KR102706292B1 - Pressure-sensitive adhesive composition, pressure-sensitive adhesive member, optical member and electronic member - Google Patents
Pressure-sensitive adhesive composition, pressure-sensitive adhesive member, optical member and electronic member Download PDFInfo
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- KR102706292B1 KR102706292B1 KR1020170007894A KR20170007894A KR102706292B1 KR 102706292 B1 KR102706292 B1 KR 102706292B1 KR 1020170007894 A KR1020170007894 A KR 1020170007894A KR 20170007894 A KR20170007894 A KR 20170007894A KR 102706292 B1 KR102706292 B1 KR 102706292B1
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- South Korea
- Prior art keywords
- meth
- weight
- adhesive composition
- adhesive
- polymer
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 120
- 230000003287 optical effect Effects 0.000 title claims abstract description 34
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title description 5
- 239000000853 adhesive Substances 0.000 claims abstract description 177
- 230000001070 adhesive effect Effects 0.000 claims abstract description 177
- 239000000178 monomer Substances 0.000 claims abstract description 71
- 229920000642 polymer Polymers 0.000 claims abstract description 57
- 239000012790 adhesive layer Substances 0.000 claims abstract description 52
- 239000003431 cross linking reagent Substances 0.000 claims description 35
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 18
- 239000004593 Epoxy Substances 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 239000005056 polyisocyanate Substances 0.000 claims description 10
- 229920001228 polyisocyanate Polymers 0.000 claims description 10
- 230000001588 bifunctional effect Effects 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 125000005907 alkyl ester group Chemical group 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 66
- 239000007787 solid Substances 0.000 description 62
- 229920000058 polyacrylate Polymers 0.000 description 52
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 49
- 239000000243 solution Substances 0.000 description 47
- -1 2-ethylhexyl Chemical group 0.000 description 36
- 239000000758 substrate Substances 0.000 description 29
- 229920006267 polyester film Polymers 0.000 description 22
- 238000004132 cross linking Methods 0.000 description 21
- 239000003054 catalyst Substances 0.000 description 20
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 16
- 239000004925 Acrylic resin Substances 0.000 description 16
- 229920000178 Acrylic resin Polymers 0.000 description 16
- 239000000126 substance Substances 0.000 description 16
- 239000010408 film Substances 0.000 description 15
- 239000004814 polyurethane Substances 0.000 description 15
- 229920002635 polyurethane Polymers 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 229910001873 dinitrogen Inorganic materials 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 239000003505 polymerization initiator Substances 0.000 description 12
- 238000003756 stirring Methods 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 125000002723 alicyclic group Chemical group 0.000 description 9
- 238000005259 measurement Methods 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000012986 chain transfer agent Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 4
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 238000003776 cleavage reaction Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920005672 polyolefin resin Polymers 0.000 description 3
- 230000007017 scission Effects 0.000 description 3
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 2
- CCTFAOUOYLVUFG-UHFFFAOYSA-N 2-(1-amino-1-imino-2-methylpropan-2-yl)azo-2-methylpropanimidamide Chemical compound NC(=N)C(C)(C)N=NC(C)(C)C(N)=N CCTFAOUOYLVUFG-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- NMZSJIQGMAGSSO-UHFFFAOYSA-N 3-[[1-amino-2-[[1-amino-1-(2-carboxyethylimino)-2-methylpropan-2-yl]diazenyl]-2-methylpropylidene]amino]propanoic acid Chemical compound OC(=O)CCNC(=N)C(C)(C)N=NC(C)(C)C(=N)NCCC(O)=O NMZSJIQGMAGSSO-UHFFFAOYSA-N 0.000 description 2
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 229920005603 alternating copolymer Polymers 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 235000006708 antioxidants Nutrition 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- MKIJJIMOAABWGF-UHFFFAOYSA-N methyl 2-sulfanylacetate Chemical compound COC(=O)CS MKIJJIMOAABWGF-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- NWAHZAIDMVNENC-UHFFFAOYSA-N octahydro-1h-4,7-methanoinden-5-yl methacrylate Chemical compound C12CCCC2C2CC(OC(=O)C(=C)C)C1C2 NWAHZAIDMVNENC-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- DCTVCFJTKSQXED-UHFFFAOYSA-N (2-ethyl-2-adamantyl) 2-methylprop-2-enoate Chemical compound C1C(C2)CC3CC1C(CC)(OC(=O)C(C)=C)C2C3 DCTVCFJTKSQXED-UHFFFAOYSA-N 0.000 description 1
- NLNVUFXLNHSIQH-UHFFFAOYSA-N (2-ethyl-2-adamantyl) prop-2-enoate Chemical compound C1C(C2)CC3CC1C(CC)(OC(=O)C=C)C2C3 NLNVUFXLNHSIQH-UHFFFAOYSA-N 0.000 description 1
- FDYDISGSYGFRJM-UHFFFAOYSA-N (2-methyl-2-adamantyl) 2-methylprop-2-enoate Chemical compound C1C(C2)CC3CC1C(OC(=O)C(=C)C)(C)C2C3 FDYDISGSYGFRJM-UHFFFAOYSA-N 0.000 description 1
- YRPLSAWATHBYFB-UHFFFAOYSA-N (2-methyl-2-adamantyl) prop-2-enoate Chemical compound C1C(C2)CC3CC1C(C)(OC(=O)C=C)C2C3 YRPLSAWATHBYFB-UHFFFAOYSA-N 0.000 description 1
- AGKBXKFWMQLFGZ-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzenecarboperoxoate Chemical compound C1=CC(C)=CC=C1C(=O)OOC(=O)C1=CC=C(C)C=C1 AGKBXKFWMQLFGZ-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- VBQCFYPTKHCPGI-UHFFFAOYSA-N 1,1-bis(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1(OOC(C)(C)CCC)CCCCC1 VBQCFYPTKHCPGI-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- AYMDJPGTQFHDSA-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-ethoxyethane Chemical compound CCOCCOCCOC=C AYMDJPGTQFHDSA-UHFFFAOYSA-N 0.000 description 1
- HASUCEDGKYJBDC-UHFFFAOYSA-N 1-[3-[[bis(oxiran-2-ylmethyl)amino]methyl]cyclohexyl]-n,n-bis(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC1CC(CN(CC2OC2)CC2OC2)CCC1)CC1CO1 HASUCEDGKYJBDC-UHFFFAOYSA-N 0.000 description 1
- PHPRWKJDGHSJMI-UHFFFAOYSA-N 1-adamantyl prop-2-enoate Chemical compound C1C(C2)CC3CC2CC1(OC(=O)C=C)C3 PHPRWKJDGHSJMI-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- DPGYCJUCJYUHTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yloxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)CC(C)(C)C DPGYCJUCJYUHTM-UHFFFAOYSA-N 0.000 description 1
- KQSMCAVKSJWMSI-UHFFFAOYSA-N 2,4-dimethyl-1-n,1-n,3-n,3-n-tetrakis(oxiran-2-ylmethyl)benzene-1,3-diamine Chemical compound CC1=C(N(CC2OC2)CC2OC2)C(C)=CC=C1N(CC1OC1)CC1CO1 KQSMCAVKSJWMSI-UHFFFAOYSA-N 0.000 description 1
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- ZACVGCNKGYYQHA-UHFFFAOYSA-N 2-ethylhexoxycarbonyloxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOC(=O)OCC(CC)CCCC ZACVGCNKGYYQHA-UHFFFAOYSA-N 0.000 description 1
- OWHSTLLOZWTNTQ-UHFFFAOYSA-N 2-ethylhexyl 2-sulfanylacetate Chemical compound CCCCC(CC)COC(=O)CS OWHSTLLOZWTNTQ-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- RTEZVHMDMFEURJ-UHFFFAOYSA-N 2-methylpentan-2-yl 2,2-dimethylpropaneperoxoate Chemical compound CCCC(C)(C)OOC(=O)C(C)(C)C RTEZVHMDMFEURJ-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- ZFSPZXXKYPTSTJ-UHFFFAOYSA-N 5-methyl-2-propan-2-yl-4,5-dihydro-1h-imidazole Chemical compound CC(C)C1=NCC(C)N1 ZFSPZXXKYPTSTJ-UHFFFAOYSA-N 0.000 description 1
- ORTNTAAZJSNACP-UHFFFAOYSA-N 6-(oxiran-2-ylmethoxy)hexan-1-ol Chemical compound OCCCCCCOCC1CO1 ORTNTAAZJSNACP-UHFFFAOYSA-N 0.000 description 1
- JSZCJJRQCFZXCI-UHFFFAOYSA-N 6-prop-2-enoyloxyhexanoic acid Chemical compound OC(=O)CCCCCOC(=O)C=C JSZCJJRQCFZXCI-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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Abstract
응력 분산성이 우수한 점착제층을 형성하는 점착제 조성물, 당해 점착제 조성물로 형성되는 점착제층을 갖는 점착 부재, 당해 점착 부재를 구비한 광학 부재나 전자 부재를 제공한다.
본 발명의 점착제 조성물은, (메트)아크릴산알킬에스테르 유래의 단량체 단위를 갖는 중합체 (A)를 포함하는 점착제 조성물이며, -40℃ 내지 150℃의 전체 온도 영역에서의, 당해 점착제 조성물을 경화하여 형성되는 점착제층의 손실 정접 tanδ가 0.10 이상이다.Provided are an adhesive composition forming an adhesive layer having excellent stress dissipation properties, an adhesive member having an adhesive layer formed by the adhesive composition, and an optical member or electronic member having the adhesive member.
The adhesive composition of the present invention is an adhesive composition comprising a polymer (A) having a monomer unit derived from a (meth)acrylic acid alkyl ester, and the loss tangent tanδ of an adhesive layer formed by curing the adhesive composition in the entire temperature range of -40°C to 150°C is 0.10 or more.
Description
본 발명은 점착제 조성물, 당해 점착제 조성물로 형성되는 점착제층을 갖는 점착 부재, 당해 점착 부재를 구비한 광학 부재나 전자 부재에 관한 것이다.The present invention relates to an adhesive composition, an adhesive member having an adhesive layer formed from the adhesive composition, and an optical member or electronic member having the adhesive member.
LCD를 사용한 터치 패널, 카메라의 렌즈부, 전자 기기 등의 광학 부재나 전자 부재에는, 강성이나 내충격성을 부여하기 위해서, 노출면측에 점착성 필름이 접착되어 있는 경우가 있다(예를 들어, 특허문헌 1). 이러한 점착성 필름은, 통상, 기재층과 점착제층을 갖는다.In order to provide rigidity or shock resistance to optical or electronic components such as touch panels using LCDs, lens sections of cameras, and electronic devices, an adhesive film is sometimes adhered to the exposed surface side (e.g., Patent Document 1). Such an adhesive film usually has a substrate layer and an adhesive layer.
상기와 같은 광학 부재나 전자 부재에는, 조립 시, 가공 시, 수송 시, 사용 시 등의 각종 장면에 있어서, 압입력에 의한 부하가 걸리는 경우가 있고, 이러한 부하에 의해 광학 부재나 전자 부재가 파손되어 버린다는 문제가 발생한다.In the case of the optical or electronic components as described above, there are cases where a load due to a pressing force is applied in various situations such as during assembly, processing, transportation, and use, and a problem occurs in which the optical or electronic components are damaged due to such a load.
점착성 필름으로서, 우수한 응력 분산성을 갖는 응력 분산 필름을 채용하는 것에 착안하여, 이러한 응력 분산 필름에 설치되는 점착제층의 형성 재료에 대하여 검토를 행하였다.With a view to employing a stress-dispersing film having excellent stress dispersing properties as an adhesive film, a study was conducted on the forming material of an adhesive layer installed in such a stress-dispersing film.
본 발명의 과제는, 응력 분산성이 우수한 점착제층을 형성하는 점착제 조성물, 당해 점착제 조성물로 형성되는 점착제층을 갖는 점착 부재, 당해 점착 부재를 구비한 광학 부재나 전자 부재를 제공하는 데 있다.The object of the present invention is to provide an adhesive composition forming an adhesive layer having excellent stress dissipation properties, an adhesive member having an adhesive layer formed from the adhesive composition, and an optical member or electronic member having the adhesive member.
본 발명의 점착제 조성물은,The adhesive composition of the present invention comprises:
(메트)아크릴산알킬에스테르 유래의 단량체 단위를 갖는 중합체 (A)를 포함하는 점착제 조성물이며,An adhesive composition comprising a polymer (A) having a monomer unit derived from (meth)acrylic acid alkyl ester,
-40℃ 내지 150℃의 전체 온도 영역에서의, 당해 점착제 조성물을 경화하여 형성되는 점착제층의 손실 정접 tanδ가 0.10 이상이다.The loss tangent tanδ of the adhesive layer formed by curing the adhesive composition is 0.10 or more in the entire temperature range of -40°C to 150°C.
하나의 실시 형태에 있어서는, 상기 (메트)아크릴산알킬에스테르 유래의 단량체 단위가, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위 (I)이다.In one embodiment, the monomer unit derived from the (meth)acrylic acid alkyl ester is a monomer unit (I) derived from the (meth)acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety.
하나의 실시 형태에 있어서는, 상기 중합체 (A)가 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위 (II)를 갖는다.In one embodiment, the polymer (A) has a monomer unit (II) derived from a (meth)acrylic acid ester having an OH group and/or a COOH group in the molecule.
