의 특성이 변화되거나 접속선의 접속 부분이 단선되어 수명이 단축되는 현상을 원천적으로 배제시킬 수 있는 것이다.In another aspect, the present invention, by connecting a separate heating plate to a metal plate mounted with a light emitting diode chip can significantly improve the heat dissipation effect, and emits heat directly from the metal plate on which the light emitting diode chip is mounted, at the same time the light emitting diode chip By connecting a separate heating plate to the mounted metal plate with a heating wire to dissipate heat, the heat is discharged immediately without accumulating heat, thereby improving heat dissipation effect, and the characteristics of the mounted LED chip are changed or the connection part of the connection line is disconnected. It is possible to rule out the phenomenon that the life is shortened.

또한 본 발명은, 상기와 같이 열이 즉시 배출되어 방열효과가 향상된 표면실장형 엘이디 패키지를 모듈용 PCB에 식설하여 형성함으로써, 장시간 사용하더라도 발광다이오드칩에서 발생하는 열을 효율적으로 방출하여 열이 발생하지 않도록 하고, 식설된 발광다이오드칩의 특성이 변화되거나 수명이 단축되지 않아 장기간 사용할 수 있도록 된 백 라이트 유닛을 제공할 수 있는 것이다.In addition, the present invention is formed by implanting the surface-mounted LED package with improved heat dissipation effect on the module PCB as soon as the heat is discharged as described above, so that the heat generated from the light emitting diode chip can be efficiently released even if used for a long time It is possible to provide a back light unit that can be used for a long time because the characteristics of the light emitting diode chip is not changed or its life is shortened.

본 발명의 상기 및 기타 목적과 특징은 첨부된 도면에 의거한 다음의 상세한 설명에 의해 더욱 명확하게 이해할 수 있을 것이다.The above and other objects and features of the present invention will be more clearly understood by the following detailed description based on the accompanying drawings.

첨부된 도면 도 2a 내지 도 4b는 본 발명에 따른 직냉형 엘이디패키지(1-3)의 구체적인 실현 예를 보인 것으로서, 도 2a 내지 도 2c는 본 발명에 따른 직냉형 엘이디패키지(1-3)의 기본형을 보인 결합사시도와 분해사시도 및 결합단면도이고, 도 3a 및 도 3b는 본 발명에 따른 직냉형 엘이디패키지(1-3)의 요부를 발췌하여 보인 평면도와 정면도이며, 도 4a 및 도 4b는 본 발명에 따른 직냉형 엘이디패키지(1-3)의 각기 다른 실시 예를 보인 평면 예시도이다.2A to 4B illustrate specific examples of the direct-cooling LED package 1-3 according to the present invention, and FIGS. 2A to 2C illustrate the direct-cooling LED package 1-3 according to the present invention. 3A and 3B are a plan view and a front view showing the main parts of the direct-cooling LED package 1-3 according to the present invention, and FIGS. 4A and 4B are the present invention. Figure is a plan view showing different embodiments of the direct-cooling LED package (1-3) according to the invention.

또한, 도 5는 상기 직냉형 엘이디패키지(1-3)가 식설된 백라이트유닛(100)의 구체적인 실현 예를 보인 것이다.In addition, FIG. 5 illustrates a specific example of the backlight unit 100 in which the direct cooling type LED package 1-3 is implanted.

도 2a 내지 도 3b는 본 발명에 따른 직냉형 엘이디패키지(1-3)의 기본형을 보인 것으로서 다음과 같이 형성하였다.2a to 3b is shown as the basic form of the direct-cooling LED package (1-3) according to the present invention was formed as follows.

메탈플레이트을 이용하여 패키지본체(10)를 직육면체의 형상으로 형성하되, 패키지본체(10)는 제1전극단자(11)와 제2전극단자(12) 및 중립단자(13)로 분할 형성하여 절연결합체(14)를 개입시켜 일체로 형성하였다.The package body 10 is formed into a rectangular parallelepiped shape using a metal plate, and the package body 10 is divided into a first electrode terminal 11, a second electrode terminal 12, and a neutral terminal 13 to form an insulating coupling body. (14) was formed integrally.

상기 패키지본체(10)를 형성하는 제1전극단자(11)와 제2전극단자(12) 및 중립단자(13) 중에서 중립단자(13)의 크기(면적)를 제1전극단자(11)와 제2전극단자(12)보다 크게 형성하여, 엘이디칩(15)을 용이하게 실장할 수 있도록 하였고, 엘이디칩(15)에서 발생하는 열이 용이하게 전열되어 높은(향상된) 냉각(공랭)효과를 얻을 수 있도록 하였다.Among the first electrode terminal 11, the second electrode terminal 12, and the neutral terminal 13 forming the package body 10, the size (area) of the neutral terminal 13 is determined by the first electrode terminal 11 and the first electrode terminal 11. It is formed larger than the second electrode terminal 12 so that the LED chip 15 can be easily mounted, and the heat generated from the LED chip 15 is easily transferred to provide a high (enhanced) cooling (air cooling) effect. To get it.

특히, 중립단자(13)의 상면 중앙에는 칩실장홈(13-1)을 형성하되, 칩실장홈(13-1)의 깊이를 실장되는 엘이디칩(15)의 높이와 동일하거나 깊게 형성하여 엘이디칩(15)에서 발생하는 빛과 열이 무질서하게 비산되는 것을 방지하면서 전방으로 주사시켜 빛의 밝기(조도와 휘도)를 향상시키고, 열을 전방으로 반사시켜 열의 방출효과도 향상시킬 수 있도록 하였다.In particular, the chip mounting groove 13-1 is formed at the center of the upper surface of the neutral terminal 13, and the depth of the chip mounting groove 13-1 is equal to or deeper than the height of the LED chip 15 to be mounted. The light and heat generated from the chip 15 are prevented from being scattered randomly, and scanned forward to improve the brightness (illuminance and brightness) of the light, and to reflect the heat forward to improve the heat emission effect.

