KR20090049466A - Lamp-type light emitting diode package - Google Patents

Lamp-type light emitting diode package Download PDF

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Publication number
KR20090049466A
KR20090049466A KR1020070115731A KR20070115731A KR20090049466A KR 20090049466 A KR20090049466 A KR 20090049466A KR 1020070115731 A KR1020070115731 A KR 1020070115731A KR 20070115731 A KR20070115731 A KR 20070115731A KR 20090049466 A KR20090049466 A KR 20090049466A
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KR
South Korea
Prior art keywords
lead
light emitting
emitting diode
molding part
chip
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KR1020070115731A
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Korean (ko)
Inventor
박찬익
Original Assignee
주식회사 옵토필
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Priority to KR1020070115731A priority Critical patent/KR20090049466A/en
Publication of KR20090049466A publication Critical patent/KR20090049466A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

A low stress, high voltage lamp type light emitting diode package is disclosed. The present invention includes a first lead having an upper end and a second lead having an upper end disposed adjacent to an upper end of the first lead, wherein a light emitting diode chip is attached to an upper end of the first lead. Bonding wires are respectively connected between the light emitting diode chip and the first lead and between the light emitting diode chip and the second lead, the light emitting diode chip exposing a lower portion of the first lead and a lower portion of the second lead; Bonding wires, a molding portion for sealing the upper portion of the first lead and the upper portion of the second lead with a molding resin. The molding part seals the light emitting diode chip and the bonding wires and seals a portion of the first molding part and the upper part of the first lead and a portion of the upper part of the second lead that seal the light emitting diode chip and the bonding wires. And a second molding part positioned.

Low stress, high voltage, lamp type, light emitting diode, package, molding part, resistor

Description

Lamp-type Light Emitting Diode package

The present invention relates to a light emitting diode package, and more particularly, a low stress lamp type light emitting diode package capable of preventing cracking of a light emitting diode chip or falling off of a bonding wire, and a high voltage lamp type light emitting diode that can be usefully used even at high voltage. It's about packages.

Light Emitting Diode (LED) is a semiconductor device that emits light of a certain wavelength when electrons flow from high to low energy levels, and is a small green flashing when the hard disk is operated in the computer body. It is used as a light source in various applications such as a light source, a large display board installed on a building, and a shiny light source of a mobile phone. In particular, a lamp type light emitting diode package includes a light emitting diode chip embedded in a light-transmitting molding resin and used for a lighting device such as an electric signboard.

1 is a schematic view showing a lamp type light emitting diode package 10 according to the prior art, and FIG. 2 is a view showing a lead frame used to manufacture the light emitting diode package of FIG.

Referring to FIG. 1, the light emitting diode package 10 includes a first lead 12 and a second lead 14, and has a light reflection formed in a concave shape on an upper surface of the first lead 12. The light emitting diode chip 18 is bonded through the adhesive in the cup 16. A first wire bonding pad (not shown) is formed on an upper surface of the first lead 12 adjacent to the light reflection cup 16, and a second wire bonding pad (on a top surface of the second lead 14). (Not shown) and a bonding wire 19 is wire-bonded between the first and second chip pads (not shown) and the first and second wire bonding pads exposed to the light emitting diode chip 18. Is electrically connected. The first and second leads 12 and 14 are fixed to each other, and are formed of a molding part 11 molded with a molding resin to protect the light emitting diode chip 18 and the bonding wire 19. Lower portions of the first and second leads 12 and 14 are not sealed by the molding part 11 and are exposed to the outside.

The first lead 12 has a light reflecting cup 16 formed on the upper end of the light emitting diode chip 18 to efficiently collect light emitted from the light emitting diode chip 18. The first chip pad (not shown) of the light emitting diode chip 18 and a wire bonding pad capable of wire bonding are integrally formed around the light emitting diode chip 18 to serve as a first electrode of the light emitting diode chip 18. The second lead 14 is a second wire bonding pad (not shown) that can be spaced apart from the first lead 12 and wire bonded with another second chip pad (not shown) of the light emitting diode chip 18. Is formed on the upper part to serve as a second electrode of the light emitting diode chip 18.