하나의 실시 형태에 있어서는, 본 발명의 점착제 조성물은, 2관능 이상의 유기 폴리이소시아네이트계 가교제 및/또는 에폭시계 가교제를 포함한다.In one embodiment, the adhesive composition of the present invention comprises a bifunctional or higher organic polyisocyanate crosslinking agent and/or an epoxy crosslinking agent.
하나의 실시 형태에 있어서는, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위 (I)과 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위 (II)를 갖는 중합체와, 2관능 이상의 유기 폴리이소시아네이트계 가교제 및/또는 에폭시계 가교제를 포함하는 점착제 조성물이며, 당해 점착제 조성물 중의 NCO기의 몰 함유 비율을 [NCO]라 하고, 당해 점착제 조성물 중의 에폭시기의 몰 함유 비율을 [에폭시]라 하고, 당해 점착제 조성물 중의 OH기의 몰 함유 비율을 [OH]라 하고, 당해 점착제 조성물 중의 COOH기의 몰 함유 비율을 [COOH]라 했을 때에, 0<([NCO]+[에폭시])/([OH]+[COOH])<0.05이다. In one embodiment, an adhesive composition comprises a polymer having a monomer unit (I) derived from a (meth)acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety and a monomer unit (II) derived from a (meth)acrylic acid ester having an OH group and/or a COOH group in the molecule, and a bifunctional or higher organic polyisocyanate crosslinking agent and/or an epoxy crosslinking agent, wherein when the molar content ratio of NCO groups in the adhesive composition is [NCO], the molar content ratio of epoxy groups in the adhesive composition is [epoxy], the molar content ratio of OH groups in the adhesive composition is [OH], and the molar content ratio of COOH groups in the adhesive composition is [COOH], 0<([NCO]+[epoxy])/([OH]+[COOH])<0.05.
하나의 실시 형태에 있어서는, 본 발명의 점착제 조성물은, 화학식 1로 표시되는 지환식 구조 함유 (메트)아크릴산에스테르 유래의 단량체 단위를 갖는 중량 평균 분자량이 1000 이상 30000 미만인 중합체 (B)를 포함한다.In one embodiment, the adhesive composition of the present invention comprises a polymer (B) having a weight average molecular weight of 1,000 or more and less than 30,000 and having a monomer unit derived from a (meth)acrylic acid ester containing an alicyclic structure represented by the chemical formula 1.
(화학식 1 중, R1은 수소 원자 또는 메틸기이며, R2는 지환식 구조를 갖는 탄화수소기이다.)(In chemical formula 1, R 1 is a hydrogen atom or a methyl group, and R 2 is a hydrocarbon group having an alicyclic structure.)
본 발명의 점착 부재는, 상기 점착제 조성물로 형성되는 점착제층을 갖는다.The adhesive member of the present invention has an adhesive layer formed from the adhesive composition.
본 발명의 광학 부재는, 상기 점착 부재를 구비한다.The optical member of the present invention comprises the adhesive member.
본 발명의 전자 부재는, 상기 점착 부재를 구비한다.The electronic member of the present invention comprises the adhesive member.
본 발명에 따르면, 응력 분산성이 우수한 점착제층을 형성하는 점착제 조성물, 당해 점착제 조성물로 형성되는 점착제층을 갖는 점착 부재, 당해 점착 부재를 구비한 광학 부재나 전자 부재를 제공할 수 있다.According to the present invention, it is possible to provide an adhesive composition forming an adhesive layer having excellent stress dissipation properties, an adhesive member having an adhesive layer formed from the adhesive composition, and an optical member or electronic member having the adhesive member.
도 1은 본 발명의 하나의 실시 형태에 의한 점착 부재의 개략 단면도이다.Figure 1 is a schematic cross-sectional view of an adhesive member according to one embodiment of the present invention.
본 명세서 중에서 「(메트)아크릴」이라는 표현이 있는 경우에는, 「아크릴 및/또는 메타크릴」을 의미하고, 「(메트)아크릴레이트」라는 표현이 있는 경우에는, 「아크릴레이트 및/또는 메타크릴레이트」를 의미한다. 또한, 본 명세서 중에서 「중량」이라는 표현이 있는 경우에는, 무게를 나타내는 SI계 단위로서 관용되고 있는 「질량」이라고 바꿔 읽어도 된다.In this specification, when the expression "(meth)acrylic" appears, it means "acrylic and/or methacrylic", and when the expression "(meth)acrylate" appears, it means "acrylate and/or methacrylate". In addition, when the expression "weight" appears in this specification, it may be read as "mass", which is commonly used as an SI unit indicating weight.
본 명세서 중에서 「(a) 유래의 단량체 단위 (A)」라는 표현이 있는 경우에는, 단량체 단위 (A)는 단량체 (a)가 갖는 불포화 이중 결합이 중합에 의해 개열되어 형성되는 구조 단위이다. 또한, 불포화 이중 결합이 중합에 의해 개열되어 형성되는 구조 단위란, 「RpRqC=CRrRs」의 구조(Rp, Rq, Rr, Rs는, 탄소 원자와 단결합으로 결합하는 임의의 적절한 기)의 불포화 이중 결합 「C=C」가 중합에 의해 개열되어 형성되는 「-RpRqC-CRrRs-」의 구조 단위이다.In cases where there is an expression such as “monomer unit (A) derived from (a)” in the present specification, the monomer unit (A) is a structural unit formed by cleavage of the unsaturated double bond of the monomer (a) by polymerization. In addition, the structural unit formed by cleavage of the unsaturated double bond by polymerization is a structural unit of “-RpRqC-CRrRs-” formed by cleavage of the unsaturated double bond “C=C” of the structure “RpRqC=CRrRs” (Rp, Rq, Rr, Rs are any appropriate groups bonded to a carbon atom by a single bond) by polymerization.
본 명세서 중에서, 중합체 중의 단량체 단위의 함유 비율은, 예를 들어, 당해 중합체의 각종 구조 해석(예를 들어, NMR 등)에 의해 알 수 있다. 또한, 상기와 같은 각종 구조 해석을 행하지 않아도, 중합체를 제조할 때에 사용하는 각종 단량체의 사용량에 기초하여 산출되는 당해 각종 단량체 유래의 단량체 단위의 함유 비율을 가지고, 중합체 중의 단량체 단위의 함유 비율로 해도 된다. 즉, 중합체를 제조할 때에 사용하는 전체 단량체 성분 중의, 어떤 단량체 (m)의 함유 비율을, 당해 중합체 중의 단량체 (m) 유래의 단량체 단위의 함유 비율로서 취급해도 된다.In this specification, the content ratio of the monomer unit in the polymer can be known, for example, by various structural analyses (for example, NMR, etc.) of the polymer. In addition, even without performing various structural analyses as described above, the content ratio of the monomer unit derived from each monomer used when producing the polymer may be used as the content ratio of the monomer unit in the polymer, calculated based on the usage amounts of each monomer used when producing the polymer. That is, the content ratio of a certain monomer (m) among the total monomer components used when producing the polymer may be treated as the content ratio of the monomer unit derived from the monomer (m) in the polymer.
≪≪A. 점착제 조성물≫≫≪≪A. Adhesive composition≫≫
본 발명의 점착제 조성물은, (메트)아크릴산알킬에스테르 유래의 단량체 단위를 갖는 중합체 (A)를 포함한다.The adhesive composition of the present invention comprises a polymer (A) having a monomer unit derived from a (meth)acrylic acid alkyl ester.
본 발명의 점착제 조성물 중의 상기 중합체 (A)의 함유 비율은, 바람직하게는 80중량% 내지 100중량%이며, 보다 바람직하게는 85중량% 내지 100중량%이며, 더욱 바람직하게는 90중량% 내지 100중량%이며, 특히 바람직하게는 92.5중량% 내지 100중량%이며, 가장 바람직하게는 95중량% 내지 100중량%이다. 본 발명의 점착제 조성물 중의 상기 중합체 (A)의 함유 비율이 상기 범위 내에 있는 것에 의해, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.The content ratio of the polymer (A) in the pressure-sensitive adhesive composition of the present invention is preferably 80 wt% to 100 wt%, more preferably 85 wt% to 100 wt%, even more preferably 90 wt% to 100 wt%, particularly preferably 92.5 wt% to 100 wt%, and most preferably 95 wt% to 100 wt%. When the content ratio of the polymer (A) in the pressure-sensitive adhesive composition of the present invention is within the above range, it is possible to provide an adhesive composition that forms an adhesive layer having better stress dispersibility.
본 발명의 점착제 조성물은, -40℃ 내지 150℃의 전체 온도 영역에서의, 당해 점착제 조성물을 경화하여 형성되는 점착제층의 손실 정접 tanδ가 0.10 이상이다. -40℃ 내지 150℃의 전체 온도 영역에서의, 상기 손실 정접 tanδ가 0.10 이상인 것에 의해, 응력 분산성이 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다. 또한, 상기 손실 정접 tanδ의 측정 방법에 대해서는 후술한다.The adhesive composition of the present invention has a loss tangent tanδ of an adhesive layer formed by curing the adhesive composition in the entire temperature range of -40°C to 150°C of 0.10 or more. By having the loss tangent tanδ of 0.10 or more in the entire temperature range of -40°C to 150°C, an adhesive composition forming an adhesive layer having excellent stress dispersibility can be provided. In addition, a method for measuring the loss tangent tanδ will be described later.
본 발명의 점착제 조성물은, -40℃ 내지 150℃의 전체 온도 영역에서의, 당해 점착제 조성물을 경화하여 형성되는 점착제층의 손실 정접 tanδ의 상한이, 바람직하게는 2.40 이하이고, 보다 바람직하게는 2.20 이하이고, 더욱 바람직하게는 2.00 이하이고, 특히 바람직하게는 1.80 이하이다. 상기 손실 정접 tanδ의 상한이 상기 범위 내에 있는 것에 의해, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.The adhesive composition of the present invention has an upper limit of the loss tangent tanδ of an adhesive layer formed by curing the adhesive composition in the entire temperature range of -40°C to 150°C, preferably 2.40 or less, more preferably 2.20 or less, even more preferably 2.00 or less, and particularly preferably 1.80 or less. When the upper limit of the loss tangent tanδ is within the above range, an adhesive composition forming an adhesive layer having better stress dispersibility can be provided.
본 발명의 점착제 조성물은, -40℃ 내지 150℃의 전체 온도 영역에서의, 당해 점착제 조성물을 경화하여 형성되는 점착제층의 손실 정접 tanδ의 하한이, 바람직하게는 0.12 이상이며, 보다 바람직하게는 0.14 이상이며, 더욱 바람직하게는 0.16 이상이며, 특히 바람직하게는 0.18 이상이다. 상기 손실 정접 tanδ의 하한이 상기 범위 내에 있는 것에 의해, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.The lower limit of the loss tangent tanδ of the adhesive layer formed by curing the adhesive composition in the entire temperature range of -40°C to 150°C is preferably 0.12 or more, more preferably 0.14 or more, even more preferably 0.16 or more, and particularly preferably 0.18 or more. When the lower limit of the loss tangent tanδ is within the above range, an adhesive composition forming an adhesive layer having better stress dispersibility can be provided.
중합체 (A)는 (메트)아크릴산알킬에스테르 유래의 단량체 단위를 갖는다. 중합체 (A) 중의, (메트)아크릴산알킬에스테르 유래의 단량체 단위는, 1종만이어도 되고, 2종 이상이어도 된다.Polymer (A) has a monomer unit derived from a (meth)acrylic acid alkyl ester. In polymer (A), the monomer unit derived from a (meth)acrylic acid alkyl ester may be one type or two or more types.
중합체 (A) 중의, (메트)아크릴산알킬에스테르 유래의 단량체 단위의 함유 비율은, 바람직하게는 90중량% 내지 99.5중량%이며, 보다 바람직하게는 91중량% 내지 99중량%이며, 더욱 바람직하게는 92중량% 내지 98.5중량%이며, 특히 바람직하게는 93중량% 내지 98.2중량%이며, 가장 바람직하게는 94중량% 내지 98중량%이다. 중합체 (A) 중의, (메트)아크릴산알킬에스테르 유래의 단량체 단위의 함유 비율이 상기 범위 내에 있는 것에 의해, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.The content ratio of the monomer unit derived from the (meth)acrylic acid alkyl ester in the polymer (A) is preferably 90 wt% to 99.5 wt%, more preferably 91 wt% to 99 wt%, even more preferably 92 wt% to 98.5 wt%, particularly preferably 93 wt% to 98.2 wt%, and most preferably 94 wt% to 98 wt%. When the content ratio of the monomer unit derived from the (meth)acrylic acid alkyl ester in the polymer (A) is within the above range, an adhesive composition forming an adhesive layer having better stress dispersibility can be provided.
상기 (메트)아크릴산알킬에스테르 유래의 단량체 단위는, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 (메트)아크릴산알킬에스테르 유래의 단량체 단위를 채용할 수 있다. 이러한 단량체 단위로서는, 본 발명의 효과를 보다 발현시킬 수 있는 점에서, 바람직하게는, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위 (I)이다.The monomer unit derived from the above (meth)acrylic acid alkyl ester can employ any appropriate monomer unit derived from the (meth)acrylic acid alkyl ester, as long as it does not impair the effects of the present invention. As such a monomer unit, from the viewpoint of better demonstrating the effects of the present invention, a monomer unit (I) derived from the (meth)acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as the alkyl ester moiety is preferable.
탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르로서는, 예를 들어, 메틸(메트)아크릴레이트, 에틸(메트)아크릴레이트, n-부틸(메트)아크릴레이트, s-부틸(메트)아크릴레이트, t-부틸(메트)아크릴레이트, 이소부틸(메트)아크릴레이트, 헥실(메트)아크릴레이트, 2-에틸헥실(메트)아크릴레이트, n-옥틸(메트)아크릴레이트, 이소옥틸(메트)아크릴레이트, n-노닐(메트)아크릴레이트, 이소노닐(메트)아크릴레이트, n-데실(메트)아크릴레이트, 이소데실(메트)아크릴레이트, n-도데실(메트)아크릴레이트, n-트리데실(메트)아크릴레이트, n-테트라데실(메트)아크릴레이트 등을 들 수 있다.As (meth)acrylic acid alkyl esters having an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, isobutyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, n-dodecyl (meth)acrylate, n-tridecyl (meth)acrylate, n-tetradecyl (meth)acrylate, etc. You can hear it.
중합체 (A)는 바람직하게는, 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위 (II)를 갖는다. 중합체 (A) 중의, 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위 (II)는 1종만이어도 되고, 2종 이상이어도 된다. 중합체 (A)가 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위 (II)를 가짐으로써, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.The polymer (A) preferably has a monomer unit (II) derived from a (meth)acrylic acid ester having an OH group and/or a COOH group in the molecule. The number of monomer units (II) derived from a (meth)acrylic acid ester having an OH group and/or a COOH group in the molecule in the polymer (A) may be only one type or may be two or more types. When the polymer (A) has a monomer unit (II) derived from a (meth)acrylic acid ester having an OH group and/or a COOH group in the molecule, an adhesive composition forming an adhesive layer having better stress dispersibility can be provided.
중합체 (A) 중의, 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위 (II)의 함유 비율은, 바람직하게는 0.5중량% 내지 10중량%이며, 보다 바람직하게는 1중량% 내지 9중량%이며, 더욱 바람직하게는 1.5중량% 내지 8중량%이며, 특히 바람직하게는 1.8중량% 내지 7중량%이며, 가장 바람직하게는 2중량% 내지 6중량%이다. 중합체 (A) 중의, 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위 (II)의 함유 비율이 상기 범위 내에 있는 것에 의해, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.The content ratio of the monomer unit (II) derived from a (meth)acrylic acid ester having an OH group and/or a COOH group in the molecule in the polymer (A) is preferably 0.5 to 10 wt%, more preferably 1 to 9 wt%, still more preferably 1.5 to 8 wt%, particularly preferably 1.8 to 7 wt%, and most preferably 2 to 6 wt%. When the content ratio of the monomer unit (II) derived from a (meth)acrylic acid ester having an OH group and/or a COOH group in the molecule in the polymer (A) is within the above range, an adhesive composition which forms an adhesive layer having better stress dispersibility can be provided.
분자 내에 OH기를 갖는 (메트)아크릴산에스테르로서는, 예를 들어, 2-히드록시에틸(메트)아크릴레이트, 2-히드록시프로필(메트)아크릴레이트, 4-히드록시부틸(메트)아크릴레이트, 6-히드록시헥실(메트)아크릴레이트, 8-히드록시옥틸(메트)아크릴레이트, 10-히드록시데실(메트)아크릴레이트, 12-히드록시라우릴(메트)아크릴레이트, (4-히드록시메틸시클로헥실)메틸아크릴레이트, N-메틸올(메트)아크릴아미드, 비닐알코올, 알릴알코올, 2-히드록시에틸비닐에테르, 4-히드록시부틸비닐에테르, 디에틸렌글리콜모노비닐에테르 등을 들 수 있다.Examples of (meth)acrylic acid esters having an OH group in the molecule include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl acrylate, N-methylol (meth)acrylamide, vinyl alcohol, allyl alcohol, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, and the like.
분자 내에 COOH기를 갖는 (메트)아크릴산에스테르로서는, 예를 들어, (메타)아크릴산, 카르복시에틸(메트)아크릴레이트, 카르복시펜틸(메트)아크릴레이트, 이타콘산, 말레산, 푸마르산, 크로톤산, 이소크로톤산 등을 들 수 있다.Examples of (meth)acrylic acid esters having a COOH group in the molecule include (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid.
중합체 (A)는 기타의 단량체 유래의 단량체 단위 (III)을 갖고 있어도 된다. 중합체 (A) 중의, 기타의 단량체 유래의 단량체 단위 (III)은 1종만이어도 되고, 2종 이상이어도 된다.The polymer (A) may have a monomer unit (III) derived from another monomer. In the polymer (A), the monomer unit (III) derived from another monomer may be one type or two or more types.
기타의 단량체로서는, 예를 들어, 시아노기 함유 모노머, 비닐에스테르 모노머, 방향족 비닐 모노머, 아미드기 함유 모노머, 이미드기 함유 모노머, 아미노기 함유 모노머, 에폭시기 함유 모노머, 비닐에테르 모노머, N-아크릴로일모르폴린, 술포기 함유 모노머, 인산기 함유 모노머, 산 무수물기 함유 모노머 등을 들 수 있다.Examples of other monomers include a cyano group-containing monomer, a vinyl ester monomer, an aromatic vinyl monomer, an amide group-containing monomer, an imide group-containing monomer, an amino group-containing monomer, an epoxy group-containing monomer, a vinyl ether monomer, N-acryloylmorpholine, a sulfo group-containing monomer, a phosphoric acid group-containing monomer, and an acid anhydride group-containing monomer.
본 발명의 점착제 조성물은, 바람직하게는, 2관능 이상의 유기 폴리이소시아네이트계 가교제 및/또는 에폭시계 가교제를 포함한다. 본 발명의 점착제 조성물에 포함될 수 있는 2관능 이상의 유기 폴리이소시아네이트계 가교제 및/또는 에폭시계 가교제는, 1종만이어도 되고, 2종 이상이어도 된다.The adhesive composition of the present invention preferably contains a bifunctional or higher organic polyisocyanate crosslinking agent and/or an epoxy crosslinking agent. The bifunctional or higher organic polyisocyanate crosslinking agent and/or the epoxy crosslinking agent that can be included in the adhesive composition of the present invention may be one type or two or more types.
본 발명의 점착제 조성물 중의, 상기 2관능 이상의 유기 폴리이소시아네이트계 가교제 및 에폭시계 가교제의 합계 함유 비율은, 중합체 (A) 100중량부에 대하여 바람직하게는 0.001중량부 내지 0.4중량부이며, 보다 바람직하게는 0.0025중량부 내지 0.3중량부이며, 더욱 바람직하게는 0.005중량부 내지 0.2중량부이며, 특히 바람직하게는 0.0075중량부 내지 0.15중량부이며, 가장 바람직하게는 0.01중량부 내지 0.1중량부이다. 본 발명의 점착제 조성물 중의 상기 2관능 이상의 유기 폴리이소시아네이트계 가교제 및 에폭시계 가교제의 합계 함유 비율이 중합체 (A) 100중량부에 대하여 상기 범위 내에 있는 것에 의해, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.In the adhesive composition of the present invention, the total content of the bifunctional or higher organic polyisocyanate crosslinking agent and the epoxy crosslinking agent is preferably 0.001 part by weight to 0.4 part by weight, more preferably 0.0025 part by weight to 0.3 part by weight, even more preferably 0.005 part by weight to 0.2 part by weight, particularly preferably 0.0075 part by weight to 0.15 part by weight, and most preferably 0.01 part by weight to 0.1 part by weight, relative to 100 parts by weight of the polymer (A). When the total content of the bifunctional or higher organic polyisocyanate crosslinking agent and the epoxy crosslinking agent in the adhesive composition of the present invention is within the above range relative to 100 parts by weight of the polymer (A), an adhesive composition forming an adhesive layer having better stress dispersibility can be provided.
2관능 이상의 유기 폴리이소시아네이트계 가교제로서는, 예를 들어, 부틸렌디이소시아네이트, 헥사메틸렌디이소시아네이트 등의 저급 지방족 폴리이소시아네이트류; 시클로펜틸렌디이소시아네이트, 시클로헥실렌디이소시아네이트, 이소포론디이소시아네이트 등의 지환족 이소시아네이트류; 2,4-톨릴렌디이소시아네이트, 4,4'-디페닐메탄디이소시아네이트, 크실릴렌디이소시아네이트 등의 방향족 이소시아네이트류; 트리메틸올프로판/톨릴렌디이소시아네이트 삼량체 부가물(예를 들어, 닛본 폴리우레탄 고교사 제조, 상품명 「코로네이트 L」), 트리메틸올프로판/헥사메틸렌디이소시아네이트 삼량체 부가물(예를 들어, 닛본 폴리우레탄 고교사 제조, 상품명 「코로네이트 HL」), 헥사메틸렌디이소시아네이트의 이소시아누레이트체(예를 들어, 닛본 폴리우레탄 고교사 제조, 상품명 「코로네이트 HX」) 등의 이소시아네이트 부가물; 등을 들 수 있다.Examples of the bifunctional or higher organic polyisocyanate crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; aromatic isocyanates such as 2,4-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate and xylylene diisocyanate; Isocyanate adducts such as trimethylolpropane/tolylene diisocyanate trimer adduct (e.g., manufactured by Nippon Polyurethane Kogyo Co., Ltd., trade name “Coronate L”), trimethylolpropane/hexamethylene diisocyanate trimer adduct (e.g., manufactured by Nippon Polyurethane Kogyo Co., Ltd., trade name “Coronate HL”), and isocyanurate forms of hexamethylene diisocyanate (e.g., manufactured by Nippon Polyurethane Kogyo Co., Ltd., trade name “Coronate HX”); etc.
에폭시계 가교제로서는, 예를 들어, 비스페놀 A, 에피클로로히드린형의 에폭시계 수지, 에틸렌글리시딜에테르, 폴리에틸렌글리콜디글리시딜에테르, 글리세린디글리시딜에테르, 글리세린트리글리시딜에테르, 1,6-헥산디올글리시딜에테르, 트리메틸올프로판트리글리시딜에테르, 디글리시딜아닐린, 디아민글리시딜아민, N,N,N',N'-테트라글리시딜-m-크실렌디아민(예를 들어, 미쓰비시 가스 가가쿠사 제조, 상품명 「TETRAD-X」), 1,3-비스(N,N-디글리시딜아미노메틸)시클로헥산(예를 들어, 미쓰비시 가스 가가쿠사 제조, 상품명 「TETRAD-C」) 등을 들 수 있다.Examples of the epoxy crosslinking agent include bisphenol A, epichlorohydrin type epoxy resin, ethylene glycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1,6-hexanediol glycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl aniline, diamine glycidyl amine, N,N,N',N'-tetraglycidyl-m-xylenediamine (e.g., manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-X"), 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane (e.g., manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-C").
본 발명의 점착제 조성물은, 바람직하게는, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위 (I)과 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위 (II)를 갖는 중합체와, 2관능 이상의 유기 폴리이소시아네이트계 가교제 및/또는 에폭시계 가교제를 포함하는 점착제 조성물이며, 당해 점착제 조성물 중의 NCO기의 몰 함유 비율을 [NCO]라 하고, 당해 점착제 조성물 중의 에폭시기의 몰 함유 비율을 [에폭시]라 하고, 당해 점착제 조성물 중의 OH기의 몰 함유 비율을 [OH]라 하고, 당해 점착제 조성물 중의 COOH기의 몰 함유 비율을 [COOH]라 했을 때에, 0<([NCO]+[에폭시])/([OH]+[COOH])<0.05이다. ([NCO]+[에폭시])/([OH]+[COOH])가 상기 범위에 있는 것에 의해, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.The adhesive composition of the present invention is preferably an adhesive composition comprising a polymer having a monomer unit (I) derived from a (meth)acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety and a monomer unit (II) derived from a (meth)acrylic acid ester having an OH group and/or a COOH group in the molecule, and a bifunctional or higher organic polyisocyanate-based crosslinking agent and/or an epoxy-based crosslinking agent, wherein when the molar content ratio of an NCO group in the adhesive composition is [NCO], the molar content ratio of an epoxy group in the adhesive composition is [epoxy], the molar content ratio of an OH group in the adhesive composition is [OH], and the molar content ratio of a COOH group in the adhesive composition is [COOH], 0<([NCO]+[epoxy])/([OH]+[COOH])<0.05. By having ([NCO]+[epoxy])/([OH]+[COOH]) within the above range, an adhesive composition forming an adhesive layer having superior stress dissipation properties can be provided.
본 발명의 점착제 조성물은, 화학식 1로 표시되는 지환식 구조 함유 (메트)아크릴산에스테르 유래의 단량체 단위를 갖는 중량 평균 분자량이 1000 이상 30000 미만인 중합체 (B)를 포함하고 있어도 된다.The adhesive composition of the present invention may contain a polymer (B) having a weight average molecular weight of 1,000 or more and less than 30,000 and having a monomer unit derived from a (meth)acrylic acid ester containing an alicyclic structure represented by the chemical formula 1.