또 상기 중립단자(13)의 상면에 형성되는 칩실장홈(13-1)은 장방형 또는 원형 등 다양하게 형성할 수 있고, 상단은 넓고 하단이 좁은 상광하협으로 형성하여 열과 빛의 반사 능력을 향상시킬 수 있으며, 다수의 직냉형엘이디패키지(1-3)를 설치할 때에 중립단자(13)를 공통으로 결선할 수 있다. In addition, the chip mounting groove 13-1 formed on the upper surface of the neutral terminal 13 may be formed in various shapes such as rectangular or circular, and the upper end is formed of a wide light bottom narrow with a wide upper end, thereby improving the ability to reflect heat and light. When installing a plurality of direct-cooling LED packages 1-3, the neutral terminal 13 can be connected in common.

상기, 칩실장홈(13-1)은 에칭(Etching)하여 형성하거나 프레싱하여 형성하는 것을 들 수 있다.The chip mounting groove 13-1 may be formed by etching or by pressing.

상기와 같이, 절연결합체(14)를 개입시켜 제1전극단자(11)와 제2전극단자(12) 및 중립단자(13)를 일체로 하여 패키지본체(10)를 형성할 때에는, 중립단자(13)의 양측에 제1전극단자(11)와 제2전극단자(12)을 배치하고, 중립단자(13)와 제1전극단자(11)와 제2전극단자(12)의 각 접속면의 사이에는 절연물질로 성형된 절연결합체(14)를 개입시킨 상태에서 일체로 접속하여 패키지본체(10)를 형성하였다.As described above, when the package body 10 is formed by integrating the first electrode terminal 11, the second electrode terminal 12, and the neutral terminal 13 through the insulating coupling body 14, the neutral terminal ( The first electrode terminal 11 and the second electrode terminal 12 are disposed on both sides of the 13 side, and each of the connection surfaces of the neutral terminal 13, the first electrode terminal 11, and the second electrode terminal 12 is disposed. The package body 10 was formed by being integrally connected to each other while the insulating coupling body 14 formed of an insulating material was interposed therebetween.

상기 중립단자(13)와 제1전극단자(11)와 제2전극단자(12)의 각 접속면의 사이에 개입되는 절연물질로서는 고무ㆍ합성수지ㆍ폴리머ㆍ글라스 등을 들 수 있으며, 고무ㆍ합성수지ㆍ폴리머ㆍ글라스 등의 액상물질을 충진하고 건조(열처리)하여 형성하는 것을 들 수 있다.Rubber, synthetic resin, polymer, glass, etc. are mentioned as an insulating material interposed between the connection surface of the said neutral terminal 13, the 1st electrode terminal 11, and the 2nd electrode terminal 12, and a rubber | gum / synthetic resin ㆍ Formed by filling and drying (heat-treating) liquid substances, such as a polymer and glass.

특히, 중립단자(13)와 제1전극단자(11)와 제2전극단자(12)의 각 접속면에는 접속돌부(18-1)와 접속요부(18-2)를 대응되게 형성하고 절연결합체(14)도 접속돌부(18-1)와 접속요부(18-2)에 대응되게 형성하여 견고하게 결속(접속)시킬 수 있도록 하였다.In particular, a connection protrusion 18-1 and a connection recess 18-2 are formed on each connection surface of the neutral terminal 13, the first electrode terminal 11, and the second electrode terminal 12 so as to correspond to each other. Also, (14) was formed so as to correspond to the connecting protrusion 18-1 and the connecting recess 18-2, so that it could be solidly bound (connected).

또, 중립단자(13)와 절연결합체(14)의 상호 접속면에는 보조 결합수단을 형성하였는데, 중립단자(13)의 밑면 모서리에는 단턱요부(13-2)를 형성하고 절연결합체(14)는 단면상에서 보아 " ㄴ"의 절곡 형상으로 형성하여 절연결합체(14)의 하단 수평부가 단턱요부(13-2)에 밀접하게 접속되도록 하였다.In addition, the auxiliary coupling means was formed on the interconnection surface of the neutral terminal 13 and the insulating coupling member 14, but the stepped recess 13-2 is formed at the bottom edge of the neutral terminal 13, and the insulating coupling member 14 is As seen from the cross section, it was formed into a bent shape of "b" so that the lower horizontal portion of the insulating coupling body 14 was closely connected to the step recess 13-2.

상기와 같이 절연결합체(14)를 개입시켜 중립단자(13)의 양측에 제1전극단자(11)와 제2전극단자(12)를 일체로 형성하게 되면 중립단자(13)로 전열되는 엘이디칩(15)의 열이 절연결합체(14)에 의해 거의 차단되어 제1전극단자(11)와 제2전극단자(12)로 전열되지 않게 되며, 따라서 제1전극단자(11)와 제2전극단자(12)에 미열이 전열되더라도 즉시 냉각되어 제1전극단자(11)와 제2전극단자(12)는 열로부터 항상 안정한 상태를 유지하게 된다.As described above, when the first electrode terminal 11 and the second electrode terminal 12 are integrally formed on both sides of the neutral terminal 13 through the insulating binder 14, the LED chip is transferred to the neutral terminal 13. The heat of 15 is almost blocked by the insulating binder 14 so that the heat is not transferred to the first electrode terminal 11 and the second electrode terminal 12, so that the first electrode terminal 11 and the second electrode terminal Even if the small heat is transferred to (12), it is immediately cooled, and the first electrode terminal 11 and the second electrode terminal 12 are always kept stable from heat.

이와 같이 형성된 패키지본체(10)에서 중립단자(13)의 칩실장홈(13-1)에는 엘이디칩(15)을 통상의 방법에 의해 실장하고, 엘이디칩(15)의 양단(p측전극과 n측전극)을 금전선으로 된 접속선(6)에 의해 각 제1전극단자(11)와 제2전극단자(12)와 각각 연결하며, 패키지본체(10)의 상면에는 수지를 몰딩하여 렌즈(17)를 형성한다.In the package body 10 formed as described above, the LED chip 15 is mounted in the chip mounting groove 13-1 of the neutral terminal 13 by a conventional method, and both ends of the LED chip 15 (p-side electrode and n-side electrode) is connected to each of the first electrode terminal 11 and the second electrode terminal 12 by a connection line 6 made of a gold wire, and a resin is molded on the upper surface of the package body 10. (17) is formed.