Upper portions of the first and second leads 12 and 14 refer to portions of the package body that are sealed and fixed in the molding portion 11, and lower portions of the first and second leads 12 and 14 are molded portions ( It refers to a portion exposed in the form of a pin on the outside of 11), the lower portion of the exposed leads may be inserted into a hole formed in an external substrate such as a printed circuit board and then fixed with solder.

Referring to FIG. 2, the first lead 12 and the second lead 14 protrude from the rail 22 of the lead frame, and the first lead 12 and the second lead 14 are tied in the middle. It is stably fixed to the lead frame by a bar 21 (tie-bar). The upper portions of the first and second leads 12 and 14 fixed by the tie-bars 21 and the rails 22 are separated from the leadframe by a punching process after forming the package body. The package body is a light transmitting resin having a high light transmittance and molded with an epoxy resin that can strongly fix the upper portions of the first and second leads 12 and 14. This is because the upper part of the first and second leads 12 and 14 of the lead frame to which the light emitting diode chip 18 and the bonding wire 19 are attached in a predetermined frame called a 'mold cup' to which a release agent is applied. The lead frame and the mold cup are fixed to each other so as to be inserted into the mold cup, the liquid epoxy is filled into the mold cup, and then cured, and then separated from the mold cup.

Here, the package body uses a very hard thermosetting epoxy to maintain the upper portion of the first and second leads 12 and 14 fixed in the lead frame and to withstand heating. However, it is preferable that the epoxy has a high light transmittance and a high linearity of light, so that the use of additives used to reduce stress by suppressing heat shrinkage and expansion is limited. This acts as a serious stress on the light emitting diode chip 18 and the bonding wire 19 depending on the method of use and the environment, and often causes cracking of the light emitting diode chip 18 or dropping of the bonding wire 19. This problem is frequently observed as the most significant failure cause in the conventional lamp type LED package, which is still difficult to solve.

On the other hand, the light emitting diodes vary in color and driving voltage depending on the material of the chip 18. In addition, since most of the general-purpose power supplies for driving the light emitting diode chip 18 do not match the safe operating voltage of the light emitting diode chip 18 itself, the light emitting diode package to protect the light emitting diode chip 18 from high voltage. Must be connected in series with the chip resistor. In particular, when a plurality of color light emitting diode packages are connected in parallel to one power supply device, chip resistors according to each light emitting diode package should be connected to each other. Lamp-type LED packages are often used without using a printed circuit board. In this case, it is very inconvenient to use the chip resistors connected together.

FIG. 3 illustrates an example in which a plurality of lamp-type LED packages 10 of FIG. 1 are directly connected to each other. In the above example, one electrode of the LED package 10 and the conductive line 23 including the chip resistor 24 are connected in series, and the LED chips 18 are connected in parallel with each other. . That is, one electrode of the light emitting diode package (for example, the first lead 12 is connected to the same electrode of the other light emitting diode package, and another electrode is also the same electrode of the other light emitting diode via the chip resistor element 24). This connection is a series of repetitive connections, which are made by twisting the terminals together, which is further aggravated by the chip resistors.

SUMMARY OF THE INVENTION The present invention has been made in view of the problems of the prior art, and provides a low stress lamp type light emitting diode package and a method for manufacturing the same, which alleviate the occurrence of defects caused by the stress of the epoxy molding resin.

Another object of the present invention is to provide a high-voltage lamp type light emitting diode package having a resistance element built therein for ease of use in an application field in which a plurality of light emitting diode packages are connected to each other without using a printed circuit board. To provide a way.

According to one aspect of the present invention, there is provided a lamp type light emitting diode package according to one aspect of the present invention, having a first lead having an upper end and an upper end disposed adjacent to an upper end of the first lead. It includes a lead, the light emitting diode chip is attached to the upper end of the first lead. Bonding wires are electrically connected between the light emitting diode chip and the first lead and between the light emitting diode chip and the second lead, respectively, and expose the lower portion of the first lead and the lower portion of the second lead. And a molding part sealing the chip, the bonding wires, the upper part of the first lead, and the upper part of the second lead with a molding resin. The molding part seals the light emitting diode chip and the bonding wires and seals a portion of the first molding part and the upper part of the first lead and a portion of the upper part of the second lead that seal the light emitting diode chip and the bonding wires. And a second molding part positioned at.