<화학식 1><Chemical Formula 1>
(화학식 1 중, R1은 수소 원자 또는 메틸기이며, R2는 지환식 구조를 갖는 탄화수소기이다.)(In chemical formula 1, R 1 is a hydrogen atom or a methyl group, and R 2 is a hydrocarbon group having an alicyclic structure.)
중합체 (B)는 1종만이어도 되고, 2종 이상이어도 된다.There may be only one type of polymer (B) or two or more types.
중합체 (B)의 중량 평균 분자량은, 바람직하게는 1000 내지 30000이며, 보다 바람직하게는 1250 내지 25000이며, 더욱 바람직하게는 1500 내지 20000이며, 특히 바람직하게는 1750 내지 15000이며, 가장 바람직하게는 2000 내지 10000이다. 중합체 (B)의 중량 평균 분자량이 상기 범위 내에 있는 것에 의해, 가교제의 양을 증가시켜도, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.The weight average molecular weight of the polymer (B) is preferably 1000 to 30000, more preferably 1250 to 25000, even more preferably 1500 to 20000, particularly preferably 1750 to 15000, and most preferably 2000 to 10000. When the weight average molecular weight of the polymer (B) is within the above range, even if the amount of the crosslinking agent is increased, an adhesive composition forming an adhesive layer having better stress dispersibility can be provided.
본 발명의 점착제 조성물 중의 중합체 (B)의 함유 비율은, 중합체 (A) 100중량부에 대하여 바람직하게는 0.5중량부 내지 50중량부이며, 보다 바람직하게는 1중량부 내지 45중량부이며, 더욱 바람직하게는 2중량부 내지 40중량부이며, 특히 바람직하게는 3중량부 내지 35중량부이며, 가장 바람직하게는 4중량부 내지 30중량부이다. 본 발명의 점착제 조성물 중의 중합체 (B)의 함유 비율이 중합체 (A) 100중량부에 대하여 상기 범위 내에 있는 것에 의해, 가교제의 양을 증가시켜도, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.The content ratio of the polymer (B) in the adhesive composition of the present invention is preferably 0.5 to 50 parts by weight relative to 100 parts by weight of the polymer (A), more preferably 1 to 45 parts by weight, even more preferably 2 to 40 parts by weight, particularly preferably 3 to 35 parts by weight, and most preferably 4 to 30 parts by weight. Since the content ratio of the polymer (B) in the adhesive composition of the present invention is within the above range relative to 100 parts by weight of the polymer (A), even if the amount of the crosslinking agent is increased, an adhesive composition which forms an adhesive layer having better stress dispersibility can be provided.
중합체 (B) 중의, 화학식 1로 표시되는 지환식 구조 함유 (메트)아크릴산에스테르 유래의 단량체 단위의 함유 비율은, 바람직하게는 40중량% 내지 99.5중량%이며, 보다 바람직하게는 42.5중량% 내지 99중량%이며, 더욱 바람직하게는 45중량% 내지 98.5중량%이며, 특히 바람직하게는 47.5중량% 내지 98중량%이며, 가장 바람직하게는 50중량% 내지 97.5중량%이다. 중합체 (B) 중의, 화학식 1로 표시되는 지환식 구조 함유 (메트)아크릴산에스테르 유래의 단량체 단위의 함유 비율이 상기 범위 내에 있는 것에 의해, 가교제의 양을 증가시켜도, 응력 분산성이 보다 우수한 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.The content ratio of the monomer unit derived from the (meth)acrylic acid ester containing an alicyclic structure represented by the chemical formula 1 in the polymer (B) is preferably 40 wt% to 99.5 wt%, more preferably 42.5 wt% to 99 wt%, still more preferably 45 wt% to 98.5 wt%, particularly preferably 47.5 wt% to 98 wt%, and most preferably 50 wt% to 97.5 wt%. Since the content ratio of the monomer unit derived from the (meth)acrylic acid ester containing an alicyclic structure represented by the chemical formula 1 in the polymer (B) is within the above range, even if the amount of the crosslinking agent is increased, an adhesive composition which forms an adhesive layer having better stress dispersing properties can be provided.
상기 화학식 1로 표시되는 지환식 구조 함유 (메트)아크릴산에스테르로서는, 예를 들어, 시클로헥실(메트)아크릴레이트, 디시클로펜타닐(메트)아크릴레이트, 디시클로펜타닐옥시에틸메타크릴레이트, 디시클로펜타닐옥시에틸아크릴레이트, 트리시클로펜타닐메타크릴레이트, 트리시클로펜타닐아크릴레이트, 1-아다만틸메타크릴레이트, 1-아다만틸아크릴레이트, 2-메틸-2-아다만틸메타크릴레이트, 2-메틸-2-아다만틸아크릴레이트, 2-에틸-2-아다만틸메타크릴레이트, 2-에틸-2-아다만틸아크릴레이트 등을 들 수 있다.As the alicyclic structure-containing (meth)acrylic acid ester represented by the above chemical formula 1, examples thereof include cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentanyloxyethyl methacrylate, dicyclopentanyloxyethyl acrylate, tricyclopentanyl methacrylate, tricyclopentanyl acrylate, 1-adamantyl methacrylate, 1-adamantyl acrylate, 2-methyl-2-adamantyl methacrylate, 2-methyl-2-adamantyl acrylate, 2-ethyl-2-adamantyl methacrylate, 2-ethyl-2-adamantyl acrylate, and the like.
중합체 (B)는 기타의 단량체 유래의 단량체 단위 (IV)를 갖고 있어도 된다. 중합체 (B) 중의, 기타의 단량체 유래의 단량체 단위 (IV)는 1종만이어도 되고, 2종 이상이어도 된다.The polymer (B) may have monomer units (IV) derived from other monomers. In the polymer (B), the monomer units (IV) derived from other monomers may be one type or two or more types.
중합체 (B)에 포함될 수 있는 기타의 단량체로서는, 예를 들어, 메틸(메트)아크릴레이트, 에틸(메트)아크릴레이트, n-부틸(메트)아크릴레이트, s-부틸(메트)아크릴레이트, t-부틸(메트)아크릴레이트, 이소부틸(메트)아크릴레이트, 헥실(메트)아크릴레이트, 2-에틸헥실(메트)아크릴레이트, n-옥틸(메트)아크릴레이트, 이소옥틸(메트)아크릴레이트, n-노닐(메트)아크릴레이트, 이소노닐(메트)아크릴레이트, n-데실(메트)아크릴레이트, 이소데실(메트)아크릴레이트, n-도데실(메트)아크릴레이트, n-트리데실(메트)아크릴레이트, n-테트라데실(메트)아크릴레이트, 아크릴산, 메타크릴산, 카르복시에틸아크릴레이트, 카르복시펜틸아크릴레이트, 이타콘산, 말레산, 푸마르산, 크로톤산, 이소크로톤산 등을 들 수 있다.Other monomers that may be included in the polymer (B) include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, isobutyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, n-dodecyl (meth)acrylate, n-tridecyl (meth)acrylate, n-tetradecyl (meth)acrylate, acrylic acid, methacrylic acid, carboxyethyl acrylate, Examples include carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid.
중합체 (A), 중합체 (B)는 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 방법에 의해 제조할 수 있다. 이러한 제조 방법으로서는, 예를 들어, 용액 중합, 유화 중합, 괴상 중합, 현탁 중합, 광중합(활성 에너지선 중합) 등을 들 수 있다. 이 제조 방법 중에서도, 비용이나 생산성의 관점에서, 바람직하게는, 용액 중합이다. 얻어지는 중합체 (A)는 랜덤 공중합체, 블록 공중합체, 교호 공중합체, 그래프트 공중합체 등 중 어느 것이어도 된다. 얻어지는 중합체 (B)는 랜덤 공중합체, 블록 공중합체, 교호 공중합체, 그래프트 공중합체 등 중 어느 것이어도 된다.Polymer (A) and polymer (B) can be produced by any appropriate method as long as the effects of the present invention are not impaired. Examples of such production methods include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, photopolymerization (active energy ray polymerization), etc. Among these production methods, solution polymerization is preferable from the viewpoints of cost and productivity. The obtained polymer (A) may be any of a random copolymer, a block copolymer, an alternating copolymer, a graft copolymer, etc. The obtained polymer (B) may be any of a random copolymer, a block copolymer, an alternating copolymer, a graft copolymer, etc.
용액 중합의 방법으로서는, 예를 들어, 단량체 성분이나 중합 개시제 등을 용제에 용해하고, 가열하여 중합하여, 중합체 용액을 얻는 방법 등을 들 수 있다.Examples of methods for solution polymerization include a method of dissolving monomer components or polymerization initiators in a solvent, heating, and polymerizing to obtain a polymer solution.
용액 중합에 있어서의, 가열하여 중합할 때의 가열 온도로서는, 예를 들어, 50℃ 내지 90℃를 들 수 있다. 용액 중합에 있어서의 가열 시간으로서는, 예를 들어, 1시간 내지 24시간을 들 수 있다.In solution polymerization, the heating temperature when polymerizing by heating may be, for example, 50°C to 90°C. The heating time in solution polymerization may be, for example, 1 hour to 24 hours.
용액 중합에 사용되는 용제로서는, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 용제를 사용할 수 있다. 이러한 용제로서는, 예를 들어, 톨루엔, 벤젠, 크실렌 등의 방향족 탄화수소류; 아세트산에틸, 아세트산n-부틸 등의 에스테르류; n-헥산, n-헵탄 등의 지방족 탄화수소류; 시클로헥산, 메틸시클로헥산 등의 지환식 탄화수소류; 메틸에틸케톤, 메틸이소부틸케톤 등의 케톤류; 등의 유기 용제 등을 들 수 있다. 용제는, 1종만이어도 되고, 2종 이상이어도 된다.Any appropriate solvent can be used as a solvent used in solution polymerization, as long as it does not impair the effects of the present invention. Examples of such solvents include aromatic hydrocarbons such as toluene, benzene, and xylene; esters such as ethyl acetate and n-butyl acetate; aliphatic hydrocarbons such as n-hexane and n-heptane; alicyclic hydrocarbons such as cyclohexane and methylcyclohexane; ketones such as methyl ethyl ketone and methyl isobutyl ketone; and organic solvents such as the like. The solvent may be one type only or two or more types.
중합체 (A), 중합체 (B)의 제조에 있어서는, 중합 개시제를 사용할 수 있다. 이러한 중합 개시제는, 1종만이어도 되고, 2종 이상이어도 된다. 이러한 중합 개시제로서는, 예를 들어, 2,2'-아조비스이소부티로니트릴, 2,2'-아조비스(2-아미디노프로판)디히드로클로라이드, 2,2'-아조비스[2-(5-메틸-2-이미다졸린-2-일)프로판]디히드로클로라이드, 2,2'-아조비스(2-메틸프로피온아미딘)이황산염, 2,2'-아조비스(N,N'-디메틸렌이소부틸아미딘), 2,2'-아조비스[N-(2-카르복시에틸)-2-메틸프로피온아미딘]하이드레이트(와코 준야쿠사 제조, VA-057) 등의 아조계 개시제; 과황산칼륨, 과황산암모늄 등의 과황산염; 디(2-에틸헥실)퍼옥시디카르보네이트, 디(4-t-부틸시클로헥실)퍼옥시디카르보네이트, 디-sec-부틸퍼옥시디카르보네이트, t-부틸퍼옥시네오데카노에이트, t-헥실퍼옥시피발레이트, t-부틸퍼옥시피발레이트, 디라우로일퍼옥시드, 디-n-옥타노일퍼옥시드, 1,1,3,3-테트라메틸부틸퍼옥시-2-에틸헥사노에이트, 디(4-메틸벤조일)퍼옥시드, 디벤조일퍼옥시드, t-부틸퍼옥시이소부티레이트, 1,1-디(t-헥실퍼옥시)시클로헥산, t-부틸히드로퍼옥시드, 과산화수소 등의 과산화물계 개시제; 과황산염과 아황산수소나트륨의 조합, 과산화물과 아스코르브산 나트륨의 조합 등의, 과산화물과 환원제를 조합한 산화환원계 개시제; 등을 들 수 있다.In the production of polymer (A) and polymer (B), a polymerization initiator can be used. Such polymerization initiators may be used alone or in combination of two or more. Examples of such polymerization initiators include azo initiators such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-amidinopropane)dihydrochloride, 2,2'-azobis[2-(5-methyl-2-imidazolin-2-yl)propane]dihydrochloride, 2,2'-azobis(2-methylpropionamidine)disulfate, 2,2'-azobis(N,N'-dimethyleneisobutylamidine), and 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine]hydrate (manufactured by Wako Pure Chemical Industries, Ltd., VA-057); Persulfates such as potassium persulfate and ammonium persulfate; peroxide initiators such as di(2-ethylhexyl)peroxydicarbonate, di(4-t-butylcyclohexyl)peroxydicarbonate, di-sec-butylperoxydicarbonate, t-butylperoxyneodecanoate, t-hexylperoxypivalate, t-butylperoxypivalate, dilauroyl peroxide, di-n-octanoyl peroxide, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, di(4-methylbenzoyl)peroxide, dibenzoyl peroxide, t-butylperoxyisobutyrate, 1,1-di(t-hexylperoxy)cyclohexane, t-butyl hydroperoxide, and hydrogen peroxide; Examples thereof include redox initiators combining peroxides and reducing agents, such as combinations of persulfate and sodium bisulfite, combinations of peroxide and sodium ascorbate, etc.