상기와 같이 패키지본체(10)의 상면에는 렌즈(17)를 형성할 때에 패키지본 체(10)의 상면에 결속강화수단을 도포한 후에 렌즈(17)를 성형하여 구비하여 패키지본체(10)에서 렌즈(17)가 박리 되는 것을 방지할 수 있도록 하였다.When the lens 17 is formed on the upper surface of the package body 10 as described above, after applying the binding strengthening means to the upper surface of the package body 10, the lens 17 is formed and provided to the package body 10 The lens 17 can be prevented from peeling off.

상기 결속강화수단으로서는 다음과 같이 형성하였다.The above-mentioned binding strengthening means was formed as follows.

패키지본체(10)를 형성하도록 일체형으로 형성되는 중립단자(13)와 제1전극단자(11) 및 제2전극단자(12)의 상면 가장자리에는 결속요홈(10-2)(11-1)(12-1)을 각각 형성하였고, 결속요홈(10-2)(11-1)(12-1)에는 결속물질로서 렌즈(17)와 동일한 물질인 수지를 결속강화물질(20)로 도포(충진)하여 수지(결속강화물질)가 결속요홈(10-2)(11-1)(12-1)에 충분히 충진되도록 하였다.The binding recesses 10-2 and 11-1 are formed at the upper edges of the neutral terminal 13, the first electrode terminal 11, and the second electrode terminal 12, which are integrally formed to form the package body 10. 12-1) were formed respectively, and the binder grooves 10-2, 11-1, and 12-1 were each coated with a binder-reinforced material 20, the same material as that of the lens 17, as the binding material. The resin (binding strengthening material) was sufficiently filled in the binding grooves 10-2, 11-1, and 12-1.

상기와 같이 결속요홈(10-2)(11-1)(12-1)에 결속강화물질(20)인 수지를 충분히 충진시켜 주면 패키지본체(10)의 상면에 렌즈(17)를 성형하게 되면 동일한 물질(수지)인 결속강화물질(20)과 렌즈(17)가 일체감을 갖게 되므로 패키지본체(10)의 상면에 형성되는 렌즈(17)의 박리를 방지할 수 있게 된다. As described above, when the resin of the binding strengthening material 20 is sufficiently filled in the binding recesses 10-2, 11-1, 12-1, the lens 17 is formed on the upper surface of the package body 10. Since the binding reinforcing material 20 and the lens 17 which are the same material (resin) have a sense of unity, it is possible to prevent peeling of the lens 17 formed on the upper surface of the package body 10.

특히, 중립단자(13)와 제1전극단자(11) 및 제2전극단자(12)의 상면 가장자리에는 에칭과 같은 방법에 의해 형성되는 결속요홈(10-2)(11-1)(12-1)으로는 V형홈 또는 U형홈 등을 들 수 있고, V형홈ㆍ∪형홈과 같은 결속요홈(10-2)(11-1)(12-1)을 형성하는 방법으로는 에칭과 같은 방법을 들 수 있으며, 결속요홈(10-2)(11-1)(12-1)에 결속강화물질(20)인 수지를 충진시키는 방법으로는 실크스크린 인쇄방법을 들 수 있다.In particular, binding grooves 10-2, 11-1 and 12- formed on the upper edges of the neutral terminal 13, the first electrode terminal 11 and the second electrode terminal 12 by a method such as etching. 1) is a V-shaped groove or a U-shaped groove, and the like. As a method of forming the binding grooves 10-2, 11-1 and 12-1 such as the V-shaped groove and the U-shaped groove, a method such as etching is used. A method of filling the resin as the binding reinforcing material 20 into the binding recesses 10-2, 11-1 and 12-1 may be a silkscreen printing method.

상기와 같이 실시하여 본 발명에 따른 직냉형 엘이디패키지(1-3)의 기본형을 완성(제조)하게 된다.By performing as described above to complete (manufacturing) the basic type of the direct-cooling LED package (1-3) according to the present invention.

도 4a 및 도 4b는 본 발명에 따른 직냉형 엘이디패키지(1-3)의 각기 다른 실시 예를 보인 예시도이다.4A and 4B are exemplary views illustrating different embodiments of the direct-cooling LED package 1-3 according to the present invention.

도 4a에 예시된 직냉형 엘이디패키지(1-3)의 패키지본체(10)는 절연결합체(14)의 일면에 제1전극단자(11)와 제2전극단자(12)을 일렬로 형성한 것이 주지적인 특징이다.The package body 10 of the direct-cooling LED package 1-3 illustrated in FIG. 4A is formed by forming the first electrode terminal 11 and the second electrode terminal 12 in one line on one surface of the insulating coupling body 14. It is a well known feature.

상면에 칩실장홈(13-1)이 형성된 중립단자(13)의 일면에는 절연결합체(14)를 개입시켜 제1전극단자(11)와 제2전극단자(12)를 차례로 접속하되, 절연결합체(14) 및 제1전극단자(11)와 제2전극단자(12)이 서로 접속되는 대향되는 각 접속면에는 접속돌부(18-1)와 접속요부(18-2)를 대응되게 형성하고 절연결합체(14)도 접속돌부(18-1)와 접속요부(18-2)에 대응되게 형성하여 견고하게 결속(접속)하도록 하였다.One surface of the neutral terminal 13 having the chip mounting groove 13-1 formed thereon is connected to the first electrode terminal 11 and the second electrode terminal 12 in order through the insulating coupling 14, (14) and the connecting protrusions 18-1 and the connecting recesses 18-2 are formed on the opposite connecting surfaces to which the first electrode terminal 11 and the second electrode terminal 12 are connected to each other, and are insulated. The assembly 14 was also formed so as to correspond to the connection protrusion 18-1 and the connection recess 18-2 so as to be firmly bound (connected).