It is preferable that the first molding part uses a material having excellent optical properties as compared to the second molding part, and the second molding part uses a material having excellent physical properties compared to the first molding part. The first molding part may be made of a silicon material, and the second molding part may be made of an epoxy material. The second molding part may further include a third molding part of the same or different material as the first molding part and / or the second molding part.

On the other hand, a light reflection cup concave from the surface is formed on the upper end of the first lead, the light emitting diode chip is preferably attached to the light reflection cup in terms of condensing efficiency, the upper end of the first lead is the light A first wire bonding pad to which the bonding wire is attached may be further formed adjacent to the reflective cup, and a second wire bonding pad to which the bonding wire is attached may be further formed at an upper end of the second lead.

On the other hand, the lamp-type LED package according to another aspect of the present invention for achieving the technical problem to be solved by the present invention, the first lead having an upper end, and the upper end disposed adjacent to the upper end of the first lead And a third lead formed to be spaced apart from the first lead and the second lead, wherein the chip resistor is electrically connected to any one of the first lead or the second lead and the third lead. Is connected. A light emitting diode chip is attached to an upper end of the first lead, and bonding wires are electrically connected between the light emitting diode chip and the first lead and between the light emitting diode chip and the second lead, respectively. A molding part sealing the light emitting diode chip, the bonding wires, and the chip resistance element while exposing a lower portion of at least one of the first lead or the second lead connected to the chip resistance element and a lower part of the third lead; Include.

The molding part may include a first molding part sealing the light emitting diode chip and the bonding wires and positioned above the molding part, and a second molding part sealing the chip resistance element and positioned below the molding part. The chip resistor may be side-mounted between one side of an upper portion of the first lead or the upper side of the second lead and a side surface of the upper portion of the third lead.

The lower part of the first lead or the lower part of the second lead connected to the chip resistor may also be exposed from the sealing part, and may be mounted on a printed circuit board instead of being used as an electrode and used as a heat dissipation path.

On the other hand, the manufacturing method of the lamp-type LED package according to another embodiment of the present invention for achieving the other technical problem to be solved by the present invention, the first lead, the second lead and the top and bottom spaced apart from each other and After preparing a lead frame including a third lead, each upper portion of the first lead, the second lead and the third lead adjacent to each other, the upper portion of the third lead, the first lead or the second lead The chip resistance element is connected between any one of them. Subsequently, a light emitting diode chip is attached to an upper end of the first lead, and wire-bonded to electrically connect the light emitting diode chip to an upper portion of the second lead and between the light emitting diode chip and an upper portion of the first lead. Afterwards, the light emitting diode chip, the bonding wires, and the chip resistance element are exposed while exposing a lower portion of at least one of the first lead and the second lead and the lower part of the third lead which are not connected to the chip resistance element. Molding to seal sealing.

The molding may include a first molding step of sealing and fixing the light emitting diode chip and the bonding wires, and a second molding step of sealing and fixing the chip resistance element under the first molding part. .

According to the present invention, the package body by the low stress molding resin can improve the reliability of the package by relieving the stress applied to the light emitting diode chip and the bonding wire even in the environment of severe temperature change.

In addition, according to the present invention, by embedding a resistance element corresponding to a specific power supply, it can be easily used in applications that connect a plurality of light emitting diode packages without using a printed circuit board.

Hereinafter, the structure and effects of the present invention will be described in more detail with specific examples and comparative examples, but these examples are only intended to more clearly understand the present invention and are not intended to limit the scope of the present invention.

FIG. 4 is a schematic view illustrating a lamp type light emitting diode package according to an embodiment of the present invention, and FIG. 5 is a schematic plan view of a top portion of leads of the light emitting diode package of FIG. 4.

4 and 5, the light emitting diode package 30 includes a first lead 32 and a second lead 34, and is concave on the upper surface of the upper portion of the first lead 32. The light reflection cup 36 is formed, and the light emitting diode chip 38 is attached to the light reflection cup 36 via an adhesive. Meanwhile, the light reflection cup 36 may include a chip bonding pad (not shown) in which the light emitting diode chip 38 is mounted.