중합 개시제의 사용량은, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 사용량을 채용할 수 있다. 이러한 사용량으로서는, 예를 들어, 단량체 성분 100중량부에 대하여 바람직하게는, 0.01중량부 내지 5중량부이다.Any appropriate amount of the polymerization initiator may be used as long as it does not impair the effects of the present invention. For example, the amount is preferably 0.01 to 5 parts by weight per 100 parts by weight of the monomer component.
중합체 (A), 중합체 (B)의 제조에 있어서는, 연쇄 이동제를 사용할 수 있다. 이러한 연쇄 이동제는, 1종만이어도 되고, 2종 이상이어도 된다. 이러한 연쇄 이동제로서는, 예를 들어, 라우릴머캅탄, 글리시딜머캅탄, 머캅토아세트산, 2-머캅토에탄올, 티오글리콜산, 티오글리콜산메틸, 티오글리콜산2-에틸헥실, 2,3-디머캅토-1-프로판올 등을 들 수 있다.In the production of polymer (A) and polymer (B), a chain transfer agent can be used. This chain transfer agent may be one type or two or more types. Examples of this chain transfer agent include lauryl mercaptan, glycidyl mercaptan, mercaptoacetic acid, 2-mercaptoethanol, thioglycolic acid, methyl thioglycolate, 2-ethylhexyl thioglycolate, 2,3-dimercapto-1-propanol, and the like.
연쇄 이동제의 사용량은, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 사용량을 채용할 수 있다. 이러한 사용량으로서는, 예를 들어, 단량체 성분 100중량부에 대하여 바람직하게는, 0.01중량부 내지 5중량부이다.Any appropriate amount of the chain transfer agent can be used as long as it does not impair the effects of the present invention. For example, the amount is preferably 0.01 to 5 parts by weight per 100 parts by weight of the monomer component.
중합체 (A), 중합체 (B)의 제조에 있어서는, 일반적으로 중합 반응에 사용할 수 있는 기타의 임의의 적절한 첨가제를 사용할 수 있다.In the production of polymer (A) and polymer (B), any other appropriate additive that can generally be used in a polymerization reaction can be used.
본 발명의 점착제 조성물은, 가교 촉매를 포함하고 있어도 된다. 가교 촉매로서는, 본 발명의 효과를 손상시키지 않는 범위에서 임의의 적절한 가교 촉매를 채용할 수 있다. 이러한 가교 촉매로서는, 예를 들어, 테트라-n-부틸티타네이트, 테트라이소프로필티타네이트, 나셈 제2철, 부틸주석옥시드, 디옥틸주석디라우레이트 등의 금속계 가교 촉매(특히 주석계 가교 촉매) 등을 들 수 있다. 가교 촉매는, 1종만이어도 되고, 2종 이상이어도 된다.The adhesive composition of the present invention may contain a crosslinking catalyst. Any appropriate crosslinking catalyst may be employed as the crosslinking catalyst within a range that does not impair the effects of the present invention. Examples of such crosslinking catalysts include metal-based crosslinking catalysts (particularly tin-based crosslinking catalysts) such as tetra-n-butyl titanate, tetraisopropyl titanate, ferric nasem, butyltin oxide, and dioctyltin dilaurate. The crosslinking catalyst may be one type or two or more types.
가교 촉매의 사용량은, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 사용량을 채용할 수 있다. 이러한 사용량으로서는, 예를 들어, 단량체 성분 100중량부에 대하여 바람직하게는, 0.001중량부 내지 0.05중량부이다.Any appropriate amount of the crosslinking catalyst may be used within a range that does not impair the effects of the present invention. For example, the amount is preferably 0.001 to 0.05 parts by weight per 100 parts by weight of the monomer component.
본 발명의 점착제 조성물은, 본 발명의 효과를 손상시키지 않는 범위에서 임의의 적절한 기타의 첨가제를 함유하고 있어도 된다. 이러한 기타의 첨가제로서는, 예를 들어, 실란 커플링제, 가교 지연제, 유화제, 착색제, 안료 등의 분체, 염료, 계면 활성제, 가소제, 점착성 부여제, 표면 윤활제, 레벨링제, 연화제, 산화 방지제, 노화 방지제, 광안정제, 자외선 흡수제, 중합 금지제, 무기 충전제, 유기 충전제, 금속분, 입자상, 박형물 등을 들 수 있다. 이러한 기타의 첨가제는, 1종만이어도 되고, 2종 이상이어도 된다.The adhesive composition of the present invention may contain any other appropriate additives as long as the effects of the present invention are not impaired. Examples of such other additives include powders such as silane coupling agents, crosslinking retarders, emulsifiers, colorants, pigments, dyes, surfactants, plasticizers, tackifiers, surface lubricants, leveling agents, softeners, antioxidants, anti-aging agents, light stabilizers, ultraviolet absorbers, polymerization inhibitors, inorganic fillers, organic fillers, metal powders, particles, thin films, etc. These other additives may be used alone or in combination of two or more.
≪≪B. 점착 부재≫≫≪≪B. Absence of Adhesion≫≫
본 발명의 점착 부재는, 본 발명의 점착제 조성물로 형성되는 점착제층을 갖는다.The adhesive member of the present invention has an adhesive layer formed from the adhesive composition of the present invention.
본 발명의 점착 부재는, 점착제층만을 포함하는 것이어도 되고, 점착제층과 다른 부재를 포함하는 것이어도 된다.The adhesive member of the present invention may include only an adhesive layer, or may include an adhesive layer and another member.
본 발명의 점착 부재에 있어서, 점착제층이 최외층으로서 노출되는 형태의 경우에는, 당해 노출면측에 임의의 적절한 세퍼레이터(박리 시트)를 설치해도 된다. 세퍼레이터(박리 시트)는 후술하는 기재를 겸한 것이어도 된다.In the adhesive member of the present invention, in the case where the adhesive layer is exposed as the outermost layer, any appropriate separator (release sheet) may be installed on the exposed surface side. The separator (release sheet) may also include the substrate described below.
점착제층은, 본 발명의 점착제 조성물로 형성된다. 예를 들어, 본 발명의 점착제 조성물을 임의의 적절한 기재 상에 도포하고, 필요에 따라 건조시켜서, 기재 상에 점착제층을 형성한다. 그 후, 기재를 박리하면, 점착제층만으로 이루어지는 본 발명의 점착 부재가 얻어진다. 또한, 예를 들어, 본 발명의 점착제 조성물을 임의의 적절한 기재 상에 도포하고, 필요에 따라 건조시켜서, 기재 상에 점착제층을 형성하고, 기재를 그대로 남김으로써, 점착제층과 기재를 포함하는 점착 부재가 얻어진다. 또한, 예를 들어, 본 발명의 점착제 조성물을 임의의 적절한 기재 상에 도포하고, 필요에 따라 건조시켜서, 기재 상에 점착제층을 형성하고, 기재를 박리하여 얻어지는 점착제층을 다른 부재(예를 들어, 다른 기재)에 적재함으로써, 점착제층과 기재를 포함하는 점착 부재가 얻어진다. 또한, 예를 들어, 본 발명의 점착제 조성물을 임의의 적절한 기재 상에 도포하고, 필요에 따라 건조시켜서, 기재 상에 점착제층을 형성하고, 기재 상에 형성된 점착제층을 다른 부재(예를 들어, 다른 기재)에 전사함으로써 점착제층과 기재를 포함하는 점착 부재가 얻어진다.The adhesive layer is formed by the adhesive composition of the present invention. For example, the adhesive composition of the present invention is applied onto any suitable substrate, dried if necessary, to form an adhesive layer on the substrate. Thereafter, when the substrate is peeled off, the adhesive member of the present invention consisting only of the adhesive layer is obtained. In addition, for example, by applying the adhesive composition of the present invention onto any suitable substrate, drying if necessary, to form an adhesive layer on the substrate, and leaving the substrate as it is, an adhesive member including the adhesive layer and the substrate is obtained. In addition, for example, by applying the adhesive composition of the present invention onto any suitable substrate, drying if necessary, to form an adhesive layer on the substrate, and peeling the substrate, the adhesive layer obtained is placed on another member (for example, another substrate), an adhesive member including the adhesive layer and the substrate is obtained. In addition, for example, by applying the adhesive composition of the present invention onto any appropriate substrate, drying as necessary to form an adhesive layer on the substrate, and transferring the adhesive layer formed on the substrate to another member (e.g., another substrate), an adhesive member including an adhesive layer and a substrate is obtained.
점착제 조성물의 도포 방법으로서는, 예를 들어, 롤 코팅, 그라비아 코팅, 리버스 코팅, 롤 브러시, 스프레이 코팅, 에어 나이프 코팅법, 다이 코터 등에 의한 압출 코팅 등을 들 수 있다.Examples of methods for applying the adhesive composition include roll coating, gravure coating, reverse coating, roll brush, spray coating, air knife coating, extrusion coating using a die coater, etc.
기재는, 단층으로 이루어지는 것이어도 되고, 복수 층으로 이루어지는 것이어도 된다. 기재는, 연신된 것이어도 된다.The substrate may be composed of a single layer or multiple layers. The substrate may also be stretched.
기재의 두께는, 용도에 따라, 임의의 적절한 두께로 설정할 수 있다. 본 발명의 효과를 충분히 발현시키기 위한 관점에서, 기재의 두께는, 바람직하게는 4㎛ 내지 500㎛이며, 보다 바람직하게는 10㎛ 내지 400㎛이며, 더욱 바람직하게는 15㎛ 내지 350㎛이며, 특히 바람직하게는 20㎛ 내지 300㎛이다.The thickness of the substrate can be set to any appropriate thickness depending on the intended use. From the viewpoint of sufficiently expressing the effects of the present invention, the thickness of the substrate is preferably 4 µm to 500 µm, more preferably 10 µm to 400 µm, even more preferably 15 µm to 350 µm, and particularly preferably 20 µm to 300 µm.
기재의 재료로서는, 용도에 따라, 임의의 적절한 재료를 채용할 수 있다. 이러한 재료로서는, 예를 들어, 플라스틱, 종이, 금속 필름, 부직포 등을 들 수 있다. 이러한 재료 중에서도, 본 발명의 효과를 보다 발현시킬 수 있는 점에서, 바람직하게는, 플라스틱이다.As the material of the substrate, any appropriate material can be adopted depending on the intended use. Examples of such materials include plastic, paper, metal film, non-woven fabric, etc. Among these materials, plastic is preferable in that it can better express the effects of the present invention.
상기 플라스틱으로서는, 예를 들어, 폴리에스테르계 수지, 폴리올레핀계 수지, 폴리아미드계 수지, 폴리이미드계 수지 등을 들 수 있다. 폴리에스테르계 수지로서는, 예를 들어, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에틸렌나프탈레이트 등을 들 수 있다. 폴리올레핀계 수지로서는, 예를 들어, 올레핀 모노머의 단독 중합체, 올레핀 모노머의 공중합체 등을 들 수 있다. 폴리올레핀계 수지로서는, 구체적으로는, 예를 들어, 호모 폴리프로필렌; 에틸렌 성분을 공중합 성분으로 하는 블록계, 랜덤계, 그래프트계 등의 프로필렌계 공중합체; 리액터 TPO; 저밀도, 고밀도, 리니어 저밀도, 초저밀도 등의 에틸렌계 중합체; 에틸렌·프로필렌 공중합체, 에틸렌·아세트산 비닐 공중합체, 에틸렌·아크릴산메틸 공중합체, 에틸렌·아크릴산에틸 공중합체, 에틸렌·아크릴산부틸 공중합체, 에틸렌·메타크릴산 공중합체, 에틸렌·메타크릴산메틸 공중합체 등의 에틸렌계 공중합체; 등을 들 수 있다. 본 발명의 효과를 보다 일층 발현시킬 수 있는 점에서, 상기 플라스틱으로서는, 이들 중에서도, 바람직하게는 폴리에스테르계 수지이며, 보다 바람직하게는 폴리에틸렌테레프탈레이트이다.Examples of the above plastics include polyester resins, polyolefin resins, polyamide resins, and polyimide resins. Examples of the polyester resins include polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Examples of the polyolefin resins include homopolymers of olefin monomers, copolymers of olefin monomers, and the like. Specific examples of the polyolefin resins include homopolypropylene; propylene copolymers having an ethylene component as a copolymerization component, such as a block type, a random type, and a graft type; reactor TPO; ethylene polymers having a low density, a high density, a linear low density, and an ultra-low density; Ethylene copolymers such as ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-methacrylic acid copolymer, and ethylene-methyl methacrylate copolymer; etc. In terms of further expressing the effects of the present invention, among these, the plastic is preferably a polyester resin, and more preferably polyethylene terephthalate.
기재는, 필요에 따라, 임의의 적절한 첨가제를 함유할 수 있다. 기재에 함유될 수 있는 첨가제로서는, 예를 들어, 산화 방지제, 자외선 흡수제, 광안정제, 대전 방지제, 충전제, 안료 등을 들 수 있다. 기재에 함유될 수 있는 첨가제의 종류, 수, 양은, 목적에 따라 적절하게 설정될 수 있다. The substrate may contain any appropriate additives as needed. Examples of additives that may be contained in the substrate include antioxidants, ultraviolet absorbers, light stabilizers, antistatic agents, fillers, pigments, etc. The type, number, and amount of additives that may be contained in the substrate may be appropriately set depending on the purpose.
