KR20080056373A - Display module having grounding part, method of manufacturing the display module and method of manufacturing the grounding part - Google Patents

Abstract

A display module including a ground member, a manufacturing method thereof and a forming method of the ground member are provided to form a grounding member at a connection portion and a portion of a driving panel, thereby preventing the damage of a circuit due to the electrostatic discharge generated at the connection portion. A driving panel(110) drives an LCD panel(150). A connection member includes a substrate with plural lines mounted thereon and connects the LCD panel with the driving panel. A ground member grounds the connection member to the driving panel. The connection member includes an FPC(Flexible Printed Circuit). The ground member includes conduction materials and is formed by a thin layer type. The conduction materials are formed by a nano coating manner. The thickness of the ground member is below 10 micrometer. The ground member includes the first area formed to the connection member and the second area formed to the driving panel. The first area is formed by the same shape as the connection member and covers the entire of the connection member.

Description

DISPLAY MODULE HAVING GROUNDING PART, METHOD OF MANUFACTURING THE DISPLAY MODULE AND METHOD OF MANUFACTURING THE GROUNDING PART}

1 is a plan view of a display module according to an exemplary embodiment of the present invention.

2 is a perspective view of a display module according to an embodiment of the present invention.

3A and 3B are partially enlarged plan views of region 'A' of FIG. 1.

4A and 4B are plan views illustrating a method of forming a grounding part according to another exemplary embodiment of the present invention.

 The present invention relates to a display module, and more particularly to a display module that can prevent damage caused by electrostatic discharge of the display module.

In general, since a small liquid crystal display is often produced in a portable manner, the size of the substrate is small and the wiring is formed tightly in order to minimize the size. In addition, there is a specificity of the mobile, there is a need for a structure that can be easily prepared for exposure to static electricity.

In the case of a general substrate, it can be grounded to a chassis or the like to prepare for static electricity, but in the case of a flexible printed circuit (PCB) connecting the substrate, it is often exposed to static electricity. In addition, the connection flexible circuit board includes a single layer structure, which is further a problem.

In addition, in general, insulated tapes that are generally used have a thickness of 50 μm or more, so many materials are required, and in the case of mobile circuit boards, which are thinned, the application is often difficult.

In order to solve the above problems, an object of the present invention is to prevent damage caused by electrostatic discharge (ESD) without affecting the thin structure in the connection portion between the liquid crystal panel and the driving panel. It is to provide a display module comprising a grounding member.

In order to achieve the above object, the display module according to an embodiment of the present invention includes a liquid crystal panel, a driving panel for driving the liquid crystal panel, a connecting portion and a ground member. The connection part includes a substrate on which a plurality of wirings are mounted, and connects the liquid crystal panel and the driving panel. In addition, the grounding member grounds the connection portion to the drive panel.

The connection part may be characterized by including a flexible printed circuit (Flexible Printed Circuit).

The ground member may include a conductive material and may be formed in a thin film form. In addition, the conductive material of the ground member may be formed by a nano coating method. In addition, the ground member may be characterized in that less than 10 μm.

The ground member may include a first region formed in the connecting portion and a second region formed in the driving panel, wherein the first region is formed in substantially the same shape as the connecting portion so as to cover the entire connecting portion. You can do

The driving panel may include a ground receiving portion, and the second region of the grounding member may be formed in the ground receiving portion.

According to another aspect of the present invention, a method of manufacturing a display module includes forming a liquid crystal panel, a driving panel for driving the liquid crystal panel, a substrate on which a plurality of wirings are mounted, and forming the liquid crystal panel and the driving panel. Forming a connecting portion for connecting, and laminating a metal thin film over the connecting portion and the driving panel.

The connection part manufacturing method of a display module characterized in that it comprises a flexible printed circuit (Flexible Printed Circuit).

The method of manufacturing the display module may be characterized in that the metal thin film is 10 μm or less, and the laminating the metal thin film may include forming the metal thin film by nano coating.

According to another aspect of the present invention, there is provided a method of forming a grounding part including an electrical circuit structure including a first substrate, a second substrate including a grounding structure, a plurality of wires, and a connection part connecting the first substrate and the second substrate. The thin metal thin film passing through the second substrate and the connecting portion is laminated.

The ground portion may be characterized in that less than 10 μm. The method of forming the ground portion may include a method of forming a metal thin film using a conductive nano coating.