Meanwhile, a first wire bonding pad (not shown) may be formed on the upper surface of the first lead 32 adjacent to the light reflection cup 36, and a second surface may be formed on the upper surface of the second lead 34. Wire bonding pads (not shown) may be formed. First and second chip pads (not shown) and first and second wire bonding pads (not shown) formed on a surface of the light emitting diode chip 38 to provide an anode and a cathode to the light emitting diode chip 38. Bonding wires 39 are wire-bonded and electrically connected therebetween. In addition, a molding part 31a + 31b is formed to fix upper portions of the first and second leads 32 and 34 and to protect the light emitting diode chip 38 and the bonding wire 39, and the molding part is located above. A first molding part 31a molded with a first molding resin and a lower part of the first molding part 31a and directly contacting a lower part of the first molding part 31a and fixing upper parts of the first and second leads 32 and 34. It consists of the 2nd molding part 31b molded with the 2nd molding resin. Hereinafter, upper portions of the first and second leads 32 and 34 refer to portions sealed by the molding portions 31a and 31b, and lower portions of the first and second leads 32 and 34 are sealed by the molding portions. The exposed portion. In addition, the package body refers to the molding portions 31a and 31b and the components sealed in the molding portion.

The first lead 32 is formed with a light reflection cup 36 capable of attaching the light emitting diode chip 38 to an upper end portion and at the same time efficiently collecting the emitted light emitted from the light emitting diode chip 38. A first chip pad (not shown) of the light emitting diode chip 38 and a wire bonding pad (not shown) capable of wire bonding are integrally formed around the LED chip 38 to serve as a first electrode of the light emitting diode chip 38. . Meanwhile, in the case of the vertical chip, the first lead 32 itself may be the first electrode of the light emitting diode chip 38 without the bonding wire.

In addition, the bonding wire 39 may be wire-bonded to the upper end of the first lead 32 without the first wire bonding pad. An upper portion of the second lead 34 may be spaced apart from the first lead 32 to form a second wire bonding pad capable of wire bonding with another second chip pad (not shown) of the light emitting diode chip 38. No) is formed at the upper end to serve as a second electrode of the LED chip 38. In this case, the bonding wire 39 may be wire bonded without the second wire bonding pad.

Upper portions of the first and second leads 32 and 34 are sealed and fixed to the first and second molding portions 31a and 31b to form a body of the package, and lower portions of the first and second leads 32 and 34 are It is exposed to the outside of the second molding part 31b, and is extended for example in the form of a pin.

In general, epoxy resin, which was mainly used as a molding material in the prior art, was a good material widely used as a sealing material for a light emitting diode package in that it has a strong adhesive strength and high hardness, but the coefficient of thermal expansion for increasing light transmittance and straightness The use of an additive member that can reduce the amount has been limited. If there is no use of an additive member that can reduce the coefficient of thermal expansion or is added in an extremely limited range, the light emitting diode chip 38 and the bonding wire 39 are subjected to continuous stress in the epoxy sealing resin. In addition, although the optical refractive index is high optically, the light extraction rate can be increased from the light emitting diode chip 38, but the light resistance is weak and the problem caused by yellowing is serious. As an alternative to this, silicon materials are promising but have the physical disadvantage that physical properties, such as low hardness, do not easily fix the leads.

Therefore, in the present embodiment, the entire molding part of the light emitting diode package is molded without being molded only by epoxy resin and divided into two kinds of materials. That is, the first molding part 31a, which is an upper part of the molding part, is formed of a low stress material, for example, a silicon material, which has excellent optical characteristics and low stress, and the second molding part 31b, which is a lower part of the molding part, leads the leads. It is formed of a material that can be fixed strongly and has excellent physical properties with low thermal expansion, such as epoxy. In particular, the first molding part 31a uses silicon with enhanced hardness, and the second molding part 31b uses an epoxy containing filler such as ceramic powder to reduce the coefficient of thermal expansion. In this example of sealing, an example in which the molding part includes the first molding part 31a and the second molding part 31b has been described. However, if necessary, the material is the same as or different from that of the first molding part 31a and / or the second molding part. A plurality of molding parts such as a third molding part may be further formed using the molding resin of.