도 1은, 본 발명의 하나의 실시 형태에 의한 점착 부재의 개략 단면도이다. 도 1에 있어서, 본 발명의 점착 부재(100)는, 기재(10)와 점착제층(20)과 세퍼레이터(30)를 포함한다.Fig. 1 is a schematic cross-sectional view of an adhesive member according to one embodiment of the present invention. In Fig. 1, the adhesive member (100) of the present invention includes a substrate (10), an adhesive layer (20), and a separator (30).
≪≪C. 광학 부재, 전자 부재≫≫≪≪C. Optical Absence, Electronic Absence≫≫
본 발명의 점착 부재는, 응력 분산성이 우수한 점착제층을 갖는다. 이 때문에, 광학 부재나 전자 부재를 외부로부터의 충격으로부터 지키는 것 등을 목적으로 하는 보호재로서 적합하게 사용할 수 있다. 즉, 본 발명의 광학 부재는, 본 발명의 점착 부재를 구비한다. 또한, 본 발명의 전자 부재는, 본 발명의 점착 부재를 구비한다.The adhesive member of the present invention has an adhesive layer having excellent stress dissipation properties. Therefore, it can be suitably used as a protective material for the purpose of protecting an optical member or an electronic member from external impact. That is, the optical member of the present invention comprises the adhesive member of the present invention. Furthermore, the electronic member of the present invention comprises the adhesive member of the present invention.
[실시예][Example]
이하, 실시예에 의해 본 발명을 구체적으로 설명하지만, 본 발명은 이들 실시예에 전혀 한정되지 않는다. 또한, 실시예 등에 있어서의, 시험 및 평가 방법은 이하와 같다. 또한, 「부」라고 기재되어 있는 경우에는, 특기 사항이 없는 한 「중량부」를 의미하고, 「%」라고 기재되어 있는 경우에는, 특기 사항이 없는 한 「중량%」를 의미한다.Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited to these examples at all. In addition, the test and evaluation methods in the examples, etc. are as follows. In addition, when "part" is described, it means "part by weight" unless otherwise specified, and when "%" is described, it means "weight%" unless otherwise specified.
<중량 평균 분자량의 측정><Measurement of weight average molecular weight>
중합체의 중량 평균 분자량(Mw)은 도소 가부시끼가이샤 제조의 GPC 장치(HLC-8220GPC)를 사용하여 측정을 행하였다. 또한, 중량 평균 분자량(Mw)은 폴리스티렌 환산값으로 구하였다.The weight average molecular weight (Mw) of the polymer was measured using a GPC apparatus (HLC-8220GPC) manufactured by Tosoh Kabushikikaisha. In addition, the weight average molecular weight (Mw) was obtained as a polystyrene conversion value.
측정 조건은 하기와 같다.The measurement conditions are as follows.
샘플 농도: 0.2중량%(THF 용액)Sample concentration: 0.2 wt% (THF solution)
샘플 주입량: 10μl 용리액Sample injection volume: 10μl eluent
THF 유속: 0.6ml/minTHF flow rate: 0.6ml/min
측정 온도: 40℃Measurement temperature: 40℃
샘플 칼럼: TSKguardcolumn SuperHZ-H(1개)+TSKgel SuperHZM-H(2개)Sample column: TSKguardcolumn SuperHZ-H (1 pc) + TSKgel SuperHZM-H (2 pcs)
레퍼런스 칼럼: TSKgel SuperH-RC(1개)Reference column: TSKgel SuperH-RC (1 piece)
검출기: 시차 굴절계(RI)Detector: Differential refractometer (RI)
<점착 시트의 제작><Production of adhesive sheets>
얻어진 점착제 조성물을, 편면을 실리콘으로 박리 처리한 두께 38㎛의 폴리에스테르 필름(상품명: MRF, 미쯔비시 가가쿠 폴리에스테르 가부시끼가이샤 제조)의 박리 처리면에 파운틴 롤로 건조 후의 두께가 50㎛로 되도록 도포하고, 건조 온도 130℃, 건조 시간 3분의 조건으로 큐어하여 건조하였다. 이와 같이 하여, 기재 상에 점착제층을 제작하였다. 계속해서, 점착제층의 표면에, 편면을 실리콘으로 박리 처리한 두께 38㎛의 폴리에스테르 필름(상품명: MRF, 미쯔비시 가가쿠 폴리에스테르 가부시끼가이샤 제조)을 당해 필름의 박리 처리면이 점착제층 측이 되도록 하여 피복하였다. 이와 같이 하여, 점착 시트를 제작하였다.The obtained pressure-sensitive adhesive composition was applied to the release-treated surface of a 38 µm thick polyester film (trade name: MRF, manufactured by Mitsubishi Chemical Corporation) whose single side was peeled with silicone, so that the thickness after drying with a fountain roll became 50 µm, and the film was cured and dried under the conditions of a drying temperature of 130°C and a drying time of 3 minutes. In this way, an adhesive layer was produced on a substrate. Subsequently, a 38 µm thick polyester film (trade name: MRF, manufactured by Mitsubishi Chemical Corporation) whose single side was peeled with silicone was covered on the surface of the adhesive layer so that the release-treated surface of the film became the adhesive layer side. In this way, an adhesive sheet was produced.
<유리 전이 온도(Tg), 저장 탄성률, 손실 탄성률, tanδ(손실 정접)의 측정><Measurement of glass transition temperature (Tg), storage modulus, loss modulus, and tanδ (loss tangent)>
동적 점탄성 측정 장치(레오메트릭스사 제조, ARES)를 사용하여, 다음의 방법에 의해 구하였다.The dynamic viscoelasticity was measured using a dynamic viscoelasticity measuring device (ARES, manufactured by Rheometrics Inc.) using the following method.
얻어진 점착 시트로부터 점착제층만을 취출하고, 적층하여 약 2mm의 두께로 하고, 이것을 φ 7.9mm로 펀칭하여, 원기둥형의 펠릿을 제작하여 측정용 샘플로 하였다. 상기 측정 샘플을 φ 7.9mm 패러렐 플레이트의 지그에 고정하고, 상기 동적 점탄성 측정 장치에 의해, 저장 탄성률 G', 손실 탄성률 G"의 온도 의존성을 측정하고, tanδ=G"/G'로 하여, tnaδ를 산출하였다. 또한, 얻어진 tanδ 커브가 극대가 되는 온도를 유리 전이 온도(Tg)(℃)로 하였다.From the obtained adhesive sheet, only the adhesive layer was taken out, laminated to a thickness of about 2 mm, and this was punched to φ 7.9 mm to produce a cylindrical pellet, which was used as a measurement sample. The measurement sample was fixed to a jig of a φ 7.9 mm parallel plate, and the temperature dependence of the storage elastic modulus G' and the loss elastic modulus G" was measured by the dynamic viscoelasticity measuring device, and tnaδ was calculated as tanδ = G" / G'. In addition, the temperature at which the obtained tanδ curve becomes a maximum was defined as the glass transition temperature (Tg) (℃).
측정 조건은 하기와 같다.The measurement conditions are as follows.
측정: 전단 모드,Measurement: Shear mode,
온도 범위: -70℃ 내지 150℃Temperature range: -70℃ to 150℃
승온 속도: 5℃/minHeating rate: 5℃/min
주파수: 1HzFrequency: 1Hz
〔제조예 1〕: (메트)아크릴계 중합체 (1)〔Manufacturing Example 1〕: (Meth)acrylic polymer (1)
교반 블레이드, 온도계, 질소 가스 도입관, 냉각기를 구비한 4구 플라스크에, 2-에틸헥실아크릴레이트(닛본 쇼꾸바이사 제조): 100중량부, 2-히드록시에틸아크릴레이트(도아 고세사 제조): 4중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴(와코 쥰야꾸 고교사 제조): 0.2중량부, 아세트산에틸: 156중량부를 투입하고, 천천히 교반하면서 질소 가스를 도입하고, 플라스크 내의 액온을 65℃ 부근으로 유지하여 6시간 중합 반응을 행하여, 중량 평균 분자량 55만의 (메트)아크릴계 중합체 (1)의 용액(40중량%)을 조제하였다.In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a condenser, 100 parts by weight of 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.), 4 parts by weight of 2-hydroxyethyl acrylate (manufactured by Toagosei Co., Ltd.), 0.2 parts by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator (manufactured by Wako Pure Chemical Industries, Ltd.), and 156 parts by weight of ethyl acetate were charged, and while slowly stirring, nitrogen gas was introduced, and the liquid temperature inside the flask was maintained at around 65°C, and a polymerization reaction was performed for 6 hours, to prepare a solution (40 wt%) of a (meth)acrylic polymer (1) having a weight average molecular weight of 550,000.
〔제조예 2〕: (메트)아크릴계 중합체 (2)〔Manufacturing Example 2〕: (Meth)acrylic polymer (2)
교반 블레이드, 온도계, 질소 가스 도입관, 냉각기를 구비한 4구 플라스크에, 2-에틸헥실아크릴레이트(닛본 쇼꾸바이사 제조): 100중량부, 4-히드록시부틸아크릴레이트(오사까 유끼 가가쿠 고교사 제조): 10중량부, 아크릴산(도아 고세사 제조): 0.02중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴(와코 쥰야꾸 고교사 제조): 0.2중량부, 아세트산에틸: 156중량부를 투입하고, 천천히 교반하면서 질소 가스를 도입하고, 플라스크 내의 액온을 65℃ 부근으로 유지하여 6시간 중합 반응을 행하여, 중량 평균 분자량 54만의 (메트)아크릴계 중합체 (2)의 용액(40중량%)을 조제하였다.In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a condenser, 100 parts by weight of 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.), 10 parts by weight of 4-hydroxybutylacrylate (manufactured by Osaka Yuki Kagaku Kogyo Co., Ltd.), 0.02 parts by weight of acrylic acid (manufactured by Toagosei Co., Ltd.), 0.2 parts by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator (manufactured by Wako Pure Chemical Industries, Ltd.), and 156 parts by weight of ethyl acetate were charged, and while slowly stirring, nitrogen gas was introduced, and the liquid temperature inside the flask was maintained at around 65°C, a polymerization reaction was performed for 6 hours, to prepare a solution (40% by weight) of a (meth)acrylic polymer (2) having a weight average molecular weight of 540,000.
〔제조예 3〕: (메트)아크릴계 중합체 (3)〔Manufacturing Example 3〕: (Meth)acrylic polymer (3)
교반 블레이드, 온도계, 질소 가스 도입관, 냉각기를 구비한 4구 플라스크에, 부틸아크릴레이트(닛본 쇼꾸바이사 제조): 99중량부, 4-히드록시부틸아크릴레이트(오사까 유끼 가가쿠 고교사 제조): 1중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴(와코 쥰야꾸 고교사 제조): 1중량부, 아세트산에틸: 156중량부를 투입하고, 천천히 교반하면서 질소 가스를 도입하고, 플라스크 내의 액온을 60℃ 부근으로 유지하여 7시간 중합 반응을 행하여, 중량 평균 분자량 160만의 (메트)아크릴계 중합체 (3)의 용액(39중량%)을 조제하였다.In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a condenser, 99 parts by weight of butylacrylate (manufactured by Nippon Shokubai Co., Ltd.), 1 part by weight of 4-hydroxybutylacrylate (manufactured by Osaka Yuki Kagaku Kogyo Co., Ltd.), 1 part by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator (manufactured by Wako Pure Chemical Industries, Ltd.), and 156 parts by weight of ethyl acetate were charged, and while slowly stirring, nitrogen gas was introduced, and the liquid temperature inside the flask was maintained at around 60°C to perform a polymerization reaction for 7 hours, thereby preparing a solution (39 wt%) of a (meth)acrylic polymer (3) having a weight average molecular weight of 1,600,000.
〔제조예 4〕: (메트)아크릴계 중합체 (4)〔Manufacturing Example 4〕: (Meth)acrylic polymer (4)
교반 블레이드, 온도계, 질소 가스 도입관, 냉각기를 구비한 4구 플라스크에, 부틸아크릴레이트(닛본 쇼꾸바이사 제조): 92중량부, N-아크릴로일모르폴린(고우진사 제조): 5중량부, 아크릴산(도아 고세사 제조): 2.9중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴(와코 쥰야꾸 고교사 제조): 0.1중량부, 아세트산에틸: 200중량부를 투입하고, 천천히 교반하면서 질소 가스를 도입하고, 플라스크 내의 액온을 55℃ 부근으로 유지하여 8시간 중합 반응을 행하여, 중량 평균 분자량 180만의 (메트)아크릴계 중합체 (4)의 용액(33중량%)을 조제하였다.In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a condenser, 92 parts by weight of butylacrylate (manufactured by Nippon Shokubai Co., Ltd.), 5 parts by weight of N-acryloylmorpholine (manufactured by Kojin Co., Ltd.), 2.9 parts by weight of acrylic acid (manufactured by Toa Gosei Co., Ltd.), 0.1 part by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator (manufactured by Wako Pure Chemical Industries, Ltd.), and 200 parts by weight of ethyl acetate were charged, and while slowly stirring, nitrogen gas was introduced, and the liquid temperature inside the flask was maintained at around 55°C, a polymerization reaction was performed for 8 hours, to prepare a solution (33 wt%) of a (meth)acrylic polymer (4) having a weight average molecular weight of 1,800,000.
