KR20060096903A - Thermal processing unit - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal processing apparatus, wherein a post bake zone (POB 56), which is an example of a thermal processing apparatus, includes a substrate transport mechanism 71 and a substrate for heating the substrate G for transporting the substrate G in a horizontal direction. A plurality of panel heaters 72 are provided at predetermined height positions on the conveyance route of the substrate G by the conveyance mechanism 71 with a distance 73 at a predetermined interval along the conveyance route. The heater 72 is constituted by a plurality of small heaters 72a, 72b and a plurality of small heaters (B) because it prevents transfer traces from occurring on the substrate G due to the seams of the plurality of small heaters 72a, 72b. 72a.72b) is a high-throughput thermal processing apparatus capable of carrying out heating or cooling while conveying a substrate by connecting the joint so that the joint does not become parallel with the substrate conveying direction within a certain distance range. Provided is a technique of a thermal processing apparatus capable of suppressing occurrence.

Description

Thermal Processing Unit {THERMAL PROCESSING UNIT}

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows one Embodiment of the resist coating and image development processing system which is one Embodiment of the processing apparatus of this invention.

FIG. 2 is a plan view showing a schematic structure of the resist coating and developing processing system of FIG. 1. FIG.

It is explanatory drawing which showed the conveyance order of the board | substrate in the resist coating and image development processing system of FIG.

4 is a side view illustrating a schematic structure of the post bake zone POB and the cooling zone COL.

5 is a perspective view showing a schematic shape of a roller member.

6 is a perspective view showing a schematic structure of a heater disposed in a post bake zone POB.

** Description of reference numerals indicating major parts **

1; first processing unit

2; second processing unit

3; first conveying unit

4; second conveying unit

5; interface part

6; container carrying in and out

11a-11d 12a-12d processing block

56; Post Bake Zone (POB)

57: Cooling zone (COL)

71; substrate conveying mechanism

71a; roller member

72; heater

74; heating gas supply device

75; intake device

76: IR (infrared rays) heater

77; cooling plate

78; cooling gas injection device

100; resist coating and developing processing system

G; substrate (LCD substrate)

This invention relates to the thermal processing apparatus used for heat-cooling a board | substrate in the photolithography process, such as a glass substrate in the manufacturing process of FPD (flat panel display), such as a liquid crystal display (LCD), for example.

For example, in the LCD manufacturing process, a predetermined circuit pattern is formed on a glass substrate by supplying a resist liquid to a glass substrate using a photolithography technique, forming a coating film, and drying and heat-treating it, and then performing exposure treatment development treatment in order. . After supplying a resist liquid to a glass substrate and forming a coating film here, the prebaking process which heats a coating film and removes an unnecessary solvent etc. is performed. After the exposure treatment, a post exposure bake treatment for promoting the chemical change of the resist film due to exposure is carried out, and after the development treatment, a post bake treatment is performed which combines fixing of the development pattern and drying of the glass substrate.

Conventionally, as a device for performing such heat treatment, a heating device having a hot plate for mounting a glass substrate, a lifting mechanism for lifting the glass substrate on and off the chamber, and a chamber for containing the hot plate is used (for example, a patent document). 1). Moreover, the glass substrate after heat processing is conveyed to the cooling apparatus provided with a cooling plate as needed, and is cooled there.

However, in such a heating apparatus and a cooling apparatus, it takes time to carry out a glass substrate to an apparatus, and a yield is not good. In recent years, since the size of glass substrates is rapidly increasing, in the photolithography process, a spinner type device such as rotating a glass substrate to form a resist film tends to cause stains in the center and the periphery of the glass substrate. Instead of the apparatus, a so-called conveying type apparatus for applying and developing a resist film by applying a resist solution while carrying a substrate in one direction and applying and developing a developer is used. Therefore, when a system that consistently performs the process from resist film formation to development by combining such a transfer type device with a conventional batch type heating device or the like becomes complicated, it is also difficult to increase the yield of the substrate transfer system.

   [Patent Document 1] Japanese Patent Application Laid-Open No. 8-313855

SUMMARY OF THE INVENTION The present invention has been made in view of the related circumstances, and provides a thermal processing apparatus having a high yield which can perform heating and cooling while conveying a substrate, and also providing a thermal processing apparatus that can suppress the occurrence of heating and cooling stains on the substrate. The purpose.