A method of manufacturing a light emitting diode package having a double molding part of FIG. 4 will be briefly described.

First, a lead frame similar or similar to that of FIG. 2 is prepared. Subsequently, the light emitting diode chip 38 is mounted in the light reflection cup 36 formed on the upper surface of the upper end of the first lead 32 via an adhesive, and then the light emitting diode chip 38 and the first chip are bonded with the bonding wire 39. And wire bonding between second wire bonding pads (not shown).

Subsequently, after preparing a mold cup capable of forming a package body, a release agent is applied to the inner wall of the mold cup. Subsequently, the lead frame and the mold cup are fixed so that the upper portions of the first and second leads 32 and 34 to which the light emitting diode chip 38 and the bonding wire 39 are bonded are inserted into the mold cup. Subsequently, molding is performed so that the upper portion of the light emitting diode chip 38, the bonding wire 39, and the first and second leads 32 and 34 are submerged by using liquid silicone, which is a low-stress transparent material, as a molding resin. Fill at least half of the cup and cure first. Primary curing may be omitted depending on the characteristics of the molding resin, or may be simplified simply by partial curing.

Subsequently, the epoxy resin, which is a second hard molding resin, is filled with the remaining portion of the mold cup, and the second curing is performed. Then, the package body is separated from the mold cup, and a punching process is performed on the lead frame to prepare a desired LED chip package. Complete

FIG. 6A is a schematic diagram illustrating a lamp-type LED package according to another embodiment of the present invention, wherein the second lead 54 and the third lead 62 are electrically connected to each other by a chip resistor 64. . Detailed descriptions of components that perform functions similar or identical to those of FIG. 4 will be omitted. As for the third lead 62, the upper part refers to a part sealed in the molding part 51, and the lower part refers to a part exposed from the molding part 51.

Referring to FIG. 6A, the illustrated LED package 50 includes a first lead 52, a second lead 54, and a third lead 62, and is disposed on the upper surface of the first lead 52. The light emitting diode chip 58 is attached to the light reflection cup 56 formed in a concave shape.

Meanwhile, unlike the embodiment of FIG. 4, in the present embodiment, the third lead 62 is formed to be separated from the first lead 52 and the second lead 54, and the third lead 62 and the third lead 62 are separated from each other. The two leads 54 are connected to each other via the chip resistor element 64.

A first wire bonding pad (not shown) may be formed on an upper surface of the first lead 52 adjacent to the light reflection cup 56, and a second wire bonding may be formed on an upper surface of the second lead 54. Pads (not shown) may be formed. First and second chip pads (not shown) and first and second wire bonding pads (not shown) formed on a surface of the light emitting diode chip 58 and providing a positive electrode and a negative electrode to the light emitting diode chip 58. Bonding wires 59 are wire-bonded and electrically connected therebetween. In addition, a molding part 51 is formed to fix upper portions of the first and second leads 52 and 54, to protect the light emitting diode chip 58 and the bonding wire 59, and to embed the resistance element 64 therein. .

The first lead 52 is formed with a light reflection cup 56 attaching the light emitting diode chip 58 to an upper end thereof, and serves as a first electrode of the light emitting diode chip 58 through a bonding wire 59. . When the light emitting diode chip 58 is a vertical chip, the first lead 52 may serve as a first electrode without a separate bonding wire. The second lead 54 is spaced apart from the first lead 52, and a second wire bonding pad (not shown) is formed at an upper end thereof so that a second lead 54 of the light emitting diode chip 58 is bonded through the bonding wire 59. The second lead 54 is electrically connected by the third lead 62 and the chip resistor 64 so that the third lead 62 also serves as the second electrode of the light emitting diode chip 38. do. Lower portions of the first and third leads 52 and 62 are exposed to the outside of the molding part 51. Meanwhile, the lower part of the second lead 54 connected to the chip resistor element 64 may also be exposed to the outside from the molding part 51, and the lower part of the second lead 54 is not a role of an electrode but a printed circuit. It may be fixed to a substrate or the like and used as a heat release passage. The chip resistance element 64 may be formed to be side mounted on a portion of the side of the second lead 54 and a portion of the side of the third lead 62.