〔제조예 5〕: (메트)아크릴계 중합체 (5)〔Manufacturing Example 5〕: (Meth)acrylic polymer (5)
교반 블레이드, 온도계, 질소 가스 도입관, 냉각기를 구비한 4구 플라스크에, 부틸아크릴레이트(닛본 쇼꾸바이사 제조): 95중량부, 아크릴산(도아 고세사 제조): 5중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴(와코 쥰야꾸 고교사 제조): 0.2중량부, 아세트산에틸: 156중량부를 투입하고, 천천히 교반하면서 질소 가스를 도입하고, 플라스크 내의 액온을 63℃ 부근으로 유지하여 10시간 중합 반응을 행하여, 중량 평균 분자량 70만의 (메트)아크릴계 중합체 (5)의 용액(40중량%)을 조제하였다.In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a condenser, 95 parts by weight of butylacrylate (manufactured by Nippon Shokubai Co., Ltd.), 5 parts by weight of acrylic acid (manufactured by Toagosei Co., Ltd.), 0.2 parts by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator (manufactured by Wako Pure Chemical Industries, Ltd.), and 156 parts by weight of ethyl acetate were charged, and while slowly stirring, nitrogen gas was introduced, and the liquid temperature inside the flask was maintained at around 63°C, a polymerization reaction was performed for 10 hours, to prepare a solution (40 wt%) of a (meth)acrylic polymer (5) having a weight average molecular weight of 700,000.
〔제조예 6〕: 지환식 구조 함유 (메트)아크릴계 중합체 (6)〔Manufacturing Example 6〕: Alicyclic Structure-Containing (Meth)Acrylic Polymer (6)
모노머 성분으로서 메타크릴산시클로헥실[호모폴리머(폴리메타크릴산시클로헥실)의 유리 전이 온도: 66℃]: 95중량부, 아크릴산: 5중량부, 연쇄 이동제로서 2-머캅토에탄올: 3중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴: 0.2중량부, 및 중합 용매로서 톨루엔: 103.2중량부를, 세퍼러블 플라스크에 투입하고, 질소 가스를 도입하면서, 1시간 교반하였다. 이와 같이 하여, 중합계 내의 산소를 제거한 후, 70℃로 승온하고, 3시간 반응시키고, 또한, 75℃에서 2시간 반응시켜서, 중량 평균 분자량 4000의 (메트)아크릴계 중합체 (6)의 용액(50중량%)을 얻었다.As a monomer component, cyclohexyl methacrylate [glass transition temperature of homopolymer (poly cyclohexyl methacrylate): 66°C]: 95 parts by weight, acrylic acid: 5 parts by weight, 2-mercaptoethanol: 3 parts by weight as a chain transfer agent, 2,2'-azobisisobutyronitrile: 0.2 parts by weight as a polymerization initiator, and toluene: 103.2 parts by weight as a polymerization solvent were charged into a separable flask and stirred for 1 hour while introducing nitrogen gas. After removing oxygen in the polymerization system in this way, the temperature was increased to 70°C and reacted for 3 hours, and further reacted at 75°C for 2 hours to obtain a solution (50 wt%) of a (meth)acrylic polymer (6) having a weight average molecular weight of 4000.
〔제조예 6〕: 지환식 구조 함유 (메트)아크릴계 중합체 (7)〔Manufacturing Example 6〕: (Meth)acrylic polymer containing an alicyclic structure (7)
교반 블레이드, 온도계, 질소 가스 도입관, 냉각기, 적하 깔때기를 구비한 4구 플라스크에, 톨루엔: 100중량부, 디시클로펜타닐메타크릴레이트(DCPMA)(상품명: FA-513M, 히타치 가세이 고교사 제조): 60중량부, 메틸메타크릴레이트(MMA): 40중량부, 및 연쇄 이동제로서 티오글리콜산메틸: 3.5중량부를 투입하였다. 그리고, 70℃에서 질소 분위기 하에서 1시간 교반한 후, 중합 개시제로서 2,2'-아조비스이소부티로니트릴: 0.2중량부를 투입하고, 70℃에서 2시간 반응시키고, 계속하여 80℃에서 4시간 반응시킨 후에, 90℃에서 1시간 반응시켜, 중량 평균 분자량 4000의 (메트)아크릴계 중합체 (7)의 용액(51중량%)을 얻었다.In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, a condenser, and a dropping funnel, toluene: 100 parts by weight, dicyclopentanyl methacrylate (DCPMA) (trade name: FA-513M, manufactured by Hitachi Kasei Kogyo Co., Ltd.): 60 parts by weight, methyl methacrylate (MMA): 40 parts by weight, and methyl thioglycolate: 3.5 parts by weight as a chain transfer agent were charged. Then, after stirring at 70°C for 1 hour under a nitrogen atmosphere, 2,2'-azobisisobutyronitrile: 0.2 parts by weight as a polymerization initiator was charged, and the mixture was reacted at 70°C for 2 hours, continuously reacted at 80°C for 4 hours, and then reacted at 90°C for 1 hour to obtain a solution (51 wt%) of a (meth)acrylic polymer (7) having a weight average molecular weight of 4000.
〔실시예 1〕〔Example 1〕
(메트)아크릴계 중합체 (1)의 용액에, (메트)아크릴계 중합체 (1)의 용액의 고형분 100중량부에 대하여 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (1)을 얻었다. 결과를 표 1에 나타냈다.A solution of (meth)acrylic polymer (1) was diluted with ethyl acetate so that the total solid content became 25 wt% based on 100 wt% of the solid content of the solution of (meth)acrylic polymer (1), and stirred with a disper to obtain an adhesive composition (1) including an acrylic resin. The results are shown in Table 1.
〔실시예 2〕〔Example 2〕
(메트)아크릴계 중합체 (1)의 용액에, (메트)아크릴계 중합체 (1)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.01중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (2)를 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (1), 0.01 part by weight of Coronate L (manufactured by Nippon Polyurethane Kogyo Co., Ltd.) as a crosslinking agent in terms of solid content and 0.005 part by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst in terms of solid content were added based on 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (1), the mixture was diluted with ethyl acetate so that the total solid content became 25% by weight, and stirred with a disper to obtain an adhesive composition (2) including an acrylic resin. The results are shown in Table 1.
〔실시예 3〕〔Example 3〕
(메트)아크릴계 중합체 (1)의 용액에, (메트)아크릴계 중합체 (1)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.1중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (3)을 얻었다. 결과를 표 1에 나타냈다. To a solution of (meth)acrylic polymer (1), 0.1 part by weight of Coronate L (manufactured by Nippon Polyurethane Industries, Ltd.) as a crosslinking agent in terms of solid content and 0.005 part by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst in terms of solid content were added based on 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (1), the mixture was diluted with ethyl acetate so that the total solid content became 25% by weight, and stirred with a disper to obtain an adhesive composition (3) including an acrylic resin. The results are shown in Table 1.
〔실시예 4〕〔Example 4〕
(메트)아크릴계 중합체 (1)의 용액에, (메트)아크릴계 중합체 (1)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.05중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체 (6)의 용액을 고형분 환산으로 5중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (4)를 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (1), 0.05 parts by weight of Coronate L (manufactured by Nippon Polyurethane Industries, Ltd.) as a crosslinking agent (calculated in solid content) per 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (1), 0.005 parts by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst (calculated in solid content), and 5 parts by weight of a solution of (meth)acrylic polymer (6) were added, diluted with ethyl acetate so that the total solid content would be 25% by weight, and stirred with a disper, to obtain an adhesive composition (4) including an acrylic resin. The results are shown in Table 1.
〔실시예 5〕〔Example 5〕
(메트)아크릴계 중합체 (1)의 용액에, (메트)아크릴계 중합체 (1)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.1중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체 (6)의 용액을 고형분 환산으로 5중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (5)를 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (1), 0.1 part by weight of Coronate L (manufactured by Nippon Polyurethane Industries, Ltd.) as a crosslinking agent (calculated in solid content) per 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (1), 0.005 part by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst (calculated in solid content), and 5 parts by weight of a solution of (meth)acrylic polymer (6) were added, and the mixture was diluted with ethyl acetate so that the total solid content became 25% by weight, and stirred with a disper to obtain an adhesive composition (5) including an acrylic resin. The results are shown in Table 1.
〔실시예 6〕〔Example 6〕
(메트)아크릴계 중합체 (1)의 용액에, (메트)아크릴계 중합체 (1)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.3중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체 (6)의 용액을 고형분 환산으로 5중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (6)을 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (1), 0.3 parts by weight of Coronate L (manufactured by Nippon Polyurethane Industries, Ltd.) as a crosslinking agent (calculated in solid content) per 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (1), 0.005 parts by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst (calculated in solid content) and 5 parts by weight of a solution of (meth)acrylic polymer (6) were added, diluted with ethyl acetate so that the total solid content would be 25% by weight, and stirred with a disper to obtain an adhesive composition (6) including an acrylic resin. The results are shown in Table 1.
〔실시예 7〕〔Example 7〕
(메트)아크릴계 중합체 (1)의 용액에, (메트)아크릴계 중합체 (1)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.1중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체 (7)의 용액을 고형분 환산으로 5중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (7)을 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (1), 0.1 part by weight of Coronate L (manufactured by Nippon Polyurethane Industries, Ltd.) as a crosslinking agent (calculated in solid content) per 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (1), 0.005 part by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst (calculated in solid content), and 5 parts by weight of a solution of (meth)acrylic polymer (7) were added, and the mixture was diluted with ethyl acetate so that the total solid content became 25% by weight, and stirred with a disper to obtain an adhesive composition (7) including an acrylic resin. The results are shown in Table 1.
〔실시예 8〕〔Example 8〕
(메트)아크릴계 중합체 (1)의 용액에, (메트)아크릴계 중합체 (1)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.3중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체 (7)의 용액을 고형분 환산으로 5중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (8)을 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (1), 0.3 parts by weight of Coronate L (manufactured by Nippon Polyurethane Industries, Ltd.) as a crosslinking agent (calculated in solid content) per 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (1), 0.005 parts by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst (calculated in solid content), and 5 parts by weight of a solution of (meth)acrylic polymer (7) were added, diluted with ethyl acetate so that the total solid content would be 25% by weight, and stirred with a disper to obtain an adhesive composition (8) including an acrylic resin. The results are shown in Table 1.
〔실시예 9〕〔Example 9〕
(메트)아크릴계 중합체 (2)의 용액에, (메트)아크릴계 중합체 (2)의 용액의 고형분 100중량부에 대하여 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (9)를 얻었다. 결과를 표 1에 나타냈다.A solution of (meth)acrylic polymer (2) was diluted with ethyl acetate so that the total solid content became 25 wt% based on 100 wt% of the solid content of the solution of (meth)acrylic polymer (2), and stirred with a disper to obtain an adhesive composition (9) including an acrylic resin. The results are shown in Table 1.
〔실시예 10〕〔Example 10〕
(메트)아크릴계 중합체 (2)의 용액에, (메트)아크릴계 중합체 (2)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.1중량부, TETRAD-C(미쓰비시 가스 가가쿠사 제조)를 고형분 환산으로 0.05중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (10)을 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (2), 0.1 part by weight of Coronate L (manufactured by Nippon Polyurethane Industries, Ltd.) as a crosslinking agent in terms of solid content, 0.05 part by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) in terms of solid content, and 0.005 part by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) in terms of solid content were added based on 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (2), and the mixture was diluted with ethyl acetate so that the total solid content became 25% by weight, and stirred with a disper to obtain an adhesive composition (10) including an acrylic resin. The results are shown in Table 1.
〔실시예 11〕〔Example 11〕
(메트)아크릴계 중합체 (3)의 용액에, (메트)아크릴계 중합체 (3)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.02중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (11)을 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (3), 0.02 part by weight of Coronate L (manufactured by Nippon Polyurethane Kogyo Co., Ltd.) as a crosslinking agent in terms of solid content and 0.005 part by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst in terms of solid content were added based on 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (3), the mixture was diluted with ethyl acetate so that the total solid content became 25% by weight, and stirred with a disper to obtain an adhesive composition (11) including an acrylic resin. The results are shown in Table 1.
〔실시예 12〕〔Example 12〕
(메트)아크릴계 중합체 (4)의 용액에, (메트)아크릴계 중합체 (4)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.3중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (12)를 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (4), 0.3 part by weight of Coronate L (manufactured by Nippon Polyurethane Kogyo Co., Ltd.) as a crosslinking agent in terms of solid content and 0.005 part by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst in terms of solid content were added based on 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (4), the mixture was diluted with ethyl acetate so that the total solid content became 25% by weight, and stirred with a disper to obtain an adhesive composition (12) including an acrylic resin. The results are shown in Table 1.