According to the present invention, as a thermal processing apparatus for thermally processing while transporting a substrate in a horizontal direction in a substantially horizontal posture.

A substrate conveyance mechanism for conveying the substrate in a horizontal direction;

In order to heat a board | substrate, it is provided with the some panel-shaped heater arrange | positioned at predetermined intervals along the said conveyance route at the predetermined height position on the conveyance route of the said board | substrate conveyance mechanism,

The heaters are each constituted by a plurality of small heaters, and the plurality of small heaters are arranged in the substrate conveyance direction in order to prevent transfer marks on the substrate due to the joints of the plurality of small heaters. A thermal processing apparatus is provided which is connected so as not to be parallel.

In the thermal processing apparatus according to the present invention, each heater is preferably configured by combining a plurality of small heaters having different sizes, thereby increasing the degree of freedom in arranging the joints of the small heaters. Further, the thermal processing apparatus is further provided with a heating gas supply device for supplying a gas heated at a predetermined temperature to an interval provided between the plurality of heaters, and an intake device for intake air from the interval provided between the plurality of heaters, and a heating gas supply device. If the gas supply point from and the intake point from the intake apparatus are alternately provided at intervals between a plurality of heaters present along the substrate conveyance direction, the evaporate from the substrate can be efficiently removed, which is preferable.

It is also possible to use a substrate conveying mechanism having a plurality of circumferential roller members arranged in a predetermined interval in the substrate conveying direction with a direction perpendicular to the substrate conveying direction in a longitudinal direction, and having a roller driving means for rotating these roller members. The processing apparatus is provided with a lamp having an IR heater or thermal radiation for heating the substrate from the back surface of the substrate conveyed by the substrate conveying mechanism, and the IR heater or lamp not only directly heats the substrate, but also heats the roller member from the roller member. The heat transfer to the substrate is also preferable in that the substrate can be heated to improve the yield. For this reason, a heat storage material is used suitably for a roller member.

In the thermal processing apparatus, in order to cool the board | substrate heated by the heater, a cooling plate can be provided in the predetermined height position on the conveyance route of a board | substrate. In that case, in order to cool a board | substrate from the back surface of a board | substrate, it is preferable to provide the cooling gas injection apparatus for injecting cooling gas into the back surface of a board | substrate. The material with high thermal conductivity is used suitably for the roller member cooled by exposure to the environment of a cooling gas.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to an accompanying drawing.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the external appearance of the resist coating and image development processing system 100 of LCD glass substrate (henceforth "substrate" (G) according to 1st Embodiment of this invention; FIG. 2A is a resist coating. It is a top view which shows the structure of the upper end of the image development processing system 100, and FIG. 2B is a top view which shows the structure of the lower end.

The resist coating and developing processing system 100 applies a predetermined thermal treatment or liquid treatment to the container carrying-in / out portion (cassette station 6) and the substrate G on which the cassette C containing the plurality of substrates G is placed. An interface part 5 and a first processing part 1 for carrying the substrate G between the first processing part 1 and the second processing part 2 provided with a plurality of zones and an exposure apparatus (not shown); It has the 1st conveyance part 3 provided between the container carrying-in / out part 6, and the 2nd conveyance part 4 provided between the 1st processing part 1 and the 2nd processing part 2. As shown in FIG. In addition, as shown in FIG. 1, the direction orthogonal to the X direction in the horizontal direction of the X direction in the X direction horizontal plane of the resist coating and developing processing system 100 is Y direction; The vertical direction is Z direction.

The 1st processing part 1 has the laminated structure divided | segmented into two stages in the up-down direction (Z direction), and the upper end and the lower end are divided into two also in the Y direction, respectively. In this way, independent processing blocks 11a and 11b are formed at the lower end of the first processing unit 1, and processing blocks 11c and 11d are respectively formed at the upper end thereof. The second processing unit 2 is thus also divided into two stages in the vertical direction (Z direction), and the upper and lower ends are divided into two in the Y direction, respectively, and independent processing blocks 12a and 12b are disposed at the lower ends thereof; Processing blocks 12c. 12d are formed at the upper end thereof, respectively.