A third lead 62 is added to the chip resistor 64 in order to be connected in series with the light emitting diode chip 58 and embedded in the package body. Although not directly bonded to the diode chip 58 or the bonding wire 59, the lower part of the third lead 62 is necessarily exposed to the outside of the package body as a terminal of the package. Chip resistance element 64 may be used according to the size of 0603 (length 0.6mm x width 0.3mm), 1005, 1608, 2012, etc., can be used by selecting the appropriate standard according to the package size. The resistance value may be selected and used according to the power supply to be used and the driving conditions of the light emitting diode chip 58 to be applied, and the power supply may have a suitable voltage considering the effect of heat generated from the chip resistance element 64. Can be used in consideration.

6B is a schematic diagram illustrating a lamp type light emitting diode package 50 'according to another embodiment of the present invention, in which a third lead 62 is connected to a first lead 52'. Detailed description of the same or similar components as in FIG. 6A will be omitted.

Referring to FIG. 6B, the illustrated LED package 50 ′ includes a first lead 52 ′, a second lead 54 ′, and a third lead 62. In this embodiment, the third lead 62 is formed to be separated from the first lead 52 'and the second lead 54', and the third lead 62 and the first lead 52 'are separated from each other. ) Are connected to each other through the chip resistance element (64).

The first lead 52 ′ is formed with a light reflection cup 56 attaching the light emitting diode chip 58 to an upper end thereof, and includes a light emitting diode chip together with a third lead 62 connected to the chip resistance element 64. It serves as a first electrode of (58). The second lead 54 ′ is spaced apart from the first lead 52 ′ and serves as a second electrode of the light emitting diode chip 58. Meanwhile, a lower portion of the first lead 52 ′ connected to the chip resistance element 64 may also be exposed to the outside from the package body. In this case, the lower portion of the first lead 52 ′ is not a role of an electrode but a printed circuit board. It may be fixed to the back and used as a heat release passage.

FIG. 7 illustrates a light emitting diode package assembly in which a plurality of light emitting diode packages 50 of FIG. 6a are connected in parallel. The first and third leads 52 and 62 extending to the outside of the package body are not used in a printed circuit board having fixing holes, but are connected in parallel to each other. The first leads of the first light emitting diode package are used. Reference numeral 52 is twisted and connected to the first lead 52 of the second light emitting diode package, and the third lead 62 is twisted and connected to the third lead 62 of the second light emitting diode package.

8 is a schematic view showing a lamp type light emitting diode package according to another embodiment of the present invention, which combines the embodiment of FIG. 4 with the embodiment of FIG. 6B. The same reference numerals are used for the same or similar components as those of these embodiments, and a detailed description thereof will be omitted.

Referring to FIG. 8, the light emitting diode package 70 includes a first lead 72, a second lead 74, and a third lead 82. In this embodiment, the third lead 82 is formed to be separated from the first lead 72 and the second lead 74, and the third lead 82 and the first lead 72 are chip resistors. The elements 84 are connected to each other. The chip resistance element 84 may be side mounted on a portion of the side surface of the first lead 72 and a portion of the side surface of the third lead 82.

The first lead 72 is formed with a light reflection cup 76 attaching a light emitting diode chip 78 to an upper end thereof, and a light emitting diode through a first wire bonding pad (not shown) that may be formed around the light reflecting cup 76. It serves as a first electrode of the chip 78. The second lead 74 may be spaced apart from the first lead 72, and a second wire bonding pad (not shown) may be formed at an upper end thereof, and serves as a second electrode of the LED chip 28. Since the first lead 72 is connected by the third lead 82 and the resistor 84, the third lead 82 also serves as the first electrode of the light emitting diode chip 78.