상기와 같이 절연결합체(14)의 일면에 제1전극단자(11)와 제2전극단자(12)를 차례로 결속한 상태에서 절연결합체(14)의 칩실장홈(13-1)에는 엘이디칩(15)을 실장하였고, 절연결합체(14)의 칩실장홈(13-1)에 실장된 엘이디칩(15)의 양단(p측전극과 n측전극)을 금전선으로 된 접속선(6)에 의해 각 제1전극단자(11)와 제2전극단자(12)와 각각 연결하였다.In the state where the first electrode terminal 11 and the second electrode terminal 12 are sequentially connected to one surface of the insulating assembly 14 as described above, an LED chip is formed in the chip mounting groove 13-1 of the insulating assembly 14. 15) are mounted, and both ends (p-side electrode and n-side electrode) of the LED chip 15 mounted on the chip mounting groove 13-1 of the insulating assembly 14 are connected to the connection line 6 made of a gold wire. The first electrode terminal 11 and the second electrode terminal 12 were connected to each other.

상기와 같이 형성된 패키지본체(10)의 상면에는 수지를 몰딩하여 렌즈(17)를 형성함으로서 다른 직냉형 엘이디패키지(1-3)를 완성하게 된다.By forming a lens 17 by molding a resin on the upper surface of the package body 10 formed as described above, another direct cooling type LED package 1-3 is completed.

도 4b에 예시된 직냉형 엘이디패키지(1-3)의 패키지본체(10)는 절연결합체(14)의 일면에 제1전극단자(11)와 제2전극단자(12)을 나란하게 형성한 것이 주지 적인 특징이다.The package body 10 of the direct-cooling LED package 1-3 illustrated in FIG. 4B is formed by forming the first electrode terminal 11 and the second electrode terminal 12 side by side on one surface of the insulating coupling body 14. It is a well known feature.

상면에 칩실장홈(13-1)이 형성된 중립단자(13)의 일면에는 절연결합체(14)를 개입시켜 제1전극단자(11)와 제2전극단자(12)를 좌우로 이격시켜 나란하게 접속하되, 절연결합체(14) 및 제1전극단자(11)와 제2전극단자(12)이 서로 접속되는 대향되는 각 접속면에는 접속돌부(18-1)와 접속요부(18-2)를 대응되게 형성하고 절연결합체(14)도 접속돌부(18-1)와 접속요부(18-2)에 대응되게 형성하여 견고하게 결속(접속)하도록 하였다.One surface of the neutral terminal 13 having the chip mounting groove 13-1 formed on the upper surface thereof is spaced apart from the left and right by separating the first electrode terminal 11 and the second electrode terminal 12 from side to side through the insulating coupling body 14. The connection protrusions 18-1 and the recessed recesses 18-2 are connected to each of the opposing connecting surfaces on which the insulating assembly 14, the first electrode terminal 11, and the second electrode terminal 12 are connected to each other. Correspondingly formed, the insulating assembly 14 was also formed to correspond to the connecting protrusion 18-1 and the connecting recess 18-2 so as to be firmly bound (connected).

상기와 같이 절연결합체(14)의 일면에 제1전극단자(11)와 제2전극단자(12)를 나란하게 결속한 상태에서 절연결합체(14)의 칩실장홈(13-1)에는 엘이디칩(15)을 실장하였고, 절연결합체(14)의 칩실장홈(13-1)에 실장된 엘이디칩(15)의 양단(p측전극과 n측전극)을 금전선으로 된 접속선(6)에 의해 각 제1전극단자(11)와 제2전극단자(12)와 각각 연결하였다.The LED chip in the chip mounting groove 13-1 of the insulating assembly 14 in a state in which the first electrode terminal 11 and the second electrode terminal 12 are coupled side by side on one surface of the insulating assembly 14 as described above. (6) and connecting wires (6) of which both ends (p-side electrode and n-side electrode) of the LED chip 15 mounted in the chip mounting groove 13-1 of the insulating assembly 14 are made of gold wires. The first electrode terminal 11 and the second electrode terminal 12 were connected to each other.

상기와 같이 형성된 패키지본체(10)의 상면에는 수지를 몰딩하여 렌즈(17)를 형성함으로서 또 다른 직냉형 엘이디패키지(1-3)를 완성하게 된다.By forming a lens 17 by molding a resin on the upper surface of the package body 10 formed as described above, another direct cooling type LED package 1-3 is completed.

상기와 같이 형성된 본 발명에 따른 직냉형 엘이디패키지(1-3)에서 패키지본체(10)를 형성하는 중립단자(13)에는 구체적으로 도시하지 아니하였으나 전열선을 이용하여 이격 설치되어 있는 냉각판 또는 히트싱크와 같은 냉각수단과 연결하여 중립단자(13)의 열이 전열선을 통해 냉각수단으로 전열되어 방출되도록 하는 냉각장치를 별도로 형성할 수 있다.Although not shown specifically in the neutral terminal 13 to form the package body 10 in the direct-cooling type LED package (1-3) according to the present invention formed as described above, the cooling plate or heat that is spaced apart using a heating wire In connection with a cooling means such as a sink, the cooling device may be separately formed so that the heat of the neutral terminal 13 is transferred to the cooling means through the heating wire and discharged.

본 발명에 따른 직냉형 엘이디패키지(1-3)는, 메탈플레이트를 분할하여 제1 단자(11)와 제2단자(12) 및 중립단자(13)를 형성하되, 열방출수단(냉각수단)으로 사용되는 중립단자(13)의 크기(넓이)를 제1단자(11)와 제2단자(12)보다 크게 형성하였으므로 전열되는 열을 외부에 용이하게 방출시켜 냉각효율을 향상시킬 수 있게 된다.The direct-cooling LED package (1-3) according to the present invention is formed by dividing the metal plate to form the first terminal 11, the second terminal 12 and the neutral terminal 13, heat dissipation means (cooling means) Since the size (width) of the neutral terminal 13 used as is larger than the first terminal 11 and the second terminal 12 can be easily discharged heat to the outside to improve the cooling efficiency.