The container carrying-in / out part 6 has the stage 7 which mounts the cassette C, For example, it is possible to mount four cassettes C to a predetermined position. The container carrying-in / out part 6 has the board | substrate G which should be processed in the resist coating and developing processing system 100 from the exterior; The board | substrate G in which the accommodated cassette C was carried in and the predetermined process was complete | finished in the resist coating and image development processing system 100; The stored cassette C is conveyed to the next step. The carrying in / out of this cassette (C) may use any form of automatic conveyance using manual conveyance or a conveyor.

The 1st conveyance apparatus 17 is provided in the 1st conveyance part 3 provided between the 1st process part 1 and the container carrying-in / out part 6. This 1st conveying apparatus 17 has the conveying arm 17a which expands and contracts in the X direction, and the conveyance arm 17a is comprised by the Y direction slide-freely, rotationally free in a horizontal plane, and raising / lowering freely in a Z direction. By this structure, the 1st conveying apparatus 17 accesses the container carrying-in / out part 6 and the 1st processing part 1, and transfers the board | substrate G between the container carrying-in / out part 6 and the 1st processing part 1. Then, the substrate G is transferred between the processing blocks 11a to 11d constituting the first processing unit 1.

In the second conveying unit 4 provided between the first processing unit 1 and the second processing unit 2, a second conveying apparatus 18 having a conveying arm 18a is provided. The second conveying apparatus 18 has the same structure as that of the first conveying apparatus 17, and receives the first and second treating portions of the substrate G between the first processing portion 1 and the second processing portion 2. Transfer of the substrate G between the processing blocks 11a to 11d constituting 1) and transfer of the substrate G between the processing blocks 12a to 12d constituting the second processing unit 2 are carried out. .

The interface part 5 is provided with the 3rd conveying apparatus 19 which has the same structure as the 1st conveying apparatus 17, and the conveyance arm 19a of the 3rd conveying apparatus 19 carries out the 2nd process part 2 It is possible to access the processing blocks 12a to 12d to be configured and to access an exposure device (not shown) provided so as to sandwich the interface unit 5 between the second processing units 2. In this way, the 3rd conveying apparatus 19 carries out the board | substrate G between the process blocks 12a-12d which comprise the 2nd process part 2, and between the 2nd process part 2 and an exposure apparatus. The board | substrate G is handed over.

The processing block 11a constituting the first processing unit 1 has an excimer UV irradiation zone (e-UV) 21 for removing organic matter on the substrate G on the first conveying unit 3 side prior to scrubber cleaning. The scrubber cleaning zone SCR 22 which is provided and adjoins the excimer UV irradiation zone e-UV 21 to perform the scrubber cleaning treatment of the substrate G is provided on the second conveying section 4 side. In this processing block 11a, the excimer UV irradiation process and the scrubber cleaning process are continuously performed while conveying the board | substrate G substantially horizontally to a X direction using the method of rotor conveyance, etc., without being rotated.

A filter fan unit (FFU) (not shown) is provided in the ceiling of the excimer UV irradiation zone (e-UV) 21 and the scrubber cleaning zone (SCR) 22. In addition, the scrubber cleaning zone SCR 22 does not cause mist or the like of the processing liquid generated during the scrubber cleaning process of the substrate G to scatter from the scrubber cleaning zone SCR 22 to the excimer UV irradiation zone e-UV 21. It is preferable to provide a shutter between the and excimer UV irradiation zones (e-UV) 21. Also, by adjusting the direction of the downflow from the filter fan unit FFU, scattering of mist or the like can be suppressed.

The processing block 11b positioned with the partition wall on the Y-direction side of the processing block 11a includes a cooling unit COL 23 facing from the first transfer section 3 side to the second transfer section 4 side; Resist coating unit (CT, 24); The reduced pressure drying / peripheral resist removal units (VD / ER) 25 are arranged side by side, and a filter fan unit (FFU) not shown is provided in the ceiling of the processing block 11b.