On the other hand, the sealing portion constituting the package body is molded with a first molding resin to fix the upper portion of the first and second leads (72, 74) from the upper side and to protect the light emitting diode chip (78) and the bonding wire (79). The upper and chip resistances of the first lead 72, the second lead 72, and the third lead 82 are in direct contact with the first molding portion 71a and the lower portion of the first molding portion 71a. It consists of the 2nd molding part 71b molded with the 2nd molding resin which fixes the element 84. FIG. The first molding part 71a, which is an upper part of the package body, is formed of a low stress material, for example, silicon, which has excellent optical characteristics and low stress, and the second molding part 71b, which is a lower part of the package body, leads the leads. It is formed of a material that can be fixed strongly and has excellent physical properties with low thermal expansion, such as epoxy.

FIG. 9 is a schematic diagram illustrating a process of manufacturing the light emitting diode package of FIG. 8.

Referring to Fig. 9A, a lead frame is prepared. Leads protruding from the rail 87 of the lead frame are formed. The first, second and third leads 72, 74, 82 are secured to the leadframe by tie-bars 86.

Referring to FIG. 9B, a chip resistor 84 is connected between a portion of the first lead 72 and an upper portion of the third lead 82. The chip resistor element 84 is mounted on the side of the lead frame in a flat state, and the plate material having the escape groove is not disturbed by the protruding portion of the light reflection cup 76 formed at the upper end of the lead frame. This can be done with the leadframe fixed. The chip resistor 84 may be mounted by solder cream or conductive adhesive.

Referring to FIG. 9C, the light emitting diode chip 78 is mounted in a die attach method in the light reflection cup 76 formed on the first lead 72.

Referring to FIG. 9 (D), wire bonding is performed between the light emitting diode chip 78 and the first and second leads 72 and 74 with a bonding wire 79.

Referring to Fig. 9E, after preparing a mold cup (not shown) capable of forming a package body, a release agent is applied to the inner wall of the mold cup. Subsequently, the lead frame and the mold cup are fixed to insert the upper portions of the first and second leads 72 and 74 to which the light emitting diode chip 78 and the bonding wire 79 are bonded into the mold cup. Subsequently, a mold cup is formed so that upper portions of the light emitting diode chip 78, the bonding wire 79, and the first and second leads 72 and 74 are locked by using liquid silicone, which is a low-stress transparent material, as a molding resin. The first molding part 71a is formed by filling it with at least half of the amount thereof, followed by primary curing. Primary curing may be omitted depending on the characteristics of the molding resin, or may be simplified simply by partial curing.

Referring to FIG. 9 (F), the epoxy resin, which is a second molding resin, is filled with the remaining portion of the mold cup, and the second molding part 71b is formed after curing the second portion of the mold cup, and then the package body is removed from the mold cup. After separation, the punching process is performed on the lead frame to complete the desired LED chip package. The hatched reference numeral '88' indicates the portion that is punched out and removed.

Although described in detail with respect to preferred embodiments of the present invention as described above, those of ordinary skill in the art, without departing from the spirit and scope of the invention as defined in the appended claims Various modifications may be made to the invention.

1 is a schematic view showing a lamp type light emitting diode package according to the prior art.

FIG. 2 is a diagram illustrating a lead frame used to manufacture the light emitting diode package of FIG. 1.

3 is a view illustrating a light emitting diode package assembly in which a plurality of light emitting diode packages of FIG. 1 are connected in series.

4 is a schematic view showing a lamp-type light emitting diode package according to an embodiment of the present invention.

FIG. 5 is a schematic plan view of the upper portion of the LED package of FIG. 4.

Figure 6a is a schematic diagram showing a lamp-type light emitting diode package according to another embodiment of the present invention.

6B is a schematic view showing a lamp type light emitting diode package according to another embodiment of the present invention.

FIG. 7 is a view illustrating a light emitting diode package assembly in which a plurality of light emitting diode packages of FIG. 6a are connected in series.

8 is a schematic view showing a lamp type light emitting diode package according to another embodiment of the present invention.

FIG. 9 is a schematic diagram illustrating a process of manufacturing the light emitting diode package of FIG. 8.