Hereinafter, a display device according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a display module according to an exemplary embodiment of the present invention.

Referring to FIG. 1, the display module 100 includes a liquid crystal panel 150, a driving panel 110 for driving the liquid crystal panel, a connection portion 120 connecting the driving panel and the liquid crystal panel, and a ground member 130. Include.

The connection part 120 includes a plurality of wires for exchanging electrical signals between the liquid crystal panel 150 and the driving panel 110. The plurality of wires may be mounted on the connection part 120. For example, the connection part 120 is manufactured in the form of a substrate, and a plurality of wirings are densely formed on the substrate.

The connection part 120 may include a flexible printed circuit (FPC). In addition, the connection part 120 may include a rigid flexible printed circuit.

The drive panel 110 includes a ground connection 115. The ground connection part 115 allows the ground member 130 to be electrically connected to the driving panel 110 to be grounded. In addition, the driving panel 110 may include a structure that is itself grounded. The grounding member 130 grounds the connection part 120 and the driving panel 110, and the driving panel 110 is grounded to an external chassis by itself. As a result, the connection part 120 is connected to the external chassis or the like. It will be grounded.

The ground member 130 electrically connects the connection part 120 and the driving panel 110. The ground member 130 covers most of the connection part 120. The ground member 130 is electrically connected to the ground connection portion 115 of the driving panel 110. Therefore, the connection part 120 is grounded through the driving panel 110 which is grounded.

2 is a perspective view of a display module according to an embodiment of the present invention.

The display module 100 according to an exemplary embodiment of the present invention is a case in which the connection part 120 of the display module 100 illustrated in FIG. 1 includes a flexible printed circuit.

The connecting member 120 and the ground member 130 stacked on the driving panel 110 are formed of a thin thin film layer. Therefore, even if the connection part 120 has a bent structure, the grounding member 130 can be bent as well as the connection part 120 is bent.

3A and 3B are partially enlarged plan views of region 'A' of FIG. 1.

Referring to FIG. 3A, the liquid crystal panel 350 is electrically connected to the driving unit 310 and the connection unit 320 for driving the liquid crystal panel.

The drive panel 310 includes a ground connection part 315 for electrical connection with a ground member. The ground connection part 315 may be electrically connected to the grounded structure of the drive panel 310, thereby grounding both the drive panel 310 and the connection part 320.

The driving panel 310 includes a gate drive IC and a data drive IC, and applies driving signals and data signals generated by the gate drive IC and the data drive IC to the liquid crystal panel.

Electrical signals applied by the driving panel 310 to the liquid crystal panel require a plurality of wiring structures, and a plurality of wiring structures are mounted on the connection part 320.

At this time, the connection portion 320 is not only finely formed in the spacing of a number of wiring structures, the size is formed small. In particular, when the display module 100 is a mobile display module, damages due to static electricity are likely to occur in the connection part 320.

Electrostatic discharge (ESD) may occur in the connection part 320 itself, and noise may occur in electrical signals supplied from the gate drive IC and the data drive IC of the driving panel 310. In addition, the electrostatic discharge (ESD) may flow into the driving panel 310 through the connection part 320, thereby damaging the ICs of the driving panel 310.

Therefore, in order to prevent this, the ground member 330 is electrically connected to the connecting portion 320 and the driving panel 310, and the connecting portion 320 is grounded by the ground of the driving panel 310.

Referring to FIG. 3B, the ground member 330 includes a first region 331 and a second region 333. The first area covers the entirety of the connection part 320. The first region 331 is formed in substantially the same shape as the connection portion 320. Since the first region 331 is sufficient to cover most of the connection part 320, the first area 331 may be formed in the same shape as the connection part 320.

The second area 333 is an area electrically connected to the ground connection part 315 of the driving panel 310. The ground connection part 315 electrically connected to the ground part of the driving panel 310 has a structure in which the copper foil is opened to be electrically connected to the second region 333 of the ground member 330.

The ground connection part 315 may be formed anywhere in the non-circuit area of the driving panel 310, and preferably close to the part where the driving panel 310 is connected to the connection part 320.

The ground connection part 315 may be formed in a band shape, and may be formed in a wide rectangular shape. It may be formed to be wide enough so that the ground is sufficient.