In the cooling units COL 23, a thermal treatment is performed to increase the temperature uniformity of the substrate G before applying the resist in order to increase the uniformity of the resist film formed on the substrate G. In the resist coating unit CT, 24, a resist film is formed in the surface of the board | substrate G by passing the board | substrate G in substantially horizontal position under the nozzle which discharges a resist liquid in strip shape, for example. The reduced pressure drying / peripheral resist unit (VD / ER) 25 processes the resist film formed on the substrate G under reduced pressure without heat treatment to evaporate the volatile components contained in the resist film and to apply the resist coating unit (CT, 24). The resist attached to the back surface of the substrate G and the resist film of the peripheral portion of the substrate G are removed during the application of the resist film in the substrate. Transfer of the substrate (G) from the cooling unit (COL) 23 to the resist coating unit (CT, 24) and the substrate from the resist coating unit (CT, 24) to the reduced pressure drying / ambient resist removal unit (VD / ER, 25) The conveyance of (G) can be performed by providing the board | substrate conveyance arm not shown, for example.

The dehydration bake process of the board | substrate G by which the scrubber washing process was complete | finished from the 2nd conveyance part 4 side to the 1st conveyance part 3 side is performed to the process block 11c located in the upper end of the process block 11a. Two adhesion treatment zones AD 52 which apply hydrophobization treatment to the dehydrated bake zones DHP 51 and the substrate G; Cooling zones COL 53 for cooling the substrate G to a predetermined temperature are provided.

Their dehydrated bake zones (DHP, 51); Ad-hoc treatment zones (AD) 52; The cooling zones COL 53 are not separated in the X direction but can only be divided into temperature zones for performing each treatment, and the substrate G is directed from the second transfer section 4 side toward the first transfer section 3 side. ) Is heat-treated by passing through each zone while being conveyed substantially horizontally in the processing block 11c in the X direction. Since the ADH treatment zone (AD) 52 and the cooling zone (COL) 53 have a large difference in the set temperature, it is possible to block these zones by the shutter. It is held only at the time of passage from the zones AD and 52 to the cooling zone COL 53, and is held in a closed state at other times.

The post-bake process of the board | substrate G by which the image development process was complete | finished toward the 1st conveyance part 3 side from the 2nd conveyance part 4 side to the process block 11d located in the upper end of the process block 11b is carried out. The post zone POB 56 and the cooling zone COL 57 for cooling the substrate G after the postbaking treatment are provided.

Similarly to the structure of the processing block 11c, the post bake zones POB and 56 and the cooling zones COL and 57 are not separated in the X direction, but are divided into temperature zones for performing each treatment. From the 2nd conveyance part 4, the board | substrate G is heat-processed by passing a predetermined zone, conveying the inside of a process block 11d substantially horizontally in the X direction toward the 1st conveyance part 3. The structure of this process block 11c is demonstrated in more detail later.

The lower processing block 12a constituting the second processing unit 2 is a development processing unit DEV 27 that performs development of the substrate G after the exposure processing, and is in the development processing unit DEV 27. Thus, while the substrate G is conveyed from the interface portion 5 side toward the second conveying portion 4 side in a substantially horizontal posture, the developer cleaning and drying treatment after developing the developer coating is sequentially performed. A filter fan unit (FFU) (not shown) is provided in the ceiling of the developing unit (DEV) 27, and is supplied to the substrate G to which downflow of clean air is conveyed.

In the processing block 12b, which has a partition wall on the Y-direction side of the processing block 12a, a titler TIT for recording predetermined information on the substrate G after the exposure process on the second conveying part 4 side; 62) is provided, and the stock unit ST, 64 for temporarily retiring the exposed substrate G on the interface portion 5 side, is disposed, and a sequencer of the resist coating and developing processing system 100 is placed in the middle thereof. B) Utility units (UTL, 63) capable of accommodating various control devices and power devices, such as pumps for supplying various processing liquids for development, etc., are installed.

In the processing block 12c located at the upper end of the processing block 12a, a prebaking zone for prebaking the substrate on which the resist coating processing is completed from the second conveying unit 4 side toward the interface unit 5 side ( Cooling zones COL 55 for cooling to the predetermined temperature of the PRB 54 and the substrate G are provided.

The structure of this processing block 12c is basically the same as that of the above-described processing block 11c, and the prebaking zones PRB and 54 and the cooling zones COL and 55 are subjected to each process without being separated in the X direction. The board | substrate G is heat-processed when it passes through a predetermined zone, conveying to the X direction toward the interface part 5 side from the 2nd conveyance part 4 side in a substantially horizontal attitude | position.