<Explanation of symbols for the main parts of the drawings>

30, 50, 50 ', 70; LED Package

31a, 71a; First molding portions 31b, 71b; 2nd molding part

32, 52, 72; First leads 34, 54, 74; Second lead

62, 82; Third lead 36, 56, 76; Light reflection cup

38, 58, 78; Light emitting diode chips 39, 59, 79; Bonding wire

64, 84; Chip Resistor

Claims (13)

A first lead having an upper end; A second lead having an upper end disposed adjacent to an upper end of the first lead; A light emitting diode chip attached to an upper end of the first lead; Bonding wires electrically connecting the light emitting diode chip and the first lead and between the light emitting diode chip and the second lead, respectively; And A molding part sealing the light emitting diode chip, the bonding wires, the upper part of the first lead, and the upper part of the second lead with a molding resin while exposing the lower part of the first lead and the lower part of the second lead; , The molding part, A first molding part sealing the light emitting diode chip and the bonding wires and positioned above the molding part; And A second molding part sealing a part of the upper part of the first lead and a part of the upper part of the second lead and positioned below the molding part; Lamp type light emitting diode package comprising a. The method of claim 1, wherein the first molding part uses a material having excellent optical characteristics compared to the second molding part, and the second molding part uses a material having better physical properties than the first molding part. Lamp type light emitting diode package. 3. The lamp type LED package of claim 2, wherein the first molding part is made of silicon and the second molding part is made of epoxy. The lamp type LED package of claim 1, further comprising a third molding part positioned below the second molding part. The lamp type light emitting diode package of claim 1, wherein a light reflecting cup having a concave shape is formed on an upper end of the first lead, and the light emitting diode chip is attached to the light reflecting cup. The second wire bonding pad of claim 5, wherein the first wire bonding pad is further formed on the upper end of the first lead and adjacent to the light reflection cup, and the bonding wire is attached to the upper end of the second lead. Lamp type light emitting diode package, characterized in that the further two wire bonding pads are formed. A first lead having an upper end; A second lead having an upper end disposed adjacent to an upper end of the first lead; A third lead formed to be spaced apart from the first lead and the second lead; A chip resistor connected electrically between any one of the first lead or the second lead and the third lead; A light emitting diode chip attached to an upper end of the first lead; Bonding wires electrically connecting the light emitting diode chip and the first lead and between the light emitting diode chip and the second lead, respectively; And A molding part sealing the light emitting diode chip, the bonding wires, and the chip resistance element while exposing a lower portion of at least one of the first lead and the second lead connected to the chip resistance element and a lower part of the third lead; ; Lamp type light emitting diode package comprising a. The method of claim 7, wherein the molding portion, A first molding part sealing the light emitting diode chip and the bonding wires and positioned above the molding part; And A second molding part sealing the chip resistance element and positioned below the molding part; Lamp type light emitting diode package comprising a. The chip resistor of claim 7 or 8, wherein the chip resistor is mounted between a side of any one of an upper side of the first lead or an upper side of the second lead and a side of the upper side of the third lead. Lamp type light emitting diode package. 10. The lamp type light emitting diode package of claim 9, wherein the first molding part is made of silicon and the second molding part is made of epoxy. The lamp type LED package of claim 7 or 8, wherein a light reflecting cup having a concave shape is formed on an upper end of the first lead, and the LED chip is attached to the light reflecting cup. . 12. The method of claim 11, wherein a first wire bonding pad is further formed on the upper end of the first lead adjacent to the light reflection cup, and the bonding wire is attached to the upper end of the second lead. Lamp type light emitting diode package, characterized in that the further two wire bonding pads are formed. 8. The lamp type LED package of claim 7, wherein a lower portion of the first lead or a lower portion of the second lead connected to the chip resistor is exposed from the sealing part.
KR1020070115731A 2007-11-13 2007-11-13 Lamp-type light emitting diode package KR20090049466A (en)

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KR1020070115731A KR20090049466A (en) 2007-11-13 2007-11-13 Lamp-type light emitting diode package

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109686730A (en) * 2019-01-23 2019-04-26 苏州弘磊光电有限公司 It is a kind of being capable of the mixed LAMP LED of alternating current-direct current

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109686730A (en) * 2019-01-23 2019-04-26 苏州弘磊光电有限公司 It is a kind of being capable of the mixed LAMP LED of alternating current-direct current
CN109686730B (en) * 2019-01-23 2024-01-05 苏州弘磊光电有限公司 LAMP LED capable of being used in AC-DC hybrid mode

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