KR20070049943A - Method for fabricating the oled display panel - Google Patents

Abstract

A method of manufacturing an LED display panel capable of simultaneously forming a separator and an insulator is provided. The method of manufacturing an LED display panel includes (a) forming a lower electrode pattern on a substrate, (b) forming a positive photoresist film for forming an insulator on a substrate on which a lower electrode pattern is formed, and (c) on a positive photoresist film. Forming a negative photosensitive film for forming a separator, (d) exposing the negative photosensitive film to form a reverse tape type separator, and performing a post-exposure heat treatment, and (e) forming an insulator in the positive photosensitive film between the separator patterns. Exposing a portion excluding the region, and (f) developing the exposed positive photoresist and negative photoresist to form an insulator and an insulator defining a pixel region under the separator.

OLED, OLED, Separator, Insulator, Negative Photoresist, Positive Photoresist

Description

Method for fabricating the OLED display panel

1A to 1F are cross-sectional views illustrating a manufacturing process of a conventional LED display panel.

2A through 2F are cross-sectional views illustrating a method of manufacturing an LED display panel according to an exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

200: substrate 210: lower electrode pattern

220: insulator 221: positive photosensitive film

230: Separator 231: negative photosensitive film

The present invention relates to a method for manufacturing an LED display panel, and more specifically, a separator and an insulator can be formed in one development process, thereby improving process efficiency and reducing process costs. The present invention relates to a manufacturing method of an LED display panel.

OLED stands for Organic Light Emitting Diode, and refers to a self-luminous display that emits light by electrically exciting a luminescent organic compound.

OLED can be operated at low voltage and eliminates the drawbacks of LCDs such as thinning, wide viewing angles, and fast response speeds.It is equivalent to or better than TFT-LCD in medium size and lower than other display devices. It is attracting attention as a next-generation display that has advantages such as being able to have a simple manufacturing process and advantageous in future price competition.

The OLED is formed of an organic luminescent material in a space between a lower plate having a form in which an ITO transparent electrode pattern is formed as a positive electrode on a transparent glass substrate and an upper plate in which a metal electrode is formed as a negative electrode on the substrate. And a display device that emits light while a current flows through the organic light emitting material when a predetermined voltage is applied between the metal electrode and the metal electrode.

1A to 1F are cross-sectional views illustrating a manufacturing process of a conventional LED display panel.

In order to manufacture an LED display panel, first, a lower electrode pattern 110 is formed on a substrate 100 as shown in FIG. 1A.

Next, as illustrated in FIG. 1B, a positive photoresistor for forming an insulator is formed, and the insulator 120 is subjected to an exposure and development process as shown in FIG. 1C. Form.

Thereafter, a negative photoresistor for forming a separator is formed conformally on the insulator 120 as shown in FIG. 1D, and the separator 130 is shown in FIG. 1E. Separator 130 is completed through a process of exposing as a pattern of) and a developing process as shown in FIG. 1F.

As described above, the conventional process of manufacturing an LED display panel forms the insulator 120 and the separator 130 in separate steps, and thus requires at least two exposure and development processes to form each of them. Done.

In general, reducing one exposure or development process in a semiconductor or display device manufacturing process results in an increase in process efficiency of about 10% or more, which leads to a decrease in manufacturing cost.

Accordingly, the present invention is to provide a technology that can form a separator and an insulator at the same time in one step in the conventional manufacturing of the LED display panel.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a method for manufacturing an OLED display panel, which can simultaneously form a separator and an insulator in a single development process.

Technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above technical problem, a method of manufacturing an LED display panel according to an embodiment of the present invention includes (a) forming a lower electrode pattern on a substrate, and (b) forming an insulator on the substrate on which the lower electrode pattern is formed. Forming a positive photosensitive film for use, (c) forming a negative photosensitive film for forming a separator on the positive photosensitive film, (d) exposing the negative photosensitive film to form an inverse tape type separator, and performing a post-exposure heat treatment, (e) exposing a portion of the positive photoresist film between the separator patterns except for a portion of the region where the insulator is to be formed, and (f) developing the exposed positive photoresist film and the negative photoresist film to form a pixel region under the separator and the separator. Forming an insulator to define.

Specific details of other embodiments are included in the detailed description and the accompanying drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments are intended to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

In addition, in the drawings, the size and thickness of layers and films or regions are exaggerated for clarity of description, and when any film or layer is described as being formed "on" of another film or layer, It may be directly on top of the other film or layer, and a third other film or layer may be interposed therebetween.

2A through 2F are cross-sectional views illustrating a method of manufacturing an LED display panel according to an exemplary embodiment of the present invention.

In order to manufacture an LED display panel according to an embodiment of the present invention, first, as shown in FIG. 2A, a lower electrode pattern 210 is formed on a substrate 200.

The substrate 200 becomes a base layer of the OLED display panel 20 of the present invention, and in the case of a bottom emission type and a dual emission OLED display panel, the substrate 200 is made of glass. Transparent substrates are used, and in the case of top emission, silicon substrates are used.