The processing block 12d located at the upper end of the processing block 12b is made up of the transfer unit TRS 61 and the substrate is not subjected to any processing between the second transfer section 4 and the interface section 5. (G) can be conveyed. The processing blocks 12b and 12d are not necessarily required, and other processing apparatuses may be disposed as necessary.

Next, the conveyance path | route of the board | substrate G in the resist coating and image development processing system 100 which has the structure mentioned above is demonstrated, referring FIG. FIG. 3 is an explanatory view showing the conveyance flow path of the substrate G in FIG. 2 shown by arrows D1 to D16. In FIG. 3, the first conveying apparatus 17 to the third conveying apparatus 19 are illustrated. Is omitted.

First, the 1st conveying apparatus 17 carries out the board | substrate G from the cassette C mounted in the container carrying-in / out part 6 (arrow D1), and excimer UV irradiation zone (e-UV) of the process block 11a is carried out. Bring in 21). The substrate G is subjected to the liquid treatment while conveying the excimer UV irradiation zone (e-UV) 21 and the scrubber cleaning zone SCR 22 in an approximately horizontal position (arrow D2). Next, the 2nd conveyance apparatus 18 carries out the board | substrate G from the process block 11a, and carries it in to the dehydration bake zone (DHP) 51 of the process block 11c. In this way, the board | substrate G is a dehydration bake zone (DHP) 51; Ad process zone (AD, 52); The cooling zones COL 53 are passed through in a substantially horizontal position in order and thermally treated (arrow D3).

Next, the 1st conveying apparatus 17 carries out the board | substrate G cooled to predetermined temperature from the processing block 11c, and carries it in to the cooling unit COL of the processing block 11b. The substrate G is a resist coating unit CT 24 after being adjusted to a uniform temperature in the cooling unit COL 23; The resist film is processed in the order of the reduced pressure drying / peripheral resist removal unit (VD / ER) 25 to form a resist film (arrow D4). The 2nd conveyance apparatus 18 carries out the board | substrate G in which the resist film was formed from the process block 11b, and carries it in to the process block 12c. The board | substrate G passes through the prebaking zone PRB 54 and the cooling zone COL 55 in order in a substantially horizontal position, and prebaking process is complete | finished (arrow D5).

Then, the 3rd conveying apparatus 19 carries out the board | substrate G by which the prebaking process was complete | finished from the process block 12c, and carries it in to the exposure apparatus not shown installed adjacent to the interface part 5 (arrow D6). . And the 3rd conveying apparatus 19 carries out the board | substrate G which the exposure process was complete | finished from the exposure apparatus (arrow D7), and carries in to the conveyance unit (TRS) 61 of the processing block 12d. The board | substrate G conveys in the process block 12d (arrow D8), and the 2nd conveying apparatus 18 carries out the board | substrate G from the process block 12d, and the titler TIT of the process block 12b is carried out. , 62) (arrow D9). The substrate G on which the predetermined information is recorded in the titler TIT 62 is carried out by the second conveying apparatus 18 (arrow D10), and then loaded into the processing block 12d and the interface unit 5 It is conveyed to the () side (arrow D11).

The third conveying apparatus 19 carries out the substrate G from the processing block 12d and, when the developing processing unit DEV 27 installed in the processing block 12a is empty, goes to the developing processing unit DEV 27. If the substrate G cannot be loaded because the development processing unit DEV 27 is in use here, the substrate G is temporarily loaded into the stock unit ST 64 (arrow D12). Then, when the developing unit DEV 27 is available, the third conveying apparatus 19 takes out the substrate G from the stock unit ST, 64 (arrow D13) and carries it into the processing block 12a. .

The substrate G carried in the developing unit DEV 27 is developed while being conveyed in the processing block 12a in an approximately horizontal position (arrow D14); It carries out from the image development processing unit DEV 27 by the 2nd conveying apparatus 18. As shown in FIG. The 2nd conveying apparatus 18 carries in the board | substrate G which the image development process was complete | finished to 11 d of process blocks, and the board | substrate G is substantially horizontal with post-baking zone POB 56 and cooling zone COL 57. It is passed through the postures in order and postbaked (arrow D15). Next, the 1st conveying apparatus 17 carries out the board | substrate G by which the post-baking process was completed from the process block 11d, and carries it in the predetermined | prescribed cassette C (arrow D16). In this way, the process from washing | cleaning to the board | substrate G to the resist coating phenomenon is complete | finished.