열방출수단인 중립단자(13)의 상면에는 엘이디칩(15)을 실장하였으므로 엘이디칩(15)에서 발생하는 열이 중립단자(13)에 즉시로 직접 전열되고, 중립단자(13)로 전열되는 열은 중립단자(13)의 넓은 표면적이 외기와 직접 접촉되면서 냉각이 이루어지므로 열의 방출이 효율적으로 이루어진다.Since the LED chip 15 is mounted on the upper surface of the neutral terminal 13, which is a heat dissipation means, heat generated from the LED chip 15 is directly transferred directly to the neutral terminal 13, and is transferred to the neutral terminal 13. Since heat is cooled while the large surface area of the neutral terminal 13 is in direct contact with the outside air, heat is efficiently released.

특히, 중립단자(12)의 상면에는 상광하협의 칩실장홈(13-1)이 형성되어 있으므로 엘이디칩(15)에서 발생하는 열과 빛은 메탈플레이트로 된 중립단자(12)의 칩실장홈(13-1)에 의해 소정의 각도를 유지하면서 전방으로 반사된다.In particular, since the chip mounting grooves 13-1 of the upper and lower narrow holes are formed on the upper surface of the neutral terminal 12, the heat and light generated from the LED chip 15 are the chip mounting grooves of the neutral terminal 12 made of metal plates. 13-1) and reflected forward while maintaining a predetermined angle.

따라서 전방으로 반사되는 빛의 밝기(조도와 휘도)를 향상시키게 되고, 열도 전방으로 반사(방출)시켜 주므로 열의 냉각효과도 향상시킬 수 있게 된다.Therefore, the brightness (illuminance and brightness) of the light reflected forward is improved, and the heat is also reflected (emitted) forward, thereby improving the cooling effect of the heat.

뿐만 아니라, 엘이디칩(15)이 실장된 중립단자(12)가 절연결합체(14)에 의해 제1단자(11) 및 제2단자(12)와는 직접 접속되어 있지 않으므로, 엘이디칩(15)에서 발생하는 열이 메탈플레이트로 된 중립단자(12)에 전열되더라도 절연결합체(14)가 열를 차단하게 되고, 제1단자(11) 및 제2단자(12)에는 열이 거의 전열되지 않으므로 제1단자(11) 및 제2단자(12)를 열로부터 효율적으로 보호할 수 있게 된다.In addition, since the neutral terminal 12 on which the LED chip 15 is mounted is not directly connected to the first terminal 11 and the second terminal 12 by the insulating coupling member 14, the LED chip 15 Even though the generated heat is transferred to the neutral terminal 12 made of metal plate, the insulating coupling member 14 blocks the heat, and since the heat is hardly transmitted to the first terminal 11 and the second terminal 12, the first terminal (11) and the second terminal 12 can be efficiently protected from heat.

따라서 직냉형 엘이디칩(1-3)의 특성이 변화되거나 수명이 단축되지 않도록 하여 장기간 사용할 수 있게 된다.Therefore, the characteristics of the direct-cooled LED chip 1-3 are not changed or the life is not shortened, so that it can be used for a long time.

상기와 같은 특징을 갖는 본 발명에 따른 직냉형 엘이디패키지(1-3)를 이용하여 도 5에 예시된 바와 같이 백라이트유닛(100)을 제조할 수 있다.As illustrated in FIG. 5, the backlight unit 100 may be manufactured using the direct-cooling LED package 1-3 according to the present invention having the above characteristics.

본 발명에 따른 백라이트유닛(100)은, 모듈PCB(110)의 표면에 반사시트(120)를 접착시키고, 반사시트(120)에 일정한 간격으로 뚫어진 각 패키지실장공간(121)을 통하여 모듈PCB(110)에는 표면실장형 엘이디패키지(1)를 식설하여 형성하되, 상기 표면실장형 엘이디패키지(1)를 대신하여 직냉형 엘이디패키지(1-3)를 식설하여 형성하였다.In the backlight unit 100 according to the present invention, the reflective sheet 120 is adhered to the surface of the module PCB 110, and the module PCB (through each package mounting space 121 drilled at regular intervals on the reflective sheet 120 ( 110) is formed by implanting the surface-mount LED package (1), it was formed by implanting the direct-cooling type LED package (1-3) in place of the surface-mount LED package (1).

본 발명에 따른 백라이트유닛(100)을 상기와 같이 직냉형 엘이디패키지(1-3)를 식설하여 형성하게 되면, 직냉형 엘이디패키지(1-3)은 자체의 방열능이 우수하므로 직냉형 엘이디패키지(1-3)에서 발생하는 열이 모듈PCB(110)로 전열되지 않게 되며, 따라서 열의 냉각 효과가 향상된 백라이트유닛(100)을 제공할 수 있게 된다.When the backlight unit 100 according to the present invention is formed by planting the direct cooling type LED package 1-3 as described above, the direct cooling type LED package 1-3 has excellent heat dissipation ability, so the direct cooling type LED package ( Heat generated in 1-3 may not be transferred to the module PCB 110, and thus, the backlight unit 100 may be provided with an improved cooling effect.

발명은 기재된 구체적인 실시 예에 대해서만 상세히 설명되었지만 본 발명의 기술사상범위 내에서 다양하게 변형 및 수정할 수 있음은 당업자에 있어서 당연한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연하다 할 것이다. Although the invention has been described in detail only with respect to the specific embodiments described, it will be obvious to those skilled in the art that various changes and modifications can be made within the technical scope of the invention, and such modifications and modifications will be obvious to be included in the appended claims. .

도 1a 및 도 1b는 종래의 각기 다른 표면실장형 엘이디 패키지를 보인 단면도.1A and 1B are cross-sectional views showing different surface mount LED packages according to the related art.

도 2a 내지 도 2c는 본 발명에 따른 표면실장형 엘이디 패키지의 일 실시 예를 보인 결합사시도와 분해사시도 및 결합단면도.Figures 2a to 2c is a perspective view and an exploded perspective view and a cross-sectional view of the combined perspective view showing an embodiment of the surface-mount LED package according to the present invention.