The lower electrode pattern 210 is an electrode used as an anode and is formed with a stripe pattern on the substrate 200.

The lower electrode pattern 210 is formed of a transparent material such as indium tin oxide (ITO) in the case of the bottom emission type and the bidirectional emission type, but is formed using a metal material in the case of the top emission type.

In order to form the lower electrode pattern 210, a conductive material is coated on the entire substrate 200 and patterned using a photo-etching process to have a predetermined pattern (stripe pattern).

Next, as illustrated in FIG. 2B, a positive photoresistor 221 for forming an insulator is formed on the transparent substrate 200 on which the lower electrode pattern 210 is formed.

The positive photoresist film 221 refers to a photoresist film which is removed during a development process by softening a structure of a portion receiving light in an exposure step.

The positive photoresist film 221 is generally applied using spin coating.

Next, as illustrated in FIG. 2C, a negative photosensitive film 231 for forming a separator is formed on the positive photosensitive film 221.

The negative photosensitive film 231 refers to a photosensitive film in which a portion of the portion that is not lighted during the development process is removed by hardening the structure of the portion receiving the light in the exposure step.

However, the negative photoresist film 231 is a light-received portion and is not removed in the development process unconditionally, but cross-linked to the polymer photoresist film of the exposed portion through a post exposure baking (PEB) process. Must occur to become a film that is not removed during the development process. Therefore, even if the portion of the negative photosensitive film 231 that receives the light does not go through the post-exposure heat treatment process is removed during the development process.

After the process of forming the positive photoresist film 221 and the negative photoresist film 231, soft baking is performed at a temperature of about 90 ° C. to 120 ° C. to slightly solidify the liquid photoresist films. It is common to have steps to make it into

Next, as shown in FIG. 2D, the negative photosensitive film 231 is exposed using a photo mask to form a reverse taper type separator 230. After the exposure is carried out, a post-exposure heat treatment (PEB) process is performed to form a cross link in the photoresist polymer of the exposed separator 230. As a result, the separator 230 is developed. The process remains as an area that cannot be removed.

Next, as shown in FIG. 2E, exposure is performed to a portion of the positive photoresist film 221 between the separators 230, except for a region where the insulator is to be formed (under the separator), which is later defined as a pixel region. Conduct.

At this time, the exposure is exposed deep enough to the area of the positive photoresist layer 221 in contact with the lower electrode pattern 210 through the negative photoresist layer 231. As a result, the exposed region of the positive photoresist layer 221 has a weak structure ( softening).

However, since the exposure process step is performed through the negative photoresist film 231, the negative photoresist film 231 may also receive light to harden its structure, but as described above, in this step, post-exposure heat treatment (PEB) Since the process is not performed, the negative photosensitive film 231 exposed to light by the exposure of this step can be later removed in the developing process.

Next, as shown in FIG. 2F, the negative photoresist film 231 and the positive photoresist film 221 of the non-strong tissue are removed through a development process.

The portion of the negative electrode 230 which has undergone the exposure and post-exposure heat treatment steps of the negative photoresist film 231 remains, and the portion not subjected to the heat treatment process after the exposure process is removed.

The light-receiving portion of the positive photoresist film 221 is removed, and the light-received portion of the lower portion of the separator 230 remains, and the portion of the positive photoresist film 221 not receiving the light under the separator 230 is an insulator. (insulator; 220).

Thereafter, a hard baking step may be performed at a temperature of about 100 to 130 ° C. to obtain a separator 230 and an insulator 220 having a harder structure.

Finally, curing is completed in an oven at about 200 ° C. to 300 ° C. to completely remove foreign substances, such as moisture or organic substances, remaining in the positive photoresist 221 and the negative photoresist 231 after the hard baking is completed. When the step is performed, the separator 230 and the insulator 220 according to the present invention are completed.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments but may be manufactured in various forms, and having ordinary skill in the art to which the present invention pertains. It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

According to the method of manufacturing an OLED display panel according to an embodiment of the present invention, a separator and an insulator can be formed in only one developing process, thereby increasing process efficiency, and thus, a decrease in manufacturing cost. It becomes possible.

Claims (3)

(a) forming a lower electrode pattern on the substrate; (b) forming a positive photoresist film for forming an insulator on the substrate on which the lower electrode pattern is formed; (c) forming a negative photosensitive film for forming a separator on the positive photosensitive film; (d) exposing the negative photosensitive film to form a reverse tape type separator and performing post-exposure heat treatment; (e) exposing a portion of the positive photoresist film between the separators except for a portion of the region where an insulator is to be formed; And and (f) developing the exposed positive photoresist film and the negative photoresist film to form a separator and an insulator defining a pixel region under the separator. The method of claim 1, And (b) and soft baking at a temperature of 90 ° C. to 120 ° C. after the step (c). The method of claim 1, Performing hard baking at a temperature of 100 to 130 ° C. after the step (f); And The method of manufacturing an LED display panel further comprising the step of curing in an oven at 200 ~ 300 ℃ to remove the foreign matter remaining in the photosensitive film.

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