Next, the structure of the processing block 11c having the post bake zone POB 56 and the cooling zone COL 57 will be described in more detail. 4, the schematic side view which shows the internal structure of the process block 11c (namely, the structure of the postbaking zone POB and 56 and the cooling zone COL and 57) is shown.

The post-baking zone POB 56 is a substrate G by the substrate conveying mechanism 71 for heating the substrate conveying mechanism 71 and the substrate G for conveying the substrate G in the horizontal direction in a substantially horizontal posture. Between the plurality of panel-shaped heaters 72 · 72 'and the plurality of heaters 72 · 72' disposed while having a gap 73 at a predetermined interval along the conveyance route at a predetermined height position on the conveyance route. A heating gas supply device 74 for supplying a gas heated at a predetermined temperature to a predetermined interval 73 provided; for intake air from a predetermined interval 73 provided between a plurality of heaters 72 · 72 '. An intake apparatus 75; The IR (infrared) heater 76 for heating the board | substrate G from the back surface of the board | substrate G conveyed by the board | substrate conveyance mechanism 71 is provided.

The board | substrate conveyance mechanism 71 rotates the several cylindrical roller member 71a and these roller members which were arranged in the Y direction (direction perpendicular | vertical to the X direction which is a board | substrate conveyance direction) in a long radial direction at predetermined intervals in a X direction. The roller drive means for making it, for example, has a motor 71b. In Fig. 4, a structure is shown in which four roller members 71a are rotated as one set by a motor 71b (all of which are not shown). However, the configuration is not limited to this configuration, and the motor 71b is provided to all the roller members 71a. ) May be rotated by direct connection, or may be a combination of every other rotationally driven by the motor 71b and a free one rotating by friction of the substrate G.

As the roller member 71a, as shown in the perspective view of FIG. 5, the length of the long radial direction is longer than the width | variety (length of Y direction) of the board | substrate G. This results in a band-like portion in the substrate G that does not contact the portion in contact with the roller member 71a in the X direction, resulting in a distribution in the thermal history of the substrate G, resulting in transfer marks such as stripes. Therefore, to prevent it.

The perspective view which shows schematic structure of the heater 72 * 72 'in FIG. 6 is shown. As shown in FIG. 6, the heaters 72 · 72 'are all composed of a plurality of small heaters 72a, 72b. In the case of thermally treating a large substrate G such that the length of one side exceeds 1 m, a heater having a size equal to or larger than this is required, but such a heater is expensive to manufacture and the uniformity of thermal radiation is also reduced. Thereby, by connecting a plurality of existing small heaters 72a and 72b, the thermal radiation from the heater 72 · 72 'is made uniform by inexpensive and temperature control for each small heater 72a and 72b. You can do it.

Thus, when the heater 72 is comprised from several small heaters 72a and 72b, the several small heaters 72a * and the joints of the small heaters 72a and 72b may not become parallel with a X direction in a fixed distance range. 72b). Since the heat radiation to the substrate G becomes smaller, the joints of the heaters 72a and 72b are directly reduced, and if the joint is long in the X direction, the uniformity of the heat treatment of the substrate G becomes worse and is transferred to the substrate G. The mark is generated, but the occurrence of such transcription marks can be prevented by keeping the length in the X direction of the tone within a certain range. In addition, since the "constant range" varies depending on the set temperature of the heater 72 · 72 'and the distance (interval) between the heater 72 · 72' and the substrate G, the substrate G is actually taken into consideration in consideration of these factors. It is set so that transcription marks do not occur. The distance between the lower surface of the heater 72 · 72 'and the upper surface of the substrate G may be appropriately set so that the thermal radiation can be uniformly performed on the substrate G. For example, the average temperature of the heater 72 · 72' When the temperature is 120 ° C, it can be made 2 mm or more and 50 mm or less.