도 3a 및 도 3b는 도 2a 내지 도 2c에 예시된 본 발명에 따른 표면실장형 엘이디 패키지의 요부를 발췌하여 보인 평면도와 단면도.3a and 3b are a plan view and a cross-sectional view showing the main portion of the surface-mount LED package according to the present invention illustrated in Figures 2a to 2c.

도 4a 및 도 4b는 본 발명에 따른 표면실장형 엘이디 패키지의 각기 다른 실시 예를 보인 평면도. 4A and 4B are plan views showing different embodiments of the surface mount LED package according to the present invention.

도 5는 본 발명에 따른 표면실장형 엘이디 패키지를 적용하여 제조되는 백 라이트 유닛을 보인 부분 단면도.Figure 5 is a partial cross-sectional view showing a backlight unit manufactured by applying the surface-mount LED package according to the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1: 표면실장형 엘이디패키지 1-3: 직냉형 엘이디패키지1: Surface Mount LED Package 1-3: Direct Cooling LED Package

1-3: 2: 기판 3-1. 11: 제1접속단자 3-2. 12: 제2접속단자1-3: 2: Substrate 3-1. 11: First connection terminal 3-2. 12: second connection terminal

5. 15: 엘이디칩 6. 16; 접속선 7. 17: 렌즈 5. 15: LED chip 6. 16; Connection line 7. 17: lens

10: 패키지본체 13: 중립단자 14: 절연결합체 10: package body 13: neutral terminal 14: insulation coupling

100: 백라이트유닛 110: 모듈용PCB 120: 반사시트100: backlight unit 110: module PCB 120: reflective sheet

Claims (17)