The second region 315 of the ground member 330 may be formed in substantially the same shape as the plane of the ground connection portion 315. Alternatively, the ground connector 315 may be formed in substantially the same shape as the plane of the ground connector 315 to cover most of the ground connector 315.

The first region 331 and the second region 335 of the ground member 330 may have substantially the same thickness, and the second region 335 may be formed thicker than the first region 331. Can be. Since the first region 331 is formed on the connector 320, the first region 331 may be bent together with the connector 320 when the connector 320 is a flexible printed circuit by maintaining a thin thickness. Make sure

4A and 4B are plan views illustrating a method of forming a grounding part according to another exemplary embodiment of the present invention.

4A and 4B, the electric circuit device 400 according to another embodiment of the present invention may include a first panel 410, a second panel 450, and a connection part connecting the first panel and the second panel ( 420 and ground member 430. This embodiment may be referred to as a general application example than the embodiment of FIG.

The first panel 410 includes a ground connection part 415 and a ground part 417. The first panel 410 is electrically grounded through the ground portion 417. The second panel 450 may be individually and electrically grounded. Electrostatic discharge may occur through the connection part 420. Since the first panel 410 is grounded, the first panel 410 may be electrically connected to the ground of the first panel 410 to prevent electrostatic discharge through the connection part 420.

The ground member 430 grounds the connection portion 420 through the ground connection portion 415. The ground member 430 includes a first region 431 and a second region 433. The first area 431 covers the connection part 420, and the second area 433 is electrically connected to the ground connection part 415.

The ground member 430 may be formed in a separate process after the first panel 410, the second panel 450, and the connecting portion 420 are formed. For example, the ground member 430 may be added to a finished product in which the first panel 410, the second panel 450, and the connecting portion 420 are formed in a separate process.

The ground connection part 415 should be formed in the first panel 410 first. The ground member 430 is formed by applying a metal film to the connection portion 420 and the ground connection portion 415 of the first panel 410. The applied metal film may be formed using a nano coating. In this case, the metal film formed may have a thickness of about 10 μm or less, and may include silver.

In the process of applying the metal layer to the connection part 420 and the ground connection part 415 of the first panel 410, a coating layer may be partially formed using a mask or the like.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

As described above, according to the present invention, a ground member is formed over the connection portion and a part of the driving panel at the connection portion between the liquid crystal panel and the driving panel for driving the same, thereby preventing damage to the circuit due to the electrostatic discharge generated at the connection portion. .

In addition, the grounding member may be formed by a thin film lamination method such as a nano coating to improve the grounding function by minimizing its thickness, and at the same time, it may prevent the difficulty of thinning a mobile device and increasing the number of materials due to the increase in thickness. Will be.

Claims (14)

Liquid crystal panels; A driving panel driving the liquid crystal panel; A connection part including a substrate on which a plurality of wirings are mounted, and connecting the liquid crystal panel and the driving panel; And And a ground member for grounding the connection part to the driving panel. The display module of claim 1, wherein the connection part comprises a flexible printed circuit. The display module of claim 1, wherein the ground member comprises a conductive material and is formed in a thin film form. The display module of claim 3, wherein the conductive material is formed by a nano coating method. The display module of claim 4, wherein the ground member is 10 μm or less. The method of claim 3, wherein the ground member comprises a first region formed in the connection portion and a second region formed in the drive panel, And the first area is formed in substantially the same shape as the connection part so as to cover the entire connection part. The display module of claim 6, wherein the driving panel includes a ground receiving portion, and the second region of the grounding member is formed in the ground receiving portion. Forming a liquid crystal panel and a drive panel for driving the liquid crystal panel; Forming a connection portion including a substrate on which a plurality of wirings are mounted, and connecting the liquid crystal panel and the driving panel; And Stacking a metal thin film over the connection part and the driving panel. The method of claim 8, wherein the connection part comprises a flexible printed circuit. The method of claim 8, wherein the metal thin film is 10 μm or less. The method of claim 10, wherein the stacking of the metal thin film comprises nano coating the metal thin film. An electrical circuit structure comprising a first substrate, a second substrate including a ground structure, a connection portion including a plurality of wires and connecting the first substrate and the second substrate, And forming a thin metal thin film passing through the second substrate and the connection part. The method of claim 12, wherein the ground portion is 10 μm or less. The method of claim 13, wherein the method of forming the ground portion comprises a method of forming a metal thin film using a conductive nano coating.

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