In Fig. 6, two types of heaters 72 占 72 'are shown, which is a block constituted by arranging the small heaters 72a and 72b in the Y direction and a block constituted by arranging only the small heater 72a in the Y direction. This is because three blocks are connected in each direction; If four blocks are interconnected, one type of heater is sufficient. As shown in Fig. 6, the heaters 72 占 72 'may be configured by combining small heaters of different sizes or may be configured by combining small heaters of the same shape. The plane shape of the heater 72 * 72 'is not necessarily limited to spherical shape (square, rectangle, etc.), For example, in the Y direction end, there may be unevenness | corrugation. The planar shape of such a small heater is not limited to a spherical one, but a polygonal shape such as a triangle or a hexagon may be used.

In addition, if a temperature difference occurs before and after the substrate G, a warpage occurs in the substrate G. The output of the heaters 72 · 72 'and the IR heater 76 so that the temperature before and after the substrate G is about the same. To control. Since the distance from the heater 72 · 72 'to the surface of the substrate G and the distance from the IR heater 76 to the back surface of the substrate G are different, the heater 72 · 72' and The correlation data of the output of the IR heater 76 is stored in the control device of the resist coating and developing processing system 100, and the heater 72 · 72 'is based on the correlation data according to the set processing temperature of the substrate G. ) And IR heater (76).

The gap 73 formed between the heaters 72 alternately is provided from the space between the substrate G and the heaters 72 in order to supply the gas heated at a predetermined temperature from the heating gas supply device 74. It is used to perform intake air. The heating of the substrate G can be promoted by supplying the heating gas between the substrate G and the heater 72. Thus, the heating gas is supplied to the space between the substrate G and the heater 72. By performing the supply / exhaust, the sublimation or the like generated from the substrate G can be removed from the space between the substrate G and the heater 72 by burning in the air stream. It is also preferable to heat-hold the intake pipe to a predetermined temperature so that the sublimation does not solidify in such an intake pipe (that is, up to the intake port (interval 73) to the front of the intake device 75).

If the spacing 73 is formed in a large amount using the shorter X-direction length as the heater 72 · 72 ', the removal of such sublimation becomes easier. However, it is necessary to consider the shape and arrangement of the heaters 72 · 72 'so that the heating characteristics of the substrate G do not deteriorate at that time.

The temperature of the heating gas is preferably lower than the set processing temperature of the substrate G and between the set processing temperature of the substrate G and the temperature lower by 10 ° C. If the temperature of the heating gas is higher than the set treatment temperature, there is a concern of excessive heating over the substrate G, and if the temperature of the heated gas is lower than the temperature lower than 10 degrees C. below the set treatment temperature of the substrate G, that is, the position of There exists a possibility that the board | substrate G cools just under, and the state bent to the board | substrate G may generate | occur | produce.

The IR (infrared) heater 76 for heating the substrate G from the back surface of the substrate G conveyed by the substrate conveyance mechanism 71 is disposed so as to heat not only the substrate G but also the roller member 71a. It is preferable. Thereby, the board | substrate G is heated also by the heat transfer and thermal radiation from the roller member 71a, and the drying time of the board | substrate G can be shortened. For this reason, it is preferable to use the thing comprised from the heat storage material (for example, ceramics) as the roller member 71a. Instead of the IR heater 76, a lamp having thermal radiation may be used.

In the cooling zone COL 57 which receives and cools the substrate G from the post bake zone POB 56, a substrate conveyance mechanism 71 provided in the post bake zone POB 56 is extended and post-baked. Substrate G is conveyed in substantially horizontal position continuously from zone POB 56. And in the cooling zone COL and 57, in order to cool the board | substrate G from the surface side, to cool the cooling plate 77 and board | substrate G which were provided in the predetermined height position on the conveyance route of the board | substrate G from the back surface. In order to do this, a cooling gas injection device 78 for blowing a cooling gas to the back surface of the substrate G is provided.

The cooling plate 77 is configured such that a pipe for passing a cooling medium therein is embedded and the refrigerant circulates with the chiller 79. It is also preferable to set it as the structure which inhales the gas which the space between the cooling plate 77 and the board | substrate G warmed from the space | interval of the cooling plate 77 comrades.