단자가 형성되는 패키지(PACKGE:본체)를 메탈플레이트(METAL PLATE)로 형성하고, 메탈플레이트를 분할하여 제1전극단자와 제2전극단자를 형성하며, 어느 일측의 전극단자에 엘이디칩을 실장하고 엘이디칩과 제1전극단자와 제2전극단자를 접속선으로 각각 연결하며, 제1전극단자와 제2전극단자의 상측에 수지를 몰딩하여 렌즈를 형성한 것에 있어서, The package in which the terminal is formed is formed of a metal plate, the metal plate is divided to form a first electrode terminal and a second electrode terminal, and an LED chip is mounted on one of the electrode terminals. In the case where the LED chip, the first electrode terminal and the second electrode terminal are respectively connected by connecting lines, and a lens is formed by molding a resin on the upper side of the first electrode terminal and the second electrode terminal, 상기 제1전극단자와 제2전극단자가 형성된 패키지본체에는 엘이디칩에서 발생하는 열을 직접 전도 받아 방출하는 열방출수단을 구비하여 형성한 것;을 특징으로 하는 표면 실장형 엘이디 패키지.And a heat dissipation means for directly conducting and dissipating heat generated from an LED chip in the package body in which the first electrode terminal and the second electrode terminal are formed. 청구항 1에 있어서, 열을 적접 전도 받아 방출하는 열방출수단은;The apparatus of claim 1, further comprising: a heat dissipation means for conducting heat by directly conducting heat; 엘이디칩이 실장된 열방출수단을 제1전극단자와 제2전극단자가 형성된 패키지본체에는 일체로 형성한 것;을 특징으로 하는 표면 실장형 엘이디 패키지.And a heat dissipation means in which the LED chip is mounted integrally with the package body in which the first electrode terminal and the second electrode terminal are formed. 청구항 1에 있어서, 열을 적접 전도 받아 방출하는 열방출수단은;The apparatus of claim 1, further comprising: a heat dissipation means for conducting heat by directly conducting heat; 엘이디칩이 실장된 열방출수단을 별도로 형성하여 제1전극단자와 제2전극단자가 형성된 패키지본체에 연결하여 일체형으로 형성한 것;을 특징으로 하는 표면 실장형 엘이디 패키지.Surface-mount LED package, characterized in that formed separately from the heat dissipation means mounted on the LED chip connected to the package body formed with the first electrode terminal and the second electrode terminal. 청구항 1에 있어서, 열방출수단이 구비되는 패키지본체는;The package body according to claim 1, wherein the heat dissipation means is provided; 열방출수단의 양측에는 절연결합체를 개입시켜 제1전극단자와 제2전극단자를 일체로 형성한 것;을 특징으로 하는 표면 실장형 엘이디 패키지.Surface mounting type LED package, characterized in that the first electrode terminal and the second electrode terminal is integrally formed on both sides of the heat dissipation means through the insulating binder. 청구항 1에 있어서, 열방출수단이 구비되는 패키지본체는;The package body according to claim 1, wherein the heat dissipation means is provided; 열방출수단의 일면에는 절연결합체를 개입시켜 제1전극단자와 제2전극단자를 일렬로 연속 배치하여 일체로 형성한 것;을 특징으로 하는 표면 실장형 엘이디 패키지.Surface mounting type LED package, characterized in that formed on the one surface of the heat dissipation means through the insulating binder and the first electrode terminal and the second electrode terminal continuously arranged in a row. 청구항 1에 있어서, 열방출수단이 구비되는 패키지본체는;The package body according to claim 1, wherein the heat dissipation means is provided; 열방출수단의 일면에는 절연결합체를 개입시켜 제1전극단자와 제2전극단자를 나란하게 배치하여 일체로 형성한 것;을 특징으로 하는 표면 실장형 엘이디 패키지.Surface mounting type LED package, characterized in that formed on the one surface of the heat dissipation means through the insulating coupling body and arranged in parallel with the first electrode terminal and the second electrode terminal. 청구항 1 내지 청구항 6중에서 어느 한 항에 있어서, 열을 적접 전도 받아 방출하는 열방출수단은;The heat dissipation means of claim 1, wherein the heat dissipation means for dissipating heat in direct conduction; 메탈플레이트으로 형성된 중립단자의 상면에 엘이디칩을 실장한 것;을 특징으로 하는 표면 실장형 엘이디 패키지.Surface mounted LED package characterized in that the LED chip is mounted on the upper surface of the neutral terminal formed of a metal plate. 청구항 4 내지 청구항 6중에서 어느 한 항에 있어서, The method according to any one of claims 4 to 6, 패키지본체를 형성하는 열방출수단과 제1전극단자 및 제2전극단자가 서로 접속되는 대향되는 접속면에는 접속돌부와 접속요부를 대응되게 형성하여 접속시킨 것;을 특징으로 하는 표면 실장형 엘이디 패키지.Surface-mounting LED package, characterized in that the connecting protrusion and the connecting recess are formed to correspond to each other on the opposing connection surface to which the heat dissipating means and the first electrode terminal and the second electrode terminal which form the package body are connected. . 청구항 4 내지 청구항 6중에서 어느 한 항에 있어서, The method according to any one of claims 4 to 6, 열방출수단의 양측에 절연결합체를 일체로 형성하여 형성되는 패키지본체는;The package body is formed by integrally forming an insulating joint on both sides of the heat dissipation means; 열방출수단의 양면 하단과 절연결합체의 하단과의 사이에는 요부와 돌부를 대응되게 형성하여 결합시킨 것;을 특징으로 하는 표면 실장형 엘이디 패키지.Surface-mounted LED package, characterized in that the coupling between the bottom of the both sides of the heat dissipation means and the bottom of the insulating binder correspondingly formed recesses and protrusions. 청구항 7에 있어서, 중립단자의 상면에 엘이디칩을 실장하여 형성되는 열방출수단은;The method of claim 7, wherein the heat dissipation means formed by mounting the LED chip on the upper surface of the neutral terminal; 메탈플레이트으로 형성된 중립단자의 상면에 칩실장홈을 형성하고, 상기 칩실장홈의 내부에 엘이디칩을 실장한 것;을 특징으로 하는 표면 실장형 엘이디 패키지.The chip mounting groove is formed on the upper surface of the neutral terminal formed of a metal plate, and the LED chip mounted inside the chip mounting groove; Surface-mount LED package, characterized in that. 청구항 10에 있어서, 메탈플레이트의 상면에 형성되는 칩실장홈은; The method of claim 10, wherein the chip mounting groove formed on the upper surface of the metal plate; 장방형 또는 원형인 것;을 특징으로 하는 표면 실장형 엘이디 패키지.Rectangular or circular; surface-mount LED package characterized in that. 청구항 10에 있어서, 메탈플레이트의 상면에 형성되는 칩실장홈은; The method of claim 10, wherein the chip mounting groove formed on the upper surface of the metal plate; 상단이 넓고 하단이 좁은 상광하협으로 형성한 것;을 특징으로 하는 표면 실 장형 엘이디 패키지.Surface mount type LED package, characterized in that formed by a wide upper and narrow bottom light. 청구항 1에 있어서, 패키지본체(10)의 상면에 렌즈(17)를 일체로 형성하는 표면 실장형 엘이디 패키지는;The surface mount type LED package of claim 1, wherein the surface mount type LED package integrally forms a lens 17 on an upper surface of the package body 10; 패키지본체(10)의 상면에 결속강화수단을 형성한 것과;A binding strengthening means is formed on the upper surface of the package body 10; 상기 결속강화수단이 형성된 패키지본체(10)의 상면에 렌즈(17)를 일체로 형성한 것:을 특징으로 하는 표면 실장형 엘이디 패키지.The surface-mounting LED package, characterized in that the lens 17 is integrally formed on the upper surface of the package body (10) in which the binding strengthening means is formed. 청구항 13에 있어서, 패키지본체(10)의 상면에 형성되는 결속강화수단은;The method according to claim 13, The binding strengthening means formed on the upper surface of the package body 10; 패키지본체(10)를 일체로 형성하는 중립단자(13)와 제1전극단자(11) 및 제2전극단자(12)의 상면 가장자리에는 결속요홈(10-2)(11-1)(12-1)을 각각 형성한 것과;The binding recesses 10-2, 11-1 and 12- are formed at the upper edges of the neutral terminal 13, the first electrode terminal 11, and the second electrode terminal 12 which integrally form the package body 10. Each of 1) is formed; 결속요홈(10-2)(11-1)(12-1)에는 결속물질을 도포 또는 충진시킨 것;을 특징으로 하는 표면 실장형 엘이디 패키지.Surface mounting type LED package, characterized in that the binding groove (10-2) (11-1) (12-1) is coated or filled with the binding material. 청구항 14에 있어서, The method according to claim 14, 중립단자(13)와 제1전극단자(11) 및 제2전극단자(12)의 상면 가장자리에 형성되는 결속요홈(10-2)(11-1)(12-1)은 에칭에 의해 형성하는 것과;The binding recesses 10-2, 11-1 and 12-1 formed at the upper edges of the neutral terminal 13, the first electrode terminal 11 and the second electrode terminal 12 are formed by etching. With; 중립단자(13)와 제1전극단자(11) 및 제2전극단자(12)의 상면 가장자리에 형성되는 결속요홈(10-2)(11-1)(12-1)은 V형홈 또는 ∪형홈 인 것;을 특징으로 하는 표면 실장형 엘이디 패키지.The binding grooves 10-2, 11-1 and 12-1 formed at the upper edges of the neutral terminal 13, the first electrode terminal 11 and the second electrode terminal 12 are V-shaped grooves or V-shaped grooves. Surface-mount LED package, characterized in that; 청구항 14에 있어서, The method according to claim 14, 결속요홈(10-2)(11-1)(12-1)에 도포 또는 충진되는 결속강화물질(20)은 수지인 것;을 특징으로 하는 표면 실장형 엘이디 패키지.The binding reinforcing material 20 to be applied or filled in the binding groove (10-2) (11-1) (12-1) is a resin; surface-mount LED package, characterized in that. 모듈PCB의 표면에 반사시트를 접착시키고, 반사시트에 일정한 간격으로 뚫어진 각 패키지실장공간을 통하여 표면실장형 엘이디패키지를 모듈PCB에 식설하여 형성한 것에 있어서;Bonding a reflective sheet to the surface of the module PCB and forming a surface-mounted LED package on the module PCB through each package mounting space drilled at regular intervals in the reflective sheet; 상기 반사시트의 각 패키지실장공간을 통해 모듈PCB에 식설되는 표면실장형 엘이디패키지는, 상기 청구항 1 내지 청구항 12에 의해 제조되는 직냉형 엘이디패키지인 것;을 특징으로 하는 표면 실장형 엘이디 패키지를 이용한 백 라이트 유닛.The surface-mount type LED package to be implanted in the module PCB through each package mounting space of the reflective sheet is a direct-cooling type LED package manufactured by the claims 1 to 12; using the surface-mount type LED package Back light unit.
KR1020080069029A 2008-07-16 2008-07-16 A Surface Mount Device Type Light Emmitting Diode and Backlight Unit Uusing The Same KR101122059B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080069029A KR101122059B1 (en) 2008-07-16 2008-07-16 A Surface Mount Device Type Light Emmitting Diode and Backlight Unit Uusing The Same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080069029A KR101122059B1 (en) 2008-07-16 2008-07-16 A Surface Mount Device Type Light Emmitting Diode and Backlight Unit Uusing The Same