〔실시예 13〕〔Example 13〕
(메트)아크릴계 중합체 (5)의 용액에, (메트)아크릴계 중합체 (5)의 용액의 고형분 100중량부에 대하여 가교제로서 TETRAD-C(미쓰비시 가스 가가쿠사 제조)를 고형분 환산으로 0.075중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (13)을 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (5), 0.075 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a crosslinking agent in terms of solid content and 0.005 parts by weight of ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst in terms of solid content were added based on 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (5), the mixture was diluted with ethyl acetate so that the total solid content became 25% by weight, and stirred with a disper to obtain an adhesive composition (13) including an acrylic resin. The results are shown in Table 1.
〔실시예 14〕〔Example 14〕
(메트)아크릴계 중합체 (5)의 용액에, (메트)아크릴계 중합체 (5)의 용액의 고형분 100중량부에 대하여 가교제로서 TETRAD-C(미쓰비시 가스 가가쿠사 제조)를 고형분 환산으로 0.075중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체 (6)의 용액을 고형분 환산으로 20중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (14)를 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (5), 0.075 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a crosslinking agent (in terms of solid content) per 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (5), 0.005 parts by weight of ferric nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst (in terms of solid content), and 20 parts by weight of a solution of (meth)acrylic polymer (6) were added, diluted with ethyl acetate so that the total solid content would be 25% by weight, and stirred with a disper, thereby obtaining an adhesive composition (14) including an acrylic resin. The results are shown in Table 1.
〔비교예 1〕〔Comparative Example 1〕
(메트)아크릴계 중합체 (1)의 용액에, (메트)아크릴계 중합체 (1)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.5중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (C1)을 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (1), 0.5 part by weight of Coronate L (manufactured by Nippon Polyurethane Industries, Ltd.) as a crosslinking agent in terms of solid content and 0.005 part by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst in terms of solid content were added based on 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (1), the mixture was diluted with ethyl acetate so that the total solid content became 25% by weight, and stirred with a disper to obtain an adhesive composition (C1) including an acrylic resin. The results are shown in Table 1.
〔비교예 2〕〔Comparative Example 2〕
(메트)아크릴계 중합체 (2)의 용액에, (메트)아크릴계 중합체 (2)의 용액의 고형분 100중량부에 대하여 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.45중량부, TETRAD-C(미쓰비시 가스 가가쿠사 제조)를 고형분 환산으로 0.3중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가하고, 전체의 고형분이 25중량%로 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물 (C2)를 얻었다. 결과를 표 1에 나타냈다.To a solution of (meth)acrylic polymer (2), 0.45 parts by weight of Coronate L (manufactured by Nippon Polyurethane Industries, Ltd.) as a crosslinking agent in terms of solid content, 0.3 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) in terms of solid content, and 0.005 parts by weight of Ferric Nasem (manufactured by Nippon Kagaku Sangyo Co., Ltd.) in terms of solid content were added per 100 parts by weight of the solid content of the solution of (meth)acrylic polymer (2), and the mixture was diluted with ethyl acetate so that the total solid content would be 25% by weight, and stirred with a disper to obtain an adhesive composition (C2) including an acrylic resin. The results are shown in Table 1.
〔실시예 15〕〔Example 15〕
실시예 1에서 얻어진 점착제 조성물 (1)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (1) obtained in Example 1, and adhered to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product name “TEG1465DUHC”), which is an optical member, to obtain an optical member to which the adhesive sheet was adhered.
〔실시예 16〕〔Example 16〕
실시예 2에서 얻어진 점착제 조성물 (2)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (2) obtained in Example 2, and adhered to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product name “TEG1465DUHC”), which is an optical member, to obtain an optical member to which the adhesive sheet was adhered.
〔실시예 17〕〔Example 17〕
실시예 4에서 얻어진 점착제 조성물 (4)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (4) obtained in Example 4, and adhered to a polarizing plate (manufactured by Nitto Denko Co., Ltd., trade name “TEG1465DUHC”), which is an optical member, to obtain an optical member to which the adhesive sheet was adhered.
〔실시예 18〕〔Example 18〕
실시예 7에서 얻어진 점착제 조성물 (7)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (7) obtained in Example 7, and adhered to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product name “TEG1465DUHC”), which is an optical member, to obtain an optical member to which the adhesive sheet was adhered.
〔실시예 19〕〔Example 19〕
실시예 9에서 얻어진 점착제 조성물 (9)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (9) obtained in Example 9, and adhered to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product name “TEG1465DUHC”), which is an optical member, to obtain an optical member to which the adhesive sheet was adhered.
〔실시예 20〕〔Example 20〕
실시예 10에서 얻어진 점착제 조성물 (10)으로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (10) obtained in Example 10, and adhered to a polarizing plate (manufactured by Nitto Denko Co., Ltd., trade name “TEG1465DUHC”), which is an optical member, to obtain an optical member to which the adhesive sheet was adhered.
〔실시예 21〕〔Example 21〕
실시예 11에서 얻어진 점착제 조성물 (11)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (11) obtained in Example 11, and adhered to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product name “TEG1465DUHC”), which is an optical member, to obtain an optical member to which the adhesive sheet was adhered.
〔실시예 22〕〔Example 22〕
실시예 12에서 얻어진 점착제 조성물 (12)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (12) obtained in Example 12, and adhered to a polarizing plate (manufactured by Nitto Denko Co., Ltd., trade name “TEG1465DUHC”), which is an optical member, to obtain an optical member to which the adhesive sheet was adhered.
〔실시예 23〕〔Example 23〕
실시예 13에서 얻어진 점착제 조성물 (13)으로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (13) obtained in Example 13, and adhered to a polarizing plate (manufactured by Nitto Denko Co., Ltd., trade name “TEG1465DUHC”), which is an optical member, to obtain an optical member to which the adhesive sheet was adhered.
〔실시예 24〕〔Example 24〕
실시예 14에서 얻어진 점착제 조성물 (14)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (14) obtained in Example 14, and adhered to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product name “TEG1465DUHC”), which is an optical member, to obtain an optical member to which the adhesive sheet was adhered.
〔실시예 25〕〔Example 25〕
실시예 1에서 얻어진 점착제 조성물 (1)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (1) obtained in Example 1, and adhered to a conductive film (manufactured by Nitto Denko Co., Ltd., trade name “Elecrista V270L-TFMP”), which is an electronic member, to obtain an electronic member to which the adhesive sheet was adhered.
〔실시예 26〕〔Example 26〕
실시예 2에서 얻어진 점착제 조성물 (2)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (2) obtained in Example 2, and adhered to a conductive film (manufactured by Nitto Denko Co., Ltd., trade name “Elecrista V270L-TFMP”), which is an electronic member, to obtain an electronic member to which the adhesive sheet was adhered.
〔실시예 27〕〔Example 27〕
실시예 4에서 얻어진 점착제 조성물 (4)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (4) obtained in Example 4, and adhered to a conductive film (manufactured by Nitto Denko Co., Ltd., trade name “Elecrista V270L-TFMP”), which is an electronic member, to obtain an electronic member to which the adhesive sheet was adhered.
〔실시예 28〕〔Example 28〕
실시예 7에서 얻어진 점착제 조성물 (7)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (7) obtained in Example 7, and adhered to a conductive film (manufactured by Nitto Denko Co., Ltd., trade name “Elecrista V270L-TFMP”), which is an electronic member, to obtain an electronic member to which the adhesive sheet was adhered.
〔실시예 29〕〔Example 29〕
실시예 9에서 얻어진 점착제 조성물 (9)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (9) obtained in Example 9, and adhered to a conductive film (manufactured by Nitto Denko Co., Ltd., trade name “Elecrista V270L-TFMP”), which is an electronic member, to obtain an electronic member to which the adhesive sheet was adhered.
〔실시예 30〕〔Example 30〕
실시예 10에서 얻어진 점착제 조성물 (10)으로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (10) obtained in Example 10, and adhered to a conductive film (manufactured by Nitto Denko Co., Ltd., trade name “Elecrista V270L-TFMP”), which is an electronic member, to obtain an electronic member to which the adhesive sheet was adhered.
〔실시예 31〕〔Example 31〕
실시예 11에서 얻어진 점착제 조성물 (11)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (11) obtained in Example 11, and adhered to a conductive film (manufactured by Nitto Denko Co., Ltd., trade name “Elecrista V270L-TFMP”), which is an electronic member, to obtain an electronic member to which the adhesive sheet was adhered.
〔실시예 32〕〔Example 32〕
실시예 12에서 얻어진 점착제 조성물 (12)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (12) obtained in Example 12, and adhered to a conductive film (manufactured by Nitto Denko Co., Ltd., trade name “Elecrista V270L-TFMP”), which is an electronic member, to obtain an electronic member to which the adhesive sheet was adhered.
〔실시예 33〕〔Example 33〕
실시예 13에서 얻어진 점착제 조성물 (13)으로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (13) obtained in Example 13, and adhered to a conductive film (manufactured by Nitto Denko Co., Ltd., trade name “Elecrista V270L-TFMP”), which is an electronic member, to obtain an electronic member to which the adhesive sheet was adhered.
〔실시예 34〕〔Example 34〕
실시예 14에서 얻어진 점착제 조성물 (14)로부터 얻어진 점착 시트의 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.A polyester film was peeled from one side of an adhesive sheet obtained from the adhesive composition (14) obtained in Example 14, and adhered to a conductive film (manufactured by Nitto Denko Co., Ltd., trade name “Elecrista V270L-TFMP”), which is an electronic member, to obtain an electronic member to which the adhesive sheet was adhered.
본 발명의 점착제 조성물로 형성되는 점착제층을 갖는 점착 부재는, 예를 들어, 광학 부재나 전자 부재를 외부로부터의 충격으로부터 보호하는 것 등을 목적으로 하는 보호재로서 적합하게 사용할 수 있다.An adhesive member having an adhesive layer formed from the adhesive composition of the present invention can be suitably used as a protective material for the purpose of protecting, for example, an optical member or an electronic member from external impact.
10: 기재
20: 점착제층
30: 세퍼레이터
100: 점착 부재10: Description
20: Adhesive layer
30: Separator
100: Absence of adhesive
Claims (9)
상기 점착제 조성물 중의 상기 중합체 (A)의 함유 비율이 80중량% 내지 100중량%이고,
상기 (메트)아크릴산알킬에스테르 유래의 단량체 단위가, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위 (I)이고,
상기 중합체 (A)가, 분자 내에 OH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위를 갖고,
2관능 이상의 유기 폴리이소시아네이트계 가교제 및/또는 에폭시계 가교제를 포함하고,
-40℃ 내지 150℃의 전체 온도 영역에서의, 당해 점착제 조성물로 형성되는 점착제층의 손실 정접 tanδ가 0.10 이상인,
점착제 조성물.An adhesive composition comprising a polymer (A) having a monomer unit derived from (meth)acrylic acid alkyl ester,
The content ratio of the polymer (A) in the adhesive composition is 80 to 100 wt%,
The above (meth)acrylic acid alkyl ester-derived monomer unit is a (meth)acrylic acid alkyl ester-derived monomer unit (I) having an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety,
The above polymer (A) has a monomer unit derived from (meth)acrylic acid ester having an OH group in the molecule,
Containing a bifunctional or higher organic polyisocyanate crosslinking agent and/or an epoxy crosslinking agent,
- The loss tangent tanδ of the adhesive layer formed by the adhesive composition is 0.10 or more in the entire temperature range of -40℃ to 150℃.
Adhesive composition.
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JP4548679B2 (en) * | 1999-10-08 | 2010-09-22 | 大日本印刷株式会社 | Adhesive for pressure-sensitive adhesive layer in volume hologram laminate |
JP3907611B2 (en) * | 2003-06-23 | 2007-04-18 | 日東電工株式会社 | Adhesive composition and adhesive product |
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KR100668943B1 (en) * | 2004-04-23 | 2007-01-12 | 주식회사 엘지화학 | Acrylic Pressure-Sensitive Adhesive Composition for the Polarizing Film |
US8445597B2 (en) * | 2006-07-20 | 2013-05-21 | Soken Chemical & Engineering Co., Ltd. | Pressure-sensitive adhesive composition for PDP front filter and use thereof |
JP5441901B2 (en) * | 2008-06-11 | 2014-03-12 | 電気化学工業株式会社 | Curable composition |
JP5199917B2 (en) * | 2009-02-25 | 2013-05-15 | 日東電工株式会社 | Adhesive sheet, method for producing the same, and adhesive functional film |
JP5187973B2 (en) * | 2009-04-30 | 2013-04-24 | 日東電工株式会社 | Optical film adhesive composition, optical film adhesive layer, adhesive optical film, and image display device |
JP2013142162A (en) * | 2012-01-10 | 2013-07-22 | Mitsubishi Shindoh Co Ltd | Copper or copper alloy plate for base plate with excellent warp workability, and method for producing the same |
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JP2009057394A (en) * | 2006-08-30 | 2009-03-19 | Dic Corp | Repeelable self-adhesive sheet |
JP2008231358A (en) | 2007-03-23 | 2008-10-02 | Dic Corp | Image display module for electronic terminal and pressure-sensitive adhesive sheet for whole surface lamination |
JP2009256607A (en) * | 2008-03-17 | 2009-11-05 | Nitto Denko Corp | Acrylic adhesive, acrylic adhesive layer, and acrylic adhesive tape or sheet |
JP2014152198A (en) * | 2013-02-05 | 2014-08-25 | Soken Chem & Eng Co Ltd | Adhesive sheet |
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