As the cooling gas injector 78, for example, a nitrogen gas or air can be used in a pipe provided in a refrigerant to cool the gas and blow the gas from the nozzle 78a toward the substrate G. It is also preferable to cool the roller member 71a by exposing to the environment of such a cooling gas, and to accelerate the cooling rate of the board | substrate G by heat transfer from the board | substrate G to the roller member 71a. In that case, the roller member 71a to be cooled is preferably composed of a material having high thermal conductivity, for example, a metal material. The roller member 71a provided in the cooling zone COL 57 may have a structure which circulates and cools cooling water inside.

In addition, since the post-baking zone (POB, 56) and the cooling zone (COL, 57) have a large difference in the set temperature, the post-baking zone (POB, 56) and the cooling zone (COL, 57) are simplified by a shutter not shown. Block the enemy. That is, it is also preferable to distinguish both, ensuring the space | interval for conveying the board | substrate G. The structure of the processing block 11c can be similarly applied to the other processing blocks 11c and 12c which apply thermal processing to the substrate G, and the heat treatment is performed in the adhesion processing zones AD and 52 of the processing block 11c. Process gas such as HMDS gas is supplied to the substrate G.

 This invention is suitable for the heat processing and cooling process in the photolithography process of large board | substrates, such as LCD glass substrate.

If the heater is configured from a plurality of small heaters, the heating uniformity can be improved by adjusting the temperature of the individual small heaters, and the small heaters are arranged so as not to extend the joints of the small heaters in the conveying direction of the substrate to prevent the occurrence of processing spots. I can prevent it. In addition, it is easy to manufacture a heater having a size adapted to the size of the glass substrate, and the heater cost can be reduced. Even if a panel heater is disposed above the substrate, the substance that evaporates from the substrate can be efficiently removed by the heating gas, so that recontamination of the substrate can be suppressed. In addition to heating a board | substrate from the upper surface with a heater, a yield can also be improved by heating also from a back surface.

Claims (8)

A thermal processing apparatus for thermally processing while transporting a substrate in a horizontal direction in a substantially horizontal posture, A substrate conveyance mechanism for conveying the substrate in a horizontal direction; In order to heat a board | substrate, it is equipped with the some panel-shaped heater arrange | positioned at predetermined intervals along the said conveyance route at the predetermined height position on the conveyance route of the said board | substrate conveyance mechanism, The heaters are each constituted by a plurality of small heaters, and the plurality of small heaters are arranged in the substrate conveyance direction so as to prevent transfer marks on the substrate due to the seams of the plurality of small heaters. The thermal processing apparatus characterized in that it is connected so that it may not become parallel. The method according to claim 1, And the heater is configured by combining a plurality of small heaters having different sizes, respectively. The method according to claim 1, And a heating gas supply device for supplying a gas heated at a predetermined temperature at intervals provided between the plurality of heaters, and an intake device for intake air from the interval provided between the plurality of heaters, And a gas supply point from the heating gas supply device and an intake point from the intake device are alternately provided at intervals between the plurality of heaters existing along the substrate conveyance direction. The method according to any one of claims 1, 2, 3, The substrate conveyance mechanism has a plurality of circumferential roller members arranged in a predetermined interval in the substrate conveyance direction with a direction perpendicular to the substrate conveyance direction as a contraction direction, and roller drive means for rotating the plurality of roller members, And a lamp having an IR heater or a thermal radiation function for heating the substrate from the back surface of the substrate conveyed by the substrate conveying mechanism, And the roller member is heated by the IR heater or the lamp, and the substrate is also heated by heat transfer from the roller member to the substrate. The method according to claim 4, The roller member heated by the IR heater or the lamp is made of a heat storage material. The method according to any one of claims 1, 2, 3, Moreover, in order to cool the board | substrate heated by the said heater, the cooling plate provided in the predetermined height position on the conveyance route of the said board | substrate is provided, The thermal processing apparatus characterized by the above-mentioned. The method according to any one of claims 1, 2, 3, And a cooling gas injector for injecting a cooling gas to the back surface of the substrate in order to cool the substrate from the back surface of the substrate conveyed by the substrate conveyance mechanism. The method according to claim 7, And the roller member cooled by being exposed to the environment of the cooling gas is made of a material having high thermal conductivity.

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