Publications (2)

Publication Number Publication Date
KR20100008509A true KR20100008509A (en) 2010-01-26
KR101122059B1 KR101122059B1 (en) 2012-03-14

Family

ID=41817110

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080069029A KR101122059B1 (en) 2008-07-16 2008-07-16 A Surface Mount Device Type Light Emmitting Diode and Backlight Unit Uusing The Same

Country Status (1)

Country Link
KR (1) KR101122059B1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013019032A2 (en) * 2011-07-29 2013-02-07 Lg Innotek Co., Ltd. Optical device package and method of manufacturing the same
WO2013055014A1 (en) * 2011-10-10 2013-04-18 Ju Jae Cheol Method for manufacturing led package
WO2013055013A1 (en) * 2011-10-10 2013-04-18 Ju Jae Cheol Led package
WO2014120256A1 (en) * 2013-01-31 2014-08-07 Cree, Inc. Submount based surface mount device (smd) light emitter components and methods
KR101433734B1 (en) * 2013-02-15 2014-08-27 솔레즈 주식회사 LED Package
USD738832S1 (en) 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US10672957B2 (en) 2017-07-19 2020-06-02 Cree, Inc. LED apparatuses and methods for high lumen output density

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4305896B2 (en) * 2002-11-15 2009-07-29 シチズン電子株式会社 High brightness light emitting device and manufacturing method thereof
KR100616413B1 (en) * 2004-05-22 2006-08-29 서울반도체 주식회사 Light emitting diode and method of manufacturing the same
KR100699161B1 (en) 2005-10-06 2007-03-22 엘지전자 주식회사 Light emitting device package and method for manufacturing the same
KR100986211B1 (en) * 2008-01-04 2010-10-07 주식회사 이츠웰 Metal substrate, method of making the substrate, and smd type led package using the substrate

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
USD738832S1 (en) 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US9196811B2 (en) 2011-07-29 2015-11-24 Lg Innotek Co., Ltd. Optical device package having a groove in the metal layer
WO2013019032A3 (en) * 2011-07-29 2013-04-11 Lg Innotek Co., Ltd. Optical device package and method of manufacturing the same
WO2013019032A2 (en) * 2011-07-29 2013-02-07 Lg Innotek Co., Ltd. Optical device package and method of manufacturing the same
WO2013055014A1 (en) * 2011-10-10 2013-04-18 Ju Jae Cheol Method for manufacturing led package
WO2013055013A1 (en) * 2011-10-10 2013-04-18 Ju Jae Cheol Led package
CN103270612A (en) * 2011-10-10 2013-08-28 朱宰哲 Led package
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US11004890B2 (en) 2012-03-30 2021-05-11 Creeled, Inc. Substrate based light emitter devices, components, and related methods
WO2014120256A1 (en) * 2013-01-31 2014-08-07 Cree, Inc. Submount based surface mount device (smd) light emitter components and methods
KR101433734B1 (en) * 2013-02-15 2014-08-27 솔레즈 주식회사 LED Package
US10672957B2 (en) 2017-07-19 2020-06-02 Cree, Inc. LED apparatuses and methods for high lumen output density

Also Published As

Publication number Publication date
KR101122059B1 (en) 2012-03-14

Similar Documents

Publication Publication Date Title
KR101122059B1 (en) A Surface Mount Device Type Light Emmitting Diode and Backlight Unit Uusing The Same
AU2006254610B2 (en) Package structure of semiconductor light-emitting device
US8368112B2 (en) Aligned multiple emitter package
JP4123105B2 (en) Light emitting device
KR101578090B1 (en) Light emitting devices and methods
US8455889B2 (en) Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module
KR100616695B1 (en) High power light emitting diode package
KR100851183B1 (en) Semiconductor light emitting device package
KR100550750B1 (en) Luminescent diode package and method for manufacturing led package
JP2005158957A (en) Light emitting device
JP2009177187A (en) Light-emitting diode package
US10693049B2 (en) Light emitting device package and lighting system comprising same
KR101202168B1 (en) High voltage led package
KR20080017522A (en) Light emitting diode package and method of manufacturing the same
KR101004929B1 (en) Light emitting diode package and Light emitting diode package module having the same
KR100730772B1 (en) Package for high power light emission device
JP2009177188A (en) Light-emitting diode package
KR100878398B1 (en) High power led package and fabrication method thereof
US8344399B2 (en) LED package with wide emission range and effective heat dissipation
US20070246727A1 (en) Chip seat structuer for light-emitting crystal and a packaging structure thereof
KR101431590B1 (en) Light-Emitting Diode package of luminescence for spherical shaped
JP4862808B2 (en) Light emitting device
KR100803161B1 (en) Light emitting diode package using single crystal and light emitting device thereof
KR101518458B1 (en) High voltage led package
KR20120055180A (en) Mold for light emitting diode package

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment
FPAY Annual fee payment

Payment date: 20160205

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20170222

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20180221

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20190220

Year of fee payment: 8